HP FX700 2 TB Review - Chinese QLC is Working Well 23

HP FX700 2 TB Review - Chinese QLC is Working Well

Test Setup »

Packaging

Package Front
Package Back


The Drive

SSD Front
SSD Back

The drive is designed for the M.2 2280 form factor, which makes it 22 mm wide and 80 mm long.

SSD Interface Connector

PCI-Express 4.0 x4 is used as the host interface to the rest of the system, which doubles the theoretical bandwidth compared to PCIe 3.0 x4.

SSD Teardown PCB Front
SSD Teardown PCB Back

On the PCB you'll find the SSD controller and four flash chips. A DRAM cache is not available.


HP includes a preinstalled heat spreader foil with the SSD. We've seen this on other SSDs, too, but here the metal foil is rather thin. The are also marketing the grayish substance as "graphene," looks like graphite to me. Still, as our thermal testing shows, this level of cooling is sufficient for everything, including the worst possible scenarios.

Chip Component Analysis

SSD Controller

MaxioTech's MAP1602A controller is produced on TSMC's 12 nanometer node and uses several Arm Cortex R5 CPU cores.

SSD Flash Chips

The four flash chips are YMTC 232-layer 3D QLC NAND.
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