Possible launch SEP pricing of AMD's Ryzen 7000 series "Zen 4" desktop processors leaked to the web by Wccftech, which appear to be similar to those of the Ryzen 5000 "Zen 3" at launch. AMD will launch a slim set of four SKUs in its first round of these processors—the flagship Ryzen 9 7950X (16-core/32-thread), followed by the second-best Ryzen 9 7900X (12-core/24-thread), the Ryzen 7 7700X (8-core/16-thread), and the mid-range Ryzen 5 7600X (6-core/12-thread).

Apparently, the series debuts with the Ryzen 5 7600X at $299, or the same SEP of the Ryzen 5 5600X at launch. The Ryzen 7 7700X launches at $449. The Ryzen 9 7900X comes in at $549, and the flagship Ryzen 9 7950X at $799, which again, is identical to that of the 5950X. Besides processors, motherboard vendors are expected to launch their first Socket AM5 motherboards, debuting with the AMD X670E and X670 chipsets. There's talk of mid-range chipsets such as the B650 and B650E, but we haven't seen any confirmed products show up on motherboard vendors' websites, yet. Pre-launch pricing for the X670E and X670 put them at a significant premium over the current Socket AM4 flagship boards based on the X570. Besides processors and motherboards, we could see announcements from memory vendors launching their first DDR5 memory products to feature AMD EXPO technology.

AMD's upcoming launch of Ryzen 7000 series processors will bring an entirely new AM5 platform that will enable newer technologies and protocols. We have DDR5 memory and PCIe 5.0 connection with everything at level five. However, the upcoming chipsets AMD has designed to work alongside the new processors will be available in several variants. There will be regular X670 and B650 versions that support either a PCIe 5.0 GPU or a PCIe 5.0 M.2 NVIMe SSD. Today, we got a confirmation that not only the big X670 chipset has an "E" or "Extreme" version, but its smaller brother B650 as well. With X670E and B650E, users get both PCIe 5.0 connectivity for their GPU and M.2 NVIMe SSD. For more information, we have to wait for AMD's official launch information later today.

ASUS Republic of Gamers (ROG) today announced the latest gaming gear at Gamescom 2022, including the AMD X670E series motherboards, AIO coolers, PSU, displays, networking products, and peripherals. Along with these products, ROG released its first music single Reality, with vocals by renowned voice actor and musician Troy Baker, more commonly known for his roles in video games like The Last of Us and Uncharted series. An anime-inspired interactive 360° music video featuring the song is available on YouTube.

ROG Swift OLED PG42UQ / PG48UQ: The 42-inch ROG Swift OLED PG42UQ is designed for immersive desktop gaming and features 4K visuals at an overclocked 138 Hz refresh rate. The OLED panel ensures the deepest hues, as well as vibrant colors thanks to a 98% DCI-P3 color gamut and Delta E < 2 color difference. An ultrafast 0.1 ms (GTG) response time ensures great viewing and gaming experiences. The larger, 48-inch ROG Swift OLED PG48UQ is ideal for those looking to play their games on an even bigger scale. ROG OLED monitors include a custom heatsink that offers more surface area for heat exchange, resulting in up to 8% lower operating temperatures compared to ROG monitors without a heatsink to ensure better OLED performance and longevity.

ASUS today announced a new generation of AMD-based motherboards to accompany the ROG Crosshair X670E Extreme and support the latest Ryzen 7000 processors: the ROG Crosshair X670E Hero, the ROG Strix X670E-E Gaming WiFi, and the TUF Gaming X670E-Plus WiFi. Introducing the new generation of AMD ROG motherboards: the X670E series. Featuring support for DDR5 memory modules and PCIe 5.0 devices, the ROG Crosshair X670E Hero, ROG Strix X670E-E Gaming WiFi, and TUF Gaming X670E-Plus WiFi is equipped with improved bandwidth capabilities, stability, and overall connectivity.

