SolidRun, a leading developer and manufacturer of high-performance System on Module (SOM) solutions, Single Board Computers (SBC) and network edge solutions, today announced the launch of its new Ryzen V3000 CX7 Com module, configurable with the 8-core/16-thread Ryzen Embedded V3C48 Processor. Boasting AMD's state-of-the-art 6 nm "Zen 3" architecture, this ultra-powerful embedded solution offers industry-leading performance and power efficiency. As SolidRun's first x86-based Com Express 7 module, the Ryzen V3000 CX7 Com module ushers in a new era of efficient, high-performance computing for a diverse range of networking and edge applications.

"Our new Ryzen V3000 CX7 Com module is an exciting addition to our CX7 product line as it represents a significant leap forward in embedded computing and offers unmatched performance and scalability for networking and edge applications," said Dr. Atai Ziv, CEO at SolidRun. "By leveraging the power of AMD's Ryzen Embedded V3000 processor, we are empowering developers to create innovative solutions that meet the evolving demands of modern embedded computing."

Huawei's new server CPU based on the HiSilicon Taishan V120 core has shown impressive single-threaded performance that matches AMD's Zen 3 architecture in a leaked Geekbench 6 benchmark. The Taishan V120 is likely being manufactured on SMIC's 7 nm process node. The Geekbench 6 result posted on social media does not identify the exact Huawei server CPU model, but speculation points to it being the upcoming Kunpeng 930 chip. In the benchmark, the Taishan V120 CPU operating at 2.9 GHz scored 1527 in the single-core test. This positions it nearly equal to AMD's EPYC 7413 server CPU based on the Zen 3 architecture, which boosts up to 3.6 GHz and which scored 1538 points. It also matches the single-threaded performance of Intel's Coffee Lake-based Xeon E-2136 from 2018, even though that Intel chip can reach 4.5 GHz boost speeds, scoring 1553 points.

The Taishan V120 core first appeared in Huawei's Kirin 9000 smartphone SoC in 2020. Using the core in server CPUs would allow Huawei to achieve competitive single-threaded performance to rival AMD's last-generation EPYC Milan and Intel's older Skylake server chips. Multi-threaded benchmarks will be required to gauge the Kunpeng 930's overall performance fully when it launches. Huawei continues innovating its ARM-based server CPU designs even while facing restrictions on manufacturing and selling chips internationally due to its inclusion on the US Entity List in 2019. The impressive single-threaded results versus leading x86 competitors demonstrate Huawei's resilience and self-reliance in developing homegrown data center technology through its HiSilicon division. More details on the Kunpeng 930 server chip will likely surface later this year, along with server configurations from Chinese OEMs.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces that its AMD AM4 series motherboards are now compatible with the latest AMD Ryzen 5000 series processors.With the official unveiling of the Ryzen 8000 Series desktop processors, AMD has further enhanced its Ryzen 5000 Series, first released in 2020, by introducing four new processors. These additions include the Ryzen 7 5700X3D, Ryzen 7 5700, Ryzen 5 5600GT, and Ryzen 5 5500GT, all built on AMD's efficient Zen 3 architecture. This expansion of the Ryzen 5000 Series offers users a broader range of options, from high-end to mainstream, demonstrating AMD's dedication to diversifying its CPU offerings.

The AMD Ryzen 7 5700X3D and Ryzen 7 5700 processors are equipped with advanced technologies like AMD StoreMI, which enhances storage performance by combining SSDs and HDDs into a more efficient, single-tiered storage system. Additionally, they support AMD Ryzen VR-Ready Premium technology, offering greater immersion in virtual reality, even on older hardware. This combination of StoreMI and VR-Ready Premium technology ensures these processors deliver high storage efficiency and an enhanced VR experience, making them suitable for a wide range of demanding applications.

