The USB Implementers Forum (USB-IF) today announced the upcoming Intel 7 Series Chipset and Intel C216 Chipset Family host silicon has achieved SuperSpeed USB certification by the USB-IF. The certified solution includes four SuperSpeed USB ports integrated into the chipset, enabling manufacturers to conveniently incorporate SuperSpeed USB into their systems.

"This is a tremendous milestone for the industry," said Jeff Ravencraft, USB-IF President & COO. "With USB-IF certification of Intel's integrated USB host silicon, host manufacturers will be able to bring SuperSpeed USB to the masses. Intel's commitment to SuperSpeed USB will continue to provide peripheral device manufacturers a compelling incentive to develop a growing number of diverse SuperSpeed USB products."

Thecus is well known in the market for always putting innovative hardware and state of the art technology on the table for a fair price in order to guarantee our customers the best value. Thecus's new N4100EVO NAS offer a broad range of advanced features and differentiate themselves with low-energy hardware for those who place strong value on cutting down their electricity costs and carbon footprint. This cost-effective hardware is the first four-bay NAS on the market to feature the speedy and efficient dual-core Cavium CPU to get the quick transfer speeds necessary for large backups and heavy use. The N4100EVO is designed to change the way you run your office, at home or at work.

Fujitsu Semiconductor Limited and SuVolta, Inc. today announced that they have successfully demonstrated ultra-low-voltage operation of SRAM (static random access memory) blocks down to 0.425V by integrating SuVolta's PowerShrink low-power CMOS platform into Fujitsu Semiconductor's low-power process technology. By reducing power consumption, these technologies will make possible the ultimate in "ecological" products in the near future. Technology details and results will be presented at the 2011 International Electron Devices Meeting (IEDM) being held in Washington DC, starting December 5th.

Controlling power consumption is the primary limiter of adding features to product types ranging from mobile electronics to tethered servers and networking equipment. The biggest contributor to power consumption is supply voltage. Previously, the power supply voltage of CMOS steadily reduced to approximately 1.0V at the 130nm technology node, but it has not reduced much further as technology has scaled to the 28nm node. To reduce the power supply voltage, one of the biggest obstacles is the minimum operating voltage of embedded SRAM blocks.

TSMC today announced that its 28nm process is in volume production and production wafers have been shipped to customers. TSMC leads the foundry segment to achieve volume production at 28nm node.

TSMC's 28nm process offering includes 28nm High Performance (28HP), 28nm High Performance Low Power (28HPL), 28nm Low Power (28LP), and 28nm High Performance Mobile Computing (28HPM). Among these technology offerings, 28HP, 28HPL and 28LP are all in volume production and 28HPM will be ready for production by the end of this year. The production-version design collateral of 28HPM has been distributed to most mobile computing customers for their product-design use.

Renesas Electronics Corporation, a premier provider of advanced semiconductor solutions, today announced the availability of its new SuperSpeed Universal Serial Bus (USB 3.0) SATA3 bridge system-on-chip ([SoC], part number, µPD720230) that enables data transfer between a USB3.0 host system and a Serial ATA (SATA) device in external USB storage equipment. The new SoC is the world's first USB 3.0 Bridge SoC that supports the UASP (USB Attached SCSI Protocol) protocol that significantly speeds up data throughput for large volumes of data.

USB 3.0 achieves data transfer speeds more than 10 times faster than the previous version of the standard, USB 2.0 (currently the mainstream data transfer technology) and therefore easily supports the growing need for increased data-recording media capacities. Renesas has led the industry by releasing the µPD720200 USB 3.0 host controller in May 2009 and began mass production in June that same year. Since then, the company's lineup of USB 3.0 host controllers has been widely adopted by customers worldwide. Total shipments of these products have already exceeded 40 million units since May 2010, and Renesas has ramped up production of its USB 3.0 host controllers to 6 million units per month. During this period, the company also released in December 2009 a UASP driver that achieves high-speed data transfers for storage devices by improving the performance limit of the BOT (Bulk-Only Transfer) standard used by USB 2.0, making it possible for external storage devices to take advantage of the increased speed offered by the new USB 3.0 standard.

New Venture Partners, the global venture capital firm dedicated to corporate technology spin-outs, today announced that its portfolio company, Silicon Hive, a spin-out from Philips Electronics (Philips), has been acquired by Intel Corporation (Intel). "New Venture Partners and Intel Capital never shied away from the heavy lifting involved in making Silicon Hive the success it is today".

Silicon Hive was incubated by Philips to commercialize parallel processing technology for semiconductor Systems-on-Chip (SoC). In 2007, Philips decided to spin out Silicon Hive as an independent, venture-backed company. New Venture Partners structured the transaction, transitioning the Silicon Hive business -- team, relationships, products, technology and related intellectual property -- out of Philips and into a start-up company. New Venture Partners led the Series A investment in Silicon Hive with initial participation from TVM Capital.

