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ADATA Reveals a New Perspective on the AI Era at CES 2025

The world's leading memory module and flash memory brand, ADATA Technology, will be participating in CES 2025 with its gaming brand XPG and industrial-grade embedded storage brand ADATA Industrial. ADATA will be bringing its theme of "Innovate for a Better Tomorrow" to the Venetian in Las Vegas, located at booth Titian #2204 from January 7th to 10th. An online exhibition will be launched during this period for consumers around the world to experience a full range of innovative products in real time.

This year, ADATA will present three exhibition zones, each with an overarching theme. The "Artificial Intelligence Computing Solutions Zone" will showcase XPG AICORE DDR5 R-DIMM overclocked memory and XPG LANCER CUDIMM RGB DDR5 gaming memory. Additional products in this zone include the XPG DEFENDER SFF small form factor commercial chassis and XPG EDGECORE TFX power supply, which are designed to meet the needs of edge computing systems and demonstrate ADATA's comprehensive investment in the evolution of the AI era. The "Innovative Technology and Smart Mobile Lifestyle Zone" will see the launch of multiple Gen 5 SSD cooling solutions and highlight the world's first eco-friendly XPG LANCER NEON RGB DDR5 gaming memory with PCB heat dissipating coating, creating a new benchmark for cooling and efficient data transfer in the high-speed storage industry. The "Xtreme Performance Gear Zone" will showcase highly efficient gaming systems, top-notch power supplies, and cooling solutions, taking gaming applications to a new level. Each exhibit combines innovative technologies and high-performance products, and consumers around the world can join online for a one of a kind experience!

OneXPlayer G1 Gaming Handheld Gets Early January Launch Date

We previously covered the announcement of the One-Netbook OneXPlayer G1, a hybrid handheld gaming laptop with a unique removable keyboard and trackpad module that hides PS Vita-like game controls, but a launch date for the Ryzen-powered Windows handheld was unknown until now. One-Netbook has now officially launched the Indiegogo crowdfunding page for the OneXPlayer G1, providing more details about the upcoming hybrid's launch configurations and confirming a January launch date. Still missing from the Indiegogo page, though, are any indications of pricing or memory configurations for the G1.

Notebookcheck also says it received confirmation from One-Netbook that the OneXPlayer G1 will launch on January 9, and that it will only be available initially via Indiegogo. As for launch configurations, the G1 will be equipped with an AMD Ryzen AI 9 HX 370, a 144 Hz, 8.8-inch, 2.5 K, IPS touchscreen display, and a 14,283 mAh battery. It will also offer OcuLink and dual USB4 ports, for enhanced connectivity and compatibility with a variety of eGPU solutions.

Mid-January Launches for AMD B850 and B840; and Intel B860 and H810 Motherboards

In the first week of the 2025 International CES, Intel and AMD are expected to expand their desktop processor product stacks, with the introduction of 65 W models; and with them, more affordable motherboard chipset models. AMD is expected to launch the AMD B850 and AMD B840; while Intel debuts the Intel B860 and H810. Board Channels, a site that tracks hardware launches at the retail channel level, says that AMD is expected to set January 15 as the market availability date for motherboards based on the AMD B850 and B840. The chipset will be announced at AMD's January 7th event.

Meanwhile, Intel is expected to announce its mid-range Intel B860 and entry-level Intel H810 on its own event slated for January 7, but with product availability on January 13. The AMD B850 is essentially a rebadged B650, but motherboard vendors can optionally enable Gen 5 PEG instead of Gen 4, at which point the platform would essentially be an AMD X870, but without the mandatory discrete USB4 host controller. The AMD B850 supports CPU overclocking. The AMD B840 lacks this, and is functionally similar to the AMD B550 chipset from the Socket AM4 platform, except that it lacks CPU overclocking support. Meanwhile, the Intel B860 is expected to feature a similar I/O as the Intel B760 from the Socket LGA1700 platform. The H810 is expected to be a lean entry-level option. Both the Intel B860 and H810 are expected to lack CPU overclocking support, but the B860 probably retains memory overclocking capability.

