Last week, graphics card industry watchdogs alerted the wider hardware public to a registration of XFX Radeon RX 9070 XT and RX 9070 custom design SKUs in South Korea. The recent leak points to an upcoming release of unannounced RDNA 4 -based SWIFT and QUICKSILVER models; XFX's official website does not list anything newer than its current Radeon RX 7000 series offerings. Based on a fresh momomo_us social media post, Amazon's South Korean branch has accidentally published product pages for Radeon RX 9070 (non-XT) 16 GB SWIFT and QUICKSILVER cards. Related imagery and a single screenshot were preserved and then shared online; we are looking at very minimal black shroud and backplate designs.

TechPowerUp handled a similarly dark-tinted XFX demonstration sample at CES 2025, but the latest leaked models do not visually match with this "premium black" preview unit. The Radeon RX 9070 QUICKSILVER's backplate appears to utilize the exact same backplate design, but its shroud's aesthetic setup is more elaborate (lots of angular surfaces). The CES "premium white" sample's overall shape and profile align with the leaked SWIFT model. XFX's black and white options were listed by a Canadian e-tailer, a week ago. momomo_us's single screen capture points to alleged XFX Radeon RX 9070 SWIFT SKU clock speeds—apparently, its Amazon page was adorned with the following info points: 1400 MHz (base), 2210 MHz (game), and 2700 MHz (boost). As interpreted by VideoCardz, this is a factory-overclocked unit—PowerColor's Red Devil RX 9070 card shares the exact same clock settings.

Chuwi is a pretty decent brand of competent mini PCs which have received positive reviews. The brand's latest offering, the AuBox mini PC, combines a powerful AMD APU with an attractive design that is not only commendably compact, but also quite premium looking. The product measures 15 x 15 cm with a height of only 4.5 cm that gives it a genuinely sleek appeal, unlike other mini PCs available on the market which are going for a somewhat tall form factor ever since the M4 Mac Mini has hit the scene. At its core, the AuBox is powered by the Ryzen 7 8745HS APU with eight Zen 4 cores and sixteen threads. Apart from not having an NPU, the 8745HS is basically a slightly down clocked version of the Ryzen 7 8845HS that results in a 6-7% performance drop in synthetic benchmarks.

That said, the APU is plenty performant for the vast majority of workloads that are likely to be thrown its way, provided that they are not overly demanding GPU-wise, since the compact AuBox mini PC lacks discrete graphics, which is hardly out of the ordinary for mini PCs. The integrated RDNA 3-based Radeon 780M iGPU with 12 CUs is perfectly potent for lightweight tasks, however, and entry-level gaming with modest settings should not be much of a hassle either. The AuBox ships with 12 GB of DDR5-5600 memory, which can be upgraded to a healthy 64 GB down the road courtesy of user-accessible SODIMM slots.

AMD's Ryzen 9 9950X3D and Ryzen 9 9900X3D "Zen 5" processors are due for launch next month, but an exact date has not been announced. Currently, Team Red's 3D V-Cache-equipped Ryzen 9000 CPU series is composed of a single SKU: the popular eight-core Ryzen 7 9800X3D model. A new leak points to a possible imminent lineup expansion; the sixteen-core Ryzen 9 9950X3D and twelve-core Ryzen 9 9900X3D CPUs have finally popped up on Geekbench Browser. Both candidates seemed to be tested on the same PC platform; utilizing a GIGABYTE X670 AORUS ELITE AX motherboard and 32 GB (2 x 16 GB) of DDR5-4800 MT/s RAM. Notebookcheck

The Ryzen 9 9950X3D sample scored overall with 3363 (single-core) and 20,465 points (multi-core) in Geekbench 6.3. As expected, the Ryzen 9 9900X3D candidate's overall tallies came in slightly lower—it achieved 3274 (single-core) and 19,227 points (multi-core) overall. Press outlets were quick to compare these figures to prior generation outputs (refer to Wccftech's chart, below). On average, the incoming "Zen 5" parts surpass "Zen 4" equivalents by an average of 15%—in terms of single-core performance. Multi-core performance improvements are less significant; coming in at an average of 7%. The range-topping Ryzen 9 9950X3D CPU's multi-core performance score is "lower than expected," but closer-to-launch optimizations could rectify this matter. Geekbench results often do not reflect the true potential of tested silicon; gamers tend to dismiss or completely ignore these data points. Last month, an AMD executive revealed that the two upcoming X3D Granite Ridge desktop chips: "will provide similar overall gaming performance to the Ryzen 7 9800X3D." Speculative price points—of $699 (16-core) & $599 (12-core)—leaked online last week.

