AMD today made four key announcements for its Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture. These mainly aim to improve upon the products as originally launched in August. To begin with, AMD announced a 105 W cTDP (configurable TDP) mode for the Ryzen 7 9700X and Ryzen 7 9600X processors, with full warranty coverage. This setting can be enabled in the UEFI setup program of a motherboard running its latest version of UEFI firmware, which encapsulates the AGESA ComboAM5 PI 1.2.0.2 microcode. The setting raises the PPT (package power tracking) value of the 9700X and 9600X to 140 W, and treats them as if they were 105 W TDP processors. These chips were originally launched by AMD with 65 W (88 W PPT), and as reviewers quickly found out, unlocking power improves performance at stock clock speeds, as it improves boost frequency residence of these chips.

Next up, is the AGESA PI 1.2.0.2 microcode itself, which introduces the 105 W cTDP mode for the 9700X and 9600X along with warranty coverage, which we just talked about; plus works to improve the core-to-core latency on the Ryzen 9 9900X and Ryzen 9 9950X. These are processors with two CPU complex dies (CCDs), each with either 8 or 6 cores enabled. To the software, this is still a single-socket (1P) CPU with 12 or 16 cores. Although some awareness of the dual-CCD architecture is added to the OS scheduler to help it localize certain kinds of workloads (such as games) to a single CCD, reviewers noted that core-to-core latency on the dual-CCD chips was still too high, which should affect performance when a software's threads are migrating between cores, or if a workload is multithreaded, such as media encoding. AMD addressed exactly this with the new AGESA PI 1.2.0.2 update.

Major AMD partners like ASUS, ASRock, GIGABYTE, and MSI have unveiled their latest AMD AM5 motherboards featuring the X870E and X870 chipsets. The new motherboards offer broad compatibility, supporting not only the latest AMD Ryzen 9000 series, but also the Ryzen 8000 and 7000 CPUs. These boards are aimed at high-end and enthusiast users, sporting optimized VRM designs and enhanced I/O capabilities, including WiFi 7 and USB 4 support.

The motherboards are all in ATX format; however, mATX/ITX models should follow later this year. They all support DDR5-5600 MT/s memory speeds natively, with some models supporting over 8000 MT/s memory speeds. In terms of chipset, the X870E series uses two Promontory 21 dies with support for USB 4 and Gen 5 GPU/SSD (24x Gen 5 CPU Lanes, 8x Gen 4 + 12x Gen 3 PCH Lanes). The X870 will use just one of the dies, retaining the Gen 5 lanes, however the PCH Lanes will be limited to 4x Gen 4 + 8x Gen 3.

NZXT, a leader in PC gaming components, gear, and prebuilt gaming systems, is excited to announce the N9 X870E ATX motherboard, optimized for the new "Zen 5" architecture based AMD Ryzen 9000 series desktop processors. NZXT's latest motherboard combines high-performance features with a stunning new look that is geared towards enthusiast PC gamers building a high-end AMD system.

The N9 X870E boasts overclocking-ready power delivery and optimized thermals, providing gamers with the tools and headroom to overclock their AMD Ryzen 9000, 8000 or 7000 series processors and memory to their highest levels of performance. Additionally, the N9 X870E ensures prolonged compatibility with future and previous generations of Ryzen processors, thanks to AMD's commitment to support the AM5 platform until 2027+.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, unveils cutting-edge AMD X870E/X870 motherboards. Designed with AI accelerated performance boost, premium thermal management, next-generation memory optimization, intuitive DIY-friendly features, state-of-the-art BIOS technology, GIGABYTE X870E/X870 motherboards maximize the capabilities of the latest AMD Ryzen 9000 series processors and power the gaming performance for AI era.

AORUS AI SNATCH
GIGABYTE X870E/X870 lineup boasts the innovative AORUS AI SNATCH, which can unleash ultimate performance with simple one click. Powered by an AI engine, the memory and system performance can be boosted with improved multitasking and overall system responsiveness. Users can overclock like an expert in a snap through simple interface while enjoy smart and safe overclocking. The AI processing is accelerated as well for better performance with optimal power efficiency.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to showcase an incredibly high-speed overclock of G.SKILL DDR5 memory at DDR5-9000 CL44-56-56 with 48 GB (24 GB x2) kit capacity, featuring AMD EXPO overclock profile and demonstrating the memory overclock capability of the ASUS ROG CROSSHAIR X870E HERO motherboard and the AMD Ryzen 7 8700G processor.

