Monday, May 23rd 2022

Intel to Present Meteor/Arrow Lake with Foveros 3D Packaging at Hot Chips 34

Hot Chips 34, the upcoming semiconductor conference from Sunday, August 21 to Tuesday, August 23, 2022, will feature many significant contributions from folks like Intel, AMD, Tesla, and NVIDIA. Today, thanks to Intel's registration at the event, we discovered that the company would present its work on Meteor Lake and Arrow Lake processors with the novel Foveros 3D packaging. The all-virtual presentation from Intel will include talks about Ponte Vecchio GPU and its architecture, system, and software; Meteorlake and Arrowlake 3D Client Architecture Platform with Foveros; and some Xeon D and FPGA presentations. You can see the official website here for a complete list of upcoming talks.

As a little reminder, Meteor Lake is supposed to arrive next year, replacing the upcoming Raptor Lake design, and it has already ahs been pictured, which you can see below. The presentation will be recorded and all content posted on Hot Chips's website for non-attendees to catch up on.
Source: via Tom's Hardware
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9 Comments on Intel to Present Meteor/Arrow Lake with Foveros 3D Packaging at Hot Chips 34

#1
Unregistered
Well Foveros Die to Die stacking is certainly interesting

[URL]https://www.anandtech.com/show/16823/intel-accelerated-offensive-process-roadmap-updates-to-10nm-7nm-4nm-3nm-20a-18a-packaging-foundry-emib-foveros/4[/URL]

Posted on Edit | Reply
#2
samum
I'm surprised they haven't changed the name of the conference. "Hot Chips" doesn't mean the same thing today as it did 30 years ago.
Posted on Reply
#3
DeathtoGnomes
FYI: Intel is not scheduled to give a keynote presentation at this years Computex.
Posted on Reply
#4
Vayra86
samumI'm surprised they haven't changed the name of the conference. "Hot Chips" doesn't mean the same thing today as it did 30 years ago.
You beat me to it... LOL
Posted on Reply
#5
Minus Infinity
Meteor Lake and Arrow Lake look potentially really exciting products. Arrow Lake will be a huge shift in power efficiency for mobile from what I've read. I think Intel will get much much closer to Apple's offerings in this regard and dominate performance. I hope Zen 5/Zen 6 mobile are also going to aggressively target power efficiency and performance per watt.
Posted on Reply
#6
Fouquin
Intel would like to present you all our upcoming announcement. Now with 15% more things to be announced, and a teaser for our next announcement after that. Stay tuned for that announcement!
Posted on Reply
#7
bonehead123
Much like their so-called desktop GPU's, until such time that I have one of these "hot" chips runnin in front of me, they are/will remain vaporware IMO :)
Posted on Reply
#8
mouacyk
Vayra86You beat me to it... LOL
Don't worry, they won't beat ever NVidia
Posted on Reply
#9
Richards
TiggerWell Foveros Die to Die stacking is certainly interesting

[URL]https://www.anandtech.com/show/16823/intel-accelerated-offensive-process-roadmap-updates-to-10nm-7nm-4nm-3nm-20a-18a-packaging-foundry-emib-foveros/4[/URL]

The 3d gen one is a game changer chips stacked and touching with no latency.. monolithic stacked

Intel is just flecing on amd so many architectures coming fast while the competition still is designing zen 5 smh
Posted on Reply
May 21st, 2024 08:43 EDT change timezone

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