Three months ago, AMD unveiled its Ryzen Z2 APU series at CES 2025—purpose made for deployment in next-gen handheld gaming PCs. The officially announced flagship—Ryzen Z2 Extreme "Strix Point," utilizing Zen 5 and RDNA 3.5 technologies—was previously alluded to by leakers in late 2024; albeit with some curious claims regarding an "odd 3+5 core configuration." Last week, Hoang Anh Phu (@AnhPhuH) presented an alleged expanded lineup of Ryzen Z2 processors—headlined by a mysterious "Ryzen AI Z2 Extreme" SKU.

PC hardware watchdogs believe that this speculative variant will eventually arrive with an enabled XDNA 2 NPU (a first for the series); likely readied to take on Intel's Core Ultra 200V "Lunar Lake" processor family. MSI's Core Ultra 7 258V-powered Claw 8 AI+ and Claw 7 AI+ handhelds launched not too long ago, boasting all sorts of Microsoft Copilot+ capabilities. Mid-way through March, an Xbox executive introduced "Copilot for Gaming." Team Red and manufacturing partners are likely jumping onto this "AI gaming" bandwagon with the aforementioned "AI Ryzen Z2 Extreme" chip, as well as Phu's fanciful "Ryzen Z2 A" model. The latter could be a spin-off of AMD's vanilla Ryzen Z2 "Hawk Point" design, with a "switched on" XDNA NPU.

Successors to AMD's current-generation lineup of Ryzen 8000G desktop APUs are reportedly in the pipeline—according to the latest HXL/9550pro predictive declaration, finalized units could arrive at retail later this year. They propose that an "AMD AM5 New APU" family could arrive alongside an unannounced MSI Unify-X enthusiast-grade motherboard design, within the final quarter of 2025. Press interpretations of this inside track information point to possible upcoming "Ryzen 9000G" processors, utilizing Team Red's Zen 5 and RDNA 3.5 technologies. This potent combination already exists, albeit in mobile form—namely within Team Red's stable of Ryzen AI "Strix Halo, Strix Point," and "Krackan Point" APUs.

Industry experts opine that AMD will most likely deploy high-end "Strix Point" silicon to desktop, or more fancifully: "Gorgon Point." The latter codename turned up via leaks last week. Around early 2024, we witnessed Team Red's transfer of "Phoenix"—from original mobile formats—to their AM5 desktop platform. TechPowerUp's W1zzard evaluated the Ryzen 5 8500G "Phoenix 2" APU last summer; this plucky budget-friendly model sports Zen 4 and Zen 4c cores. Theoretically a flagship "Ryzen 9000G" SKU could emerge with twelve processor cores (4x "Zen 5" + 8x "Zen 5c"), a Radeon 890M iGPU, and an XDNA 2 NPU.

Shipping manifests have served as fairly reliable sources of pre-launch information—Everest (aka Olrak29) has discovered many juicy details in recent times. Their latest sleuthing session—combing through NBD documents—has indicated AMD's (alleged) prepping of a larger socket design for next-generation mobile processors. A leaked document alludes to the existence of various "MEDUSA01" jig and block "FP10" socket validation parts. Current-generation Ryzen AI "Strix Point" 300 series APUs utilize the FP8 socket format. Based on the "MEDUSA01" shipping manifest, it seems that a successor will arrive with a larger footprint—measurements of 25 mm x 42.5 mm are repeated throughout the leaked description list. Industry watchdogs surmise that "Medusa Point's" BGA FP10 socket will be approximately 6% larger than its predecessor.

Mid-way through last month, insider theorizations pointed to "Medusa Point" being a chiplet-based design. A "single 12-core Zen 6 CCD" was linked to a TSMC 3 nm-class node, with "N4P" reportedly selected for a separate mobile client I/O die. Readily available 4 nm Ryzen AI "Strix Point" processors are monolithic in nature. Initial inside track info mentioned RDNA 4 technology in the same equation as "Medusa Point," but recent Team Red's recent-ish targeting of "GFX1153" places RDNA 3.5 as the de facto choice.

