Danger Den MPC-975X Chipset Waterblock Review 8

Danger Den MPC-975X Chipset Waterblock Review

Performance »

Installation


The Danger Den MPC-975X chipset waterblock will be installed on an ASUS P5W-DH Deluxe motherboard, which uses the Intel 975X chipset. To install the MPC-975X block, this motherboard had to be removed from the case and the motherboard tray to allow removal of the stock chipset heatsink assembly. With other motherboards that do not have connected heatsinks, it may be possible to leave the motherboard on a tray and remove the chipset heatsink by itself.


After removing the stock heatsink, the chipset was cleaned of all thermal compound. The thermal paste was reapplied (in this case, using Noctua's NT-H1 thermal compound), making sure to cover the entire die.


The MPC-975X block was placed on top of the chipset, being sure to line up the openings in the top with the loops attached to the motherboard. The ASUS board uses only two loops to mount the heatsink, so in this case only two hooks and springs are used. The black metal hook is inserted through the spring, pressed down, then turned to lock the hook under the loop. I found it best to do both hooks at the same time. With boards that use four loops, I suggest attaching two hooks at opposite corners at the same time to help provide even pressure on the core.


One thing I noticed here was that there is a possibility of a small amount of rocking since the base is so much larger than the small core. One way to solve this would be to add a foam rubber pad or dots to the kit. The one shown here is made by Microcool and was purchased from Sidewinder Computers. The price is fairly low on these foam protectors, but it would be nice to include one with the MPC waterblocks that may require them. Also having such protectors would greatly reduce the chance of chipping the silicon die during installation and use.


Immediately after mounting the block was removed to check the contact area. As usual, the Danger Den block had made perfect contact with the chipset core. Any extra thermal compound was pushed out along the sides, which is fine for non-conductive thermal material like the NT-H1 or Arctic Silver Ceramique.


At this point, the block was remounted and the rest of the loop assembled. Then the loop was filled, bled and leak tested for several hours before testing.
Next Page »Performance
View as single page
Jul 24th, 2024 03:17 EDT change timezone

New Forum Posts

Popular Reviews

Controversial News Posts