Minisforum V3 SE 3-in-1 Tablet Goes on Sale with Ryzen 7 APU

Minisforum is a consumer hardware brand that is well known for its impressive lineup of SFF/Mini PCs. However, what might not be as well-known, might be the fact that the brand also makes a plethora of other computing hardware and accessories. The company had recently announced the V3 and the more affordable V3 SE 3-in-1 tablet PCs with a design that is reminiscent of the Microsoft Surface. The V3 SE is now available to purchase, starting at $799.

At its heart, the Minisforum V3 SE is powered by the 28 W Ryzen 7735U "Rembrandt R" APU based on the Zen 3+ microarchitecture paired with 16 GB of LPDDR5-6400 memory. The APU is a decently powerful one, with multicore performance that is roughly in the same league as the Core Ultra 7 258V "Lunar Lake" processor. Unsurprisingly, any kind of discrete graphics is absent from the PC tablet, thereby making it rely solely on the 12-CU Radeon 680M iGPU for graphically demanding tasks. Storage is taken care of by its 1 TB M.2 SSD, which is housed in a 2280 slot.

Cable Matters Unveils Next-Gen Thunderbolt 5 Docking Station

Cable Matters Inc., a leading connectivity solutions provider, has announced the launch of its Thunderbolt 5 Docking Station, setting an important benchmark for speed, simplicity, and reliability, and offering unmatched performance for modern professionals, gamers, and content creators.

Utilizing Thunderbolt 5 technology, the docking station offers up to 120 Gbps of bandwidth-three times more than Thunderbolt 4-enabling ultra-fast data transfers and superior display experiences. It features an upstream Thunderbolt 5 port compatible with Thunderbolt 3, Thunderbolt 4, Thunderbolt 5, and USB4 based hosts, and three downstream Thunderbolt 5 ports for versatile connections to monitors, SSDs, and other devices. The downstream ports support up to three 8K@60 Hz monitors or two 8K@120 Hz displays for enhanced visual clarity, gameplay, and multitasking.

Western Digital Announces New SanDisk and WD_BLACK Products

Western Digital announced it has released several new Flash storage solutions to help pros and consumers get ready for the holidays. Whether looking for the perfect gift, or planning a new venture in the New Year, the innovative products from its award-winning SanDisk and WD_BLACK brands reach new levels of speed, reliability, and capacity, serving a diverse set of digital storage needs.

High Performance, Super Capacity Portable SSDs
The expanded SanDisk portfolio of portable SSDs includes two offerings that feature next-generation SSD speeds and help defy the limits of durability. The new drives are perfect for pros or creators and anyone else who needs to store large amounts of data on the go in the toughest of climates.

AOOSTAR Unveils XG76 and XG76 XT eGPUs with OCuLink, USB4 and Relatively Affordable Pricing

The prominent Chinese brand AOOSTAR has unveiled its XG lineup of RDNA 3-based eGPUs. Consisting of the XG76 and the XG76 XT, the eGPUs are powered by the AMD Radeon RX 7600M with 28 CUs and the desktop-class RX 7600 XT with 32 CUs respectively, both with a 150 W TDP. These GPUs are plenty performant, and are likely to offer respectable 1080p gaming performance.

Similar to offerings from competitors such as GPD and Ayaneo, the XG lineup features dock functionality as well. Both the variants sport USB4 connectivity with up to 100 W of power delivery. Display output is taken care of by the dual DisplayPort 2.0 ports, and a single HDMI 2.1 port. The system also rocks OCuLink support, allowing for a significantly lower performance hit when compared to Thunderbolt 4 or USB4.

Razer Launches its USB 4 Dock for Gaming and Productivity

Razer, the leading global lifestyle brand for gamers, further expands its line-up and affirms its foothold in PC accessories with the announcement of the new Razer USB 4 Dock. Engineered for superior performance, this dock represents a leap into the future of connectivity, combining high-speed data transfer and dual-display functionality to meet the demands of high-stakes gaming and intensive productivity.

"With the Razer USB 4 Dock, we're unleashing the next level of high-performance docking," Travis Furst, Head of Notebooks and Accessories at Razer. "This powerhouse is engineered to deliver blazing-fast data transfer and stunning dual-monitor 4K display output, all through a single cable solution to the laptop, making it the ultimate tool for gamers and professionals alike."

