NZXT, a leader in PC gaming components, gear, and prebuilt gaming systems, is excited to announce the N9 X870E ATX motherboard, optimized for the new "Zen 5" architecture based AMD Ryzen 9000 series desktop processors. NZXT's latest motherboard combines high-performance features with a stunning new look that is geared towards enthusiast PC gamers building a high-end AMD system.

The N9 X870E boasts overclocking-ready power delivery and optimized thermals, providing gamers with the tools and headroom to overclock their AMD Ryzen 9000, 8000 or 7000 series processors and memory to their highest levels of performance. Additionally, the N9 X870E ensures prolonged compatibility with future and previous generations of Ryzen processors, thanks to AMD's commitment to support the AM5 platform until 2027+.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, today is excited to unveil the shiny new X870E VALKYRIE flagship motherboard designed to run the latest "Zen 5" architecture based AMD Ryzen 9000 series processors. Built on BIOSTAR's top-of-the-line VALKYRIE platform, the X870E VALKYRIE delivers exceptional features and functionality, catering to gamers, content creators, and PC enthusiasts alike.

Meticulously crafted to cater to the modern-day professional, the X870E VALKYRIE motherboard offers unparalleled power and stability across the most demanding applications. Whether you're designing immersive 3D worlds, rendering high-definition animations, editing ultra-high-resolution videos, or pushing the limits of AAA gaming, this motherboard is engineered to deliver. Powered by the latest AMD Ryzen 9000 series processors built on "Zen 5" architecture, with support for up to 192 GB of DDR5 memory and PCIe 5.0 technology, the X870E VALKYRIE ensures seamless, high-speed performance for even the most intensive tasks, including generative AI computing. With support for AMD EXPO & Intel XMP technologies, it can extract the maximum capability out of all hardware to deliver the best user experience.

Earlier this week, we got rumors that AMD is rushing in the Ryzen 7 9800X3D 8-core/16-thread "Zen 5" processor with 3D V-cache for a late-October debut. The 9800X3D succeeds the popular 7800X3D, and AMD probably hopes it will have a competitive gaming processor in time for Intel's Core Ultra 2-series "Arrow Lake-S" launch. In the previous article, it was reported that the higher core-count 9000X3D series processor models, the Ryzen 9 9950X3D and Ryzen 9 9900X3D, would arrive some time in Q1 2025, because it was reported that the chips have certain "new features" compared to their predecessors, the 7950X3D and 7900X3D. At the time, we even explored the possibility of AMD giving both 8-core CCDs on the processor 3D V-cache. Turns out, this is where things are headed.

A new report by Benchlife.info claims that the higher core-count 9950X3D and 9900X3D will implement 3D V-cache on both CCD chiplets, giving these processors an impressive 192 MB of L3 cache (96 MB per CCD), and 208 MB or 204 MB of "total cache" (L2+L3). The report also says that AMD is planning a Ryzen 5 9600X3D chip, its second attempt at taking on Intel's Core i5 lineup, following its very recent release of the Ryzen 5 7600X3D, which ended up 1-3% short of the Core i5-14600K in gaming workloads. There's no word on whether the 9600X3D will launch in October alongside the 9800X3D, or in Q1-2025 with the Ryzen 9 9000X3D series.

In case you missed it, AMD's new madcap enthusiast silicon engineering effort, the "Strix Halo," is real, and comes with the Ryzen AI Max 300 series branding. These are chiplet-based mobile processors with one or two "Zen 5" CCDs—same ones found in "Granite Ridge" desktop processors—paired with a large SoC die that has an oversized iGPU. This arrangement lets AMD give the processor up to 16 full-sized "Zen 5" CPU cores, and an iGPU with as many as 40 RDNA 3.5 compute units (2,560 stream processors), and a 256-bit LPDDR5/x memory interface for UMA.

