AMD recently announced its 3rd Gen Ryzen 3000XT "Matisse Refresh" processors, with July 7 availability, and it appears like samples of the processors already hit leaky taps on the web. TUM_APISAK discovered a Geekbench 5.1 submission of a Ryzen 9 3900XT 12-core/24-thread processor sample. The processor is paired with a GIGABYTE X570 AORUS Master motherboard and 16 GB of dual-channel DDR4-3600 memory. The 3900XT scores 10945 points in the multi-threaded test, and 1324 points in the single-threaded one; both of which are roughly 5% higher than those of the 3900X. The Geekbench score is indicative that AMD wants to slim the already single-digit percentage gaming performance gap with the Core i9-10900K, and extending its multi-threaded productivity performance lead on account of more cores/threads.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announce the latest BIOS update of AMD platform motherboards. To ensure users can embrace the performance boost, high compatibility, and high stability of 3rd Gen. AMD Ryzen XT Series desktop processors.

In order to furnish the best performance and user experience, AMD has been working closely with GIGABYTE and other motherboard vendors to provide BIOS code updates regularly for optimizing system performance or solving the issues verified by motherboard vendors. Adapted to the latest 3rd gen. are AMD Ryzen 9 3900XT,Ryzen 7 3800XT, Ryzen 5 3600XT processors. AMD provides AGESA ComboV2 1.0.0.2 BIOS for X570 and B550 chipset motherboards, and AGESA ComboV1 1.0.0.6 BIOS for X470, B450,X370, B350, and A320 chipsets products.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, proudly announced our high clock rate memory, the TOUGHRAM RGB DDR4 4600 MHz 16 GB Memory (2x8GB), which comes in both black and white versions. Besides the previous TOUGHRAM RGB 4000 MHz and TOUGHRAM RGB 4400 MHz Memory, we have now reached a new level, the TOUGHRAM line with a new higher clock rate of 4600 MHz in 16 GB (2x8GB) to ensure that we meet the users' needs. To provide high and stable gaming performance, all ICs are tightly-screened and coated with a ten-layer PCB.

Uniquely designed TT premium heat spreader with ten high lumens individual addressable LEDs not only dispatches heat faster but can allow users to show off 16.8 million colors with countless lighting combinations. Furthermore, users can use NeonMaker to customize and control the lighting effects, or even synchronized TOUGHRAM RGB DDR4 4600 MHz Memory with the TT RGB Plus software to maximize the control of RGB effects. TOUGHRAM RGB DDR4 4600 MHz Memory is also compatible with Intel Z490 and AMD X570 chipsets and supports Intel's XMP 2.0. If you're looking for high-quality, high functioning stable memory, choose TOUGHRAM RGB DDR4 4600 MHz.

AMD's 4th generation Ryzen "Renoir" desktop APUs, based on the "Zen 2" microarchitecture, could lack PCI-Express gen 4.0, hints the product page of an upcoming AMD B550 chipset motherboard by BIOSTAR. AMD already declared that the B550 lacks support for "Picasso," which means the "Ryzen with Radeon Vega Graphics" processors referenced in the BIOSTAR product page have to be "Renoir." On the mobile platform, Ryzen 4000H and 4000U series processors do lack PCIe gen 4.0, but it was expected that AMD will enable gen 4.0 for the desktop socket AM4 platform.

The lack of gen 4.0 support has implications for "Renoir." For starters, the APU, like its predecessors, spares only 8 PCIe lanes toward PEG (PCI-Express discrete graphics, or the main x16 slot you typically use for graphics cards). If these lanes are gen 3.0, then even the newer graphics cards, such as AMD's "Navi" RX 5700 XT, or next-gen GeForce "Ampere," would have to make do with a PCI-Express 3.0 x8 interface, despite being gen 4.0 x16-capable. We will test just how much of a bottleneck this poses, when the next-gen graphics cards come out.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, announced today the launch of AORUS RGB MEMORY 4400 MHz. The all new design memory kit features the highly-praised Hynix D die, providing high bandwidth and high performance of DDR4 XMP 4400 MHz under 8 GB x2 mainstream specifications with a friendly price tag. The AORUS RGB MEMORY 4400 MHz is qualified by the high-end platform of INTEL Z490 and AMD X570, offering distinguished quality and stability with a lifetime warranty. Through RGB 2.0 support, users can create personal stylish lighting among DRAM and system components with balance of performance, budget, and fashion.