Officially, NVIDIA has only revealed mobile variants of its GeForce RTX 50 "Blackwell" GPU series going down to RTX 5070. At CES 2025, Jensen Huang's keynote presentation proposed a $1299 entry point for GB206-equipped gaming laptops—rated up to 800 AI TOPS. As demonstrated by recent market trends, "MSRP" recommendations are widely viewed as whimsical recommendations (at best). Pre-orders for upper crust to mid-range GeForce RTX 50-series laptops opened up on February 25, but the missing ROP (Raster Operations Pipeline) problem has seemingly spread to Blackwell's mobile offshoot. Reports suggest that necessary investigations have pushed initial customer-bound deliveries into April. Presumably, unannounced lower end products—in GeForce RTX 5060 and RTX 5050 Mobile form—are similarly delayed.

Earlier today, momomo_us—a notable source of pre-launch information—unearthed an alleged "Razer-authored" new product document. The American-Singaporean brand appears to be preparing a multitude of Razer Blade 16 (2025) SKUs, with a series identified as "RZ09-0528." The leaked MSRP guide contains a major error; Razer's forthcoming flagship model—powered by an AMD Ryzen AI 9 HX 370 "Strix Point" APU and GeForce RTX 5090 Mobile GPU—will not arrive at retail/e-tail with a $1499 price tag. Focusing on the opposite end of Razer's chart, VideoCardz highlighted the $1999 OLED-equipped SKU—featuring a Ryzen AI 9 365 processor and Team Green's unannounced GeForce RTX 5060 Mobile GPU. The speculative steep asking price is not a big surprise, given the expected tagging on of Razer "premium tax." Mid-way through last week, "lowly" GeForce RTX 5050-powered laptops were accidentally listed by retail outlets. The cheapest offering was advertised with a $1720 (including VAT) price point—based on these recent (possibly unfinalized) data points, industry watchdogs have predicted steep asking prices for even the most basic of Blackwell mobile options.

Framework has finally introduced its next-generation Framework Laptop 13, now powered by the extremely potent Ryzen AI 300 "Strix Point" APUs. The product is already available for pre-order on Framework's website, with prices starting from $899 for the Do-It-Yourself variant, and $1,099 for the fully assembled variant. From the outside, the design of the product has been left mostly unchanged, which may appear somewhat disappointing at first, although an unaltered design likely indicates compatibility of components between the two laptops, which is undoubtedly one of the primary selling points for the Framework Laptop.

As mentioned, the biggest upgrade that the new Framework Laptop brings to the table is the new selection of processors, with the Ryzen AI 9 HX 370 APU sitting at the highest-end. Unsurprisingly, the Strix Point APUs allow for excellent performance improvements to both CPU and GPU side of things. With 12 cores (4 Zen 5 + 8 Zen 5c) and 24 threads, the highest-end Ryzen AI 9 HX 370 APU performs admirably well in benchmarks as well as real-life workloads. The Radeon 890M iGPU is among the fastest available on the market, trading blows with the Arc 140T iGPU in synthetic benchmarks. Of course, the 50 TOPS NPU allows for CoPilot functionality, for those who care. The Windows variant ships with a dedicated CoPilot key as well, while the DIY variant does not.

Navigating AMD's various modern processor model naming schemes is tricky business, and another layer of complexity has been added this week; with newly revealed "Strix Point" and "Krackan Point" CPUs. Three previously unannounced SKUs have appeared on AMD's Chinese website: Ryzen AI 9 H 365, Ryzen AI 7 H 350, and Ryzen AI 5 H 340. At first glance, these models codes seem to be familiar—after a double take, we see a small difference in nomenclature. The addition of a middle-placed/detached "H" has press outlets and hardware enthusiasts scratching their collective heads. After discovering Team Red's Ryzen AI 9 H 365 APU listing, Lonely City Hardware posted a humorous observation on social media: "for the Chinese market. No one can remember the full name."