All three boards feature the latest ASUS Q-Design innovations. The ROG Crosshair X670E Hero and ROG Strix X670E-E Gaming WiFi includes the PCIe Q-Release button, a feature that lets users release their graphics card from the PCIe slot with one press. In addition, all three featured motherboards will include the single-sided Q-DIMM latching design to ensure ease of installation and allowing memory sticks to hold firmly in place. Lastly, the boards include the M.2 Q-latch, allowing users to secure or loosen an M.2 drive with just their fingertips.

A bit late to the game compared to its competitors, MSI has finally published its product pages for three of its upcoming X670 and X670E motherboards. The three models are the MEG X670E ACE, the MPG X670E Carbon WiFi and the Pro X670-P WiFi. Earlier todaywe got a first hint with regards to the pricing of a couple of these boards and now we have most of the technical details with regards to the boards themselves. As with all other boardmakers, MSI hasn't revealed any information with regards to memory clocks and obviously no details about which CPUs will be supported. We already had a pretty good idea what to expect from these boards based on the details MSI released at Computex, but features like the power design weren't revealed at the time, nor did we get a very good look at the board.

The MEG X670E ACE appears to be MSI's high-end board for those that aren't interested in spending a small fortune on the Godlike board and it should cater to just about all needs. The board has a 22+2+1 phase power design and MSI is using a heatpipe as well as a stacked fin-array heatsink and a MOSFET backplate to help cool the oversized power circuitry. Other features include 10 Gbps Ethernet, although there is only one Ethernet interface, a DisplayPort 1.4 compatible USB-C 10 Gbps port (which was said to be DP 2.0 compliant at Computex), as well as two 20 Gbps USB-C ports around the back. USB4 is nowhere to be seen, but is most likely related to ASMedia being late to the game with its host controller. MSI has gone for a design where the x16 PCIe 5.0 lanes from the CPU are split between the first two PCIe x16 slots and the third slot is using four lanes of PCIe 5.0 from the CPU. The final four PCIe 5.0 lanes from the CPU are for one of the M.2 NVMe slots and the board has a further three M.2 PCIe 4.0 slots. On top of that, MSI also includes an M.2 Xpander-Z Gen5 Dual add-in card that can accept a further two PCIe 5.0 NVMe SSD at the cost of eight PCIe lanes from the GPU.

The first X670 motherboards from MSI have recently been listed for pre-order on several Italian sites before their official announcement. The two motherboards listed are the MSI PRO X670-P WIFI and the MPG X670E Carbon Wi-Fi with all the sites featuring the same product details and imagery but with varying pricing. The motherboards both include Wi-Fi 6 and 2.5 GbE LAN networking along with PCIe 5.0 storage while only the X670E Carbon will support PCIe 5.0 graphics cards. The X670E Carbon also includes upgraded power delivery circuitry with an 18+2 phase 90 A design versus 14+2 80 A on the PRO X670-P.

The three Italian retailers currently offering the boards for pre-order include the 22% Italian VAT in the price which we have deducted in the following prices. The MSI PRO X670-P WIFI is listed for between 307 EUR (315 USD) and 349 EUR (360 USD) while the MPG X670E Carbon Wi-Fi is available for 461 EUR (475 USD) and 525 EUR (540 USD). These prices would represent a significant increase from their equivalent X570 counterparts with even more expensive boards such as the MEG Ace and Godlike also expected to be released.

GIGABYTE today showed off its upcoming AMD X670E and X670 chipset-based Socket AM5 motherboard lineup for the Ryzen 7000-series "Zen 4" desktop processors due to launch in September. Given AMD's push for PCI-Express Gen 5 connectivity beyond just the PEG slot, the new X670E chipset, with multiple Gen 5 M.2 slots, covers the upper end of the GIGABYTE AORUS motherboard series, with the X670E AORUS Xtreme and the X670E AORUS Master. The lower-end of the lineup is based on the X670, with the AORUS Pro and AORUS Elite tiers.