Following the innovation of computer platforms, the support of high memory XMP increases as well. GIGABYTE AORUS RGB MEMORY has won most credits consistently from the industry, and brings extra to the plate with the latest AORUS RGB MEMORY 4400 MHz 16 GB, with the specification of 8 GB x2 DDR4 XMP 4400 MHz and 19-26-26-46 timing. AORUS RGB MEMORY 4400 MHz 16 GB adopts Hynix D die which is the latest optimized option that memory overclockers highly recommend, and chose this level of product when purchasing. GIGABYTE implements this high quality material on AORUS RGB MEMORY 4400 MHz memory for overclockers who chase high memory frequency and enthusiasts can take full advantage of the various performance boosts.

The Ryzen 3 3100 is turning out to be a fun little toy for enthusiasts. PC enthusiast TSAIK succeeded in overclocking it to 5923 MHz under extreme cooling. The chip was fed 1.45 Volts, and put under liquid nitrogen cooling, to achieve the feat. An MSI MAG X570 Tomahawk motherboard and a single stick of 8 GB memory underclocked to DDR4-1600 made the rest of the critical hardware. The feat is the second highest OC record for a "Zen 2" powered processor, next only to TSAIK's own speed record with the flagship Ryzen 9 3950X, which was pushed to 6041 MHz. Find the HWBot submission for the Ryzen 3 3100 speed record here.

MSI, a world-leading motherboard manufacturer, proudly introduces the all new X570 motherboard, MAG X570 TOMAHAWK WIFI. For the 3rd Gen Ryzen processors, the new MAG X570 TOMAHAWK WIFI motherboard is optimized with best performance in every aspects. Military totem style coupled with a rugged and powerful heat dissipation design, the MAG X570 TOMAHAWK WIFI successfully subverts all other key players in the mainstream market. The 12X60A SPS Power Stages design, can stably supply the performance needs of multi-core CPUs, supports up to AMD Ryzen 9 3950X 16-core processors.

Coupled with MSI's exclusive heat dissipation technology, Extended Heatsink design, MAG X570 TOMAHAWK WIFI can maintain a stable processing frequency under severe conditions with high loads. The exclusive Frozr Heatsink design has Zero Frozr Technology that stops the fan when the temperature of the chip is at low power, reducing the generated system fan.

ORIGIN PC is proud to announce the availability of a custom ORIGIN PC desktop powered by AMD Ryzen inside a Tesla Model S for kids called the LUDICROUS PC. Originally built for Marques Brownlee, also known as MKBHD, and inspired by his Tesla Model S, the LUDICROUS PC is a powerful gaming desktop featuring liquid cooling and is capable of being driven just like a normal Radio Flyer Tesla Model S. The LUDICROUS PC is available now on ORIGINPC.com with options to select the color and rims for the vehicle.

Designed by the ORIGIN PC team, the LUDICROUS PC is a special build that required some challenges to overcome such as airflow, fitting the PC parts inside the Tesla Model S for kids, and still maintaining the drivability of the car. The first LUDICROUS PC was engineered, built, and shipped to MKBHD late 2019 for the opening of his new studio in 2020. The LUDICROUS PC features working headlights, a horn, the capability of being driven forwards and backwards, and a remote that can turn the PC on.