Frustratingly, Western search engines (at the time of writing) just point you to the non-H equivalents. The "H" designation denotes Chinese market exclusivity; TechPowerUp has covered previous-generation examples in the recent past. When comparing technical details and specification sheets to Western equivalents, VideoCardz noted that there were no apparent differences—platform and packaging are the same (FP8). A cross-reference—of clock speeds, thermal ratings, and core architecture (Zen 5/Zen 5C)—points to spec parity across East and West variants.

Back in January, we covered a report about AMD designing its next-generation "Zen 6" CCDs on a 3 nm-class node by TSMC, and developing a new line of server and client I/O dies (cIOD and sIOD). The I/O die is a crucial piece of silicon that contains all the uncore components of the processor, including the memory controllers, the PCIe root complex, and Infinity Fabric interconnects to the CCDs and multi-socket connections. Back then it was reported that these new-generation I/O dies were being designed on the 4 nm silicon fabrication process, which was interpreted as being AMD's favorite 4 nm-class node, the TSMC N4P, on which the company builds everything from its current "Strix Point" mobile processors to the "Zen 5" CCDs. It turns out that AMD has other plans, and is exploring a 4 nm-class node by Samsung.

This node is very likely the Samsung 4LPP, also known as the SF4, which has been in mass-production since 2022. The table below shows how the SF4 compares with TSMC N4P and Intel 4, where it is shown striking a balance between the two. We have also added values for the TSMC N5 node from which the N4P is derived from, and you can see that the SF4 offers comparable transistor density to the N5, and is a significant improvement in transistor density over the TSMC N6, which AMD uses for its current generation of sIOD and cIOD. The new 4 nm node will allow AMD to reduce the TDP of the I/O die, implement a new power management solution, and more importantly, the need for a new I/O die is driven by the need for updated memory controllers that support higher DDR5 speeds and compatibility with new kinds of DIMMs, such as CUDIMMs, RDIMMs with RCDs, etc.

At some point this week, HP's North American online store was updated with new high-end EliteBooks that feature AMD Strix Point APUs. Three models appear to support up to 128 GB of LPDDR5X-8533 memory—these curious entries were highlighted by tech enthusiast Hoang Anh Phu (AnhPhuH). The advertised maximum 8533 MT/s transfer rate exceeds Team Red's official reference figure (7500 MT/s) for the EliteBook X G1a's Ryzen AI 9 HX 375 APU. Looking further up in the Team Red "Strix Point" product stack, we spotted their Ryzen AI 9 HX PRO 375 spec sheet boasting a maximum LPDDR5x transfer speed of 8000 MT/s. Press outlets have expressed doubt when analyzing three of HP's EliteBook X G1a SKUs. Theories point to product pages containing possible placeholder information, or inaccuracies.

Working with the belief that the specs are legit, AnhPhuH commented: "this is the first laptop featured with 128 GB LPDDR5x-8533 128-bit memory. That would mean it's using four 256 Gb x32 modules(?!). As far as I know, all three major DRAM manufacturers currently only have 128 Gb x32 modules...the EliteBook X G1a uses Strix Point, not Strix Halo, so it only pairs with four x32 modules (two 64-bit channels)." HP's web shop states that the EliteBook X G1a models are due to launch on March 14. We hope that further clarification and concrete specifications appear online closer to release time. Initial pricing starts at $2749 for the lowliest of the three "128 GB LPDDR5X-8533" equipped models. The agonizingly named flagship "HP EliteBook X G1a 14 inch Notebook Next Gen AI PC Wolf Pro Security Edition" offering comes in at an eye-watering $4299.

The AOKZOE A1 X was recently teased by its maker as a new AMD Strix Point-powered gaming handheld, featuring the commendably potent Ryzen AI 9 HX 370 APU with the equally admirable RDNA 3.5-based Radeon 890M iGPU. Details were scarce regarding the handheld, but now the company has shed some much-needed light on a few features of the upcoming handheld. We still do not have a clue as to when the handheld will finally see the light of day, or even an expected price bracket. Considering that AOKZOE is not nearly as well known as its competitors in this space, the A1 X can be expected to launch with a price tag that undercuts its rivals. Thanks to a previous teaser, already know that the A1 X will sport an 8-inch 120 Hz display with VRR support.

