The system being used to test the heatsink is as follows:
CPU: | Intel E6850 Core2 Duo |
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Clock speed: | 9 x 333 MHz = 3.0 GHz, Memory at DDR2-667 |
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Motherboard: | Asus P5W DH Deluxe |
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Memory: | 2 x 1GB G.Skill F2-6400PHU1-2GBHZ |
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Video Card: | Sapphire HD 2900XT PCI-e |
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Harddisk: | 4 x 250 GB Seagate 7200.10 in Matrix Raid 0/5 |
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Power Supply: | ThermalTake ToughPower 850W |
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Case: | Lian Li PC-A10B |
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Software: | Windows XP Pro SP2, Catalyst 8.1 |
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Ambient temperature was kept to 22º Celsius (+/- 1 degree) and was measured by a standard mercury thermometer. Chipset temperature was measured with a Craftsman non-contact infrared thermometer. All idle temperatures were recorded after 30 minutes of resting at the desktop, and load temperatures were taken after 30 minutes of Orthos StressPrime. The rest of the water loop consists of the following components:
CPU Waterblock: | Danger Den MC-TDX |
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Pump: | Danger Den D5 (variable speed: pump set to "5") |
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Radiator: | Swiftech MCR320-QP-K |
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Fans: | 3 x Yate Loon D12SM-124B |
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Tubing: | Tygon 3603 1/2" ID |
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Fittings: | 1/2" OD barbs |
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Here you can see the obvious improvement of watercooling the chipset block over using plain air cooling. Watercooling is much more effective, beating air cooling by 9 to 19°C.
On a side note, adding the Danger Den MPC-975X chipset waterblock to the water loop surprisingly resulted in no CPU temperature change. Perhaps this is due to the superior flow design of these two waterblocks or the heat output of the chipset is too low to make any measureable difference.