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Kingston DC1500M 1.9 TB

1.9 TB
Capacity
SM2270
Controller
TLC
Flash
PCIe 3.0 x4
Interface
U.2
Form Factor
Front
PCB Back
Overclockers
PCB Back
PCB Front
Overclockers
PCB Front
DRAM
Overclockers
DRAM
Flash
Overclockers
Flash
SSD Controller
Controller
NAND Die
NAND Die
The Kingston DC1500M is a solid-state drive in the U.2 form factor, launched on July 21st, 2021. It is available in capacities ranging from 1.9 TB to 7.5 TB. This page reports specifications for the 1.9 TB variant. With the rest of the system, the Kingston DC1500M interfaces using a PCI-Express 3.0 x4 connection. The SSD controller is the SM2270 from Silicon Motion, a DRAM cache chip is available. Kingston has installed 96-layer TLC NAND flash on the DC1500M, the flash chips are made by Toshiba. The DC1500M is rated for sequential read speeds of up to 3,100 MB/s and 2,700 MB/s write; random IO reaches 420K IOPS for read and 200K for writes.
The SSD's price at launch is unknown. The warranty length is set to five years, which is an excellent warranty period. Kingston guarantees an endurance rating of 13450 TBW, a very high value, making this drive a good choice for write-intensive enterprise applications.

Solid-State-Drive

Capacity: 1.9 TB (1920 GB)
Variants: 1.9 TB 7.5 TB
Overprovisioning: 771.9 GB / 43.2 %
Production: Active
Released: Jul 21st, 2021
Part Number: SEDC1500M/1920G
Market: Enterprise

Physical

Form Factor: U.2
Interface: PCIe 3.0 x4
Protocol: NVMe 1.3
Power Draw: 7.0 W (Idle)
8.2 W (Avg)
20.9 W (Max)

Controller

Manufacturer: Silicon Motion
Name: SM2270
Architecture: ARM 32-bit Cortex-R5
Core Count: 6-Core
Frequency: 550 MHz
Flash Channels: 16 @ 800 MT/s
Chip Enables: 8
Controller Features: DRAM (enabled)

NAND Flash

Manufacturer: Toshiba
Name: BiCS4
Rebranded: FB12808UCT1-7F (Rebranded by Kingston)
Type: TLC
Technology: 96-layer
Speed: 800 MT/s
Capacity: 20 chips @ 1 Tbit
ONFI: 4.0
Toggle: 3.0
Topology: Charge Trap
Process: 19 nm
Die Size: 86 mm²
(6.0 Gbit/mm²)
Dies per Chip: 2 dies @ 512 Gbit
Planes per Die: 2
Decks per Die: 2
Word Lines: 109 per NAND String
88.1% Vertical Efficiency
Read Time (tR): 58 µs
Program Time (tProg): 561 µs
Die Read Speed: 551 MB/s
Die Write Speed: 57 MB/s
Endurance:
(up to)		 3000 P/E Cycles
(30000 in SLC Mode)
Page Size: 16 KB
Block Size: 1152 Pages
Plane Size: 1822 Blocks

DRAM Cache

Type: DDR4-2400 CL17
Name: Kingston D2516ACPCXGPH
Capacity: 2048 MB
(4x 512 MB)
Organization: 4Gx16

Performance

Sequential Read: 3,100 MB/s
Sequential Write: 2,700 MB/s
Random Read: 420,000 IOPS
Random Write: 200,000 IOPS
Endurance: 13450 TBW
Warranty: 5 Years
MTBF: 2.0 Million Hours
Drive Writes Per Day (DWPD): 3.8
Write Cache: N/A

Features

TRIM: Yes
SMART: Yes
Power Loss Protection: Yes
Encryption:
  • Unknown
RGB Lighting: No
PS5 Compatible: No

Reviews

Notes

Controller:

The SM2270 uses three separate dual-core ARM Cortex R5 CPUs. To do this, Silicon Motion "essentially removed the front-end from the SM2262 8-channel controller design and put two of those on one die, behind a new wider front end with support for PCIe x8.".

NAND Die:

Read latency tR: 58 µs (ABL)
tPROG with ~ 25% Overhead: ~ 750 µs (Avg - 42.7 MB/s per each die)
Aug 28th, 2024 01:18 EDT change timezone

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