Tuesday, July 18th 2023
Intel's Upcoming LGA-1851 Socket Detailed
Igor Wallossek over at Igor's Lab has posted a range of technical specs for Intel's upcoming LGA-1851 socket and it covers everything from the pin-out to the mechanical characteristics of the new socket. The new socket is intended for Intel's 15th gen Arrow Lake S CPU. Raptor Lake refresh, which will launch as Intel's 14th gen—and last generation—Core i desktop processor, still uses LGA-1700. Although the new socket has additional pins, the physical size remains the same as the LGA-1700 sockets, so it's expected that current coolers will remain compatible with the LGA-1851 socket. However, the mounting pressure has almost doubled from 489.5 N to 923 N, suggesting that a different mounting kit might be needed.
What is more interesting with regards to the new socket is that Igor confirms that Intel will be adding four PCIe 5.0 lanes for a CPU connected NVMe SSD, but apparently Intel will also keep the current four PCIe 4.0 lanes for a second CPU connected NVMe SSD, not quite matching AMD's AM5 platform. It's likely that we'll see a similar segmentation like the one AMD has done, so only Z-series chipset motherboards will be able to take advantage of the PCIe 5.0 NVMe lanes, but it's possible some other chipset SKUs from Intel will enable PCIe 5.0 storage support as well.
Source:
Igor's Lab
What is more interesting with regards to the new socket is that Igor confirms that Intel will be adding four PCIe 5.0 lanes for a CPU connected NVMe SSD, but apparently Intel will also keep the current four PCIe 4.0 lanes for a second CPU connected NVMe SSD, not quite matching AMD's AM5 platform. It's likely that we'll see a similar segmentation like the one AMD has done, so only Z-series chipset motherboards will be able to take advantage of the PCIe 5.0 NVMe lanes, but it's possible some other chipset SKUs from Intel will enable PCIe 5.0 storage support as well.
9 Comments on Intel's Upcoming LGA-1851 Socket Detailed
Which, reminds me of Nintendo's hardware strategy: Purposefully leave out expectant features, so you can sell another (revised) product, at a later date. :shadedshu:
Makes me wonder if AMD was similarly short-sighted and there'll be an AM5+ socket (ala AM2 - AM2+ - AM3)?
And then they'll surprise Pikatchu face in next quarters when market will contract further, everyone just accepting their old PC is actually just as good as the new, 50% more expensive one!
This is why it usually takes longer.
Heck frame generation was shown off in Star Wars the Force Unleashed 2 as a concept, yet as an actual tech we are only getting it now.
The mounting pressure was already high enough on LGA1700 to make me use the thermalright contact frame, it just felt like something would give with the amount of pressure needed (and probably would be the case with warp).
I think everyone understands that Intel has had some gigantic hiccups in their fabs business. Yes, TSMC now has a lead of easily half a decade (or more) and thus Intel can just barely compete in performance and not at all in efficiency.
Intel is limping behind by years. We get it. All of that is mostly understandable and sh*t happens in this extremely complex tech business.
However, if you can not compete on a leading edge level with regard to the chips/cores then the VERY LEAST you should try to do would be to take the lead in all other areas like I/O, QoL, usability, whatever. It would be incredibly disappointing if Intel would fall way behind in these other areas as well. What the actual f are they doing?