It's that time again! 3DExperience World 2025 kicks off on February 23 and runs through February 26 at the George R. Brown Convention Center in Houston, Texas. The show is hosted by Dassault Systèmes and highlights annual advances and improvements throughout its product ecosystem. It's a great opportunity to meet the engineers, students, and industry professionals who use SolidWorks and other Dassault Systèmes applications across browsers, local workstations, and the cloud.

One of the best parts of the event for me is showcasing how advances in silicon engineering can lead to transformational products - systems that offer performance, features, and efficiency that wasn't possible before. In 2024, the AMD Ryzen Threadripper PRO 7000 WX-Series processor stole the proverbial show with its excellent single-thread performance, support for multi-GPU configurations for AI training, and up to 96 cores and 2T B of memory for the largest and most demanding projects. This year, AMD has complemented these full-size tower systems with compact and mobile workstations based on the new AMD Ryzen AI Max PRO Series processors. Drop by booth #919 and see the array of systems and demos on exhibit.

EK, the premium liquid cooling manufacturer, is proud to announce the latest generation of EK-Quantum Velocity³ CPU water blocks. Offering universal compatibility for both AMD AM5 and Intel LGA 1700 / 1851 sockets, the EK-Quantum Velocity³ features a fully customizable configuration that allows you to rotate, adjust, and reposition the internal components, heat spreader, and ports - ensuring high-performance liquid cooling that's perfectly optimized for your build.

Universal Intel & AMD Platform Compatibility
The EK-Quantum Velocity³ offers a new level of compatibility with design that allows you to interchange between Intel LGA 1700 / 1851 & AMD AM5 with a few simple adjustments. When choosing your platform, simply align the jet plate alignment based on the Intel or AMD socket, reposition the cold plate and attach the LGA or AM5 mounting bracket - it's that simple. This design ensures universal compatibility, offering high performance liquid-cooling that's future proofed should you wish to change platform when upgrading your PC.

AMD's "Strix Halo" APU, marketed as Ryzen AI Max+, has just been exposed in die-shot analysis. Confirming the processor's triple-die architecture, the package showcases a total silicon footprint of 441.72 mm² that integrates advanced CPU, GPU, and AI acceleration capabilities within a single package. The processor's architecture centers on two 67.07 mm² CPU CCDs, each housing eight Zen 5 cores with a dedicated 8 MB L2 cache. A substantial 307.58 mm² I/O complements these die that houses an RDNA 3.5-based integrated GPU featuring 40 CUs and AMD's XDNA 2 NPU. The memory subsystem demonstrates a 256-bit LPDDR5X interface capable of delivering 256 GB/s bandwidth, supported by 32 MB of strategically placed Last Level Cache to optimize data throughput.

The die shots reveal notable optimizations for mobile deployment, including shortened die-to-die interfaces that reduce the interconnect distance by 2 mm compared to desktop implementations. Some through-silicon via structures are present, which suggest potential compatibility with AMD's 3D V-Cache technology, though the company has not officially confirmed plans for such implementations. The I/O die integrates comprehensive connectivity options, including PCIe 4.0 x16 lanes and USB4 support, while also housing dedicated media engines with full AV1 codec support. Initial deployments of the Strix Halo APU will commence with the ASUS ROG Flow Z13 launch on February 25, marking the beginning of what AMD anticipates will be broad adoption across premium mobile computing platforms.

Well, the wait is over and early reviews for AMD's Strix Halo APUs have finally dropped. For those who kept up with the leaks and rumors, the high-end RDNA 3.5 Radeon 8060S iGPU was repeatedly rumored to features up to 40 CUs, allowing for raw performance that keeps up with several discrete-class mobile GPUs. Now that we have concrete information, it appears that the Strix Halo iGPU does indeed trade blows with mid-range mobile GPUs, which is an undeniably impressive feat for an integrated unit. Some of the fastest x86 iGPUs - the Arc 140 V, Radeon 890M, are all left in the dust, although Apple's highest-end offerings are unsurprisingly well ahead.

