Corning Incorporated (NYSE: GLW) today announced the introduction of Corning Gorilla Glass Ceramic, an innovative, transparent, and strengthenable glass ceramic material to help bring advanced toughness to more mobile devices. Gorilla Glass Ceramic significantly improves drop performance on rough surfaces compared to competitive aluminosilicate glasses. The new material expands Corning's portfolio of durable cover materials for OEMs.

"Gorilla Glass has built a reputation of strength and resilience, and our new glass ceramic material continues this tradition. Designed to offer enhanced toughness, Gorilla Glass Ceramic reinforces our commitment to innovating and engineering high-quality, durable materials for display covers and enclosures," said David Velasquez, Vice President & General Manager, Corning Gorilla Glass.

PanelSemi, a developer of ultra-thin flexible LED displays and semiconductor substrates, has partnered with NGK Insulators to create high-performance hybrid packaging solutions. Leveraging its tiled thin-film transistor (TFT) circuit fabrication technology, PanelSemi is developing a hybrid circuit board that combines fine wiring and functional circuits on polyimide film with a ceramic substrate. The company is expanding into high-performance circuit boards for semiconductor modules, targeting large-scale panel manufacturing for wireless communications and opto-electronic integration. The collaboration with NGK extends the application of ceramic substrates to higher power and thermal scenarios.

NGK aims to integrate PanelSemi's circuit fabrication technology with its own products, including the ultra-compact EnerCera lithium-ion rechargeable battery, ceramic substrates, and ceramic packages. PanelSemi's HyBrid Substrate (HBS) technology platform features ultra-fine line width and spacing achieved through Thin Film (TF) and Panel Level Packaging (PLP) processes. HBS enables high-density interconnection, functioning as both an interposer and package substrate in advanced packaging, with the top die directly bonded to the HBS.