During keynote presentations today at the Intel Developer Forum, Intel Corporation executives outlined several software- and hardware-related efforts as the company intensifies its System-on-a-Chip (SoC) product plans based on the Intel Atom processor family.

Amid predictions of billions of additional Internet-connected devices going online, Renée James, senior vice president and general manager, Intel Software and Services Group, and Doug Davis, vice president and general manager, Embedded and Communications Group, discussed the expansion of these processors into high-growth areas including netbooks, tablets, CE, embedded, and smart phones.

Samsung Electronics Co., Ltd., a worldwide leader in advanced semiconductor technology solutions, today introduced its latest wireless universal serial bus (USB) solution, developed using Ultra Wide Band (UWB) technology. Offered in a two-chip set, Samsung's newest S3C2680/ S5M8311 WUSB solution enables high definition content to be wirelessly transmitted from a mobile host device to a tethered device for viewing. Initial applications are high-resolution cameras, camcorders, TVs and PCs with prospects for adoption in other applications including tablet PCs, printers, beam projectors, portable HDDs, Blu-ray players, and mobile handsets.

"The ability to handle wireless high-speed data transmission while consuming less power is a key requirement for many consumer electronic devices," said Yiwan Wong, vice president, System LSI marketing, Samsung Electronics. "Due to power/performance issues, previous generations of WUSB products were unable to meet the consumers' expectations. Samsung's new WUSB chipset delivers up to 480Mbps (Megabit per second) data transmission rate, at an average power consumption of less than 300mW. This level of power efficiency greatly increases the attractiveness of WUSB connectivity in consumer electronic and mobile applications.

Toshiba's own 10-inch 'pad' tablet device project seems to have taken shape, after official pictures were released to the press. The device is referred to as the "SmartPad", is powered by NVIDIA Tegra 2 processor, which is a high-performance SoC designed for graphics-intensive portable devices. The SmartPad runs Google's Android operating system that's optimized for its relatively large screen taking advantage of advanced touch features. The tablet is build of an aluminum frame, with crystal top.

The pictures reveal it to have six essential buttons that are feather-touch, and separate from the touchscreen, also shown is a front-facing camera. Another picture reveals some of its connectors, which include a memory card slot, a mini-USB (input), a USB port, an HDMI connector, audio and DC-in. The device is said to pack its own stereo speakers. As far as functionality goes, the device looks to be taking an aim at the Apple iPad with a few more software features, with its hardware, it is not a tablet "PC", as it cannot run Windows 7. It is also learned that older rumors suggesting that there could be a Windows 7 variant are not true. The IFA event in Berlin could be Toshiba's launch-vehicle of choice.

Intel Corporation today announced it has signed an agreement to acquire Texas Instruments' cable modem product line. The purchase enhances Intel's focus on the cable industry and related consumer electronics (CE) market segments, where the company's expertise in building advanced system-on-chip (SoC) products, based on Intel Atom processors, will be applied.

Intel plans to combine Texas Instruments' best-of-breed Puma product lines with the Data Over Cable Service Interface Specification (DOCSIS) standard technology and Intel SoCs to deliver advanced set top box, residential gateway and modem products for the cable industry. The objective is to provide cable OEMs with an open and powerful platform for delivering innovative and differentiated products to service providers that improve the video, voice and data content experience at home.

ARM and Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today jointly announced a long-term agreement that provides TSMC with access to a broad range of ARM processors and enables the development of ARM physical IP across TSMC technology nodes. This agreement supports the companies' mutual customers to achieve optimized Systems-On-Chip (SoC) based on ARM processors and covers a wide range of process nodes extending down to 20nm.

The agreement provides TSMC access to optimize the implementation of ARM processors on TSMC process technologies, including ARM Cortex processor family and CoreLink interconnect fabric for AMBA protocols. It also establishes a long-term relationship with ARM for the development of physical IP, including memory products and standard cell libraries targeting the most advanced TSMC 28nm and 20nm processes.

At next week's Design Automation Conference (DAC), GLOBALFOUNDRIES will unveil a new platform to spur innovation in semiconductor manufacturing and help deliver unparalleled service to chip designers. Called GLOBALSOLUTIONS, the new ecosystem combines the company's internal resources with a broad spectrum of partners to efficiently enable the fastest time-to-volume for foundry customers.

"As chip design grows in complexity and manufacturing partnerships become increasingly critical, foundry customer enablement needs to extend beyond process design kits and reference flows to include the full spectrum of the semiconductor value chain," said Jim Kupec, senior vice president of worldwide sales and marketing at GLOBALFOUNDRIES. "To this end, GLOBALSOLUTIONS includes ecosystem partners in all aspects of design enablement, turnkey services, design for manufacturability, optical proximity correction and mask operations, and will further expand our capabilities in advanced assembly solutions. This will allow our customers to unlock their innovation potential and differentiate at all levels of the design process, from the silicon and SoC level all the way up to the full system."