Here are the first detailed die maps of the I/O controller dies of AMD's "Matisse" and "Rome" multi-chip modules that make up the company's 3rd generation Ryzen and 2nd generation EPYC processor families, respectively, by PC enthusiast and VLSI engineer "Nemez" aka @GPUsAreMagic on Twitter, with underlying die-shots by Fitzchens Fitz. The die maps of the "Matisse" cIOD in particular give us fascinating insights to how AMD designed the die to serve both as a cIOD and as an external FCH (AMD X570 and TRX40 chipsets). At the heart of both these chips' design effort is using highly configurable SerDes (serializer/deserializers) that can work as PCIe, SATA, USB 3, or other high-bandwidth serial interfaces, using a network of fabric switches and PHYs. This is how motherboard designers are able to configure the chipsets for the I/O they want for their specific board designs.

The "Matisse" cIOD has two x16 SerDes controllers and an I/O root hub, along with two configurable x16 SerDes PHYs, while the "Rome" sIOD has four times as many SerDes controllers, along with eight times as many PHYs. The "Castle Peak" cIOD (3rd gen Ryzen Threadripper) disables half the SerDes resources on the "Rome" sIOD, along with half as many memory controllers and PHYs, limiting it to 4-channel DDR4. The "Matisse" cIOD features two IFOP (Infinity Fabric over Package) links, wiring out to the two "Zen 2" CCDs (chiplets) on the MCM, while the "Rome" sIOD features eight such IFOP interfaces for up to eight CCDs, along with IFIS (Infinity Fabric Inter-Socket) links for 2P motherboards. Infinity Fabric internally connects all components on both IOD dies. Both dies are built on the 12 nm FinFET (12LP) silicon fabrication node at GlobalFoundries.

Intel's Core i7-7700K "Kaby Lake" quad-core processor may fall significantly behind its 9th generation successor and today's Ryzen 7 chips, but it remains a formidable piece of silicon for strictly-gaming builds. Can it be bested by a $120 AMD Ryzen 3 3300X? A leaked, alleged Cinebench R15 score suggests that something very fascinating is brewing at AMD. The score points to the i7-7700K having a single-thread score just 0.5 percent higher than the 3300X, which means the multi-threaded score of the 4-core/8-thread AMD chip could end up within striking distance of the i7-7700K.

If this holds up, then AMD has a shot at bringing i7-7700K levels of gaming performance down to $120 (SEP). That would have the potential to seriously disrupt the sub-$200 processor market for gamers, enabling them to build fairly powerful 1440p (or higher) gaming builds. The low price will also let builders allocate more money to the graphics card. Adding to its gaming credentials could be the fact that the "Matisse" MCM features PCI-Express gen 4.0 x16 when paired with an X570 or upcoming B550 chipset motherboard, as detailed in AMD's announcement of the processor. The Ryzen 3 3300 is a 4-core/8-thread processor based on the "Zen 2" microarchitecture, clocked at 3.80 GHz, with 4.30 GHz boost frequency, and featuring 18 MB of total cache. It is expected to be available from May 2020.

Bitspower today unveiled its Mono Block for the ASUS ROG Crosshair VIII Impact X570 motherboard. It is designed to cool the socket AM4 processor and CPU VRM of the Crosshair VIII Impact, with precisely-laid base-plate contact points for the board's 8+2 phase VRM and the processor. The block's primary material is nickel-plated copper, with mirror-finish at its base-plate contact points. It features a clear acrylic top with provision for an ARGB LED light strip. A micro-fin lattice is located over the CPU for heat-dissipation. The block measures 115 mm x 98 mm x 28 mm, and features standard G1/4" fittings. Available now, it is priced at USD $140.

The leading global motherboard, graphics card and mini PC manufacturer, ASRock, announces X570 Phantom Gaming-ITX/TB3 receives the Thunderbolt Host certification from Intel. It is the first Thunderbolt Certified AMD motherboard.

X570 Phantom Gaming-ITX/TB3 is the high-end Mini-ITX model in the ASRock X570 series motherboard which supports AMD Ryzen 2000 and 3000 series processors with AM4 socket. It is equipped with 10 power phase design (Dr.MOS) which provides completely smooth power delivery to the CPU to offer unmatched overclocking capabilities, and enhanced performance with the lowest temperature for advanced gamers. The key feature of this motherboard, Thunderbolt 3 technology, enables lightning-fast data bandwidth up to 40 Gbps, and can also provide both data and video transmission. Meanwhile, X570 Phantom Gaming-ITX/TB3 can connect up to six Thunderbolt 3 devices such as graphics card, hard disk or monitor simultaneously by means of Daisy Chain technology.

