Last month, NBD shipping documents linked Intel's next-gen "Nova Lake‑S" (aka "NVL‑S") desktop processor family to an LGA 1954 socket type. Given Team Blue's track record, consumers are not overly enthused by the prospect of another change in mounting profiles. Famously, the current-gen Core Ultra "Arrow Lake-S" CPU series required a fresh slate of motherboards design—centered around LGA1851. Fortunately, a late March-authored shipping manifest has indicated that a successor will leverage nigh identical dimensions. This intriguing leak was shared on social media by Ruby_Rapids—they happily surmised: "the package size of FCLGA1954 is 45×37.5 mm, too. Today's coolers are mechanically compatible with Nova Lake-S."

Despite leveraging a greater number of pins, the supposed LGA 1954 footprint could grant support for cooling solutions that were designed during the eras of LGA1851 and LGA1700. Naturally, a shift into next-gen Team Blue desktop processor territories will necessitate a fresh swath of mainboards. In sharp contrast, AMD enthusiasts remain happy about the AM5 socket's long-term prospects. According to official company timelines, Core Ultra "Nova Lake‑S" processors are "on track" for a loose 2026 launch window. 2 nm manufacturing details were leaked last month; indicating TSMC's involvement.

ENERMAX, an industry-leading force dedicated to designing high-performance computer hardware and cooling solutions, announced that its CPU cooler product line now supports the new generation Intel processor socket, LGA1851. The new generation of Intel CPUs utilizes the LGA1851 socket, which is compatible with existing LGA1700 CPU coolers. Therefore, users with ENERMAX CPU coolers can directly upgrade to the new generation Intel platform.

ENERMAX provides a comprehensive range of CPU cooling solutions with a maximum thermal design power (TDP) of up to 420 W, successfully unleashing CPU performance and enabling fast processing capabilities during multitasking.

NVIDIA is reportedly considering a significant design change for its GPU products, shifting from the current on-board solution to an independent GPU socket design following the GB200 shipment in Q4, according to reports from MoneyDJ and the Economic Daily News quoted by TrendForce. This move is not new in the industry, AMD has already introduced socket design in 2023 with their MI300A series via Supermicro dedicated servers. The B300 series, expected to become NVIDIA's mainstream product in the second half of 2025, is rumored to be the main beneficiary of this design change that could improve yield rates, though it may come with some performance trade-offs.

According to the Economic Daily News, the socket design will simplify after-sales service and server board maintenance, allowing users to replace or upgrade the GPUs quickly. The report also pointed out that based on the slot design, boards will contain up to four NVIDIA GPUs and a CPU, with each GPU having its dedicated slot. This will bring benefits for Taiwanese manufacturers like Foxconn and LOTES, who will supply different components and connectors. The move seems logical since with the current on-board design, once a GPU becomes faulty, the entire motherboard needs to be replaced, leading to significant downtime and high operational and maintenance costs.

MSI liquid coolers are fully compatible with Intel's Core Ultra Processors. As Intel's latest CPU approach promises unprecedented power and innovation, we understand that many users are looking into system upgrades. MSI liquid coolers are equipped to support this latest development, ensuring users are prepared for Intel's latest processors without the need for a complete liquid cooler replacement.

If you upgrade to Intel Core Ultra CPUs, consider MSI liquid coolers for a seamless transition. All MSI liquid coolers will support Intel's LGA1851 socket, which will be already prepared in the box.

EK, the leading computer cooling solutions provider, is rolling out a brand-new water block built from the ground up for the LGA 1700 socket, explicitly designed for delidded Intel Core CPUs. It bears improvements that benefit 14th-generation CPUs and shares almost no parts with the previously released Intel Direct Die water block. It includes a purpose-developed cold plate, cooling fin structure, and mounting mechanism. It relies on standoffs positioned at the four corners of the water block to ensure optimal contact with the CPU, eliminating concerns about applying too much or too little pressure on the bare CPU die, just like the AM5 Direct Die water block. EK's latest water block features EK-Matrix7 compatibility, meaning the product's height and port distance are managed in 7 mm increments for easier loop planning and precise results.

EK-Quantum Velocity² Direct Die D-RGB - 1700 Core Edition
This new direct die LGA 1700 water block is built from scratch and made to squeeze every bit of performance out of the 14th-generation Intel Core CPUs. The top is seethrough glass-like acrylic, with rich D-RGB illumination behind the window, which is riddled with aluminium bars going over the top and two G1/4" extenders that interrupt the flow of the black-anodized aluminium bars. These G1/4" extenders are standard Torque micro extenders. They can be replaced by other products from the EK-Quantum Torque Micro series, be it extenders of different finish, HDP or HDC fittings.

Azza has introduced its new Cube 240 and Cube 360 liquid AIO coolers, compatible with Intel's upcoming LGA1851 socket for Arrow Lake processors. The new LGA1851 socket offers more contact pins than the previous LGA1700 socket, but it maintains the same dimensions and mounting spacing, allowing many existing coolers to remain compatibility. As we see with the latest Reddit post of the Azza Cube 360 installation manual, the LGA1851 socket will retain cooler compatibility with the current LGA1700 socket. For users planning to upgrade to the upcoming Arrow Lake platform, the cooler installation will be the least of their worries if their mounting brackets are compatible.

