Using new lows in core clock speeds, Intel is looking to give its upcoming Westmere-based Core i7 "Clarksfield" mobile quad-core processors surprisingly low rated TDPs. Apart from the rest of the known lineup of upcoming Intel processors, it is learned that Intel will initially have three mobile quad-core chips, all branded Core i7, and based on the 32 nm Clarksfield core. The three will include an Extreme Edition (XE) SKU. The clock speeds of these will be surprisingly low: ranged between 1.60 to 2.00 GHz, while having a high Turbo-Boost speed ranged between 2.80 to 3.20 GHz.

The Turbo-Boost speed is enabled when the processor powers-down some of its cores, and increases the clock speed of the cores that are available. In the process, power consumption is reduced. These chips have some very low TDPs that make them ideal for notebooks. The XE variant has a TDP of 55W, while the two lower models have rated TDP of 45W. The low-end model comes with 6 MB of L3 cache, while the higher two have 8 MB. All models have four cores with HyperThreading enabling 8 threads, and lack IGPs. They will run on the new PGA-G1 socket.

In related news, the first three Core i5/i7 "Lynnfield" processors come with rated TDP no higher than 95W. They come with Turbo-Boost Speeds ranging between 3.20 and 3.60 GHz.

Intel is on a golden path, showing no signs of a slowdown as far as technology development is concerned. After having pushed its 32 nm manufacturing node and its derived Westmere architecture to production grade, Intel seems to have already made a prototype on the 32 nm node, which will serve a technology leap on 32 nm. The company uses a "tick-tock" model of process development, where each processor architecture gets to be made in two manufacturing processes, while each process gets to build two succeeding architectures. The current Nehalem architecture meets 32 nm with the Westmere architecture, while the 32 nm node meets its next architecture with the SandyBridge.

SandyBridge is characterised by a larger level of integration of components. While Nehalem and Westmere "Lynnfield" and "Clarksfield" mainstream processors use a multi-chip module that holds the CPU and north-bridge dice, SandyBridge will see an integration of both into a monolithic, rectangular die spreading across an area of around 225 sq. mm. Significant portions of the die will be occupied with a DirectX 11-compliant integrated graphics processor, the "SandyBridge System Agent" (a component which includes a PCI-Express hub, and DMI. The L3 cache is the largest component on the die. It will have a large 256-bit ring-topology, which lets it not only perform cache operations, but also as a fast transport medium between the various components.

While the bulk of Intel's upcoming Nehalem and Westmere derived products include quad-core processors, the company hasn't left out dual-core processors just as yet. The dual-core Core i5 desktop processor will be based on the new Clarkdale core, built on the 32 nm Westmere architecture. Originally slated for a Q1 2010 launch, the new chip seems to have been pulled into the Q4 2009 launch schedule, deep enough to make for a significant amount of projected sales, according to sources in the Taiwanese motherboard industry.

The sales projections for Q4 look particularly interesting. Core i5 "Clarkdale" dual-core is projected to amount for 10% of Intel's sales, while Core i7 "Bloomfield" at 1%, Core i5 "Lynnfield" at 2% (Core i7 "Lynnfield" is slated for Q1 2010), Core 2 Quad at 9%, Core 2 Duo E7000/E8000 at 35%, Pentium E5000/E6000 at 31%, Celeron E3000 and Atom together at 9%, Pentium E2000 and Celeron 400 together at 4%. In the following quarter, Clarkdale's sales share is expected to rise to 20%. The numbers prove just how large the market for dual-core processors is, even four years into the introduction of quad-core chips.

Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, today announced a new study that indicates the end of the market for the popular integrated graphics chipset, known as the IGP.

After fifteen years of stellar growth the IGP will cease to exist, replaced by embedded graphics in the processor. Integrated graphics are used in desktop and net top PCs, notebooks, and netbooks, and various embedded systems such as point of sale, set-top boxes, and signage systems.

Intel today spread opens its plans to deal with the mainstream and value markets using its Nehalem micro-architecture. The company introduced to the media and analysts, its plans concerning the upcoming Westmere family of processors, a term used to describe Intel processors built using the company's 32 nm second-generation high-K silicon fabrication technology, while being based on the Nehalem micro-architecture. The presentation demystifies all confusion surrounding the company canning plans of dual-core 45 nm Nehalem-derivatives. The presentation also sheds light on what approach Intel plans to adopt with bringing the new architecture to the enterprise segment.