Addressing the features teased recently, AOKZOE has revealed that the handheld will sport a 72.7 Wh battery with support for bypass charging, allowing it to draw power directly without having to pass it through the battery, thereby increasing the battery's lifespan. Moreover, the A1 X will also sport MicroSD 4.0 support, allowing for transfer speeds of up to 300 MB/s. The handheld will sport dual USB4 ports, along with an OCuLink port which will allow for speedy eGPU connections for gaming sessions that demand more horsepower than the Radeon 890M can provide. Going by the shared images, the A1 X will also sport at least one USB-A port, which will surely come in handy when the need arises for additional peripherals.

Apple's M4 SoC was released to overwhelmingly positive reviews, particularly regarding the commendable performance and efficiency benefits it brought to the table. The chip first appeared in the OLED iPad Pro lineup last May, arriving in the company's MacBook Pro lineup only much later, giving Intel's Lunar Lake and AMD's Strix Point a run for their money. Now, it appears that the company is cognizant of the heat brought by AMD's Strix Halo, and has already commenced mass production for the first SoC in the M5 family - the vanilla M5, according to Korean news outlet ET News.

Just like last time, the M5 SoC has been repeatedly rumored to first arrive in the next-generation iPad Pro, scheduled to enter production sometime in the second half of this year. The MacBook Pro will likely be next-in-line for the M5 treatment, followed the rest of the lineup as per tradition. Interestingly, although Apple decided against using TSMC's 2 nm process for this year's chips, the higher-tier variants, including the M5 Pro and M5 Max are expected to utilize TSMC's SoIC-mH technology, allowing for vertical stacking of chips that should ideally benefit thermals, and possibly even allow for better and larger GPUs thanks to the separation of the CPU and GPU portions. Consequently, yields will also improve, which will allow Apple to bring costs down.

AMD today put out detailed guides on how to get DeepSeek R1 distilled reasoning models to run on Radeon RX graphics cards and Ryzen AI processors. The guide confirms that the new Ryzen AI Max "Strix Halo" processors come in hardwired to LPCAMM2 memory configurations of 32 GB, 64 GB, and 128 GB, and there won't be a 16 GB memory option for notebook manufacturers to cheap out with. The guide goes on to explain that "Strix Halo" will be able to locally accelerate DeepSeek-R1-Distill-Llama with 70 billion parameters on the 64 GB and 128 GB memory configurations of "Strix Halo" powered notebooks, while the 32 GB model should be able to run DeepSeek-R1-Distill-Qwen-32B. Ryzen AI "Strix Point" mobile processors should be capable of running DeepSeek-R1-Distill-Qwen-14B and DeepSeek-R1-Distill-Llama-14B on their RDNA 3.5 iGPUs and NPUs. Meanwhile, older generation processors based on "Phoenix Point" and "Hawk Point" chips should be capable of DeepSeek-R1-Distill-Llama-14B. The company recommends running all of the above distills in Q4 K M quantization.

Switching gears to the discrete graphics cards, and AMD is only recommending its Radeon RX 7000 series for now, since the RDNA 3 graphics architecture introduces AI accelerators. The flagship Radeon RX 7900 XTX is recommended for DeepSeek-R1-Distill-Qwen-32B distill, while all SKUs with 12 GB to 20 GB of memory—that's RX 7600 XT, RX 7700 XT, RX 7800 XT, RX 7900 GRE, and RX 7900 XT, are recommended till DeepSeek-R1-Distill-Qwen-14B. The mainstream RX 7600 with its 8 GB memory is only recommended till DeepSeek-R1-Distill-Llama-8B. You will need LM Studio 0.3.8 or later and Radeon Software Adrenalin 25.1.1 beta or later drivers. AMD put out first party LMStudio 0.3.8 tokens/second performance numbers for the RX 7900 XTX, comparing it with the NVIDIA GeForce RTX 4080 SUPER and the RTX 4090.

