TYAN, an industry-leading server platform provider, and a subsidiary of MiTAC International Corp. will display a full line-up of cloud computing solutions that meet the increasing demand for higher density and lower power consumption at Computex 2011. TYAN will also provide a live demonstration of the FT77-B7015, a GPU Computing platform that features up to eight NVIDIA Tesla M2050 GPU computing processors in a 4U enclosure, at the TYAN booth (#407).

"Cloud Computing has changed the enterprise server landscape," said Albert Mu, Vice President and General Manager of TYAN Business Unit at Mitac International Corp. "TYAN is now positioned to lead the industry with high-density server solutions that meet the demand for more computing power and lower power consumption - at higher densities."

Intel may be a little over 6 months away from unveiling its new Sandy Bridge-EP platform, but it's understandable that the company is circulating engineering samples among closely tied industry partners. One such sample fell into the right (wrong, for Intel) hands, and is being pawned away on ebay for a handsome price. The current bid stands at US $1,359.99.

The chip itself is Q19D ES, an 8-core Sandy Bridge-EP in the LGA2011 package. The chip is said to have 8 cores, and 16 threads with HyperThreading enabled. It is being sold as Core i7, though some sources say the chip could be from Xeon E5-4600 or E5-2600 series (4600 is four-socket capable, 2600 is dual-socket capable). The chip is clocked at 1.60 GHz, and holds 20 MB shared cache according to the seller, though even the highest-end LGA2011 Core i7 is said to hold no more than 15 MB L3 (shared) cache. L3 is the only shared cache.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced that a PC equipped with its Dominator GT ultra-high performance DDR3 memory was used to set new world records with the 3DMark 11 and 3DMark Vantage benchmarks. Well-known overclockers Vince "K|ngp|n" Lucido and Illya "TiN" Tsemenko posted list-topping scores of P24347 in 3DMark 11 and P79364 in 3DMark Vantage.

The hardware used included an EVGA Classified SR-2 motherboard, dual Intel Xeon X5690 CPUs, four custom-modified EVGA GeForce GTX 580 GPUs, and three 2GB Corsair Dominator GT GTX2 DDR3 memory modules. A total of seven Kingpin Cooling liquid nitrogen pots were used to cool the CPUs, GPUs, and the Intel 5520 chipset.

The GIGABYTE GA-6UASL Series of single socket motherboards for server offers the best platform to deliver the new world class performances available through Intel's brand new processor microarchitecture and chipset series.

Designed for small and medium business applications, the GIGABYTE GA-6UASL Series offers a multipurpose product perfect for applications such as web server, file & print server, e-mail server, storage server, and any type of vertical-specific business applications, but it is also absolutely suitable for high performance computing and embedded applications.

Enabling IT departments to better manage data-intensive environments through new security and reliability features and record-breaking performance, a new family of server processors that accelerate mission-critical computing have been announced by Intel Corporation.

The record-setting Intel Xeon processor E7-8800/4800/2800 product families build on Intel's previous generation of server processors to set a new standard for high-end computing applications, including business intelligence, real-time data analytics and virtualization. Strengthening the line of defense for data centers, the new processors also provide advanced security features that ensure greater data integrity.

TYAN, an industry-leading server platform manufacturer, and a subsidiary of MiTAC International Corp., announces new single-socket servers that support the Intel Xeon Processor E3-1200 series (codename: Sandy Bridge). The S5510 and S5512 motherboards are ideal as entry-level servers for both small business and enterprise server customers. For high-density datacenter applications such as web hosting, TYAN has launched the industry-leading FM65-B5511 Micro Server.

The FM65-B5511 supports up to 18 Intel Xeon processors in a 4U enclosure. The FM65-B5511 is based on the Micro Module Server Specification, which addresses the emerging server segment that features scale-out, single-processor nodes with higher density and lower power consumption for web services applications.

Lenovo announced today the ThinkStation E30 workstation and ThinkCentre M81 desktop - two new solutions that bring users speedy performance with 2nd generation Intel Core processors, rapid boot up/shut down and extra productivity features. Designed for creative, engineering and financial professionals who rely on specialized software applications to power their work, users get workstation-class performance and reliability starting at an affordable $599. Meanwhile, the ThinkCentre M81 desktop equips large businesses with the advanced computing features employees need to be most productive.