"Strix Halo" is designed for ultraportable gaming notebooks or mobile workstations where low PCB footprint is of the essence, and discrete GPU is not an option. For enthusiast gaming notebooks with discrete GPUs, AMD is designing the "Fire Range" processor, which is essentially a mobile BGA version of "Granite Ridge," and a successor to the Ryzen 7045 series "Dragon Range." The Ryzen AI Max series has three models based on CPU and iGPU CU counts—the Ryzen AI Max 395+ (16-core/32-thread with 40 CU), the Ryzen AI Max 390 (12-core/24-thread with 40 CU), and the Ryzen AI Max 385 (8-core/16-thread, 32 CU). An alleged Ryzen AI Max 390 engineering sample surfaced on the Geekbench AI benchmark online database.

The upcoming Strix Point Halo processors from AMD now have a new name - Ryzen AI Max - and come with big promises of impressive power. This rumor, first reported by VideoCardz and originating from Weibo leaker Golden Pig Upgrade, reveals key details about the first three processors in this lineup, along with their specifications.

The leaker claims AMD might roll out a new naming system for these processors branding them as part of the Ryzen AI Max series. These chips will run on the anticipated Strix Halo APU. This series includes three models, with the top-end version boasting up to 16 Zen 5 cores and 40 Compute Units (CUs) for graphics. This setup is expected for the best model contrary to earlier rumors that AMD would drop such a variant. In fact, word has it that at least two of the models in this lineup will come with 40 RDNA 3.5 Compute Units. The leaker also hints that Strix Halo will handle up to 96 GB of video memory suggesting AMD aims to make this processor work with its ROCm (Open Compute Platform) system.

According to new latest testing, the latest AGESA (AMD Generic Encapsulated Software Architecture) update, version 1.2.0.2, promises a significant boost in performance for AMD Ryzen 9000 "Zen 5" processors. This update is targeting one of the most crucial aspects of multi-core processing: inter-core latency. The AGESA 1.2.0.2 update addresses challenges initially reported in AMD's Zen 5 architecture, particularly in scenarios demanding rapid communication between multiple cores. Early reports suggest a remarkable reduction in inter-core latency by up to 58%. According to Overclock.net testing, older AGESA 1.2.0.1A showed the cross-CCD latency at around 180 ns. However, with the new AGESA 1.2.0.2 BIOS, the latency is seemingly around 75 ns.

Interestingly, the update has arrived on the ASUS ROG Crosshair X670E motherboard, with BIOS version 2401. BIOS updates with the latest AGESA 1.2.0.2 are still rolling out, so it will be interesting to see further testing and possible improvements. It could be that the cross-CCD latency has just been reported badly, so final testing will conclude the latency increase from Zen 4 to Zen 5 debate.

AMD is about to extend its mobile CPU lineup with the introduction of new Ryzen AI APUs, which are going to include the Krackan Point series which has been greatly expected. These CPUs are aimed at mainstream platforms and are targeted to bring performance, AI capabilities, and memory support to a new level. Krackan Point is supposed to be a cheaper alternative to the premium Strix Point series. Jack Huynh, Senior Vice President and General Manager of the Computing and Graphics Business Group of AMD confirmed at IFA 2024 that Krackan will be released to the mass market early in 2025.

One of the highlights is the support for LPDDR5X-8000 memory, this feature is expected to place the Krackan Point APUs close to AMD's Strix Halo series and compete directly with Intel's Lunar Lake processors. The XDNA2 Neural Processing Unit and also the certification of AMD for Microsoft Copilot+PC will be the advantages of this enhancement of the product.

AMD is readying a major update to its category-defining Ryzen Z-series SoCs, with the new Ryzen Z2. Designed for handheld game consoles, the Ryzen Z-series chips are typically power-optimized variants of its mobile processors designed for ultra-low board footprint, allowing PC OEMs to build handheld game consoles with them. Facing competition from Intel's upcoming Core Ultra 200V "Lunar Lake-MX" SoCs in this segment, AMD is readying the Ryzen Z2 chip. The Z2 is based on the 4 nm "Strix Point" silicon, which gives it a significantly updated iGPU, as well as a higher core-count CPU.