A New High-Speed Frontier with 24 GB x2 Continuing to explore the overclock limits of DDR5 memory speed in conjunction with the new ASUS NitroPath DRAM technology that provides enhanced DDR5 memory overclock performance, G.SKILL demonstrates an amazing DDR5-9000 CL44-56-56 with two 24 GB capacity modules. Refer to the screenshot below to see this G.SKILL memory kit reaching the astounding overclocked memory speed on the ASUS ROG CROSSHAIR X870E HERO motherboard with an AMD Ryzen 7 8700G processor

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, and gaming monitors, today announced a full line-up of flagship to mainstream motherboards using the AMD X870E/X870 series chipset, which is designed expressly for the latest AMD Ryzen 9000 series processors using AM5 socket. New motherboards include the flagship series X870E Taichi and Taichi Lite, newly introduced flagship Phantom Gaming X870E Nova WiFi, mainstream gaming X870 Riptide WiFi, plus the always popular X870 Steel Legend WiFi, X870 Pro RS and Pro RS WiFi, which are both now available in a white design.

All the new ASRock X870E/X870 motherboards, from the flagship Taichi series to the mainstream Steel Legend and Pro RS WiFi, feature a highly robust design for extreme performance. The Taichi series combines SPS Dr.MOS power delivery of up to 24+2+1 phases, server-grade 8-layer PCBs enabling excellent memory overclocking up to DDR5-8200, and exclusive low-ripple 1000μf 20K black capacitors that guarantee stable and superior performance for the CPU.

T-FORCE, Team Group's gaming brand, and T-CREATE, its creator-focused brand, are launching dual-mode DDR5 overclocking memory modules for Intel and AMD platforms with speeds up to 8000 MHz. This highlights Team Group's industry-leading overclocking capabilities, delivering the ultimate performance for gamers and creators.

T-FORCE, known for pushing the boundaries of performance, and T-CREATE, focused on stable and efficient performance, will offer a range of DDR5 dual-mode overclocking memory modules under their product portfolio. These modules will come in eight speeds, ranging from 6400 MHz to 8000 MHz, catering to diverse needs and providing optimal performance for gaming enthusiasts and content creators managing complex workflows. The dual-mode memory modules will be available in 2x16GB and 2x24GB capacity options. A single 24 GB stick significantly expands memory capacity for handling large workloads, leading to smoother and more efficient performance. The memory modules are fully compatible with Intel XMP 3.0 (Extreme Memory Profile) and AMD EXPO (Extended Profiles for Overclocking) profiles, ensuring seamless one-click overclocking on the latest AMD X870E and Intel Z790 platforms, delivering an exceptional user experience across both platforms.

MSI unveils the X870E and X870 motherboards, designed to harness the full power of AMD's Ryzen 9000 Series desktop processors. The lineup includes four models: MEG X870E GODLIKE, MPG X870E CARBON WIFI, MAG X870 TOMAHAWK WIFI, and PRO X870-P WIFI. These motherboards deliver exceptional value and performance with cutting-edge features and exclusive MSI innovations. Offering top components, innovative features, and easy DIY options, MSI's X870E and X870 motherboards make building and using your PC seamless.

Introducing MSI's Ultra Connect feature in the X870E and X870 motherboards, offering next-gen networking, storage, and expansion. With built-in 5G LAN and Wi-Fi 7, users can enjoy lightning-fast speeds, reaching up to 5.8 Gbps. As well as TriLink Connectivity, Expansion is made to future-proof with PCIe Gen 5.0 for next-gen graphics cards and SSDs. The USB4 ports, which are Thunderbolt compatible, enable fast data transfers and support a wide range of next-gen devices, including display output through USB-C.

Intel is set to launch its Arrow Lake processors on October 24th, likely alongside the official release of the Z890 motherboards. Meanwhile, AMD is expected to launch its new X870 and X870E motherboards on September 30th. Ahead of these dates, we've already seen many of them showcased at Computex, however, today an Australian retailer listed several MSI motherboards, including one Z890 model (MSI Z890 Carbon WiFi) and three X870/X870E models (MSI MPG X870E Carbon WiFi, MSI MAG X870 Tomahawk WiFi, and MSI PRO X870-P WiFi).

MSI Z890 Carbon WiFi
This is a mid-range motherboard, however without an official spec sheet, we're left trying to decipher details from the pictures. From what we can see, it offers a solid set of features, including USB 3.2, USB Type-C ports, BIOS Flash, Clear CMOS, and Smart Buttons. The board itself includes an 8-pin PCI-E connector and at least three M.2 slots. Currently, there is no information about its retail price.