After several months of teasers, the Ayaneo 3 gaming handheld has finally witnessed its official launch. The product will be available with two APUs - the Ryzen 7 8840U for the entry variant, and the Ryzen AI 9 HX 370 for the high-end variant. The system can be equipped with up to 64 GB of LPDDR5X-7500 memory, and a whopping 4 TB of SSD storage. The handheld will also feature modular controllers, which can be detached with the click of a single button.

The Ayaneo 3 will also give customers the option to chose between an LCD or an OLED panel, and as VideoCardz notes, selecting the OLED option does not change the final price. As mentioned earlier, the system will be available with either a Zen 4 or a Zen 5 APU. The Strix Point variant leads the Hawk Point part by almost around 50% in multicore tests, and the HX 370's integrated Radeon 890M iGPU is somewhere around 25% more performant than the 8840U's Radeon 780M. Clearly, the performance gap between the two variants will be substantial.

Ayaneo has been teasing the Ayaneo 3 gaming handheld for what seems like an eternity now. The handheld was among the first to be powered by the Ryzen AI 9 HX 370 "Strix Point" APU with the extremely potent Radeon 890M iGPU, promising impressive performance potential. However, the 7-inch gaming handheld is yet to see the light of day, and we still have no clue when it finally will.

However, Ayaneo has gone ahead and teased the Ayaneo 3 once again, showing off a new colorway for the gaming handheld. This edition, dubbed "Retro Power", utilizes a beige-themed design with red accents on some of the controls. The device will also be available in black and white colorways, making the "Retro Power" variant a fun alternative for those who prefer something other than black or white for their handheld gaming console. That is, when the Ayaneo 3 finally ships, of course.

The Beelink SER9 Pro made headlines a few months ago as one of the first mini PCs with AMD's Strix Point APUs. Powered by the Ryzen AI 9 HX 370 APU with the powerful Radeon 890M iGPU, the SER9 Pro promised impressive performance and efficiency in a commendably compact form factor. Now, the brand has unveiled a new variant of the SER9 Pro, powered by the slightly less-powerful Ryzen AI 9 365 APU. This variant will likely be more affordable than its higher-tier sibling, which currently starts from $999 in the US.

The differences between the Ryzen AI HX 370 and the Ryzen AI 365 are actually more substantial than one might think. Both the APUs sport four Zen 5 cores, while the AI 365 gets only six Zen 5c cores compared to the HX 370's eight. The AI 365 also gets a 100 MHz lower boost clock, and a notably slower Radeon 880M iGPU with fewer shaders. Beelink had equipped the HX 370 variant with a 65 watt TDP, but has not disclosed the TDP value for the AI 365 variant yet. That said, going by synthetic benchmark scores, the Ryzen AI 9 365 variant will likely be roughly 20% and 10% slower in CPU and GPU performance respectively than the Ryzen AI HX 370 variant.

The market for gaming handhelds has been expanding at an unprecedented rate, largely thanks to the impressive performance and efficiency improvements brought to the table by modern APUs. AMD's Strix Point APUs are no exception, and are expected to power a multitude of high-end handhelds. Thanks to its 12 (4 Zen 5 + 8 Zen 5c) cores and RDNA 3.5-based Radeon 890M iGPU, the Ryzen AI 9 HX 370 is an impressive performer for sure. The chip can already be found in a plethora of gaming-oriented handhelds and laptops, and now a fresh offering from AOKZOE is poised to join the list.

Of course, AOKZOE is not nearly as well known as some of its competitors, such as GPD and Minisforum. AOKZOE has revealed only a single image for the product so far, and the differences between the A1, A1 Pro, and A1 X are expected to be minimal, at least on the outside. The company has revealed that the handheld will sport the aforementioned Strix Point flagship APU, along with an 8-inch display with a refresh rate of 120 Hz and a 72.7 Wh battery. These specifications are nothing extraordinary nowadays, and further details regarding the product, such as thermal performance, display quality, battery life, and the like can only be established with proper hands-on reviews. There are is no information on pricing or availability as of now, and more such details should become available as we inch closer to the A1 X's release.