Perhaps the biggest sub-system performance uplift console designers can expect from the Ryzen Z2 is graphics—AMD has given the "Strix Point" a larger iGPU with 16 compute units in place of 12 on "Phoenix," which is a 33% increase in just numerical terms. Then there's also the update to the newer RDNA 3.5 graphics architecture, which incorporates several architecture-level performance and battery-efficiency improvements. It's also better optimized for LPDDR5 memory. With CPU, AMD has given "Strix Point" a heterogeneous multicore setup with four "Zen 5" and eight "Zen 5c" cores. At this point, we don't know if all 12 cores are enabled on the Z2. ASUS is designing its next generation of ROG Ally consoles powered by the Ryzen Z2, and its designers hint that the console should be able to offer over 1 hour of "Black Myth: Wukong" gameplay on a full charge of battery—something current-gen ROG Ally X powered by the Z1 doesn't.

OpenSIL is an open-source CPU initialization framework project that seeks to replace on-chip initialization microcode, such as AGESA, across both client- and server processors. AMD looks to implement OpenSIL as it makes its AMD EPYC processors more friendly to large customers that want to take control of this aspect of the processor. Since its open-sourcing in June 2023, AMD has come up with reference motherboards implementing OpenSIL, as well as modifying a Supermicro server motherboard to the architecture, to demo at conferences. AMD firmware engineer Paul Grimes presented the company's progress with implementing OpenSIL, at the OSFC conference, in Germany. It's been known that AMD is targeting a 2025-26 timeline for OpenSIL to hit product, but AMD put out specifics, such as its next-generation "Venice" server processor supporting OpenSIL.

"Venice" is codename for an AMD EPYC server processor generation succeeding "Turin." It is built on the future "Zen 6" microarchitecture, and AMD could at least unveil the processor some time in 2025, if not mass-produce it. late-2024 thru 2025 could see the company ramp up "Turin" and other server processors implementing "Zen 5." That's not all, AMD plans to being OpenSIL even to client processors, with the generation of Ryzen processors based on "Zen 6." This will see the AGESA microcode replaced by a first-party firmware from AMD based on OpenSIL, which PC OEMs will be able to customize. The biggest impact of this change will be felt in the commercial notebook and commercial desktop segments, where large organizations can take greater control over the chip initialization firmware.

Lenovo, a global leader in technology innovation, proudly announces a series of groundbreaking products at Lenovo Innovation World 2024, each designed to redefine the future of professional computing and artificial intelligence. At a special event hosted in Berlin, the highlights include the newly designed premium Lenovo ThinkPad X1 Carbon Gen 13 Aura Edition powered by the latest Intel Core Ultra processors (Series 2), and the innovative Lenovo Auto Twist AI PC proof of concept. Lenovo also featured the ThinkPad T14s Gen 6 and the all new ThinkBook 16 Gen 7+ powered by the latest AMD Ryzen AI processors. Additionally, Lenovo introduced the ThinkBook 16 Gen 7 powered by the Snapdragon X Plus 8-core processor. Together, these innovations showcase Lenovo's commitment to delivering cutting-edge technology, exceptional user experiences, and enhanced productivity and creativity for enterprise customers.

Lenovo also announced AI PC Fast Start, a solution designed to help organizations swiftly transition to AI-ready devices, maximizing ROI through AI-powered advisory and simplified deployment. Backed by Lenovo's award-winning support, these services accelerate AI adoption and ensure seamless implementation.

Motherboard manufacturers are beginning to roll out UEFI firmware updates that not just patch the Sinkclose critical vulnerability, but enable an experimental "105 W TDP mode" option as part of the processor's custom BIOS settings (CBS). The mode elevates the power limits of the Ryzen 5 9600X and Ryzen 7 9700X "Zen 5" desktop processors, with up to 13%" performance gains being reported by the motherboard vendors themselves. By default, your motherboard will run these processors at their original 65 W TDP, and you're supposed to manually enable the setting in the UEFI firmware setup program. It could either be found in the overclocking/tuning page, or the AMD CBS section.

To remove the last bit of hesitation among users go turn this setting on, AMD is working to extend its processor warranty to cover the 105 W TDP mode, reports Wccftech editor Hassan Mujtaba. Currently, the setting is being shipped with AM5 AGESA version 1.2.0.1, which includes the Sinkclose vulnerability patch, but will "officially" release it with AM5 AGESA 1.2.0.2, along with warranty coverage. Mujtaba reports that firmware updated with AGESA 1.2.0.2 are expected to begin rolling out in late-September.