Starting off with 3D Mark Time Spy, the 40-CU Radeon 8060S, housed in the 13-inch ROG Flow Z13, managed an impressive score of 10,200 points according to Notebookcheck. This puts the iGPU in close proximity to other RTX 4070-powered 14-inch gaming laptops, such as the Zephyrus G14 which managed to rake in around 10,300 points. Compared to the previous iteration of the ROG Flow Z13, which boasts a 65-watt RTX 4070, the Radeon 8060S-powered Z13 pulls ahead by around 5%. Laptops with more substantial power envelopes do race ahead significantly, such as the 140-watt RTX 4070 Laptop-powered Razer Blade 14 which managed over 13,000 points. In the Steel Nomad benchmark, however, the Radeon 8060S appears less impressive, trailing behind not only the RTX 4070 Laptop, but also systems with the RTX 4060 Laptop GPU (110 W).

A leaked document has revealed an alleged review release date of March 5; occurring the day before a rumored global market release of AMD Radeon RX 9070 XT and RX 9070 graphics cards. VideoCardz has reported on its inspection of "NDA materials" intended for members of the press. Team Red has officially announced a proper RDNA 4-themed event; February 28 is an important date on their calendar. Fresh reportage suggests that hardware media outlets and online influencers will be briefed next week, mere days away from AMD's highly-anticipated presentation.

Following head-scratching delays and a secretive marketing strategy (earlier on in 2025), Team Red and its AIB co-conspirators are expected to deliver full specifications, performance data, and pricing during next week's special event. Leaks have pointed to a possible March 6 launch; VideoCardz did not spot any mentioning of this specific date in leaked Radeon RX 9070 NDA documents. A steady flow of insider knowledge has already hinted at speculative "Navi 48" technical details and pre-release performance figures. Will AMD confirm (rumored) PCIe 5.0 connectivity, or acknowledge leaked "Pro" 32 GB variants (with less sarcasm)?

ASUS Republic of Gamers (ROG) announced that the 2025 ROG Flow Z13 is now available for pre-order. This versatile gaming 2-in-1 can feature up to AMD's newest AMD Ryzen AI Max+ 395 Processor with Radeon 8060S Graphics and a unified memory structure, allowing for incredible performance and power efficiency. A new stainless steel and copper vapor chamber, larger intake vents, and 2nd Gen Arc Flow Fans offer 70% more airflow for quiet and efficient cooling.

This 13-inch tablet boasts a stunning ROG Nebula Display, a 2.5K resolution 180 Hz touchscreen with 500 nits of peak brightness, and Corning Gorilla Glass 5 protection. The Flow Z13 now also features a larger 70Wh battery, a larger touchpad and keycaps, and a convenient Command Center button for quick access to vital system functions. With dual USB-C ports, both of which support USB4 and power delivery, as well as a dedicated HDMI 2.1 port, the Flow Z13 lets gamers leave their dongles at home.

Nexa AI, today, announced NexaQuants of two DeepSeek R1 Distills: The DeepSeek R1 Distill Qwen 1.5B and DeepSeek R1 Distill Llama 8B. Popular quantization methods like the llama.cpp based Q4 K M allow large language models to significantly reduce their memory footprint and typically offer low perplexity loss for dense models as a tradeoff. However, even low perplexity loss can result in a reasoning capability hit for (dense or MoE) models that use Chain of Thought traces. Nexa AI has stated that NexaQuants are able to recover this reasoning capability loss (compared to the full 16-bit precision) while keeping the 4-bit quantization and all the while retaining the performance advantage. Benchmarks provided by Nexa AI can be seen below.

We can see that the Q4 K M quantized DeepSeek R1 distills score slightly less (except for the AIME24 bench on Llama 3 8b distill, which scores significantly lower) in LLM benchmarks like GPQA and AIME24 compared to their full 16-bit counter parts. Moving to a Q6 or Q8 quantization would be one way to fix this problem - but would result in the model becoming slightly slower to run and requiring more memory. Nexa AI has stated that NexaQuants use a proprietary quantization method to recover the loss while keeping the quantization at 4-bits. This means users can theoretically get the best of both worlds: accuracy and speed.