ASUSTOR Launches Flashstor Gen2 NAS Series Featuring AMD Quad-Core Ryzen Embedded CPUs

Following the enthusiastic market response and positive reviews of the revolutionary Flashstor series NAS, ASUSTOR Inc. has released all-new all-M.2 SSD NAS, the Flashstor Gen2 series, which includes both the Flashstor 6 Gen2 and Flashstor 12 Pro Gen2. The Flashstor Gen2 series brings radical hardware upgrades to meet the demands of enthusiasts and professionals. The Flashstor Gen2 series brand new hardware to achieve ultimate performance. The new Flashstor Gen2 series is powered by AMD's 6 nm Quad-Core Ryzen Embedded V3C14 which clocks up to 3.8 GHz. This new CPU delivers efficient, yet high performance, which along with high-speed I/O connectivity enables you to make the most out of your ASUSTOR NAS.

The Flashstor Gen2 series come with 10-Gigabit Ethernet, dual USB4 ports in an ASUSTOR first. USB4 is so fast, that it helps to fully unleash the high speeds offered by the M.2 SSDs. The USB4 ports are also compatible with Thunderbolt devices, as well as direct attach technology, extended possibilities that surpass the imagination of professionals and creators.

Other World Computing Launches OWC Thunderbolt 5 Hub

Other World Computing (OWC), a trusted leader in delivering high-performance, secure, and sustainable technology solutions that enhance and extend the life of Macs and PCs, today announced the general availability launch of the OWC Thunderbolt 5 Hub - opening a new world of workflow possibilities and performance. By turning a single cable connection into three Thunderbolt 5 ports and one USB-A port, the new OWC Thunderbolt 5 Hub breaks the connectivity handcuffs of host machines not offering enough Thunderbolt 5 ports. With up to 80 Gb/s of bidirectional data speed - up to 2x faster than Thunderbolt 4 and USB4 - and up to 120 Gb/s for higher display bandwidth needs, the OWC Thunderbolt 5 Hub redefines productivity. Connect portable SSDs exceeding 6000 MB/s, up to three 8K displays @60 Hz with DSC, today's USB-C connector compatible devices, and yesterday's USB-A desktop accessories - all while keeping modern notebooks and tablets powered and charged up for mobile use with 140 watts.

"The bidirectional bandwidth design of the OWC Thunderbolt 5 Hub enables users to send and receive data simultaneously - making it ideal for connecting high-res displays, SSDs, and more without compromising speed," said Larry O'Connor, Founder and CEO, Other World Computing (OWC). "With three additional Thunderbolt 5 ports, users gain the flexibility to power multiple displays or create complex daisy chains with ease. The hub's 140 W power delivery guarantees notebooks and tablets remain charged, no matter how demanding the workload."

Gigabyte Launches its first Mini-ITX X870 Motherboard, the X870I Aorus Pro Ice

When the initial batch of AMD X870/E motherboards were announced, there were no signs of Mini-ITX motherboards, but now Gigabyte has launched its first X870 Mini-ITX board and it's a bit of a hit and miss in our opinion. The X870I Aorus Pro Ice comes in white, as per the Ice moniker that Gigabyte likes to use for its white products and this might really appeal to some and put others off. Feature wise, we're looking at a single PCIe 5.0 x16 slot—as per most Mini-ITX boards—two NVMe M.2 slots, one PCIe 5.0 and one PCIe 4.0, but for some reason, Gigabyte decided that a single USB4 port was enough.

What makes the single USB4 port decision even worse is the fact that the board only has a USB 3.2 Gen 2 10 Gbps USB Type-C port and the front panel header is also limited to 10 Gbps. On a brand new board, this is really quite disappointing, but the Pro SKUs are usually feature limited models from Gigabyte. The rest of the ports around the back consists of an HDMI 2.1 port, although it too is limited to 4K 60 Hz output, which again is disappointing—the USB4 port is capable of 4K at 240 Hzvia DP Alt mode—two USB 3.2 Gen 2 10 Gbps USB Type-A ports, two USB 3.2 Gen 1 5 Gbps USB Type-A ports and two USB 2.0 Type-A ports, a 2.5 Gbps RJ45 Ethernet jack, a WiFi antenna connector for the onboard RTL8922AE WiFi 7 and Bluetooth 5.4 module and a pair of 3.5 mm audio jacks mounted on a separate PCB. There's also a BIOS flashing button around the back.