The market for compact gaming handheld is expanding at an unprecedented rate, thanks to the popularity boom that handhelds have received in recent months. The GPD Win Min (2025) is one such offering, sitting alongside the rest of interesting gaming products that GPD is known for. The Win Mini is now available for pre-order on Indiegogo, with a starting price of $769 (backers only), and a retail price of $839. Of course, interested buyers are encouraged to be mindful of the risks associated with crowdfunding campaigns, although GPD has mostly had a complaint-free track record.

Unfortunately, and rather unsurprisingly, the entry-level variant does not ship with the latest AMD Strix Point chips, but rather the older Hawk Point offerings, specifically the Ryzen 7 8840U with the Radeon 780M iGPU with 12 CUs. The higher-tier variants ship with Strix Point APUs, starting at the Ryzen AI 9 HX 365 APU, going all the way up to the 12-core Ryzen AI 9 HX 370 with the powerful Radeon 890M iGPU. To accommodate the new APUs, GPD has reworked the thermals, and has added room for full-sized M.2 2280 SSD drives as well. The product packs hall-effect joysticks, plug-and-play grips, and a bunch of useful ports including USB4, USB 3.2 Type-C, an SD Card slot, an audio jack, as well as a good old USB-A port. The 7-inch 1080p display ramps up to 120 Hz, and the system can be equipped with up to 64 GB of memory and 2 TB of PCIe 4.0 storage, and a 44.24 Wh battery is also present.

At CES, AMD unleashed the much awaited Ryzen AI Max "Strix Halo" APUs with mammoth iGPUs, up to a whopping 40 CUs for the Radeon 8060S. These chips are powerful enough to not require discrete graphics at all, making them ideal for mini PCs, which lack the physical room for dedicated graphics. GMK appears to be among the first to announce a mini PC with the top-end Ryzen AI Max+ 395 APU, although any further details are under wraps as of now.

Unlike the Strix Point parts, Strix Halo abandons the smaller and more efficient Zen 5c cores for a Zen 5-only setup, with up to 16 Zen 5 cores for the highest-end Ryzen AI Max+ 395 SKU. This allows for some serious performance potential, with AMD promising substantially better performance than both Intel's Lunar Lake and Apple's M4 Pro, although it would be much fairer to compare Strix Halo to Apple's M4 Max, and Intel's Arrow Lake-H/X instead. Regardless, there is no denying Strix Halo APUs open up new doors in terms of performance for compact systems, the rest remains to be seen as and when the products reach reviewers.

We had a chance to get close and personal with the new ZOTAC ZONE GAMING prototype at the CES 2025 show. While it is not a final product, we had a chance to see it in action as it is a working prototype and thanks to updated hardware, it should provide much higher performance compared to the ZOTAC Zone that we had a chance to review last year.

The biggest update is the 4 nm Ryzen AI 9 HX 370 processor. The Strix Point architecture brings 12-core/24-thread CPU (four performance and eight efficiency) based on Zen 5 architecture, 24 MB of shared L3 cache and 1 MB of L2 cache per core. It also comes with Radeon 890M, a RDNA 3.5 architecture GPU with 16 Compute Units. ZOTAC also increased the amount of LPDDR5X RAM to 32 GB and raised M.2 2280 PCIe 4.0 SSD storage space to 1 TB. The Ryzen AI 9 HX 370 has a standard TDP of 28 W, and a configurable TDP between 15 W and 54 W, so it gives ZOTAC a lot of room to work with. It also features 50 TOPS XDNA NPU.