The MLCommons consortium on Wednesday posted MLPerf Inference v4.1 benchmark results for popular AI inferencing accelerators available in the market, across brands that include NVIDIA, AMD, and Intel. AMD's Instinct MI300X accelerators emerged competitive to NVIDIA's "Hopper" H100 series AI GPUs. AMD also used the opportunity to showcase the kind of AI inferencing performance uplifts customers can expect from its next-generation EPYC "Turin" server processors powering these MI300X machines. "Turin" features "Zen 5" CPU cores, sporting a 512-bit FPU datapath, and improved performance in AI-relevant 512-bit SIMD instruction-sets, such as AVX-512, and VNNI. The MI300X, on the other hand, banks on the strengths of its memory sub-system, FP8 data format support, and efficient KV cache management.

The MLPerf Inference v4.1 benchmark focused on the 70 billion-parameter LLaMA2-70B model. AMD's submissions included machines featuring the Instinct MI300X, powered by the current EPYC "Genoa" (Zen 4), and next-gen EPYC "Turin" (Zen 5). The GPUs are backed by AMD's ROCm open-source software stack. The benchmark evaluated inference performance using 24,576 Q&A samples from the OpenORCA dataset, with each sample containing up to 1024 input and output tokens. Two scenarios were assessed: the offline scenario, focusing on batch processing to maximize throughput in tokens per second, and the server scenario, which simulates real-time queries with strict latency limits (TTFT ≤ 2 seconds, TPOT ≤ 200 ms). This lets you see the chip's mettle in both high-throughput and low-latency queries.

AMD "Strix Halo" isn't just a mobile processor with an oversized iGPU meant to power "gaming ultraportables," it has other potential applications such as game consoles (both handheld and standalone). Not willing to cede this market to AMD, Intel is reportedly readying its own such chip, which is being reported as the "Arrow Lake Halo" for the lack of an official name. This chip will feature a large iGPU based on the Xe2 "Battlemage" graphics architecture, the variant of Xe2 Intel plans to use for its next-generation Arc discrete GPUs. The CPU compute complex will be carried over from the regular "Arrow Lake" chips, and feature a mix of "Lion Cove" P-cores, and "Skymont" E-core clusters.

To meet the higher memory bandwidth demand that arises from a high-performance iGPU and CPU, AMD designed the RDNA 3.5 graphics architecture to be more LPDDR5-aware, since at the physical layer, LPDDR operates differently from GDDR. Intel will probably do something similar, and deploy a 256-bit wide LPDDR5/x memory interface replacing the 128-bit wide interface the regular "Arrow Lake" mobile chips come with. Whether "Arrow Lake Halo" and "Strix Halo" remain competitive will depend a lot on which gaming experiences the two companies want to sell. The way the iGPU of "Strix Halo" is rumored to be specced suggests something that is 1440p-capable, or 4K-capable with FSR 3.

MSI is set to launch its most advanced AM5 motherboard to date: the MEG X870E GODLIKE. This flagship model is designed to support AMD's Ryzen 9000 series processors and beyond. The MEG X870E GODLIKE boasts an impressive 28-phase power delivery system with 110 A power stages, surpassing its predecessor's capabilities. This robust VRM design ensures a stable power supply even for the most demanding scenarios of next-generation CPUs. The motherboard's E-ATX form factor provides ample space for its array of features, including support for DDR5 memory speeds exceeding 8000 MT/s and a capacity of up to 256 GB. Connectivity is a strong suit for this motherboard, featuring eight USB Type-C ports with varying speeds of up to 40 Gbps. Storage options include five M.2 slots (two PCIe Gen 5 and three Gen 4) and four SATA III ports.

For graphics, the board offers two PCIe Gen 5.0 slots. MSI has also included several user-friendly features, such as EZ M.2 and PCIe release mechanisms, making component installation and removal a breeze. The M.2 slots are equipped with MSI's Shield Frozr heatsinks, ensuring optimal thermal performance for NVMe SSDs. Perhaps most intriguing is the inclusion of an additional 8-pin power connector, specifically designed to support future multi-GPU setups like NVIDIA's anticipated RTX 50 "Blackwell" series. While pricing details are yet to be announced, the MEG X870E GODLIKE is expected to carry a premium price tag, reflecting its top-tier status in MSI's lineup. With the high-end power delivery setup, overclockers will find this motherboard interesting, and users are planning to upgrade to next-generation RTX 50 series GPUs. Availability is also unknown as of time of writing.