Both the X670E and X670 offer at least one PCI-Express 5.0 x16 slot (which can be further split into two x8 Gen 5 slots); and at least one PCI-Express 5.0 x4 M.2 NVMe slot wired to the AM5 processor. The X670E is differentiated in having an additional Gen 5 M.2 slot that is wired to the SoC, besides downstream Gen 5 PCIe connectivity from the chipset. The AORUS Xtreme leads the pack with a monstrous 18-phase VRM that uses 105 A DrMOS, an 8-layer PCB, four Gen 5 M.2 slots, the highest-grade onboard audio with ESS-made headphones DAC, AQuantia 10 GbE, WiFi 6E, and a plethora of overclocker-friendly features.

Courtesy of Planet 3DNow! we now have an idea when AMD might be launching the Ryzen 7000-series of CPU's, as the site posted about an upcoming AMD event called Meet the Experts on Twitter. The event registration page reads "Supporting the recent launch of AMD Ryzen 7000 Series processors," which suggests that the new Ryzen 7000-series is likely to launch on or before the 4th of August. The event takes place at 11:00 in the morning, CDT (Central Daylight Time) or 16:00 UTC.

The event will showcase motherboards from AMD's partners and representatives from ASRock, ASUS, Biostar, Gigabyte and MSI will be attending the online event. There's still no mention of the B650E chipset, but apparently X670E and X670 products will be shown, but not even B650 at this point. Based on the short summary blurb, we're also likely to see a PCIe 5.0 NVMe SSD being shown off. AMD will obviously have a separate launch event for the Ryzen 7000-series, but if that will take place on the same day, or on a different date, is unknown at this point.

It would appear that we're slowly getting closer to the launch of AMD's AM5 platform, as ASRock just put up its first X670E motherboard on its website. The page still has very limited information and there's only a single picture of the motherboard, which is the same one that the company shared at Computex. However, we now get a few more details with regards to what to expect in terms of additional features. For starters, ASRock has gone for a 26-phase SPS Dr.MOS power design, which should be plenty even for the most avid overclocker. The board has a pair of PCIe 5.0 x16 slots that operate in dual x8 mode when both slots are used. In addition to this there are four M.2 slots, where ASRock has decided to call the CPU connected slot for Blazing, as it's PCIe 5.0, whereas the three PCIe 4.0 slots are using the Hyper name the company has used so far.

The board also has eight SATA ports, two Thunderbolt 4 ports, which apparently are USB4 certified as well and a header for a USB 3.2 Gen 2x2 (20 Gbps) case mounted port. Furthermore the board has five rear USB 3.2 Gen 2 (10 Gbps) USB-A ports around the back, plus three USB 3.2 Gen 1 (5 Gbps) ports and a further four via headers, as well as a single HDMI port of unknown version. ASRock has gone for an Intel Killer E3100G 2.5 Gbps Ethernet controller and an Intel Killer AX1675X WiFi 6E and Bluetooth card, with the combo having Killer DoubleShot Pro support. Finally audio is via a Realtek ALC4082 USB connected audio codec and an ESS Sabre 9218 DAC. Overall this looks like a pretty kitted out board without too much excessive bling and will hopefully be priced accordingly.

There has been a fair bit of confusion about AMD's upcoming AM5 platform when it comes to connectivity and we're going to break things down and explain what the difference is between the B650 and X670 boards. We're also going to cover the processor connectivity, since that's an integral part of any motherboard these days. All the information in this article is based on what we've been told by various sources during Computex.

The long awaited AMD AM5 platform is finally debut! ASRock reveals a series of motherboard based on the revolutionary AMD X670 chipset including X670E Taichi, X670E Steel Legend for the high end and enthusiasts & X670E PRO RS for the mainstream. The new motherboards are equipped with many exciting features and new technology such as PCIe 5.0 & DDR5 capability, the insane IO capability including the support of Thunderbolt 4.0 has pushed the X670 platform even further into high end desktop category, ASRock went all out on the VRM design too, with total of 26 phases SPS Dr.MOS design on the X670E Taichi, it is the most powerful AM5 product ASRock can offer, and on top of that, there's a special edition motherboard X670E Taichi Carrara to celebrate the 20th birthday of ASRock!