MSI is thrilled to introduce a groundbreaking feature on its X870(E) series motherboards. This innovative is designed with gamers and professionals in mind, provides the extra power required for AI computing and GPU-intensive applications. The supplemental PCIe Power feature, equipped with an integrated 8-pin PCIe power connector, delivers additional power for GPUs demanding higher wattage, ensuring they can achieve their peak performance. Paired with the ATX 3.1 power standard, which can hold up to a 2.5x power excursion for enhanced reliability and better power delivery, this feature ensures stable, efficient, and sustained performance, even under heavy loads. Whether gaming or tackling complex applications, this supplemental PCIe Power offers unmatched reliability and stability for the most demanding environments.

What is Supplemental PCIe Power?
Think of it as an extra battery pack for your motherboard. The system's 12 V power on the 24pin power connector from the motherboard basically handles all the PCIe interface, fans and RGB extensions. Still, the supplemental PCIe power ensures everything runs smoothly when your PC is pushed to the limit—like when running very intensive graphical games or maximizing all the fan dissipation for extreme performance.

Motherboard vendors have been sporadically announcing their new premium- and high-end motherboards based on the AMD X870E and AMD X870 desktop chipsets, however, we've had a hard time finding or ordering these online. It turns out that although AMD allowed its motherboard partners to tease or announce their products based on the new chipset models, their market availability is timed.

Apparently, you should be able to buy these motherboards starting September 30, 2024. In the run-up to their availability, various online retailers have put up these motherboards at fairly high prices. Motherboards based on the cheaper AMD X870 are typically priced above $250, while those based on the top X870E start around $325. It is widely rumored that the mid-range AMD B850 will launch early next year. Until then, you always have the option of older AMD B650 chipset motherboards. If you want to pair these with newer Ryzen 9000 series "Granite Ridge" processors, you can take advantage of the UEFI BIOS Flashback feature.

MSI today launched its first wave of Socket AM5 motherboards based on the new AMD X870E and AMD X870 chipsets, which come with drop-in support for the new Ryzen 9000 "Granite Ridge" processors, and new platform I/O. The company debuted products across its four key consumer motherboard brands—MEG, MPG, MAG, and PRO. Leading the pack is the flagship MEG X870E GODLIKE, followed by the performance segment MPG X870E Carbon WIFI, the mid-range MAG X870 Tomahawk WIFI, and the mainstream PRO X870-P WIFI.

The MEG X870E GODLIKE isn't just a flagship motherboard with no feature spared, but designed to be a piece of jewelry. It is shrouded almost entirely in heatsinks. Almost all its onboard I/O faces the front-end, including a 24-pin ATX, and two optional 8-pin PCIe power inputs. The two 8-pin EPS power inputs are exposed near the CPU socket area. A 27-phase VRM powers the CPU, with an active fan-heatsink solution that uses a series of aluminium fin-stack heatsinks with heat-pipes spreading heat among them. The CPU is wired to four DDR5 DIMM slots, supporting over DDR5-8000, with preparation for higher memory OC speeds that may come up in the future. Expansion slots include a PCI-Express 5.0 x16, a second x16 (electrical Gen 4), and a x4. There are four M.2 NVMe slots, three of these are Gen 5, and one Gen 4.

ASUS today announced the launch of the exclusive Warhammer 40,000: Space Marine 2 Collector's Edition graphics card, developed in collaboration with AMD and Focus Entertainment and officially unveiled at the ROG press event during Gamescom on August 20. At the Gamescom press event, ASUS revealed that this card is based on the TUF Gaming Radeon RX 7900 XTX and is custom-built for a global giveaway for gamers and fans of Space Marine 2 and the Warhammer 40K universe.

To celebrate the game's launch, ASUS and AMD collaborated on a live stage event at the Gamescom Hall on August 23, where three randomly-chosen audience members competed to win one of the exclusive Space Marine 2 graphics cards. After several rounds of quickfire questions centered around Warhammer 40,000 lore and Space Marine 2, one of the participants received the first Space Marine 2 graphics card prize.