AMD announced that its Ryzen processor branch prediction optimization that provide gaming performance uplifts, is now available for Windows 11 23H2, through an optional update. This update applies to AMD Ryzen processors based on the "Zen 3," "Zen 4," and "Zen 5" microarchitectures, and essentially yields the kind of performance you get in the real Administrator account, on regular Windows accounts, especially non-local (online) accounts. Users should look for "Cumulative Update Preview for Windows 11 Version 23H2 for x64-based Systems (KB5041587)" in Windows Update, which should begin showing up as an optional update. This update requires a system restart to apply.

With this update in place, gaming performance uplifts between Windows 11 23H2 and 24H2 should be identical. "We wanted to let you know that the branch prediction optimization found in Windows 11 24H2 has now been backported to Windows 11 23H2. Users will need to look for KB5041587 under Windows update > Advanced options > Optional updates. We expect the performance uplift to be very similar between 24H2 and 23H2 with KB5041587 installed," AMD said in a statement to Wccftech.

A shipping manifest has revealed a new 96-core Ryzen Threadripper CPU codenamed "Shimada Peak." This processor is expected to incorporate Zen 5 CPU cores and maintain a configuration similar to AMD's current Zen 4 Threadripper flagship. The new CPU will likely be compatible with existing DDR5 HEDT motherboard platforms like TRX50 and WRX90. Its architecture appears to mirror that of AMD's previous 96-core Threadripper and EPYC models, featuring twelve 8-core CCDs and a single IO die. These similarities suggest that the primary change lies in the CCDs.

The Shimada Peak series is unlikely to debut in the near future. Given that the previous generation launched in October 2023 after a considerable delay, a similar timeline may apply here. AMD has remained silent regarding its Threadripper roadmap. Reports suggest AMD is preparing to unveil multiple products soon, the lineup is said to include the Ryzen AI 300 PRO, EPYC Turin, and Instinct MI325X. Following this, the next major showcase is expected to be CES. At this event, Kraken or Strix Halo are anticipated to make an appearance.

AMD's Ryzen processors have received a significant performance upgrade, thanks to the recent Windows 11 24H2 update. This development addresses initial disappointments with the Ryzen 9000 "Zen 5" series performance, particularly in gaming applications. The update, which improves branch prediction capabilities, has resulted in substantial gains for both the Ryzen 9000 "Zen 5" and Ryzen 7000 "Zen 4" CPU lineups. According to tests by Hardware Unboxed, Ryzen 9000 "Zen 5" CPUs have shown double-digit performance increases across multiple game titles, a boost typically seen only between generational upgrades.

Interestingly, contrary to AMD's initial claims, the performance gains are not limited to the Zen 5 architecture. The Ryzen 7000 "Zen 4" processors have also benefited from the update, with minimal performance differences observed between comparable Zen 5 and Zen 4 models after the update. This development marks a crucial turning point for AMD, addressing earlier criticisms and narrowing the gap between reported and expected performance figures. As users install the Windows 11 24H2 update, they can expect enhanced gaming experiences across a wide range of titles, highlighting the complex interplay between hardware capabilities and software optimization in modern computing. Below are the results from Hardware Unboxed benchmarks.

AMD's upcoming Ryzen 9000X3D series of processors with 3D V-Cache have been reportedly scheduled to arrive in January 2025 and should make a debut at the CES event, a few months later than initially expected. While disappointing for eager enthusiasts, the delay could signify that AMD is taking extra precautions to ensure a smooth launch and deliver a product that meets the high-performance standards set by its previous 3D V-Cache offerings. Delaying the new product launch could also be a strategic move by AMD to avoid potential supply chain issues or to align the launch with other product announcements.

We previously reported that the series will maintain the same cache size configurations as the last generation with 3D V-Cache, and it will just be an upgrade to up the performance of the new Zen 5 design. The launch of the 9000X3D series follows a smaller six-month gap from the regular Ryzen 9000 series, where the previous Ryzen 7000X3D and 5000X3D followed seven and seventeen months after the launch of their regular SKUs, respectively.