M31 Launches USB4 IP for TSMC 5 nm Process

M31 Technology Corporation, a leading global provider of silicon intellectual property (IP), today announced that its cutting-edge USB4 IP has achieved silicon validation on TSMC's 5 nm (N5) process. The newly validated IP enhances data transfer capabilities for a new wave of mobile and portable devices. The announcement coincides with M31's participation in TSMC's 2024 Open Innovation Platform (OIP) Ecosystem Forum in Taiwan. This milestone underscores the close collaboration between M31 and TSMC, reflecting M31's commitment to advancing high-performance IP solutions by leveraging TSMC's innovative platform to drive next-generation connectivity.

M31's USB4 IP is built on the latest USB4 specification and represents a major leap in the evolution of USB architecture. It supports multi-protocol tunneling, enabling simultaneous transmission of multiple data types—such as USB, DisplayPort, and PCIe—over a single connection. The USB4 IP achieves 40 Gbps data transfer rates, significantly enhancing bandwidth associated with previous USB standards. The IP is fully compatible with USB 3.2, USB 2.0, and Thunderbolt 3, ensuring seamless integration with existing and future devices.

OWC Unveils Thunderbolt 5 Solutions for New Mac Mini and MacBook Pro with M4

Other World Computing (OWC), a trusted leader in delivering high-performance, secure, and sustainable technology solutions that enhance and extend the life of Macs and PCs, today announced the full compatibility of its OWC Thunderbolt 5 innovations—including its OWC Envoy Ultra SSD and OWC Thunderbolt 5 (USB-C) Cables—with the latest Mac mini powered by the new M4 Pro chip and MacBook Pro powered by the M4 Pro and M4 Max family of chips. With these cutting-edge OWC solutions, Apple users are empowered to unlock the full potential of Thunderbolt 5, and enjoy a new era of speed, reliability, and connectivity.

"Thunderbolt 5 unlocks a new world of possibilities for users, and OWC is proud to be at the forefront of this exciting evolution," said Larry O'Connor, CEO and Founder, Other World Computing (OWC). "With the Envoy Ultra SSD and our Thunderbolt 5 cables, we're giving Mac Mini and MacBook Pro users the speed, reliability, and power they need to push their workflows further than ever before - whether they're editing 8K video, managing massive data sets, or just staying connected on the go." He continued, "And, don't blink - because OWC is set to roll out even more Thunderbolt 5 innovations, including the powerful OWC Thunderbolt 5 Hub, set for release in November."

Die-Shots of Intel Core Ultra "Arrow Lake-S" Surface, Thanks to ASUS

As Intel's Core Ultra "Arrow Lake-S" desktop processors near their launch, ASUS China put out a video presentation about its Z890 chipset motherboards ready for these processors, which included a technical run-down of Intel's first tile-based desktop processor, which included detailed die-shots of the various tiles. This is stuff that would require not just de-lidding the processor (removing the integrated heat-spreader), but also clearing up the top layers of the die to reveal the various components underneath.

The whole-chip die-shot gives us a bird's eye view of the four key logic tiles—Compute, Graphics, SoC, and I/O, sitting on top of the Foveros base tile. Our article from earlier this week goes into the die areas of the individual tiles, and the base tile. The Compute tile is built on the most advanced foundry node among the four tiles, the 3 nm TSMC N3B. Unlike the older generation "Raptor Lake-S" and "Alder Lake-S," the P-cores and E-core clusters aren't clumped into the two ends of the CPU complex. In "Arrow Lake-S," they follow a staggered layout, with a row of P-cores, followed by a row of E-core clusters, followed by two rows of P-cores, and then another row of E-core clusters, before the final row of P-cores, to achieve the total core-count of 8P+16E. This arrangement reduces concentration of heat when the P-cores are loaded (eg: when gaming), and ensures each E-core cluster is just one ringbus stop away from a P-core, which should improve thread-migration latencies. The central region of the tile has this ringbus, and 36 MB of L3 cache shared among the P-cores and E-core clusters.