MSI is set to launch its most advanced AM5 motherboard to date: the MEG X870E GODLIKE. This flagship model is designed to support AMD's Ryzen 9000 series processors and beyond. The MEG X870E GODLIKE boasts an impressive 28-phase power delivery system with 110 A power stages, surpassing its predecessor's capabilities. This robust VRM design ensures a stable power supply even for the most demanding scenarios of next-generation CPUs. The motherboard's E-ATX form factor provides ample space for its array of features, including support for DDR5 memory speeds exceeding 8000 MT/s and a capacity of up to 256 GB. Connectivity is a strong suit for this motherboard, featuring eight USB Type-C ports with varying speeds of up to 40 Gbps. Storage options include five M.2 slots (two PCIe Gen 5 and three Gen 4) and four SATA III ports.

For graphics, the board offers two PCIe Gen 5.0 slots. MSI has also included several user-friendly features, such as EZ M.2 and PCIe release mechanisms, making component installation and removal a breeze. The M.2 slots are equipped with MSI's Shield Frozr heatsinks, ensuring optimal thermal performance for NVMe SSDs. Perhaps most intriguing is the inclusion of an additional 8-pin power connector, specifically designed to support future multi-GPU setups like NVIDIA's anticipated RTX 50 "Blackwell" series. While pricing details are yet to be announced, the MEG X870E GODLIKE is expected to carry a premium price tag, reflecting its top-tier status in MSI's lineup. With the high-end power delivery setup, overclockers will find this motherboard interesting, and users are planning to upgrade to next-generation RTX 50 series GPUs. Availability is also unknown as of time of writing.

GIGABYTE today debuted its AMD 800-series motherboards with the launch of the premium X870E AORUS Master. This will go on to be the company's second most premium product on this chipset, as the company is also planning the X870E AORUS Xtreme. The AORUS Master is still packed to the gills with everything this chipset has to offer, along with high-end onboard devices. The board is built in the ATX form-factor, and draws power from a combination of 24-pin ATX and two 8-pin EPS power connectors. It offers a 16+2+2 phase digital VRM featuring 110 A power stages. The board is laid out on a premium 8-layer PCB. You get tall extruded aluminium heatsinks for the CPU VRM, and the topmost M.2 NVMe Gen 5 slot.

The AMD Socket AM5 is wired to four DDR5 DIMM slots that support up to 192 GB of dual-channel DDR5, at speeds of over DDR5-8000. It also puts out no less than three M.2 NVMe Gen 5 slots. Two of these are wired to the dedicated x4 interfaces from the AMD "Raphael" or "Granite Ridge" processor, while one of them subtracts 4 lanes from the board's PCI-Express 5.0 x16 PEG slot. The board's fourth M.2 NVMe slot is Gen 4, and wired to the chipset. The only other expansion slots are a couple of PCI-Express 4.0 x16 (electrical Gen 4 x1). Besides the M.2 slots, you get four SATA 6 Gbps ports completing the board's storage connectivity.

AMD has reportedly pushed the launch of mid-tier models from its AMD 800-series chipset to early 2025, reports ComputerBase.de. With the Ryzen 9000-series "Zen 5" processors already launched earlier this month, and compatible with existing AMD 600-series chipset motherboards with a BIOS update, motherboard vendors are leisurely announcing their motherboards based on the AMD X870E and AMD X870 chipsets. Motherboards based on both offer drop-in compatibility with Ryzen 9000-series processors, and introduce new connectivity features such as 40 Gbps USB4 and Wi-Fi 7.

The company probably wants the two to have some time in the Sun before they're joined by the more affordable B850, which gamers could be drawn to. The AMD B850 has mostly identical platform I/O to the AMD X870, except Gen 5 support for the PCI-Express x16 slot is optional (motherboard vendors can choose to wire this out as Gen 4). The 40 Gbps USB4 is also optional here. You still get CPU overclocking support. The B840 is an entry-level chipset that's being launched to probably phase out the A620 and A620A, since it features similar I/O features to the A620A, but will probably come with drop-in compatibility for 65 W Socket AM5 processors. A deferred launch of the mid-tier chipset isn't too off character for AMD. It launched its popular B450 and B550 chipsets several months after the X470 and X570, respectively.

AMD's next-gen Ryzen 9000 Series CPUs have arrived, setting a new bar for gaming performance. For Gamescom 2024, we're introducing our X870E and X870 motherboard family. These boards unleash the full power of your new AMD CPU with upgraded connectivity, a host of smart features, and an arsenal of performance-boosting refinements.