AMD's openSIL project, aimed towards open CPU silicon initialization code, continues progressing despite a slight delay in its development timeline. The initiative, which will eventually replace the current AGESA system across AMD's client and server processors, received a new update. The company initially targeted the end of 2024 to release proof-of-concept code for Phoenix client SoCs and Turin server hardware. However, as we move through the first quarter of 2025, AMD has acknowledged a slight deviation from this schedule. In a recent statement, AMD representatives assured the developer community that work continues steadily on both Phoenix and Turin proof-of-concept releases.

"We are hard at work preparing the Phoenix and Turin POC's for public release," stated an AMD representative, emphasizing that these releases will serve as sample code previewing future production-worthy implementations. The company clarified that these initial releases are not intended for production environments. The delay has minimal impact on AMD's plan, as the primary goal remains focused on achieving full production readiness with the upcoming Zen 6 architecture. The openSIL project promises to enhance Coreboot support and provide developers with full access to low-level system components. Though limited to select reference motherboards, the proof-of-concept releases will serve as the first milestones in AMD's journey toward more open hardware solutions.

Upcoming AMD Radeon RX 9070 XT and RX 9070 (non-XT) graphics card specification sheets remain under wraps; we will very likely be presented with the full kibosh on February 28. Throughout early 2025, Team Red and its board partners have divulged very little. Instead, PC hardware news outlets have depended on a steady flow of leaked information. The opening round of Team Red RDNA 4 models have been comprehensively linked to PCIe 4.0 connection standards, but recent anomalies have appeared online. Contradictory spec info arrived late last week, courtesy of a leaker having pre-release access to an allegedly very high-end custom design. The validity of an uploaded GPU-Z session screenshot was questioned by the PC gaming hardware community; the detected candidate card seemed to be connected via a PCI-Express 5.0 x16 bus interface. VideoCardz has stumbled upon additional evidence—their weekend reporting activities pointed to a compelling new product listing on the Micro Center website.

The North American e-tailer's webstore features a "PowerColor AMD Radeon RX 9070 XT Red Devil Limited Edition Overclocked Triple Fan 16 GB GDDR6 PCIe 5.0 Graphics Card." Micro Center's threadbare product page is devoid of promotional images/renders, in-depth technical details or specifications. The "no longer available" special edition package has an SKU assignment code of 796672, and a manufacturer part number read-out of LERX9070XT16GEO. VideoCardz reached out to their "inside source" at PowerColor for research purposes. The company mole confirmed that the PCIe 5.0 spec point is genuine. The leaked photo of "Red Devil packaging" did not reveal any PCIe interface-related info. The publication reckons that the PowerColor Radeon RX 9070 XT Red Devil model's interface "matches the appearance of the PCIe 5.0 standard," as seen on the new generation of NVIDIA RTX 50-series graphics cards. Looking back into recent history, Intel dropped initial plans for PCIe 5.0 connectivity with Arc "Battlemage" graphics cards. The B580 and B570 models have arrived at retail with bog-standard PCIe 4.0 x8 bus interfaces.

Sapphire Technology has introduced a new NITRO+ motherboard model in China—weekend reports pointed to a listing on JD.com, where the latest addition resides alongside various previous-gen B650 options. This appears to be another region specific release—priced at 1299 RMB (~$179 USD). The NITRO+ B850M Wi-Fi model seems to share its overall aesthetic design with the preceding B650M-equipped equivalent. As surmised by VideoCardz, the Sapphire NITRO+ board's VRM patterning reminded them of the leaked premium-tier Radeon NITRO+ RX 9070 graphics card series.

The generational jump from AMD B650 to B850 chipset—as expected—yields only minor benefits (see below). The older NITRO+ B650M Wi-Fi model is a significantly cheaper prospect; coming in at 899 RMB ($124 USD). VideoCardz's weekend detective work settled on a nice improvement: "based on our research, the memory overclocking support has increased from 7600 MT/s+ to 8000 MT/s. Keep in mind that these figures may be higher for both motherboards; this is just what Sapphire guarantees when paired with a supported memory kit." Industry watchdogs believe that ASRock is likely involved in the contract manufacturing of Sapphire's motherboard offerings—the former has been long-involved in pumping out NZXT-badged products.