ASUS Unveils ROG Maximus, ROG Strix, TUF Gaming, Prime, and ProArt Z890 Motherboards

ASUS today unveiled a lineup of Z890 motherboards from the ROG Maximus, ROG Strix, TUF Gaming, Prime and ProArt families, supporting Intel Core Ultra processors (Series 2). ASUS is marking the occasion with all-new motherboard features that accelerate performance and streamline the build process. ASUS AI Advisor is a new natural-language build assistant powered by AI. AEMP III, NitroPath DRAM Technology and DIMM Fit unleash DDR5 memory kits. NPU Boost provides overclocking of the integrated NPU in an Intel Core Ultra (Series 2) CPU for accelerated AI performancei. ROG M.2 PowerBoost provides more M.2 slots on a motherboard than ever before. On top of all that, there is Thunderbolt 5, WiFi 7 and new PC DIY features to discuss.

Primed to perform with Intel Core Ultra processors (Series 2) in a new socket
Intel Core Ultra processors (Series 2) use the new LGA 1851 socket. Users of these processors will need an Intel 800 series motherboard to use one, and a Z890 motherboard specifically to take advantage of CPU overclocking. These options feature up to 24 cores in a new disaggregated architecture. Performance-cores, aka P-cores, take center stage with their high clock rates, while a cluster of Efficient-cores, aka E-cores, provide high-end multithreaded performance.

COLORFUL Presents Intel Z890 Motherboard Lineup for the Intel Core Ultra 200 Series

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and HiFi audio products, introduces its lineup of Intel Z890 motherboards to the newly launched Intel Core Ultra 200 Series processors. The new Intel Z890 motherboards feature several technological improvement including 40 Gbps USB4 connectivity, Wi-Fi 7, and higher DDR5 memory support among others. Upon launch, COLORFUL presents seven Z890 motherboards designed to cater a wide range of users from casual desktop users to more demanding users such as gamers and content creators.

For high-end PC builders, COLORFUL introduces the iGame Z890 VULCAN X/W, iGame Z890 FLOW and iGame Z890 ULTRA motherboards. The iGame Z890 VULCAN X/W is the flagship motherboard, packed with premium features designed to deliver performance and aesthetics - available in black and white models. For mainstream users, the CVN Z890 ARK FROZEN, CVN Z890M GAMING FROZEN and BATTLE-AX Z890M-PLUS motherboard offer a great balance of features and latest technologies.

Gigabyte Unveils Ground Breaking Z890 Motherboards

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, today announced the launch of its revolutionary Z890 motherboards. These next-generation motherboards are set to redefine the standards in performance, AI integration, and user experience for enthusiasts and professionals alike. Powered by state-of-the-art artificial intelligence, these motherboards push the boundaries of what's possible in computing.⁠

Infinite Memory Performance
GIGABYTE Z890 lineup equips the D5 Bionic Corsa technology to create phenomenal new peaks in memory performance to DDR5 XMP 9500 and above. A true marvel of AI-enhanced overclocking technology for DDR5 memory, D5 Bionic Corsa boasts four key technologies from software, hardware to firmware side. The AORUS AI SNATCH and AI SNATCH Engine present AI-overclocking for ultimate performance, while AI-Driven PCB Design and HyperTune BIOS deliver AI-design for signal enhancement on motherboards. The AORUS AI SNATCH is an auto-overclocking software by AI model, and enables users to unleash utmost performance with one-click activation. The AI SNATCH Engine is the AI model served as the core of AORUS AI SNATCH software, trained by AI TOP on diverse overclocking datasets to improve precision and optimize performance with stability. The AI-Driven PCB Technology employs AI algorithms to optimize vias, routing and stackups, while the Hypertune BIOS uses AI to optimize MRC and adapt to signals for peak efficiency, significant memory clock boost, and enhanced overall performance.