ASRock also announces a selection of fascinating new motherboard such as B660/H610M-ITX/eDP, a whole new concept of customization by allowing an actual monitor panel can be mounted on the side of the computer chassis, ASRock is now working closely with chassis manufacture such as, Cooler Master, InWin, Thermaltake and Silver Stone to make this revolutionary concept happen, opens up countless possibility to personalizing your own PC. Also, the Z690 PG Riptide NFT Edition, a very first motherboard, was co-designed by thousands of people from the communities. Moreover, a high-end work station motherboard WRX80 Creator giving uncompromised performance for all kinds of content creation.

Computex 2022 is what's being referred to as a hybrid show and although most of the motherboard manufacturers chose not to exhibit this year, Gigabyte was at the show and we got to take a closer look at its new AM5 motherboards. Gigabyte was only showing four models, but on the plus side, the staff at the booth was more than happy to share details about the boards with us. The four boards on display were the X670E Aorus Xtreme, the X670E Aorus Master, the X670E Aero D and the X670 Aorus Pro AX. Note that these were early board revision and the E is missing in the model name from three of the models, which suggests that AMD hadn't informed the board makers about this distinction between its chipsets until earlier this month when rumours about it started to appear online.

Gigabyte will have a full lineup of boards coming later this year when AMD launches its AM5 platform, although based on the information we were given, the majority of its boards will be based on the B650 chipset. We should point out that there will be high-end B650 motherboards that will be priced similar to lower-end X670 models, which means that buying AM5 motherboards will be highly dependent on what features you favour. Unfortunately no B650 motherboards were on display and we won't be sharing any details of these models at this time. As for the X670E versus X670 chipsets, as there are of course two per board, it seems like the difference comes down to PCIe 5.0 or PCIe 4.0 for the x16 PCIe slot as the major differentiator between Gigabyte's different SKUs.

AMD today unveiled its next-generation Ryzen 7000 desktop processors, based on the Socket AM5 desktop platform. The new Ryzen 7000 series processors introduce the new "Zen 4" microarchitecture, with the company claiming a 15% single-threaded uplift over "Zen 3" (16-core/32-thread Zen 4 processor prototype compared to a Ryzen 9 5950X). Other key specs about the architecture put out by AMD include a doubling in per-core L2 cache to 1 MB, up from 512 KB on all older versions of "Zen." The Ryzen 7000 desktop CPUs will boost to frequencies above 5.5 GHz. Based on the way AMD has worded their claims, it seems that the "+15%" number includes IPC gains, plus gains from higher clocks, plus what the DDR4 to DDR5 transition achieves. With Zen 4, AMD is introducing a new instruction set for AI compute acceleration. The transition to the LGA1718 Socket AM5 allows AMD to use next-generation I/O, including DDR5 memory, and PCI-Express Gen 5, both for the graphics card, and the M.2 NVMe slot attached to the CPU socket.

Much like Ryzen 3000 "Matisse," and Ryzen 5000 "Vermeer," the Ryzen 7000 "Raphael" desktop processor is a multi-chip module with up to two "Zen 4" CCDs (CPU core dies), and one I/O controller die. The CCDs are built on the 5 nm silicon fabrication process, while the I/O die is built on the 6 nm process, a significant upgrade from previous-generation I/O dies that were built on 12 nm. The leap to 5 nm for the CCD enables AMD to cram up to 16 "Zen 4" cores per socket, all of which are "performance" cores. The "Zen 4" CPU core is larger, on account of more number-crunching machinery to achieve the IPC increase and new instruction-sets, as well as the larger per-core L2 cache. The cIOD packs a pleasant surprise—an iGPU based on the RDNA2 graphics architecture! Now most Ryzen 7000 processors will pack integrated graphics, just like Intel Core desktop processors.