The Designare brand of motherboards by GIGABYTE target content creators, and the company is extending the brand to memory, with the new Designare Memory series. It debuts with a high-capacity 64 GB dual-channel memory kit using two 32 GB modules. The rationale behind these densities is that creators may need them to deal with large data-sets. These are not off-spec "double height" modules, but are common dual-rank modules that stick to JEDEC compatibility spec, and pack XMP profiles that can run them at DDR4-3200 with 16-18-18-38 timings at 1.35 V.

GIGABYTE has tested these modules to work on all of its AMD X570, AMD B450, AMD TRX40, Intel X299, and Intel Z390 motherboards. For X570 and B450, however, the company states that only 3rd generation "Matisse" processors can handle this memory density. In its compatibility testing, GIGABYTE used 18-19-19-39 timings. Physically, the Designare modules have regular 32 mm height, a black PCB, and aluminium heatspreaders. GIGABYTE is backing the modules with lifetime warranty. The company didn't reveal pricing.

Thanks to the findings of VideoCardz, we have information that GIGABYTE has listed its upcoming motherboards for AMD and Intel platforms. Starting with AMD's upcoming mid-range chipset, the B550 model is supposed to bring PCIe 4.0 connectivity options to lower-priced motherboard variants. So far, only high-end chipset versions like X570 had PCIe 4.0 support, while the mid-range option was lacking. GIGABYTE has prepared a total of six B550 AORUS models, along with a GAMING series which is supposed to be a tier below AORUS models. The B550 chipset will span all motherboard sizes, including ATX, Micro-ATX, and Mini-ITX.

In the EEC listing, GIGABYTE also submitted Intel's upcoming Z490 motherboards for Comet Lake-S CPUs. In the listing, we see a total of 15 motherboards listed with an unusable entry. Again the W480 chipset appears, which is meant to power workstation motherboards. This chipset will go inside a new motherboard lineup called the "VISION" series. While we don't know what this new series brings, we know that both the workstation enabled W480 chipset and regular Z490 chipset will be a part of it.

EK, the European premium liquid cooling gear manufacturer, is releasing a unique chipset water block made for Aorus motherboards based on AMD X570 chipset - the EK-Quantum Momentum Chipset Aorus X570. The EK-Quantum Momentum Chipset Aorus X570 water block completely replaces the PCH (chipset) heatsink and the small fan which is the primary source of the noise. This water block-based solution removes a moving part, thus providing a more long term solution with 0 noise and far superior thermal performance.

This chipset block is specifically made for the Gigabyte X570 Aorus Elite, Gigabyte X570 Aorus Ultra and Gigabyte X570 Aorus Master motherboards. The EK-Quantum Momentum Chipset Aorus X570 water block is made in Slovenia, Europe and is available for pre-order through EK Webshop and Partner Reseller Network. This Quantum Line water block will start shipping on the 22nd of January 2020 for €39.99.

The Tomahawk line of motherboards by MSI gained popularity in recent times on the back of high cost/performance and an aspirational feature-set for its price, but has seen competition from the likes of ASUS TUF Gaming. When MSI launched its AMD X570 chipset motherboards, a Tomahawk product was MIA. The company finally got around to one, with the MAG X570 Tomahawk Wi-Fi. In its product-stack, MSI appears to be positioning this product above the MPG X570 Gaming Plus, but a notch below the MPG X570 Gaming Edge Wi-Fi and the popular X570 Gaming Pro Carbon. The Tomahawk is equipped with a visibly bigger chipset fan-heatsink than the Gaming Plus, and a more powerful CPU VRM solution, with a 14-phase setup. You also get chunky VRM heatsinks, a metal I/O area shroud, and an integrated I/O shield.