"Workstation users need the kind of performance that lets them do more each minute. The ThinkStation E30 workstation builds on our strong workstation platform, combining new rapid processing for data-crunching with more vivid and intense graphics capabilities," said Tao Gu, executive director and general manager, Workstation Business Unit, Lenovo. "We created the ThinkStation E30 workstation to offer extremely powerful processing on a software-certified solution at desktop prices."

TYAN, an industry-leading server platform manufacturer, and a subsidiary of MiTAC International Corp., has completed validating 160GB and 640GB ioDrives from Fusion-io in two of their most powerful HPC computing platforms: the S7025, a dual Socket 1366 motherboard supporting Intel Xeon 5500/5600 series processors, and the S8232, the company's newest dual Socket G34 board supporting AMD Opteron 6100 series processors.

TYAN's rigorous validation process included testing ioMemory technology from Fusion-io with a full range of operating systems and applications, as well as comprehensive hardware testing to ensure complete compatibility. Tyan engineers also performed some cursory benchmark tests. "Validating Fusion ioDrives with Tyan's leading HPC platforms gives Tyan and our OEM partners total confidence in Fusion's game changing technology. We're looking forward to expanding our relations with Fusion-io in the future," stated TYAN's Senior Director of Sales, Joe James. Both motherboards are available now through TYAN distributors worldwide. OEM pricing is available on request.

Eurocom Corporation, the world's leading developer of highly personalized, high-performance notebook PCs and energy efficient All-in-One PCs, is now supporting the groundbreaking Intel Xeon Processor X5690 in its line of Mobile Server and Mobile Workstation notebooks.

The EUROCOM Mobile Server Technology significantly reduces the time and cost of deploying short-term LAN based solutions and of extending usage of existing business applications to users wherever is required. Eurocom has developed a concept called "Server-on-the-Go" where a team of Engineers in the field operating under a RED Team strategy utilize a Eurocom Mobile Server to receive and process feedback while being face-to-face with customers, co-developers, final users and other third parties.

Bringing industry leading security and manageability, and better, more flexible performance to business computing, Intel Corporation today unveiled its newest family of business processors. The new 2nd generation Intel Core vPro processor family features the performance and capabilities of Intel's new microarchitecture, enhancements to Intel vPro technology and new security features, including a 3G "poison pill" option to help protect a PC's data.

Computer makers around the world, including Dell, Fujitsu, HP and Lenovo, are introducing new laptop, convertible-tablet, desktop and all-in-one PCs for businesses based on the new Intel Core vPro processors.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it will demonstrate for the first time a 16-Gigabyte (GB), very low profile (VLP) memory module at the VM World 2010 in an IBM H22V blade server, running on Intel Xeon 5600-series processors.

Based on 4-gigabit (Gb), 40 nanometer (nm)-class DDR3, the new modules use 18 4Gb dual-die packaged (DDP) chips, and operate on 1.35 volts of electrical current. The 16GB 40nm-class DDR3 memory provides a powerful green solution, consuming 70 percent less power than four 4GB DDR3 modules and over 40 percent less than two 8GB modules, in setting a new "standard" for lower power consumption in servers. The module's very low profile (18.75 mm high) allows it to be used in extremely compact blade servers.

Intel is readying its fastest six-core processors ever. While the company is working to introduce the Core i7 990X Extreme Edition for launch sometime in Q4 2010, it's already begun sampling the Xeon X5690. The X5690 is a dual-socket ready LGA1366 processor based on the 32 nm Westmere-EP silicon. It carries a nominal clock-speed of 3.46 GHz (26.0 x 133 MHz), with a Turbo Boost speed of 3.60 GHz (27.0 x 133 MHz). It features a QuickPath Interconnect speed of 6.4 GT/s, and supports triple-channel registered DDR3 memory with its integrated memory controller. Cache levels include 256 KB L2 cache per core, and 12 MB shared L3 cache.

