According to Taiwanese media Commercial Times, Intel is significantly increasing its outsourcing of "Arrow Lake" CPU production to TSMC, a strategic move as it grapples with persistent issues in its own foundry division. This decision to outsource a substantial portion of Arrow Lake's production is a significant shift in Intel's strategy, showing the company's rising reliance on external partners to meet quality and performance demands. The Arrow Lake Core Ultra 200 series is Intel's first major outsourcing initiative, in which Intel gave its core IP to third-party foundries, more specifically for a 3 nm node at TSMC. However, it clearly indicates the performance gaps in Intel's own Intel Foundry and the high demand expectations for the new CPUs. Originally intended to use Intel 20A node, Intel shifted focus of 18A node for its products and upcoming foundry customers.

Intel's recent orders with TSMC extend to its upcoming Lunar Lake chips and next-generation Falcon Shores AI GPUs, both of which will use TSMC's 3 nm process. Although Intel's 18A node remains promising, the company relies on current products to sustain its revenue streams, making TSMC's support crucial in ensuring timely shipments. This increased outsourcing reflects Intel's need to maintain competitive performance in the short term. Once its Foundry division meets performance and capacity targets, Intel aims to bring more CPU manufacturing back in-house. However, if anything goes wrong, Intel could face challenges securing sufficient volume from TSMC, as the foundry has longstanding commitments with major clients like Apple, NVIDIA, Qualcomm, and AMD.

According to ChinaScope, an effort is currently underway to strengthen Huawei's HarmonyOS platform's presence. The local government of Shenzhen has unveiled an ambitious program aimed at supercharging the development of native applications for the operating system. The "Shenzhen Action Plan for Supporting the Development of Native HarmonyOS Open Source Applications in 2024" outlines several key goals to foster a more robust and competitive ecosystem around HarmonyOS. One primary objective is for Shenzhen-based HarmonyOS apps to account for over 10% of China's total by the end of 2024. To facilitate this, the city plans to establish at least two specialized industrial parks dedicated to HarmonyOS software development across various application domains.

Furthermore, the initiative calls for over 1,000 software companies in Shenzhen to obtain HarmonyOS development talent qualifications, underscoring the city's commitment to cultivating a skilled workforce for the platform. Perhaps most impressively, the action plan encourages eligible companies to ramp up their outsourcing services for HarmonyOS app development, with a lofty target of reaching 500,000 HarmonyOS developers. This would represent a significant influx of developer talent focused on the platform if achieved. The Shenzhen government's push aligns with China's broader strategy to reduce reliance on foreign technologies and promote the adoption of domestic alternatives like HarmonyOS. While initially launched by Huawei as a workaround for U.S. sanctions, HarmonyOS has since expanded to power many devices, including smartphones, tablets, smartwatches, and TVs.

Intel's leadership has announced the hastened expansion of 20 A and 18 A-capable fabrication facilities in Arizona, in order to meet next year's anticipated manufacturing demand from Foundry Services clients. Team Blue's native efforts are possibly not enough in the eyes of an investment bank—Taiwan's Commercial Times has managed to take a look at industry analysis conducted by Goldman Sachs Securities. Intel is predicted to broaden its outsourcing to TSMC in 2024 and 2025—although a part of said report proposes the hypothetically bizarre scenario where Intel outsources all of its products at a cost of $18.6 billion in 2024, and $19.4 billion in 2025 (in terms of total addressable market). A more down-to-earth synopsis outlines TSMC winning Intel outsourcing contracts worth $5.6 billion in 2024, and $9.7 billion for 2025.

According to Trendforce's report this would approximately account: "for 6.4% and 9.4% of TSMC's overall revenue in the corresponding years." Industry analyst Andrew Lu was contacted for comment on the conjectural conditions: "(this) explains that Intel's wafer chip manufacturing division competes with TSMC, rather than its design division. The design division is striving for survival in the high-speed computing semiconductor sector, and it is currently hopeful for close collaboration with TSMC. Lu even predicts that Intel's wafer manufacturing and design divisions will inevitably be further separated into two companies several years down the line."