Your most feature-rich, high-end options for an AMD Ryzen 9000 Series CPU use the X870E chipset. The ROG Crosshair X870E Hero sits at the top of the stack. Premium metallic textures, nickel-plated surfaces, and second-gen Polymo Lighting II make this a true showcase motherboard. But this board doesn't just look the part—it's fully prepped to take your gaming to the next level with the power of advanced AI.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, today is excited to announce a brand-new BIOS update for its AMD AM5 motherboards, designed to support AMD's latest Ryzen 9000 series processors, including Ryzen 9 9950X, Ryzen 9 9900X, Ryzen 7 9700X, and Ryzen 5 9600X. Incorporating the latest AMD AGESA 1.2.0.0.a Patch A BIOS update on BIOSTAR official website, BIOSTAR AM5 series motherboards consisting of X870E, X670E, B650E, B650, A620, and A620A are now primed and ready to unleash the full potential of AMD's ZEN 5 processors with superior stability.

AMD's latest Ryzen 9000 series processors, built on the groundbreaking Zen 5 architecture, represent a significant leap forward in computing performance and efficiency. These processors offer up to 16 cores and 32 threads, with clock speeds reaching up to 5.7 GHz. Featuring enhanced IPC (Instructions Per Cycle) performance and advanced Ryzen AI capabilities, the Ryzen 9000 series is engineered to handle intensive gaming, content creation, and professional workloads with ease. The new architecture also introduces improved power efficiency, ensuring cooler operation and lower energy consumption. With these cutting-edge processors, users can experience unprecedented levels of speed, responsiveness, and overall computing power.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, storage devices, and IPC solutions, is excited to introduce its COMPUTEX Taipei 2024 product highlights. BIOSTAR's COMPUTEX showcase features all-new AI PCs powered by Intel Arc graphics cards, the newest high-end AMD X870E motherboards, graphics cards, storage units, and industrial computing solutions.

Catching the eye of many visitors at the show are BIOSTAR's latest flagship motherboards, the BIOSTAR X870E VALKYRIE motherboard with AMD AM5 X870E chipset, built to run the latest Ryzen 9000 series processors. For Intel platform, BIOSTAR's newest VALKYRIE and SILVER motherboards, ideal for gamers, content creators and PC enthusiasts, engineered to deliver superior performance and a next-level user experience.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, proudly announces the launch of the brand-new X870E VALKYRIE motherboard. Expertly crafted to meet the exacting demands of content creators and professional gamers, BIOSTAR's X870E VALKYRIE delivers unparalleled reliability and next-gen features with superior performance.

BIOSTAR's X870E VALKYRIE motherboard is a game-changer for content creators. Its smart layout and extensive hardware support effortlessly handle intensive workloads, such as crafting immersive 3D worlds, designing breathtaking animations, and editing high-resolution videos. This ensures that creative professionals can bring their visions to life with unmatched precision and efficiency, pushing the boundaries of their work.Updated Jun 4, 2024 - Added pictures from BIOSTAR booth at Computex (see below)

While wandering through the Computex showrooms, our little spies spotted something interesting at the ASRock stand: an extensive lineup of motherboards built around the AMD X870 and X870E chipsets. The six models from the ASRock, Pro, Steel, Phantom Gaming, and the legendary Taichi families support the latest AMD Ryzen 9000, 8000, and 7000 series processors. We had the opportunity to see them live on display and rushed to present them one by one, complete with pictures and main specifications.Now we're going to look further in detail:

GIGABYTE in its Computex 2027 booth showcased a huge lineup of next-generation Socket LGA1851 motherboards based on the top Intel Z890 chipset, which are ready for Intel's Core Ultra "Arrow Lake-S" desktop processors. GIGABYTE has taped out the motherboard model names, so all mentions of Z890 in this article are based on our assumption that it's the name of the next-gen Intel chipset. These chips are expected to bring generational IPC increases from their "Lion Cove" P-cores, "Skymont" E-cores, a more complete PCIe Gen 5 I/O (including for the CPU-attached NVMe slots), and other innovations. If the socket looks similar to the LGA1700, it's because it's identical in physical dimensions, and you can use your LGA1700 cooler on the LGA1851, but the processors are not inter-compatible. The company also showcased a few AMD Socket AM5 motherboards based on the new AMD X870E chipset.

The first motherboard to catch our eye is the Z890 AORUS Tachyon. This board is geared for record-seeking CPU overclocking. The processor is wired to just two DDR5 memory slots (1 DIMM per channel, the best configuration for memory OC); and the CPU-attached NVMe slots being close to the socket, with a combined heatsink. The only expansion slots are a PCI-Express 5.0 x16, and what could be a Gen 4 x8. There are plenty of overclocker-friendly controls, voltage measurement points, diagnostic LEDs, and status displays, scattered all over the board.