USB4 2.0 Cables Capable of 80 Gbps Data and Power Delivery of 60 W and 240 W, Get Certified

With PC motherboard manufacturers implementing 40 Gbps USB4, one wonders what's next for the [mostly] universal connectivity standard. Turns out, it is USB4 2.0, which yields the connector 80 Gbps of data bandwidth per direction, and 60 W of power-delivery (PD). Power delivery for USB4 2.0 can be as high as 240 W (48 V, 5 A). Japanese PC peripherals maker Elecom is the first with certified cables for both 80 Gbps + 60 W PD and 80 Gbps + 240 W PD. Besides power and data, both cables support DisplayPort passthrough for up to 8K @ 60 Hz (7680 x 4320 pixels). USB-IF, the governing body of the USB standard, is expected to formally launch USB4 2.0 in December 2024. A typical USB4 2.0 host controller will require at least a PCI-Express 5.0 x4 system bus connection to reach the standard's maximum bandwidth.

AMD Announces New AGESA 1.2.0.2, 105W cTDP for 9700X and 9600X, Intercore Latency Improvements

AMD today made four key announcements for its Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture. These mainly aim to improve upon the products as originally launched in August. To begin with, AMD announced a 105 W cTDP (configurable TDP) mode for the Ryzen 7 9700X and Ryzen 7 9600X processors, with full warranty coverage. This setting can be enabled in the UEFI setup program of a motherboard running its latest version of UEFI firmware, which encapsulates the AGESA ComboAM5 PI 1.2.0.2 microcode. The setting raises the PPT (package power tracking) value of the 9700X and 9600X to 140 W, and treats them as if they were 105 W TDP processors. These chips were originally launched by AMD with 65 W (88 W PPT), and as reviewers quickly found out, unlocking power improves performance at stock clock speeds, as it improves boost frequency residence of these chips.

Next up, is the AGESA PI 1.2.0.2 microcode itself, which introduces the 105 W cTDP mode for the 9700X and 9600X along with warranty coverage, which we just talked about; plus works to improve the core-to-core latency on the Ryzen 9 9900X and Ryzen 9 9950X. These are processors with two CPU complex dies (CCDs), each with either 8 or 6 cores enabled. To the software, this is still a single-socket (1P) CPU with 12 or 16 cores. Although some awareness of the dual-CCD architecture is added to the OS scheduler to help it localize certain kinds of workloads (such as games) to a single CCD, reviewers noted that core-to-core latency on the dual-CCD chips was still too high, which should affect performance when a software's threads are migrating between cores, or if a workload is multithreaded, such as media encoding. AMD addressed exactly this with the new AGESA PI 1.2.0.2 update.

GIGABYTE X870E/X870 Motherboards Unleash the AI Performance, Infinite Power⁠

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, unveils cutting-edge AMD X870E/X870 motherboards. Designed with AI accelerated performance boost, premium thermal management, next-generation memory optimization, intuitive DIY-friendly features, state-of-the-art BIOS technology, GIGABYTE X870E/X870 motherboards maximize the capabilities of the latest AMD Ryzen 9000 series processors and power the gaming performance for AI era.

AORUS AI SNATCH
GIGABYTE X870E/X870 lineup boasts the innovative AORUS AI SNATCH, which can unleash ultimate performance with simple one click. Powered by an AI engine, the memory and system performance can be boosted with improved multitasking and overall system responsiveness. Users can overclock like an expert in a snap through simple interface while enjoy smart and safe overclocking. The AI processing is accelerated as well for better performance with optimal power efficiency.

ASRock Formally Launches its AMD X870E and X870 Chipset Motherboards

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, and gaming monitors, today announced a full line-up of flagship to mainstream motherboards using the AMD X870E/X870 series chipset, which is designed expressly for the latest AMD Ryzen 9000 series processors using AM5 socket. New motherboards include the flagship series X870E Taichi and Taichi Lite, newly introduced flagship Phantom Gaming X870E Nova WiFi, mainstream gaming X870 Riptide WiFi, plus the always popular X870 Steel Legend WiFi, X870 Pro RS and Pro RS WiFi, which are both now available in a white design.