AMD has reportedly pushed the launch of mid-tier models from its AMD 800-series chipset to early 2025, reports ComputerBase.de. With the Ryzen 9000-series "Zen 5" processors already launched earlier this month, and compatible with existing AMD 600-series chipset motherboards with a BIOS update, motherboard vendors are leisurely announcing their motherboards based on the AMD X870E and AMD X870 chipsets. Motherboards based on both offer drop-in compatibility with Ryzen 9000-series processors, and introduce new connectivity features such as 40 Gbps USB4 and Wi-Fi 7.

The company probably wants the two to have some time in the Sun before they're joined by the more affordable B850, which gamers could be drawn to. The AMD B850 has mostly identical platform I/O to the AMD X870, except Gen 5 support for the PCI-Express x16 slot is optional (motherboard vendors can choose to wire this out as Gen 4). The 40 Gbps USB4 is also optional here. You still get CPU overclocking support. The B840 is an entry-level chipset that's being launched to probably phase out the A620 and A620A, since it features similar I/O features to the A620A, but will probably come with drop-in compatibility for 65 W Socket AM5 processors. A deferred launch of the mid-tier chipset isn't too off character for AMD. It launched its popular B450 and B550 chipsets several months after the X470 and X570, respectively.

AMD Ryzen 9000 "Granite Ridge" desktop processors have been out for a couple of weeks now, and the "Zen 5" based processors have fallen short of gaming performance expectations, set mainly by some of the numbers AMD put out in its Computex 2024 reveal for the processors. The consensus among the tech press is that these processors are roughly 3-5% faster than Ryzen 7000 series "Raphael," but with noteworthy improvements in energy efficiency. AMD set out to study why there are such vast deltas in performance between its numbers and those of reviews, and arrived a few possible explanations. The company also stated that it is working with Microsoft to fix this in the next major update to Windows 11.

One of them is that AMD's testing was done on Windows 11 23H2 with Admin mode (i.e. a local system administrator account was used), while some reviewers tested with a regular user account that has some admin privileges. Apparently this affects the way the branch prediction units of "Zen 5" processors work. "Our automated test methodology was run in "Admin" mode which produced results that reflect branch prediction code optimizations not present in the version of Windows reviewers used to test Ryzen 9000 Series," AMD said in a statement.

TechPowerUp has released version 2.60.0 of GPU-Z, a popular graphics sub-system information, monitoring, and diagnostic utility. This latest update brings significant enhancements, including full support for the Arm64 architecture and Qualcomm Snapdragon X Elite GPUs. The release also adds support for AMD Zen 5 CPU temperature monitoring and a wide range of new GPUs from NVIDIA, AMD, and Intel. Notable additions include the NVIDIA 4070 Ti Super (AD102), RTX 4070 (AD103), RTX 4060 Ti (AD104), RTX 4060 (AD106), as well as AMD Zen 5 (Strix Point and Granite Ridge), and Intel Raptor Lake U SKUs and Meteor Lake Intel Arc Graphics.

In addition to expanded hardware support, GPU-Z 2.60.0 addresses several important issues. The update fixes NVIDIA driver version reporting for some pre-2015 versions, resolves an installer problem that prevented closing running instances of GPU-Z, and corrects the "0 MHz" memory clock display on certain AMD RDNA GPUs without overclocking support. Other improvements include a small handle leak fix, added support for the Monster Notebook subvendor ID, and compatibility with new VMWare virtual GPU IDs. The installer now requires Windows 7 or newer, with appropriate messaging for unsupported systems. Users can download the latest version of TechPowerUp GPU-Z from the official TechPowerUp website to access these new features and improvements.

DOWNLOAD: TechPowerUp GPU-Z 2.60.0

Recent reports suggest that AMD's Zen 5 desktop processors may soon receive a significant power upgrade. The upcoming AGESA 1.2.0.1A Patch A is rumored to increase the default power limits (TDP) from 65 W to 105 W for certain models, specifically the 8-core Ryzen 7 9700X and the 6-core Ryzen 5 9600X. This development comes as a surprise given that the first reviews of the Ryzen 9000 series were published just last week, with lower power consumption praised as a major advantage over previous generations. The potential TDP increase, while not as high as the 120 W initially rumored for the 9700X, still represents a substantial boost in power allocation.