ASUS's Republic of Gamers China account on Weibo has teased the ROG Magic X mobile device that combines laptop/tablet form with a detachable keyboard. Inside, the device is powered by AMD Ryzen AI MAX+ SoC, which ASUS called a "three-in-one" chip, mainly due to its CPU, NPU, and iGPU combination. One possible SKU for ROG Magic X is AMD's top-end Ryzen AI MAX+ 395 processor. Carrying 16 "Zen 5" cores and 32 threads, the chip is designed for AI-enhanced laptops with 126 combined TOPS of AI processing power. The Ryzen AI MAX+ 395 features 64 MB of L3 cache and operates at a base clock of 3 GHz, with boost capabilities up to 5.1 GHz, depending on workload conditions. Manufactured on TSMC's 4 nm process node, the processor maintains a modest 55 W TDP, suitable for high-performance mobile systems. The chip includes support for ECC memory and PCIe Gen 5. It integrates the Radeon 8060S solution based on RDNA 3.5 architecture for graphics.

We are yet to see more details about the ROG Magic X, but with the arrival of AMD Ryzen AI MAX+, we assume this machine will result in a powerful gaming device for users on the go. More details are expected on February 25, when ASUS plans to showcase it. Pricing and availability are also expected to follow soon after.

We live in crazy times, that's for sure. We have already witnessed a plethora of listings for AMD's RX 9070 and RX 9070 XT GPUs - both set to hit shelves early next month - indicating a decent value proposition compared to NVIDIA's RTX 5070 family, if the leaks and rumors are anything to go by. More recently, as spotted by @momomo_us, Amazon briefly listed a bunch of RX 9070 and 9070 XT cards from XFX. The pricing details are as follows:

• XFX Swift AMD Radeon RX 9070 OC - $649.99
• XFX Swift AMD Radeon RX 9070 XT - $749.99
• XFX Quicksilver AMD Radeon RX 9070 XT - $769.99
• XFX Mercury AMD Radeon RX 9070 XT OC - $819.99
• XFX Mercury AMD Radeon RX 9070 XT OC Magnetic Air Edition - $849.99

Recent rumors hinted at a 32 GB variant of the Radeon RX 9070 XT being in the works, which were quickly dismissed as false information by AMD's Frank Azor. However, reliable sources seem to point to the contrary, stating that a 32 GB variant of the RX 9070 XT, likely dubbed the RX 9070 XTX, is under active development indeed. The source, as pointed out by Wccftech, has a decent track record with AMD-related claims, which sure does add weight to the assertion. Unlike previous XTX-class cards from AMD, which boasted higher clock speeds and core counts, the 9070 XTX is almost certain to feature the same core count as the XT, since the latter already utilizes the full Navi 48 chip - unless, of course, there is an even higher-end chip under wraps.

The VRAM amount seems to indicate that the card will likely be positioned to appease AI enthusiasts. There is also the possibility that the rumored card will be launched under a different branding entirely, although that is not what the post at Chiphell states. Interestingly, Frank Azor did specifically mention that a 32 GB "RX 9070 XT" card is not on the horizon - he did not state that a higher-end XTX card isn't either, which sure does leave room for us to speculate. Benchlife has also chimed in on the matter, claiming that they are aware of AIB partners working on a 32 GB RDNA 4 card with the Navi 48 GPU, which in some ways, confirms the information that came out of Chiphell. The RDNA 4 cards are set to see the light of day soon enough, it seems the wait won't be much longer. However, if the 32 GB card is indeed in the pipeline, it's likely still further down the road.

AMD is readying two important client segment processors powered by the next-generation "Zen 6" microarchitecture, according to a sensational new report by Moore's Law is Dead. These are the "Medusa Point" mobile processor, and the "Olympic Ridge" desktop. The former is a BGA roughly the size and Z-Height of the current "Strix Point," but the latter is being designed for the existing Socket AM5, making it the third (and probably final) microarchitecture to do so. If you recall, Socket AM4 served three generations of Zen, not counting the refreshed "Zen+." At the heart of the effort is a new CPU complex die (CCD) that AMD plans to use across its client and server lineup.