However, one notable change with LGA1851 is the higher maximum dynamic pressure, signifying increased mounting pressure from CPU coolers. But that only sometimes leads to new mounting mechanisms for coolers. In addition to Azza, Noctua's coolers, like NH-U12, have also confirmed signs of Arrow Lake support, as you can see here.

The latest retail batch of Noctua's NH-U12A single-tower CPU coolers has been photographed sporting updated packaging and containing a new set of mounting brackets. Japan's Akiba PC Watch reported on new stock of Noctua's popular (and well reviewed) NH-U12A cooler sitting on shelves at Tsukumo Computer's flagship store in Akihabara, Tokyo. Their article pinpointed Socket LGA-1851 compatibility listed on the revised retail box, and documented within new installation instruction steps. They noted that: "according to the manual, the mounting bar and spacer for fixing the CPU cooler are shared with the existing LGA-1700 (kit)."

Noctua has not updated its NH-U12A product page or compatibility centre pages with these revisions, but Tom's Hardware did pick up on the NH-D15's overhauled entry: "now listed as having SecuFirm2 mounts compatible with Intel LGA-1851." The Austrian computer hardware manufacturer seems to pride itself on its preparedness well in advance of a forthcoming new CPU range—Akiba PC Watch cheekily observed: "it is currently unknown when CPUs and motherboards compatible with LGA-1851 will be released." Intel's 15th Gen Arrow Lake S is presumably the main candidate lined up to adopt LGA-1851—technical specifications were uncovered back in June time.

Igor Wallossek over at Igor's Lab has posted a range of technical specs for Intel's upcoming LGA-1851 socket and it covers everything from the pin-out to the mechanical characteristics of the new socket. The new socket is intended for Intel's 15th gen Arrow Lake S CPU. Raptor Lake refresh, which will launch as Intel's 14th gen—and last generation—Core i desktop processor, still uses LGA-1700. Although the new socket has additional pins, the physical size remains the same as the LGA-1700 sockets, so it's expected that current coolers will remain compatible with the LGA-1851 socket. However, the mounting pressure has almost doubled from 489.5 N to 923 N, suggesting that a different mounting kit might be needed.

What is more interesting with regards to the new socket is that Igor confirms that Intel will be adding four PCIe 5.0 lanes for a CPU connected NVMe SSD, but apparently Intel will also keep the current four PCIe 4.0 lanes for a second CPU connected NVMe SSD, not quite matching AMD's AM5 platform. It's likely that we'll see a similar segmentation like the one AMD has done, so only Z-series chipset motherboards will be able to take advantage of the PCIe 5.0 NVMe lanes, but it's possible some other chipset SKUs from Intel will enable PCIe 5.0 storage support as well.

EK, the renowned premium liquid cooling solutions manufacturer, introduces a brand-new high-performance CPU water block explicitly made for Intel LGA 1700 socket-based CPUs. This CPU block features a high-flow cooling engine and a dense microfin design that allows ample cooling even for the overclocked Intel Core i9-13900K processor.

EK-Pro CPU WB 1700 - Nickel + Inox
This is a dedicated enterprise-grade water block developed for Intel Core consumer processors based on the LGA 1700 socket. It features two standard G1/4" threaded ports on the top and is built with performance, reliability, serviceability, and no compromises in mind. This liquid cooling solution is intended for desktop PCs, workstations, and taller server racks. The water block's top is CNC-machined from durable black POM Acetal, while the hold-down bracket is made of laser-cut stainless steel.

Intel's Birch Stream-AP socket will provide an LGA7529 socket with as many as 7529 pins to power the next generation of CPUs. Today, thanks to Yuuki_Ans on Twitter, we have another set of pictures that highlight the massive scale that these processors offer. We got similar pictures in the past; however, these are more representative of how big the next-generation Xeon processors are. In 2024, Intel plans to split its Xeon lineup into E-core and P-core powered models. However, both CPUs will utilize the same platform to reduce the overall ecosystem's complexity. Thanks to the new pictures, we can see the processor with its heatsink present, with labeling indicating an engineering sample based on little info printed on the metal surface.

Below are the pictures of the Granite Rapids-AP and the LGA7529 socket, along with the specification table. The third image shows current generation Xeon Platinum processor in the LGA7529 socket.

A set of detailed photos has been uploaded to a blog on the Chinese Bilibili site, and the subject matter is an engineering sample of a motherboard that features Intel's next generation LGA 7529 socket. Specifications and photos relating to this platform have cropped up in the past, but the latest leak offers many new tidbits of information. The Bilibili blogger placed a Sapphire Rapids Xeon Processor on top of the the new socket, and this provides an interesting point of reference - it demonstrates the expansive physical footprint that the fifth-generation platform occupies on the board.

This year's Sapphire Rapids LGA 4677 (Socket E) is already considered to be a sizeable prospect - measuring at 61 × 82 mm. The upcoming Mountain Stream platform (LGA 7529) is absolutely huge in comparison, with eyeball estimates placing it possessing rough dimensions (including the retention arm) of 66 × 92.5 mm. The fifth generation platform is designed to run Intel's Granite Rapids and Sierra Forest CPUs - this family of Xeons featuring scalable microarchitecture is expected to launch in 2024. The code name "Avenue City" has been given to a reference platform that features a dual socket configuration.