The rationale behind this significant TDP increase appears to be addressing the lower than expected performance of the Ryzen 7 9700X and Ryzen 5 9600X compared to their predecessors. Initial testing showed that both CPUs performed similarly to earlier models, especially in gaming scenarios, with notable improvements only visible when using Precision Boost Overdrive (PBO). Even at 65 W, the Ryzen 7 9700X struggled to outpace the 7800X3D in gaming performance, highlighting the need for improved power delivery.

In a recent report by Mercury Research, AMD has shown significant progress in the CPU market during Q2 2024, particularly in the data center and laptop segments. AMD's most notable achievement comes in the server CPU space, where it now holds 24.1% of the market, a 5.6% increase year-over-year, and a 0.5% increase from the previous quarter. This growth is particularly impressive in terms of revenue, with AMD capturing 33.7% of server CPU revenue despite its lower unit share. This suggests that AMD's high-end EPYC processors carry premium prices in the data center market and are most of the unit volume. AMD has also made advancements in the laptop CPU segment, reaching a 20.3% market share. This represents a 1% increase from the previous quarter and a 3.8% rise year-over-year. The company's success in laptops can be attributed to solid demand for its existing products, propelled by Intel's reported supply issues with Meteor Lake processors.

However, AMD experienced a slight setback in the desktop CPU market, losing a 1% share to Intel quarter-over-quarter. AMD now controls 23% of this segment, compared to Intel's 77%. This dip may be due to AMD's preparation for the launch of its new Zen 5-based CPUs in August. Despite AMD's gains, Intel maintains its overall dominance in the CPU market. In the total client PC space, Intel holds a 78.9% market share, with AMD at 21.1%. Intel still holds the majority of revenue and market share on all fronts. However, AMD is executing well, and Intel's financial troubles could be a setback for team blue. More competition at every front is great to see, and we are curious to look at the data from upcoming quarters and analyze how well both of companies perform.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, today is excited to announce a brand-new BIOS update for its AMD AM5 motherboards, designed to support AMD's latest Ryzen 9000 series processors, including Ryzen 9 9950X, Ryzen 9 9900X, Ryzen 7 9700X, and Ryzen 5 9600X. Incorporating the latest AMD AGESA 1.2.0.0.a Patch A BIOS update on BIOSTAR official website, BIOSTAR AM5 series motherboards consisting of X870E, X670E, B650E, B650, A620, and A620A are now primed and ready to unleash the full potential of AMD's ZEN 5 processors with superior stability.

AMD's latest Ryzen 9000 series processors, built on the groundbreaking Zen 5 architecture, represent a significant leap forward in computing performance and efficiency. These processors offer up to 16 cores and 32 threads, with clock speeds reaching up to 5.7 GHz. Featuring enhanced IPC (Instructions Per Cycle) performance and advanced Ryzen AI capabilities, the Ryzen 9000 series is engineered to handle intensive gaming, content creation, and professional workloads with ease. The new architecture also introduces improved power efficiency, ensuring cooler operation and lower energy consumption. With these cutting-edge processors, users can experience unprecedented levels of speed, responsiveness, and overall computing power.

AMD, with a post on X confirmed the pricing and availability of its new Ryzen 9000 "Granite Ridge" desktop processor models. These were supposed to launch on July 31, but faced a delay, and are now facing a staggered launch. The 8-core Ryzen 7 9700X and 6-core Ryzen 5 9600X will be available from tomorrow, August 8, 2024. The flagship 16-core Ryzen 9 9950X and 12-core Ryzen 9 9900X follow a week later, on August 15. The company also confirmed pricing of the four chips in USD SEP. The Ryzen 9 9950X is confirmed with a $650 price, followed by the Ryzen 9 9900X at $500, the Ryzen 7 9700X at $360, and the Ryzen 5 9600X at $280. These are slightly cheaper than their predecessors, with the 7950X, 7900X, 7700X, and 7600X, launching at $700, $550, $400, and $300, respectively.