Call it the admin's graphics card or the gamer's network card, but PowerColor seems to have come up with an unusual combination of a graphics processor (ATI Radeon HD 5770) with a hardware-accelerated network processor (Bigfoot Killer), which are seated on the same board, and share the system bus using a PCI-Express bridge chip. The GPU is a fairly standard HD 5770 that packs DirectX 11 support, 800 stream processors, and 1 GB of GDDR5 memory across a 128-bit wide interface, while the NPU is an ARM-derived system-on-chip (SoC) which offloads network stack processing completely from the host in a bid to cut system latencies. The inclusion of a PCI-Express bridge chip and the NPU significantly increased the size of PCB, yet the card seems to make do with just a single 6-pin power input. Given that a standalone PCI-E Killer NIC easily costs over $120 and the HD 5770 around the $150 mark, with the $10-odd PCI-E bridge chip, one can expect this product to easily cost over $250.

At Computex today, Intel Corporation unveiled new products and features based on its low-power Intel Atom processor family, including plans to further differentiate the popular netbook category and expand into several new market segments beyond its growing PC, laptop and server businesses.

In the past 45 days, Intel and its Atom processor has entered a variety of markets beyond the more than 50 million Intel-based netbooks sold in the past 2 years. Intel announced a processor and MeeGo* software win with Chinese carmaker HawTai Automobile for a future in-vehicle-infotainment platform; a greater than 50-times lower platform idle power reduction with Intel's next generation Atom processor platform for handheld devices including smartphones; and a collaboration with Google*, Sony* and Logitech* to deliver a new Smart TVs experience powered by Intel Atom CE products and running Android*-based Google TV*.

Benefitting from the company's power-saving architecture, transistor and circuit design expertise, plus unique manufacturing process techniques, Intel Corporation today unveiled its newest Intel Atom processor-based platform (formerly "Moorestown").

The technology package provides significantly lower power consumption and prepares the company to target a range of computing devices, including high-end smartphones, tablets and other mobile handheld products. The chips bring Intel's classic product strengths - outstanding performance to run a comprehensive and growing number of rich media and Internet applications, a choice of software, and the ability to easily multitask - across a number of applications, including HD video and multi-point videoconferencing.

Intel unveils upcoming "Tunnel Creek" System-on-Chip (SoC) for IP phones, printers and in-vehicle-infotainment systems for cars. Two Intel executives today outlined the latest Intel system-on-chip (SoC) products for embedded applications and described new research to allow homes and small businesses to better use and manage energy. The forthcoming SoC product features an Intel Atom processor core that, for the first time, will let other companies create PCI Express-compliant devices that directly connect to the chip, which offers new flexibility for embedded applications.

Intel also highlighted work with HawTai, a major Chinese car maker that plans to use Intel Atom processors and MeeGo software for their in-car infotainment systems. In addition, China Mobile, the world's largest wireless telecommunications company, will adopt Intel chips for targeted platforms powering its wireless networks.

At the 2010 Mobile World Congress, GLOBALFOUNDRIES and ARM today unveiled new details on their leading-edge System-on-Chip (SoC) platform technology for powering the next generation of wireless products and applications. The new chip manufacturing platform is projected to enable a 40 percent increase in computing performance, a 30 percent decrease in power consumption, and a 100 percent increase in standby battery life. The new platform includes collaboration on two GLOBALFOUNDRIES process variants: 28nm super low power (SLP) for mobile and consumer applications and 28nm high performance (HP) for applications requiring maximum performance.

"The success of the next generation of mobile products will be increasingly dependent on their ability to deliver PC-class performance, a highly integrated rich media experience and longer battery life," said GLOBALFOUNDRIES chief operating officer Chia Song Hwee. "These demands are going to require a strong technology foundation and close collaboration between industry leaders to enable an increasing number of design companies to unlock this innovation. We are working closely with ARM to optimize the physical IP and implementation of the Cortex-A9 processor with our proven manufacturing experience in high-volume, advanced technology products, to deliver a fully integrated platform for leading-edge wireless products and applications."

ARM and GLOBALFOUNDRIES today announces a long-term strategic relationship to provide their mutual customers with an innovative SoC enablement program. To support the long-term relationship, GLOBALFOUNDRIES and ARM have signed a broad agreement on processor implementation and circuit optimization to provide mutual customers with a robust enablement program geared towards next-generation applications.