The processor is compatible with most server boards based on the Intel 5500 and 5520 chipsets with BIOS updates. A quick overclocking feat by Fitseries3 on the EVGA Classified SR-2 motherboard yielded a speed of 5 GHz making use of the high BClk multiplier. The chip is likely to carry a rated TDP of 130W. Intel may release this processor in the next quarter, either displacing the X5680 from its US $1,730 price point, or occupying a higher one. The CPU-Z validation of the mentioned overclocking feat can be found here.

During the International Supercomputing Conference (ISC), Intel Corporation announced plans to deliver new products based on the Intel Many Integrated Core (MIC) architecture that will create platforms running at trillions of calculations per second, while also retaining the benefits of standard Intel processors.

Targeting high-performance computing segments such as exploration, scientific research and financial or climate simulation, the first product, codenamed "Knights Corner," will be made on Intel's 22-nanometer manufacturing (nm) process - using transistor structures as small as 22 billionths of a meter - and will use Moore's Law to scale to more than 50 Intel processing cores on a single chip. While the vast majority of workloads will still run best on award-winning Intel Xeon processors, Intel MIC architecture will help accelerate select highly parallel applications.

Intel has once again shelved plans to come back to the discrete graphics market, with the much talked about GPU codenamed Larrabee. In a recent post by Director, Product and Technology Media Relations Bill Kircos on the company blog, it was detailed that the company's priorities at the moment lie with releasing industry-leading processors that have the graphics-processing horsepower for everyday computing. The Intel HD graphics will only get better with the 2011 series of Core processors based on the Sandy Bridge architecture, where the iGPU core will be completely integrated with the processing complex.

An unexpected yield of the Larrabee program seems to be that Intel has now perfected many-core processors. Since Larrabee essentially is a multi-core processor with over 32 IA x86 cores that handle graphics workload, it could as well give Intel a CPU that is Godsent for heavy-duty HPC applications. Intel has already demonstrated a derivative of this architecture, and is looking to induct it into its Xeon series of enterprise processors.

EVGA just released two of its most indigenous designs that marks a complete evolution from being a reference-design products vendor to an enthusiast-grade hardware giant: the much talked about EVGA Classified SR-2 dual-LGA1366 enthusiast-workstation motherboard, and power supply unit (PSU) tailor-made to suit systems based on the SR-2 motherboard. To begin with, the Classified SR-2 motherboard is a dual-LGA1366 motherboard supporting two dual-socket capable Intel Xeon E5500 series, and X5600 series quad-core and six-core processors. It is based on Intel's enterprise-grade 5520 chipset with ICH10R southbridge.

The Intel 5520 supports two QuickPath Interconnect paths to each of the sockets, which in turn can communicate with each other. Since each socket (processor) has its own triple-channel DDR3 memory controller, it has its own six DDR3 memory slots. The 5520 gives out two PCI-Express 2.0 x16 lanes which connect to two NVIDIA nForce 200 chips that give out two PCI-Express 2.0 x16 links each. With external x8 switching thrown into the mix, the motherboard manages a staggering seven PCI-Express x16 slots.

Lexar Media, a leading global provider of memory products for digital media, today introduced Crucial DDR3L-1333Mhz 1.35v energy-efficient server memory modules in support of the new Intel Xeon processor 5600 series. Available in 1GB, 2GB and 4GB RDIMM and VLP (very low profile) RDIMM modules, Crucial DDR3L memory modules are fully compatible and have been validated with the new Intel Xeon processor 5600 series. Servers across the enterprise, including those utilized for virtualization, data storage and processing, and blade servers will reap the benefits of new Crucial DDR3L memory. Crucial DDR3L memory is available through select resellers worldwide and online at Crucial.com/server.

"The benefits of energy-efficient DDR3L memory are clear - most notably the significant reduction in memory sub-system energy consumption and overall system cooling demands. Moreover, these benefits come without sacrificing the performance gains our customers expect from Intel's next-generation servers," said Jim Jardine, Lexar Media senior worldwide product manager. "Additionally, all Crucial DDR3L 1.35v memory has been fully validated and certified compatible with the Intel Xeon Processor 5600 series, so customers can rest assured their server infrastructure investment will perform reliably and efficiently with Intel's newest processors."