AMD today vastly fleshed out its mobile processor lineup with the introduction of two new processor lines besides the Ryzen AI Max 300 series. This includes the introduction of more processor models in the Ryzen AI 300 series that are powered by the "Strix Point" silicon, and the introduction of the Ryzen 200 series mobile processors, which are based on the older "Hawk Point" silicon. In 2024, AMD had debuted the Ryzen AI 300 series "Strix Point," but with just the top-end Ryzen AI 9 370 and 365, which came with maxed out 12-core/24-thread (4x Zen 5 + 8x Zen 5c) core configuration, and a maxed out iGPU with 16 CU. Today the company is introducing the Ryzen AI 7 350, the Ryzen AI 5 340, and their AMD PRO variants for commercial notebooks. Both the consumer and commercial parts have identical specs, except for the latter featuring the AMD PRO feature-set.

The Ryzen AI 7 350 comes with a CPU configuration of 8-core/16-thread (4x Zen 5 + 4x Zen 5c). All cores have a base frequency of 2.00 GHz, the Zen 5 cores boost up to 5.00 GHz. The iGPU on offer is the Radeon 860M, with 12 CU and an engine clock of up to 3.00 GHz. TDP is configurable between 15 W to 55 W. The Ryzen AI 5 340 comes with a 6-core/12-thread configuration (3x Zen 5 + 3x Zen 5c), and CPU clock speeds of 2.00 GHz base with 4.80 GHz boost achievable on the Zen 5 cores. The iGPU is heavily cut down, with just 4 CU available, and an iGPU engine clock of 2.90 GHz. Notebook designers can configure this chip with a wide power range from 15 W to 55 W. All four processor models mentioned above come with a Ryzen AI XDNA 2 NPU that's capable of 50 AI TOPS, which means they're all Microsoft Copilot+ AI PC logo eligible.

AMD at the 2025 International CES unveiled the Ryzen Z2 line of SoCs for gaming handhelds that combine an x86-64 based SoC with a customized version of Windows 11. This market segment is poised to heat up with the entry of the Intel Core Ultra 200V "Lunar Lake" processor, and so AMD is responding with its latest IP. The Ryzen Z2 series is based on the 4 nm "Strix Point" silicon, which combines "Zen 5" and "Zen 5c" CPU cores with a fairly large iGPU based on the new RDNA 3.5 graphics architecture that's optimized for LPDDR5X memory. AMD's engineering effort focused on modest CPU performance gains over the Ryzen Z1 "Phoenix Point," but significant graphics performance gains. The NPU is disabled on all models.

The "Strix Point" silicon physically features two CCX, one with four "Zen 5" cores sharing a 16 MB L3 cache, and the other with eight "Zen 5c" cores sharing an 8 MB L3 cache. The iGPU of "Strix Point" is based on RDNA 3.5, and comes with 16 CU (compute units), a step up from the 12 CU of "Phoenix Point." The series is led by the Ryzen Z2 Extreme, which features an 8-core/16-thread CPU configuration that probably consists of four "Zen 5" cores, four "Zen 5c" cores, and a maxed out iGPU with 16 CU. The chip has a cTDP range of 15 W to 35 W. The "Zen 5" cores boost up to 5.00 GHz.

AMD fans are undoubtedly on their toes to witness the performance improvements that Strix Halo is ready to bring forth. Unlike Strix Point, which utilizes a combination of Zen 5c and full-fat Zen 5 cores, Strix Halo will do away with the small cores for a Zen 5 "only" setup, allowing for substantially better multicore performance. Moreover, it is also widely expected that Strix Halo will boast chunky iGPUs that will bring the heat to entry-level and even some mid-range mobile GPUs, allowing Strix Halo systems to not require discrete graphics at all, with a prime example being the upcoming ROG Flow Z13 tablet.

As per recent reports, the upcoming Ryzen AI Max+ Pro 395 APU will sport an RDNA 3.5-based iGPU with a whopping 40 CUs, and will likely be branded as the Radeon 8060S. In a leaked Geekbench Vulkan benchmark, the Radeon 8060S managed to outpace the RTX 4060 Laptop dGPU in performance. However, according to yet another leaked benchmark, Passmark, the Radeon 8060S and the 32-CU 8050S scored 16,454 and 16,663 respectively - and no, that is not a typo. The 8060S with 40 CUs is marginally slower than the 8050S with 32 CUs, clearly indicating that the numbers are far from final. That said, performance in this range puts the Strix Halo APUs well below the RTX 4070 laptop GPU, and roughly the same as the RTX 3080 Laptop. Not bad for an iGPU, although it is almost certain that actual performance of the retail units will be higher, judging by the abnormally small delta between the 8050S and the 8060S.