The SoC enablement program, built around a full suite of ARM Physical IP, Fabric IP and Processor IP, will deliver customers unparalleled design flexibility on GLOBALFOUNDRIES' most advanced HKMG semiconductor manufacturing capabilities. The collaborative efforts of the partnership will initially focus on enabling SoC products which use the low power and high performance ARM Cortex -A9 processor on GLOBALFOUNDRIES 28nm HKMG process. The characteristics of GLOBALFOUNDRIES 28nm "Gate First" HKMG technology is optimized for high performance processing with minimal leakage making it an ideal choice for advanced mobile solutions.

Marvell Semiconductor has come up with a marvel: the SheevaPlug computer software/hardware development kit (SHDK). The initiative puts to use the company's Sheeva ARM processor in a compact unit the size and form of a retro wall-mount AC-DC adapter. Consuming no more than 5 W of power, the unit can function as a full-featured PC, driving Linux. It packs a 1.2 GHz Sheeva ARM processor, 512 MB of RAM, and 512 MB of flash-based fixed storage.

Throwing open the development kit would mean companies wanting to build similar devices based on Marvell hardware. The SheevaPlug is built around the Marvell 88F6000 Kirkwood SoC design that makes use of Feroceon and XScale architectures, both of which are derivatives of ARM. Gigabit Ethernet and USB ports add to the connectivity. With several industry heavyweights such as Microsoft and Google predicting a bright future for cloud-computing, companies such as Marvell can only help but gain interest in developing inexpensive devices that drive the client-side machinery for it. Take a guess on how much SheevaPlug costs: US $100 in single unit retail quantities. What's more, it could be bought in bulk for as low as $50 a piece!

Samsung Electronics, a worldwide leader in advanced semiconductor technology, today announced a new wireless universal serial bus (W-USB) System-On-Chip (SoC) designed specifically for the upcoming ultra-wideband (UWB) market. The latest in a growing portfolio of mobile technology solutions, Samsung's new W-USB SoC combines the convenience of wireless connectivity, the security level of wired USB, and the high speed performance of UWB to instantly transfer mass storage data such as digital photos, movie videos or MP3 music files between electronic devices. For example, the new W-USB SoC can download a 700MB movie in approximately one minute.

Tegra is NVIDIA's System on a Chip (SoC) platform. It takes NVIDIA's supreme expertise in the field of visual computing and architectural finesse to SoC that is projected to have a large market in the near future in several industries, mainly consumer electronics and automobiles. Heavyweights in the automobile industry such as Daimler AG (Mercedes Benz), FIAT Group (Alfa Romeo, Ferrari, Fiat, Lancia, Maserati), V.A.G. group (Audi, Bentley, Bugatti, Lamborghini, Porsche, Seat, Skoda, VW) have lobbied around the Terga technology to be used to enhance their products.

As automobiles manufacturers venturing into a realm of new technology of compact computing, they would prefer proven and stable technologies from NVIDIA over future tech. For this matter, NVIDIA has derived some versions of the graphics processor part of Tegra on the GeForce 6 series. It makes it fully DirectX 9.0c compatible and capable of running up to three or more displays. Some variants NVIDIA plans to sell V.A.G. group includes a GPU derived from GeForce 9600 GT albeit much lower speeds (since it's not required to work to its potential). Futuremark has already showcased its 3D dashboard software for Audi which could harness the power of Tegra to display a futuristic dashboard panel that provides drivers with information on the car's operation along with maps and guidance in 3D.

Team R21 of FiringSquad studied the credibility of a rumor on NVIDIA materializing its long-term processor plans. They said they would be surprised if NVIDIA didn't have an x86 plan chalked out at least at a very interior level. The Inquirer speculated earlier that NVIDIA could lift the covers from its x86 plans as early as some time this week, during the ongoing NVISION event. The credibility of this rumor is based purely on who's breeding it. Many point it to have been doing rounds during IDF.

Reality bites: NVIDIA lacks a regularized x86 license which has to be issued by Intel to be able to use x86 in their products. Any mass announcement at this point could cost them. NVISION however looks to be an ideal substrate for discussions on CUDA and NVIDIA's SoC (System on a Chip) plans.

With wide-spread news about AMD integrating a graphics controller on a CPU, the AMD Fusion, the concept of "Small is Big" is being redefined. Fusion may look like a step in the right direction but is merely prelude to another computing methodology, the SoC (system on a chip). Fusion could be confined to consumer desktop/notebook central processing with graphics thrown in, but a concrete step taken by Intel into this which is more of targeted to the enterprise, embedded systems and consumer electronics is the EP80579 integrated processor. HotHardware spoke with Gadi Singer, Vice President of Intel's Mobility Group, and Doug Davis, Vice President of Intel's Digital Enterprise Group. Intel's brand new product line targeted at security, storage, communications, and industrial applications, basically embedded computing were discussed. The EP80579 integrated processor was central to this conversation. The need for this product came about by Intel as a preparation of the company for the impending onslaught of smart, Internet-connected devices and appliances predicted to arrive over the next few years.