As Computex 2022 is largely an online event, MSI announced its upcoming AMD X670 and X670E boards shortly after AMD's keynote earlier today. Although the official press release didn't go into too many details, VideoCardz got their hands on more detailed information from MSI, which also brings some additional clarity to the platform as a whole. The most interesting slide is the one that lists the AM5 CPU's as having 28 PCIe 5.0 lanes, rather than the 24 PCIe lanes AMD mentioned in its presentation. This makes sense based on the fact that some X670/E boards have multiple PCIe 5.0 M.2 slots for NVMe drives. MSI's X670E Godlike and X670E Ace even feature three PCIe 5.0 x16 slots, although it's likely that this is in a x8/x8/x4 configuration, as these boards only have a single PCIe 5.0 M.2 slot. The same slide also mentions that all Raphael based CPUs will have support for HDMI 2.1 as well as DisplayPort 2.0, which will also work over USB Type-C Alt Mode. Interestingly it seems like not all AM5 CPUs will support DisplayPort 2.0, based on a footnote from MSI.

Other interesting titbits include a minimum CMOS chip size of 32 MB, which hopefully means we won't be seeing a repeat of the issue that the AM4 platform had, where AMD ran out of space for the AGESA, which led to multiple UEFI versions depending on the CPU used with the board. As far as MSI specific features goes, at least the high-end models will be getting eight to 10 layer PCBs and MSI will offer up to 24+2 power phases with improved heatsinks. MSI is also promising 60 W USB PD support for the front USB-C header. Just like ASUS, MSI will also offer an add-in card for more M.2 NVMe drives and MSI calls it the Xpander-Z Gen5 Dual. A common feature among all four boards is that they'll feature AMD's RZ616 WiFi 6E module, which is technically a MediaTek solution.

Although AMD didn't provide too many details during its Computex 2022 keynote speech about the upcoming AM5 platform, the company did announce that there will be at least three chipsets for the platform and showed pictures of some upcoming motherboards. ASUS has kindly filled in some more details about its upcoming ROG Crosshair X670E Extreme, which will be one of its higher-end models. Sadly the pictures posted are kind of tiny and the company didn't provide a shot of the rear I/O. That said, ASUS did point out some of its new features that we can expect to find on the ROG Crosshair X670E Extreme.

For starters, the board will have a pair of PCIe 5.0 x16 slots, although each slot is likely to only have eight lanes each, when both slots are in use, but ASUS doesn't mention any details here. The board has support for up to five M.2 NVMe SSDs, four of which support PCIe 5.0. Only two are onboard, with the other three being via ASUS' proprietary ROG PCIe 5.0 M.2 card and ROG GEN-Z.2 card. ASUS also promises USB4 support, as well as a USB 3.2 Gen 2x2 header with Quick Charge 4+ as well as up to 60 W charging support, for cases with a front USB-C port. On top of the rear I/O is an AniMe Matrix LED display that can be user customised.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced to present the latest gaming products at COMPUTEX 2022. The innovations include its flagship gaming solutions powered by Intel 12th gen processors. The perfect combination of the IF Design Awarded Z690 AORUS XTREME motherboard, high-end key components, and big size monitors provide remarkable gaming experience. The Project Stealth kit enables an easy and simple assembly experience with special interface and cables hidden design while further enhances the system airflow for optimized cooling effect. Meanwhile, the new gaming PC, Model S delivers powerful, cool, and silent operation even on 3A games with its slick and neat aesthetics.

Moreover, the latest AMD Socket AM5 motherboards including gaming series of X670 AORUS XTREME, MASTER, PRO AX and X670 AERO D for designers will be first exposed in this exhibition as well. Users can take a sneak peek at the advanced design and extensive features of PCIe 5.0 graphics slot, M.2 Gen5 interface, exclusive PCIe/M.2 EZ-latch on GIGABYTE motherboards.