The MAG Tomahawk X570 upstages competition with networking: 2.5 GbE wired Ethernet and 802.11ax (Wi-Fi 6). The 2.5 GbE interface is pulled by a Realtek 8125B-CG controller, while the WLAN is Intel AX200-family. Other noteworthy specs include two M.2 PCI-Express gen 4.0 slots with heatsinks on both; and a premium ALC1220-based onboard audio solution (which is a segment-first for the Arsenal Gaming series). The MAG Tomahawk X570 Wi-Fi will begin selling within Q1-2020, priced around $180.

EK, the European premium liquid cooling gear manufacturer, is releasing the eagerly awaited AMD AM4 socket based monoblock belonging to the Quantum Line of products, the EK-Quantum Momentum Aorus X570 Elite D-RGB. This monoblock is engineered specifically for the Gigabyte X570 Aorus Elite motherboards. The addressable D-RGB LED in the monoblock is compatible with RGB Fusion 2.0 Sync RGB control and offering a full lighting customization experience for every single diode at any given time.

This is a complete all-in-one (CPU and motherboard) liquid cooling solution for Ryzen AMD processors and the monoblock is compatible with the AM4 socketed Gigabyte X570 Aorus Elite motherboard.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories is pleased to announce that ADATA and XPG DDR4 memory modules are compatible with latest 3rd Gen AMD Ryzen and Ryzen Threadripper HEDT (High-end Desktop) platforms. Whether for creators that demand high-capacity modules or gamers and overclockers seeking high-performance modules, ADATA and XPG offer memory products that meet their specific needs.

ADATA and XPG have always strove to ensure high compatibility of their memory modules through the use of high-quality, rigorously tested IC chips and PCB boards. With the recent launch of AMD's most powerful desktop processors- Ryzen 9 3950X processor with X570 platform and AMD HEDT Ryzen Threadripper 3960X/3970X processor with TRX40 platform, ADATA's and XPG's commitment to high compatibility remains a key consideration, in addition to robust performance and sufficient capacity.

AMD X570 chipset is the industry's first PC platform core-logic to support PCI-Express gen 4.0, but has proven to be expensive and hot. Its 600-series chipset successor will be third-party sourced much like its 400-series predecessor, according to a MyDrivers report citing sources in the motherboard industry. AMD is reportedly sourcing its 500-series mid-range chipset, the B550, from ASMedia. The B550 uses PCI-Express 3.0 x4 as its chipset bus, and puts out eight PCIe gen 3.0 downstream general purpose lanes, however, B550 motherboards could still feature PCI-Express 4.0 x16 slots from the socket AM4 SoC (provided a 3rd gen Ryzen processor is installed), and at least one of the M.2 NVMe slots on B550 motherboards could have PCI-Express 4.0 x4, since they're wired to the SoC instead of the chipset.

The MyDrivers report predicts that the successor to X570, the supposed "X670," could be sourced from a third-party firm, much like the B550, and implement PCI-Express gen 4.0, not just as chipset-bus, but also putting out PCI-Express gen 4.0 general purpose lanes. A possible design goal of the X670 could be to implement PCIe gen 4.0 switching fabric without running too hot, resulting in a cooler chipset than can make do with fanless cooling solutions, much like the X470. AMD will continue to make "chipsets" in the form of I/O controller dies for use in its MCM processors, although the relatively low-margin motherboard chipset business could be axed.

Colorful Technology Company Limited, professional manufacturer of graphics cards, motherboards and high-performance storage solutions is thrilled to announce the latest product to join its CVN class of high-performance motherboards with the new CVN X570M GAMING Pro microATX motherboard. Building on the foundation of the first X570 Gaming Pro V14 motherboard, COLORFUL is offering the same level of quality and feature for those looking for a more compact build and the CVN X570M GAMING Pro makes that possible.

The CVN X570M GAMING Pro is ready for the future with support for AMD's new 7 nm processor based on their Zen 2 architecture while still supporting both 2nd-gen and 3rd-gen Ryzen products. This allows upgraders an easy path to step into modern hardware without spending more. Making its debut is PCIe 4.0 on this motherboard giving it extra bandwidth for high-speed connections with devices. The motherboard also comes rich with USB connectivity including USB 3.1 Gen 2.