AMD is debuting its Ryzen 9000 series "Granite Ridge" desktop processors powered by the "Zen 5" microarchitecture later this year. These chips are compatible with existing AMD 600-series chipset motherboards with a simple UEFI firmware update, but the company is also taking the opportunity to launch the AMD 800-series chipset family alongside these chips. The lineup will be led by the AMD X870E, followed by the X870. These two chipsets should launch immediately alongside the new processors, but will later be joined by the AMD B850 and B840. There's no entry-level chipset planned, the AMD A620 will continue to hold the fort for AMD here. There is an interesting new mix of product differentiation, according to a leaked GIGABYTE slide scored by VideoCardz.

If you recall, the X670E and X670 were differentiated by a lack of Gen 5 PCI-Express x16 PEG slots on the X670, which instead was limited to Gen 4 on the PEG slot. The X670 still had Gen 5 NVMe slots attached to the CPU, and had practically the same I/O features as the X670E, including the same counts of downstream PCIe Gen 4 general purpose lanes. Both the X670E and X670 are 2-chip solutions, in that the second chip is a connected to the general purpose PCIe lanes of the first chip, which in turn is connected to the processor. Things are going to change with the 800-series. The top-spec X870E will be a 2-chip solution, with PCIe Gen 4 general purpose lane counts resembling the X670E; but the X870 is a single-chip solution that more closely resembles the B650E in I/O. The X870 (non-E) now gives you Gen 5 PCI-Express x16 PEG, just like the X870E and the B650E, and at least one Gen 5 x4 NVMe slot attached to the CPU, but has fewer downstream Gen 4 general purpose PCIe lanes than the X670. Both the X870E and X870 assure USB4 connectivity, and support CPU overclocking. Things get very interesting in the mid-range.

Shipping manifests appear to be great sources of pre-release information—only a few hours ago, the existence of prototype AMD "Strix Point" and "Fire Range" mobile processors was highlighted by hardware sleuth harukaze5719. A related leak has appeared online fairly quickly after the discovery of laptop-oriented "Zen 5" chips. momomo_us joined in on the fun, with their exposure of speculated desktop silicon. Two brand-new AMD OPN codes have been linked to the upcoming "Granite Ridge" series of AM5 processors.

100-000001404-01 is likely an eight-core/ sixteen-thread "Zen 5" Ryzen CPU with a 170 W TDP—a stepping designation, B0, indicates engineering sample status. The other listing, 100-000001290-21, seems to be an A0-type engineering sample—leaked info suggests that this a six-core/twelve-thread (105 W TDP) next-gen mainstream desktop processor. AMD is likely nearing the finish line with its Ryzen 9000-series—a new generation of chipsets, including X870E, is reportedly in the pipeline. Additionally, VideoCardz posits that a refresh of 700-series boards could be on the cards. "Granite Range" CPUs are expected to retain the current-gen 6 nm client I/O die (cIOD), as sported by "Raphael" Ryzen 7000-series desktop processors.

AMD is readying the new 800-series motherboard chipset to launch alongside its next-generation Ryzen 9000 series "Granite Ridge" desktop processors that implement the "Zen 5" microarchitecture. The chipset family will be led by the AMD X870E, a successor to the current X670E. Since AMD isn't changing the CPU socket, and this is very much the same Socket AM5, the 800-series chipset will support not just "Granite Ridge" at launch, but also the Ryzen 7000 series "Raphael," and Ryzen 8000 series "Hawk Point." Moore's Law is Dead goes into the details of what sets the X870E apart from the current X670E, and it all has to do with USB4.

Apparently, motherboard manufacturers will be mandated to include 40 Gbps USB4 connectivity with AMD X870E, which essentially makes the chipset a 3-chip solution—two Promontory 21 bridge chips, and a discrete ASMedia ASM4242 USB4 host controller; although it's possible that AMD's QVL will allow other brands of USB4 controllers as they become available. The Ryzen 9000 series "Granite Ridge" are chiplet based processors just like the Ryzen 7000 "Raphael," and while the 4 nm "Zen 5" CCDs are new, the 6 nm client I/O die (cIOD) is largely carried over from "Raphael," with a few updates to its memory controller. DDR5-6400 will be the new AMD-recommended "sweetspot" speed; although AMD might get its motherboard vendors to support DDR5-8000 EXPO profiles with an FCLK of 2400 MHz, and a divider.