All the new ASRock X870E/X870 motherboards, from the flagship Taichi series to the mainstream Steel Legend and Pro RS WiFi, feature a highly robust design for extreme performance. The Taichi series combines SPS Dr.MOS power delivery of up to 24+2+1 phases, server-grade 8-layer PCBs enabling excellent memory overclocking up to DDR5-8200, and exclusive low-ripple 1000μf 20K black capacitors that guarantee stable and superior performance for the CPU.

All-New MSI X870(E) Motherboards - Built to Dominate Next-Gen AI Computing

MSI unveils the X870E and X870 motherboards, designed to harness the full power of AMD's Ryzen 9000 Series desktop processors. The lineup includes four models: MEG X870E GODLIKE, MPG X870E CARBON WIFI, MAG X870 TOMAHAWK WIFI, and PRO X870-P WIFI. These motherboards deliver exceptional value and performance with cutting-edge features and exclusive MSI innovations. Offering top components, innovative features, and easy DIY options, MSI's X870E and X870 motherboards make building and using your PC seamless.

Introducing MSI's Ultra Connect feature in the X870E and X870 motherboards, offering next-gen networking, storage, and expansion. With built-in 5G LAN and Wi-Fi 7, users can enjoy lightning-fast speeds, reaching up to 5.8 Gbps. As well as TriLink Connectivity, Expansion is made to future-proof with PCIe Gen 5.0 for next-gen graphics cards and SSDs. The USB4 ports, which are Thunderbolt compatible, enable fast data transfers and support a wide range of next-gen devices, including display output through USB-C.

OWC Launches Envoy Ultra Thunderbolt 5 SSD with 120Gbps Bandwidth Boost Capability

Other World Computing (OWC), a trusted leader in delivering high-performance, secure, and sustainable technology solutions that enhance and extend the life of Macs and PCs, today announced the launch of the Envoy Ultra Thunderbolt 5 SSD - ready for pre-order today (shipping in October). Designed to maximize the performance of Mac and PC devices with Thunderbolt 5, Thunderbolt 4 Thunderbolt 3, and USB4, this groundbreaking SSD sets a new benchmark with revolutionary speeds exceeding 6000 MB/s—making it up to twice as fast as Thunderbolt 4 and USB4.

"Intel's innovative Thunderbolt 5 technology sets a new standard for performance and simple connectivity, and OWC's Envoy Ultra SSD is a perfect example of how this technology can be harnessed to meet the needs of today's most demanding users," said Larry O'Connor, Founder and CEO, Other World Computing (OWC). "OWC continues to push the boundaries of what's possible, delivering a solution that not only leverages the full potential of Thunderbolt 5 but also opens up new possibilities for professionals and creatives alike."

Parade Introduces PS9010 USB4 Dock Controller

Parade Technologies, a leading supplier of high-speed interface, video display, and touch controller ICs, proudly introduces the PS9010 USB4 dock controller as the newest member of Parade's USB4 product family. Designed to meet the rising demand for high-speed, multi-protocol connectivity, the PS9010 sets a new standard for USB4 peripheral controllers, offering unprecedented performance, versatility, and power efficiency.

The PS9010 is built to optimize the user experience in modern computing environments where high-bandwidth data transfers and display connections are critical. The chip seamlessly integrates support for USB4, Thunderbolt 3, DisplayPort 2.1, and SuperSpeed USB, ensuring compatibility with a wide range of devices and peripherals.

Acer Debuts Its First Handheld Gaming PC - the Nitro Blaze 7

Acer today announced its entry into the handheld gaming space with the launch of the new Acer Nitro Blaze 7 (GN771). The device combines cutting-edge technology and a compact design to always bring next-level gaming and entertainment within reach. Acer's first-generation handheld AI gaming PC features an AMD Ryzen 7 8840HS processor, with Ryzen AI that optimizes performance and responsiveness across a wide range of games and applications.

The design allows users to easily slip the device into their bags or pockets for instant playing time on the go. It features a 7-inch Full HD (FHD) IPS display with a touch interface, plus AMD FreeSync Premium technology, and a blazing-fast 144 Hz refresh rate. This allows players to experience enhanced visuals and responsive controls while playing their favorite AAA titles. The system runs on Windows 11 and features the new Acer Game Space application which supports the addition of games from multiple platforms.
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