Combining unprecedented security, performance and energy efficiency, Intel Corporation today launched the Intel Xeon Processor 5600 series. The new processors deliver two new security features -- Intel Advanced Encryption Standard New Instructions (Intel AES-NI), and Intel Trusted Execution Technology (Intel TXT) -- that enable faster encryption and decryption performance for more secure transactions and virtualized environments, providing data centers with a stronger foundation for cloud security.

These are also the first server and workstation chips based on the groundbreaking, new Intel 32nm logic technology, which uses Intel's second-generation high-k metal gate transistors to increase speed and decrease energy consumption. The Intel Xeon Processor 5600 series supports up to six cores per processor and delivers up to 60 percent greater performance than the 45nm Intel Xeon processor 5500 series. In addition, data centers can replace 15 single-core servers with a single new one, and achieve a return on their investment in as little as 5 months.

Kingston Technology Europe Ltd, a subsidiary of Kingston Technology Company, the independent world leader in memory products,today announced that its low-voltage registered dual inline memory modules (RDIMMs) have been validated for use in the upcoming Intel Westmere-EP processor-based server platforms. The Kingston ValueRAM DDR3L ('L' for low voltage) 1333MHz (1.35 volt) server RDIMMs were certified on Intel's Westmere reference platform.

Kingston is proud to offer customers our 1.35-volt server memory and having it certified for use with Intel's next-generation Xeon processors," said Stephane Rizzetto European Product Development Manager for DRAM of Kingston Technology. "Our low voltage registered server memory helps lower total cost of ownership in datacenters as it uses less power, thus producing less heat than equivalent 1.5-volt modules resulting in lower cooling costs for memory-dense servers."

Intel is set to introduce a series of eight-core Xeon server processors later this month, that are capable of running in four-socket servers. With HyperThreading technology enabled, each core can handle two threads, taking the logical CPU count on such servers up to 64. Each Nehalem-EX chip has 8 CPU cores with dedicated L2 caches of 256 KB, a shared L3 cache of 24 MB, and Turbo Boost technology that helps conserve power while also stepping up performance when needed. The die also features a memory controller with four DDR3 memory channels. Being based on the Nehalem architecture, the chips are built on the 45 nm HKMG process.

In related news, Intel will also introduce Westmere-EP processors later this month. These chips will be based on the 32 nm Westmere architecture, and are likely to have 6 cores, up to 12 logical CPUs per chip, 12 MB of L3 cache and three DDR3 memory channels. These chips will be suited for two-socket servers and workstations.

EVGA today named its dual-LGA1366 enthusiast-grade motherboard, so far known by the codename W555. After a short contest on the company's forums, the company came up with "EVGA Classified SR-2" for its name. SR stands for "super record" and 2 denoting the dual-socket design. The Classified SR-2 is a an entusiast-grade (read: overclocker friendly) implementation of the Tylersburg platform, supporting Intel socket LGA1366 processors with two QPI links (2P Xeon, etc.) As an addition, the board allows you to do something that's difficult on typical 2P server motherboards: it allows you to mix different models of Xeon processors, provided they're based on the same architecture, and series. For example, you can mix a Xeon 5520 with Xeon 5540. You can also mix a quad-core processor with a six-core processor, provided the quad-core part is based on the Westmere architecture (32 nm), not Nehalem (45 nm).

The board will also let you run a single 2P-capable processor in either sockets. DDR3 memory modules can be non-ECC or even ECC. 2P Xeon DRAM Multipliers / Uncore Multipliers are locked so you will only be able to use maximum 2:8 or 2:10 depending on segment of CPU. EVGA tells that the board supports 4-way SLI on its GTX 285 Classified VGA, but adds that a "future flagship GPU" also supports it. Could this be GeForce GTX 400 series having it as a standard feature? We have to wait and see. 4-way CrossFireX is supported.

Intel's Core i7 processor in the LGA1366 package is currently leading in the performance front, some of the fastest processors for the desktop platform fall in this league. Despite lacking a directly competitive processor, the platform had its share of competition thanks to motherboard manufacturers competing within themselves. EVGA for one, is set to unveil a bleeding-edge motherboard later this year, which supports two LGA1366 processors. So far, enthusiasts working for EVGA have only disclosed that the motherboard would work with Intel's DP Xeon 5000 series LGA1366 processors, which are officially capable of working on dual-socket server and workstation motherboards.