We're expecting to see a wide range of AM5 motherboards next week during Computex, but we're already being treated to some early leaks ahead of the show. The most recent leak was picked up by @9550pro on Twitter, but was originally posted on Baidu. What we're looking at here though, isn't actually a picture of a motherboard, but rather the placement map for the SMD components used during motherboard assembly. These pictures are often used to make sure things like the solder mask and components were applied properly during production. However, it does give us a good look at the overall layout of the ASUS X670 Prime-P WiFi and the fact that the X670 chipset does indeed consist of two parts. What is also clear is that we're looking at a PCIe 5.0 x16 slot here, as these slots are SMD components rather than through hole.

Other things that are clearly visible, includes support for three M.2 slots, of which the one closest to the CPU might be PCIe 5.0, but there's really no way of telling by just looking at the connector placement. There's also a space for a WiFi module at the bottom of the rear I/O, but beyond that, it's hard to make out the proper port layout. However, there appears to be at least one USB-C port at the rear, as well as a header for another one at the front of the motherboard, next to a USB 3.0 header. The board also appears to feature 14 power phases and obviously four DDR5 DIMM slots. The chip between the two chipsets are either a Super I/O chip or possibly a PCIe redriver. In addition to the x16 PCIe 5.0 slot, the X670 Prime-P appears to be getting a single PCIe x1 slot and two PCIe x4 slots, both which appear to get physical x16 slots. Finally the board should have two SATA ports mounted at a 90-degree angle, as well as four ports at the bottom edge of the PCB. ASUS seems to have gone for a solar system pattern on the PCB itself, so it'll be interesting to see what the actual boards will look like.

It appears that ASRock got a little bit too excited and posted a Computex video earlier today that contained a brief glimpse of its upcoming X670E Taichi motherboard. The screenshot that was captured by Wccftech doesn't give away too much details, but the board appears to have at least three M.2 slots and a pair of PCIe x16 slots, of which at least one is meant to be of the PCIe 5.0 variety. The rest of the board is covered in heatsinks and various shrouds. The board will feature Realtek's ALC4082 USB attached audio codec, as well as a ESS ES9218 DAC. It is also said to sport a 26-phase VRM setup. The board is also expected to have Thunderbolt 4 support. The video has unfortunately been taken down, so we'll have to wait until next week to find out more details.

In related news, @momomo_us has leaked details of several upcoming AM5 motherboards, of which four models are from ASRock and two from ASUS. The ASRock models are the X670E Taichi mentioned above, the X670 PG Riptide, X670 Phantom Gaming 4 and the X670 Steel Legend. The two ASUS models are the ProArt X670E-Creator WiFi and the ProArt B650-Creator. Finally Gigabyte has revealed that the company will be displaying its X670 Aorus Xtreme, X670 Master, X670 Pro AX and X670 AERO D at Computex next week. The company mentions PCIe 5.0 for both graphics and the M.2 interface, which pretty much cements the earlier rumors about AMD offering PCIe 5.0 support for the M.2 interface on the AM5 platform.

AMD is preparing to launch its highly-anticipated AM5 socket for the next generation of motherboards. And today, thanks to the sources over at Tom's Hardware, we have information regarding memory support for B650 and X670 motherboards. According to the report, both B650 and X670 chipsets will limit the user's memory option to the latest DDR5 memory standard, making it impossible for users with already existing DDR4 memory to perform a seamless upgrade to a new platform. So far, we don't have a lot of details about Zen4's integrated memory controller, and we can't be certain if it supports DDR5 only or carries legacy DDR4 support. However, it seems like B650 and X670 motherboards will have no plans to enable the DDR4 standard memory usage.

Additionally, the report confirms that the B650 chipset is connected to the AM5 socket via PCIe 4.0 x4 connection and has eight lanes of PCIe 4.0 (four of which are for M.2 SSD), four SATA, and lots of USB ports. Documents suggest that the chipset-socket connection is available using PCIe 5.0 for some AM5 processors, so we have to wait and see how it works. As far as high-end X670 is concerned, this chipset is a combination of two chipset dies, presumably a combination of two B650 modules. This doesn't work as the older north/southbridge type of a solution but rather doubled connectivity of a single B650 chipset. We have to wait for the official launch to confirm this information.