The "Zen 6" performance CCD is being designed for a 3 nm-class node, likely the TSMC N3E. This node promises a significant increase in transistor density, power, and clock speed improvements over the current TSMC N4P node being used to build the "Zen 5" CCD. Here's where it gets interesting. The CCD contains twelve full-sized "Zen 6" cores, marking the first increase in core-counts of AMD's performance cores since its very first "Zen" CCD. All 12 of these cores are part of a single CPU core complex (CCX), and share a common L3 cache. There could be a proportionate increase in cache size to 48 MB. AMD is also expected to improve the way the CCDs communicate with the I/O die and among each other.

Gamers are eagerly awaiting the launch of the RDNA 4-based Radeon RX 9070 and RX 9070 XT gaming GPUs from AMD, which are widely expected to offer commendable value, thanks to comparatively reasonable prices paired with perfectly admirable raw performance that trades blows with the GeForce RTX 5070 family from NVIDIA. Interestingly, a recently leaked retail box for a PowerColor Red Devil RX 9070 XT GPU has revealed a striking detail - the AIB card will boast a whopping 900-watt requirement for a PSU. This is an absurd number, considering that the ROG Astral RTX 5090 behemoth commands a 1000-watt PSU requirement. While some may deem the image to be fake, or perhaps a typo, AMD's Frank Azor has responded to the tweet, claiming that there will be "plenty" of RX 9070 XT cards with lower PSU requirements.

The packaging also confirms that the upcoming mid-range GPU from AMD will sport 64 CUs, which is hardly a surprise. The Red Devil 9070 XT GPU from PowerColor is a very high-end unit with a 3.0 GHz boost clock and 3x 8-pin power connectors for overclocking headroom, which explains the mammoth 900-watt PSU requirement. As pointed out by Redditors, the Red Devil 7900 XTX also featured a 900-watt PSU requirement, which is 100 watts more than what AMD officially recommends. According to VideoCardz, the PowerColor RX 9070 XT Reaper (reference card) carries a 750-watt PSU requirement, whereas the RX 9070 variant requires a 650-watt PSU. The official launch for the RDNA 4 cards is just around two weeks away, which is when we will finally know for sure.

AMD and Nutanix have jointly developed virtualization/HCI solutions since 2019, working with major OEMs including Dell, HP and Lenovo, systems integrators and other resellers and partners. You can learn more about AMD-Nutanix solutions here.

AMD EPYC Processors
The EPYC 9004 family of high performance processors provide up to 128 cores per processor to help meet the demands of a wide range of workloads and use cases. High density core counts allow you to reduce the number of servers you need by as much as a five to one ratio when looking at retiring older, inefficient servers and replacing with a new one. Systems based on AMD processors can also be more energy efficient than many competitive processor based systems. For example, running 2000 VMs on 11 2P AMD EPYC 9654 processor-powered servers will use up to 29% less power annually than the 17 2P Intel Xeon Platinum 8490H processor-based servers required to deliver the same performance, while helping reduce CAPEX up to 46%.

Back in January, we covered a report about AMD designing its next-generation "Zen 6" CCDs on a 3 nm-class node by TSMC, and developing a new line of server and client I/O dies (cIOD and sIOD). The I/O die is a crucial piece of silicon that contains all the uncore components of the processor, including the memory controllers, the PCIe root complex, and Infinity Fabric interconnects to the CCDs and multi-socket connections. Back then it was reported that these new-generation I/O dies were being designed on the 4 nm silicon fabrication process, which was interpreted as being AMD's favorite 4 nm-class node, the TSMC N4P, on which the company builds everything from its current "Strix Point" mobile processors to the "Zen 5" CCDs. It turns out that AMD has other plans, and is exploring a 4 nm-class node by Samsung.

This node is very likely the Samsung 4LPP, also known as the SF4, which has been in mass-production since 2022. The table below shows how the SF4 compares with TSMC N4P and Intel 4, where it is shown striking a balance between the two. We have also added values for the TSMC N5 node from which the N4P is derived from, and you can see that the SF4 offers comparable transistor density to the N5, and is a significant improvement in transistor density over the TSMC N6, which AMD uses for its current generation of sIOD and cIOD. The new 4 nm node will allow AMD to reduce the TDP of the I/O die, implement a new power management solution, and more importantly, the need for a new I/O die is driven by the need for updated memory controllers that support higher DDR5 speeds and compatibility with new kinds of DIMMs, such as CUDIMMs, RDIMMs with RCDs, etc.