AMD's recently announced Strix Point APU lineup has received favorable reviews from critics and consumers alike. Especially for SFF/Mini PC enthusiasts, Strix Point brings commendable efficiency and performance to the table - both of which are absolutely essential for a high-end mini PC. The GMK EVO-X1 is surely among those, and the system is now available for purchase from GMKTec's official online store.

The EVO X1 sports a 110.19 x 107.3 x 63.2 mm chassis, which is decently compact for its class. As mentioned previously, the system is powered by the 12-core (4x Zen 5 + 8x Zen 5c) Ryzen AI 9 HX 370 APU with the shockingly potent RDNA 3.5-based Radeon 890M iGPU with 16 CUs. For most CPU-centric workloads, the EVO X1 should easily suffice. The iGPU, as mentioned, is potent enough to handle most graphically demanding tasks, including some lightweight gaming, but expecting anything more from it would be futile. Thankfully, an OCuLink port is present, which should allow for extremely fast eGPU connections courtesy of its 64 Gbps bandwidth.

OneXPlayer has pulled back the veil on its G1 gaming notebook, and the product sure does look intriguing. Calling it a notebook might not even be fair, considering that its 8.8-inch display barely exceeds tablet territory. However, for lovers of compact gaming systems and handhelds, the G1 looks like it ticks many boxes, and its detachable keyboard is undoubtedly a welcome addition.

The system is powered by AMD's 12-core Ryzen AI 9 HX 370 "Strix Point" APU with 4 Zen 5 and 8 Zen 5c cores, along with a powerful Radeon 890M iGPU with 16 CUs based on the RDNA 3.5 architecture. The aforementioned 8.8-inch display is quite the looker as well, featuring a 2.5K resolution with a speedy 144 Hz refresh rate. At least on paper, it appears that the OneXPlayer G1 leaves very little room for complaint.

AMD's recently launched Strix Point lineup of high-end APUs boast truly impressive performance, even when configured with lower TDPs. As time goes on, more and more hardware brands are hitting the market with Strix Point-powered devices, and unsurprisingly, Aoostar does not wish to sit on the sidelines either.

The company has teased a yet-to-be announced mini PC, with Strix Point at its heart. Powered by the powerful Ryzen AI 9 HX 370 APU, the system will likely offer excellent performance, considering that Aoostar refuses to skimp on its cooling system. Thankfully, that does seem to be case, since Aoostar claims the upcoming mini PC will boast a vapor chamber cooling setup allowing the HX 370 to run at its maximum of 54 watts. For those out of the loop, here is a rundown of the HX 370's specifications: 12-core setup with 8 Zen 5c cores and 4 Zen 5 cores, Radeon 890M iGPU based on RDNA 3+, and a 50 TOPS XDNA 2 NPU to justify the "AI" branding.

GPD recently updated its Win 4 gaming handheld with Strix Point APUs, and has now seemingly turned its attention to the Win Max 2. The system is available on Indiegogo, with an estimated shipping time set for sometime this December. The Strix Point update will not only bring improved performance to the table, but also enhance overall energy efficiency, which is crucial for such compact form factors.

The Win Max 2 is now available with AMD's latest Ryzen AI 9 HX 370 APU "Strix Point" APU, although a "Hawk Point" variant with a Ryzen 7 8840U is also available. The Strix Point APU outperforms the Hawk Point APU in almost every possible way, with the 12-core HX 370 pulling ahead of the 8-core 8840U by almost 45% in multithreaded benchmarks. In graphics performance, the story is much the same, with the Radeon 890M iGPU leading the 780M by almost 25% in synthetic benchmarks.