As we approach the next generation of AMD's Ryzen processors, accompanying chipsets will follow the launch of their main co-host device. Enabling different levels of features across the new processor generation, chipset versions are limiting the number of options a platform offers to the end-user. AMD is designing its motherboard chipsets in collaboration with a Taiwanese design firm ASMedia. They usually develop a few chipset types covering low-end, middle-end, and high-end motherboards segments. However, it seems like the high-end motherboard segment could be populated with the same silicon as the middle-end section of the chipset stack; note a few Chinese forum members on BiliBili.

As they note, the high-end AMD X670 chipset could be a multi-chip module (MCM) design incorporating two middle-end B650 chipsets. A combination of two B650 dies is allegedly forming an X670 chipset, and that is what AMD could force motherboard makers to use. By doing so, the Mini-ITX motherboard form factor could be challenging to design and manufacture, meaning that the package of the X670 chipset could be rather extensive. This rumor should, of course, be taken with a massive grain of salt as we don't know how this would function. However, it financially makes sense as AMD wouldn't need to design and request manufacturing for an additional chipset variant.

We've known since last week that AMD's upcoming desktop processor socket, AM5, will be a land-grid array (LGA), much like Intel's desktop sockets; and today we have a first-look at what the land-grid will look like, courtesy of ExecutableFix, who first broke news of AM5 being an LGA of 1,718 pins. Below is a render of the AM5 contact pad (the underside of the processor). The 1,718 contacts span across the fiberglass substrate, with no socket island in the middle for ancillaries. All electrical ancillaries are located on the obverse side of the substrate, surrounding the die(s). The substrate area will remain 40 mm x 40 mm, so the processor package will be roughly of the same size as AM4. In comparison, Intel's upcoming LGA1700 package is expected to measure 37.5 mm x 45 mm (a rectangular substrate).

ExecutableFix put out a handful more details about the I/O of this socket. Apparently, AM5 is a pure-DDR5 platform, with no backwards compatibility with DDR4. The socket features a dual-channel DDR5 memory interface. The PCI-Express interface is PCI-Express 4.0, with the socket putting out 28 lanes in total. 16 of these go to the PEG slot(s), four to an M.2 NVMe slot, and possibly the remaining eight as chipset bus. Considering these are Gen 4, the next-generation X670 (X570 successor) chipset could have double the chipset-bus bandwidth compared to Intel Z590. A typical Socket AM5 chip, such as "Rembrandt," could feature a TDP of 120 W, going up to 170 W, according to the source.

AMD X570 chipset is the industry's first PC platform core-logic to support PCI-Express gen 4.0, but has proven to be expensive and hot. Its 600-series chipset successor will be third-party sourced much like its 400-series predecessor, according to a MyDrivers report citing sources in the motherboard industry. AMD is reportedly sourcing its 500-series mid-range chipset, the B550, from ASMedia. The B550 uses PCI-Express 3.0 x4 as its chipset bus, and puts out eight PCIe gen 3.0 downstream general purpose lanes, however, B550 motherboards could still feature PCI-Express 4.0 x16 slots from the socket AM4 SoC (provided a 3rd gen Ryzen processor is installed), and at least one of the M.2 NVMe slots on B550 motherboards could have PCI-Express 4.0 x4, since they're wired to the SoC instead of the chipset.

The MyDrivers report predicts that the successor to X570, the supposed "X670," could be sourced from a third-party firm, much like the B550, and implement PCI-Express gen 4.0, not just as chipset-bus, but also putting out PCI-Express gen 4.0 general purpose lanes. A possible design goal of the X670 could be to implement PCIe gen 4.0 switching fabric without running too hot, resulting in a cooler chipset than can make do with fanless cooling solutions, much like the X470. AMD will continue to make "chipsets" in the form of I/O controller dies for use in its MCM processors, although the relatively low-margin motherboard chipset business could be axed.