AMD's Radeon RX 9000 series GPUs are expected to come with up to 16 GB of GDDR6 memory. However, AMD is reportedly expanding its RX 9070 lineup with a new 32 GB variant, according to sources on Chiphell. The card, speculatively called the RX 9070 XT 32 GB, is slated for release at the end of Q2 2025. The current GDDR6 memory modules used in GPUs carry a capacity of 2 GB per module only, meaning that a design with 32 GB of VRAM would require as many as 16 memory modules on a single card. No 2 GB+ GDDR6 memory modules are available, meaning that the design would require memory module installation on both the front and back of the PCB. Consumers GPUs are not known for this, but it is a possibility with workstation/prosumer grade GPUs employing this engineering tactic to boost capacity,

While we don't have information on the GPU architecture, discussions point to potential modifications of the existing Navi 48 silicon. This release is positioned as a gaming card rather than a workstation-class Radeon PRO 9000 series product. AMD appears to be targeting gamers interested in running AI workloads, which typically require massive VRAM amounts to run locally. Additionally, investing in a GPU with a big VRAM capacity is essentially "future-proofing" for gamers who plan to keep their cards for longer, as recent games have been spiking VRAM usage by a large margin. The combination of gaming and AI workloads may have made AMD reconsider some of its product offerings, potentially giving us the Radeon RX 9070 XT 32 GB SKU. We have to wait for the Q2 to start, and we can expect more details by then.

Update 20:55 UTC: AMD's Frank Azor on X debunked rumors of the 32 GB SKU coming to gamers. So, this will not happen. Instead, we could be looking at prosumer oriented AMD Radeon Pro GPU with 32 GB of memory instead.

David McAfee—AMD's corporate vice president and general manager of client channel business—has highlighted February 28 as a highly important date for next-gen graphics technology. The much-anticipated (and teased) Radeon RX 9000 series unveiling event has a confirmed time slot on that day: 8 AM EST. The overseer of Ryzen CPU and Radeon GPUs has warded off curious queries from journalists and members of the PC hardware for several weeks, since the conclusion of CES 2025. A confusing early January presentation did not include a segment dedicated to upcoming RDNA 4 products. Online conjecture pointed to Team Red delaying and restrategizing the launch of Radeon RX 9070 XT and RX 9070 models.

AMD enthusiasts will breathe a collective sigh of relief, after reading McAfee's announcement: "the wait is almost over. Join us on February 28 at 8 AM EST for the reveal of the next-gen AMD Radeon RX 9000 Series. Get ready to make it yours when it hits shelves in early March. RSVP by subscribing to the AMD YouTube channel." Insider sources reckon that retailers will have stock on shelves by the rumored March 6 launch day. Mid-to-late January leaks suggested a fairly comprehensive distribution of board partner custom cards across European retail channels. Alleged specifications and performance results have leaked out over the past month and a half—will AMD (and AIBs) have any surprises lined up for the February 28 event?

AMD's Radeon RX 9070 GPU series is due for release next month; a specific date has not been set, but we will likely find out more through official channels at the end of this month. Team Red and its board partners have chosen to remain silent on the subject of RDNA 4's technical makeup; post-CES 2025, hardware news outlets have relied on a steady trickle of Radeon RX 9070 XT and RX 9070-related leaks. Very basic sleuthing pointed to pools of 16 GB VRAM for both models, while insiders kept on mentioning an unannounced "Navi 48" GPU. The latest—courtesy of HKEPC—seems to confirm that the Radeon RX 9070 XT will utilize the aforementioned new RDNA 4 Navi chip. Earlier today, a screenshot was uploaded to social media—the leaker shared graphics card information displayed in a TechPowerUp GPU-Z (v2.62) session. Despite patch notes not disclosing compatibility, the latest version of GPU-Z is seemingly able to identify key aspects of the alleged "RX 9070 XT (Navi 48)" sample.