However, a plausible rumor doing rounds has it that EVGA may attempt to make its motherboard work with Core i7 series processors - which are incapable to operate in pairs, at least from what we're led to believe. EVGA is attempting to do this by modifying the reference Intel design for the platform.

EVGA is keeping up its streak of releasing high-end motherboards for processors based on the new Intel Nehalem architecture, with a new dual-socket monstrosity. Slated for CES 2010, not much about this high-end workstation motherboard has been revealed beyond the picture below. From the looks of it, probably EVGA is making a high-end, overclocker-friendly dual LGA-1366 motherboard based on the Intel 5500 "Tylersburg" chipset with the usual ICH10R southbridge. Existing LGA-1366 processors that support dual-socket operation which includes Xeon 5500 series may work on it. Probably, a future high-end Intel Core family CPU is released that is capable of dual-socket setups, too. The picture reveals two LGA-1366 sockets, each powered by an 8-phase digital PWM circuit. Each socket is wired to six DDR3 DIMM slots supporting triple-channel memory for that socket. More this CES.

Outgrowing the known lineup of 32 nm client processors (under the Core family), Intel's upcoming lineup of processors based on the 32 nm Westmere architecture will comprise of no less than 13 models under the Xeon E5000, L5000, X5000, and W3600 series. Among these, there are six hexa-core Xeon processors, including X5680 (3.33 GHz), X5670 (2.93 GHz), X5660 (2.80 GHz), and X5650 (2.66 GHz). X5680 has a TDP of 130W, with the latter three sub 3 GHz models having TDP as low as 95W. There is an energy-efficient L5640 hexa-core model clocked at 2.26 GHz, with TDP at 60W, and a single-socket W3680, clocked at 3.33 GHz with 130W TDP. All these models have six cores, and 12 MB of L3 cache.

Next up, are Intel's first 32 nm quad-core processors: Xeon X5677 (3.46 GHz, 130W), X5647 (3.06 GHz, 95W), E5640 (2.66 GHz, 80W), X5630 (2.53 GHz, 80W), X5620 (2.40 GHz, 80W), and energy efficient L5630 (2.13 GHz, 40W), and L5609 (1.86 GHz, 40W). Except L5609, all these quad-core chips have HyperThreading Technology and Turbo Boost available. The L2 cache amounts for each of these chips is unknown as of now, but should be up to 8 MB, or as low as 4 MB for some models. Most of these chips are slated for release on March 16, 2010.

Intel Corporation and NEC Corporation today have agreed to jointly develop High Performance Computing (HPC) system technologies that will push the boundaries of supercomputing performance. NEC will bring these technologies to market in future supercomputers based on the Intel Xeon processor. NEC's expertise in this field coupled with the Intel Xeon processor's outstanding performance and its accelerating vector capabilities such as AVX will allow for higher performance supercomputers, satisfying customer demand for Intel architecture based products.

NEC will also continue to sell their existing SX vector processor-based products. A vector processor can perform a mathematical operation on several numbers simultaneously.

"Intel's substantial investment in the Intel architecture, including the development of processors, chipsets, software compilers and other related products has expanded the usages of Intel Xeon processors in both the volume and high-end HPC market segments," said Richard Dracott, general manager of Intel's High Performance Computing Group. "Now with NEC further innovating on Intel Xeon processor-based systems, Intel is poised to bring Intel Xeon processor performance to an even wider supercomputing audience."

Following AMD's recent success of its 6-core Opteron processor in the TOP500 supercomputer list, Intel has sensed a market for "HPC-optimized" processors, which the company expects will be out in the first half of 2010. These could be either variants of the Nehalem-EX multi-socket capable processors, or that by design, Nehalem-EX suits HPC (high-performance computing) applications better.

These 6-core processors will carry clock speeds higher than 8-core Xeon processors around that time. The processors will be able to work in systems with up to 256 processors (logical CPUs). In addition to these Intel also announced that it will be releasing a beta version of its Ct technology by the end of this year. Ct makes parallel programming in the C and C++ programming languages easier, by automatically optimizing code to exploit multi-core and many-core systems.