Dell Technologies announced it has signed a definitive agreement to acquire Moogsoft, an AI-driven provider of intelligent monitoring solutions that support DevOps and ITOps. This transaction will further enhance Dell's AIOps capabilities, as part of its longstanding approach of embedding AI functionality within its product portfolio and as a critical component of its "multicloud by design" strategy. The transaction is expected to close in Q3. Additional details will be available at that time.

About Moogsoft
Moogsoft is the AI-driven observability leader that provides intelligent monitoring solutions for smart DevOps. Moogsoft delivers the most advanced cloud-native, self-service platform for software engineers, developers, and operators to instantly see everything, know what's wrong and fix things faster. Founded in 2012, Moogsoft has more than 140 customers worldwide including American Airlines, Fannie Mae, Fiserv, HCL Technologies, SAP SuccessFactors, and Verizon Media. It has established strategic partnerships with leading managed service providers and outsourcing organizations including AWS, Cisco, HCL Technologies, TCS and Wipro.

Due to the various major events that affected the global economy and politics, the overall demand for consumer electronics made a sharp downward turn in 2022, and global shipments of notebook (laptop) computers began to fall over the quarters. TrendForce's latest analysis finds that global shipments of notebook computers (from ODMs) reached just around 186 million units for 2022, showing a YoY drop of 24.5%. As for 2023, the outlook on the performance of the notebook computer market remains uncertain at this moment. TrendForce expects the YoY decline to moderate to about 7.8%, but shipments are projected to total only 171 million units.

Because market demand was anemic in 4Q22, promotional activities related to the traditional year-end peak season did not generate a lot of sales momentum. Looking at regional markets, notebook brands (PC OEMs) slashed prices in the US and China, but their sales results still did not meet expectations. This development was mainly attributed to factors such as high inflation suppressing consumers' disposable income. Since the sales results for 4Q22 were lackluster, efforts to get rid of the existing stockpile of whole devices might continue through 2Q23. Furthermore, order placements from channels are going to be much more restrained.

Intel has today reported its Q4 2020 earnings disclosing full-year revenue with the current CEO Bob Swan, upcoming new CEO Pat Gelsinger, and Omar Ishrak, Chairman of Intel's board. During the call, company officials have talked about Intel's earnings and most importantly, addressing the current problems about the company's manufacturing part - semiconductor foundries. Incoming Intel CEO, Pat Gelsinger, has talked about the state of the 7 nm node, giving shareholders reassurance and a will to remain in such a position. He has made an argument that he has personally reviewed the progress of the "health and recovery of the 7 nm program."

The 7 nm node has been originally delayed by a full year amid the expectations, and as with the 10 nm node, we have believed that it is going to experience similar issues. However, the incoming CEO has reassured everyone that it is very much improving. The new 7 nm node is on track for 2023 delivery, when Intel is expected to compete with the 3 nm node of TSMC. Firstly, Intel will make a debut of the 7 nm node with client processors scheduled for 1H 2023 arrival, with data center models following that. The company leads have confirmed that Intel will stay true to its internal manufacturing, but have stressed that there will still be a need for some outsourcing to happen.

According to a market analysis from TrendForce, Intel's manufacturing efforts with TSMC will go way beyond a potential TSMC technology licensing for that company's manufacturing technology to be employed in Intel's own fabs. The market research firm says that Intel will instead procure wafers directly from TSMC, starting on 2H2021, in the order of 20-25% of total production for some of its non-CPU products. But the manufacturing deal is said to go beyond that, with TSMC picking up orders for Intel's Core i3 CPUs in the company's 5 nm manufacturing node - one that Intel will take years to scale down to on its own manufacturing capabilities.

According to TrendForce, that effort will scale upwards with TSMC manufacturing certain allotments of Intel's midrange and high-end CPUs using the semiconductor manufacturer's 3 nm technology in 2022. TrendForce believes that increased outsourcing of Intel's product lines will allow the company to not only continue its existence as a major IDM, but also maintain and prioritize in-house production lines for chips with high margins, while more effectively spending CAPEX on advanced R&D due to savings on fabrication technology scaling - fewer in-house chips means lower needs for investment in capacity increases, which would allow the company to sink the savings into further R&D. The move would also allow Intel to close the gap with rival AMD's manufacturing advantages in a more critical, timely manner.