The card's name is obscured, but HKEPC and several press outlets believe that it is the genuine article. The fundamental details appear to be: 16 GB GDDR6 VRAM (Hynix-made), a 256-bit memory bus, 4096 stream processors, and a boost clock reaching a maximum frequency of 3.1 GHz. Older leaks have indicated that the first wave of RDNA 4 cards will make do with PCI-Express 4.0 x16 interfaces, but the GPU-Z screenshot shows a PCI-Express 5.0 x16 bus interface (detection could be bugged). The driver version was identified as Adrenalin 24.30.01.05. The unnamed card appears to feature a steep factory overclock; industry experts reckon that the sample could be a very high-end AIB model. Past reports suggest that PowerColor's Radeon RX 9070 XT Red Devil card is capable of boosting up to 3060 MHz. HKEPC uploaded another incriminating screenshot; showcasing performance results produced by Capcom's Monster Hunter Wilds PC performance benchmark tool. The test system—featuring Intel's Core Ultra 9 285K CPU and 48 GB of RAM—scored 36102 points and achieved a maximum frame rate of 211.71 FPS at 1080p, with "Very High" profile settings. The leaker confirmed that FSR and Frame Generation were enabled during the benchmark session.

Late last month, an AMD "How to Sell" Ryzen AI MAX series guide appeared online—contents provided an early preview of the Radeon 8060S iGPU's prowess in 1080p gaming environments. Team Red seemed to have some swagger in their step; they claimed that their forthcoming "RDNA 3.5" integrated graphics solution was up to 68% faster than NVIDIA's discrete GeForce RTX 4070 Mobile GPU (subjected to thermal limits). Naturally, first-party/internal documentation should be treated with a degree of skepticism—the PC hardware community often relies on (truly) independent sources to form opinions. A Chinese leaker has procured a pre-release laptop that features a "Zen 5" AMD Ryzen AI Max+ 395 processor. By Wednesday evening, the tester presented benchmark results on the Tieba Baidu forums.

The leaker uploaded a screenshot from a 3DMark Time Spy session. No further insights were shared via written text. On-screen diagnostics pointed to a "Radeon 8050S" GPU, and the CPU being an "AMD Eng Sample: 100-000001243-50_Y." Wccftech double-checked this information; they believe that the OPN ID corresponds to a: "Ryzen AI MAX+ 395 with the Radeon 8060S, instead of the AMD Radeon 8050S iGPU...The difference between the two is that the Radeon 8060S packs the full 40 Compute Units while the Radeon 8050S is configured with 32 Compute Units. The CPU for each iGPU is also different and the one tested here packs 16 Zen 5 cores instead of the 12 Zen 5 cores featured on the Ryzen AI MAX 390." According to the NDA-busting screenshot, Team Red's Ryzen AI MAX+ 395 engineering sample racked up an overall score of 9006 in 3DMark Time Spy. Its graphics score tally came in at 10,106, while its CPU scored 5571 points. The alleged Radeon 8060S iGPU managed to pull in just under NVIDIA's GeForce RTX 4060 Mobile dGPU (average) score of 10,614. The plucky RDNA 3.5 40 CU iGPU seems to outperform a somewhat related sibling; the Radeon RX 7600M XT dGPU (with 32 RDNA 3 CUs) scored 8742 points. Radeon 8060S trails the desktop Radeon RX 7600 GPU by 884 points.

XFX and ASRock have registered various Radeon RX 9070 XT and RX 9070 SKUs in South Korea—earlier today, harukaze5719 discovered these "public secrets." The National Radio Agency received two filings from Hightech Systematic Limited (aka XFX); the graphics card manufacturer is seeking certification for five models. A single filing from ASRock Incorporation contains one product, a Radeon RX 9070 (non-XT) Challenger 16 GB card—TechPowerUp spent a little bit of hands-on time with this particular model at CES 2025.

XFX showcased two unnamed custom Radeon 9070 graphics card designs at last month's CES event, but yesterday's leak revealed a slew of incoming MERCURY, QUICKSILVER and SWIFT SKUs. The latest South Korean filings corroborate a couple of the accidental Canadian retail listings. The unannounced QUICKSILVER Magnetic Air model has attracted the most interest—promotional imagery is not available at the time of writing, but VideoCardz reckons that XFX could borrow elements from last year's hot-swappable Radeon RX 7900 XTX and RX 7800 XT Series design. TPU's W1zzard praised XFX's Magnetic Air system, in his evaluation of the Radeon RX 7900 XTX MERCURY model. An "amazing removable fan implementation" was pinpointed as a major highlight. The unusual usage of Honeywell PTM7950 thermal paste—a phase change material (PCM)—was another novel plus point.