EK, the European premium liquid cooling gear manufacturer, is releasing a new AMD AM4 socket based monoblock belonging to the Quantum Line of products, the EK-Quantum Momentum ROG Strix X570-E D-RGB. This monoblock is engineered specifically for the ROG Strix X570-E Gaming motherboard from ASUS. The addressable D-RGB LED in the monoblock is compatible with ASUS Aura Sync RGB control and offering a full lighting customization experience for every single diode at any given time.

AMD today announced four new desktop processors across three very diverse markets. To begin with, the company crowned its socket AM4 mainstream desktop platform with the mighty new Ryzen 9 3950X processor. Next up, it released its new baseline entry-level APU, the Athlon 3000G. Lastly, it detailed the 3rd generation Ryzen Threadripper HEDT processor family with two initial models, the Ryzen Threadripper 3960X and the flagship Ryzen Threadripper 3970X. The company also formally released its AGESA Combo PI 1.0.0.4B microcode, and with it, introduced a killer new feature for all "Zen 2" based Ryzen processors, called ECO Mode.

The Ryzen 9 3950X is a 16-core/32-thread processor in the AM4 package, compatible with all socket AM4 motherboards, provided they have the latest BIOS update with AGESA Combo PI 1.0.0.4B microcode. The processor comes with clock-speeds of 3.50 GHz base, with 4.70 GHz maximum boost frequency, and the same 105 W TDP as the 12-core Ryzen 9 3900X. With 512 KB of dedicated L2 cache per core, and 64 MB of shared L3 cache, the chip has a mammoth 72 MB of "total cache."

MSI, the world leading gaming motherboard manufacturer, takes initiative to release BIOS updates for AMD motherboards. This latest AMD Combo PI version 1.0.0.4 Patch B (SMU v46.54) has a massive improvement at all points concerning debugs and optimization for the previous version. Specifically, optimized system boot up procedure allows users to shorten boot time and speed up the boot process. Compared to previous 1.0.0.3 version, the boot speed entering into BIOS is faster by 20%.

At the moment, the BIOS for X570 motherboards will be ready for users to download and update in the end of October. The updated BIOS version supports Ryzen 5 2400G and Ryzen 3 2200G running in X570 platform. On the other hand, it also supports RAID function including SATA- and NVMe-based drives for X570 motherboards. We are still working hard on other existing lineup of 300- and 400-series motherboard and will be released soon in November.

On a charm offensive, motherboard maker BIOSTAR revealed that it will extend support for the upcoming 16-core Ryzen 9 3950X even to its cheapest motherboards based on AMD's entry-level A320 chipset. Support for the processor will be added through a UEFI firmware update that should go live on the company website soon, and downloadable from the support section of each motherboard's product page. BIOSTAR's list of motherboards for the 3950X includes almost its entire socket AM4 motherboard lineup, spanning the A320, B350, X370, B450, X470, and X570 chipsets. A spokesperson for BIOSTAR confirmed to us that this wasn't a typo on the company website.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is delighted to announce an extreme low-latency, high-speed DDR4 memory kit at DDR4-4000 CL15-16-16-36 in a 32 GB (8 GB x4) capacity configuration under the classic Trident Z and the RGB-enabled Trident Z Royal memory series. Once again, these extraordinary memory kits are manufactured using high-performance Samsung B-die ICs to achieve the world's lowest latency of CL15 at DDR4-4000.

At G.SKILL, we are always searching for the ultimate memory kit, tuned not only for speed, but also for efficiency. This means pushing for lower latency timings. Previously, the best CAS latency that memory kits at the DDR4-4000 level could achieve was at CL17. This is surpassed by the new DDR4-4000 CL15-16-16-36 32 GB (8 GB x4) memory kit running under 1.5 V, shown validated on the MSI MEG Z390 ACE motherboard and Intel Core i7-9700K processor in the screenshot below.