AMD Socket AM4 continues to be relevant even in 2024, nearly seven years since its introduction, with the company announcing several new processor models at CES. AMD has extended Ryzen 5000 series "Zen 3" support across all three desktop chipset series, including the oldest AMD 300-series, and since all Socket AM4 motherboards feature USB BIOS Flashback, users have the full spread of Socket AM4 processors to upgrade to. The Ryzen 7 5800X3D continues to be a popular final upgrade destination for gamers on Socket AM4 who may have spent a pretty penny building a high-end gaming desktop in 2020-21. The 5800X3D offers gaming performance comparable to an Intel Core i9-12900K "Alder Lake," despite being based on the older "Zen 3" microarchitecture, since it enjoys a large 96 MB L3 cache, thanks to AMD's innovative 3D Vertical Cache technology. The 5800X3D commands a $360 street price, which may be a little steep for some users, and so AMD is increasing choice, with the introduction of the new Ryzen 7 5700X3D.

The Ryzen 7 5700X3D is an 8-core/16-thread Socket AM4 processor, which is practically the same silicon as the 5800X3D, but with lower clock speeds, and more importantly a 30% lower price. While the 5800X3D commands $360 in the market, the new 5700X3D is coming in at an attractive $250. The 5700X3D comes with a base frequency of 3.00 GHz, and maximum boost frequency of 4.10 GHz. In comparison the 5800X3D has a 3.40 GHz base frequency, and 4.50 GHz boost. Both chips enjoy the same power limits, with a TDP of 105 W. The 5700X3D gets the same 96 MB of L3 cache that includes 64 MB of 3D Vertical Cache; and 512 KB of L2 cache per core. The I/O is identical, too, with a 24-lane PCI-Express Gen 4 interface, and dual-channel DDR4 memory, with DDR4-3600 being the sweetspot frequency.Update Jan 9th: AMD clarified the specs of the Ryzen 5 5500GT in an updated slide. It is indeed a 6-core/12-thread processor.

The AMD Socket AM4 platform is still alive and kicking, with AMD releasing new processor models in its 7th year. Many of these chips started selling online in Europe. The Ryzen 7 5700X3D is a slightly lower clocked version of the 5800X3D, which for many of those still on AM4 is the final upgrade to their platform. The 5800X3D may be based on the older "Zen 3" microarchitecture, but thanks to its 3D Vertical Cache technology, offers gaming performance comparable to the Core i9-12900K "Alder Lake," making even 7-year old AM4 gaming desktops contemporary. To cash in on this exact market, AMD released a more cost-effective option, the Ryzen 7 5700X3D.

The 5700X3D is an 8-core/16-thread Socket AM4 processor that features 96 MB of L3 cache thanks to the 3D V-cache technology, just like the 5800X3D, but comes with a maximum boost frequency of 4.10 GHz, compared to the 4.50 GHz of the 5800X3D. Store listings do not mention its TDP or base frequency. The 5700X3D is being listed at 271€ including taxes, or about 15-20% cheaper than the 5800X3D. A word of caution when choosing the 5700X3D would be its close to non-existent overclocking headroom, so this probably isn't a chip that you can manually overclock to performance levels of a 5800X3D while saving some 40€ on the side.

AMD is preparing to update its desktop processor lineup not just with new Ryzen 8000G series APUs for the Socket AM5 platform, but also a handful new SKUs for AM4. Possible pricing of many of these chips is detailed in our recent report. Among the chips listed is a mysterious new Ryzen 7 5700 Socket AM4 processor. Although we don't have its pricing, AMD sneakily put up its product information on its website. On the product page, the company says that the product came out in April 2022, but it never did, at least not in the retail channel.

The Ryzen 7 5700 is an 8-core/16-thread processor that lacks integrated graphics, and yet is based on the 7 nm "Cezanne" monolithic silicon, with similar clock speeds to the Ryzen 7 5700G APU. Think of this as the 5700G with its iGPU disabled. The chip comes with a CPU base frequency of 3.70 GHz compared to the 3.80 GHz of the 5700G, although the two have an identical maximum boost frequency of 4.60 GHz. Each of the eight "Zen 3" CPU cores has 512 KB of dedicated L2 cache, and share a 16 MB L3 cache. The processor's TDP is set to 65 W, and the retail package includes a Wraith Stealth cooling solution. One pitfall of choosing the 5700 over something like the 5700X would be its lack of a PCIe Gen 4 interface (it's limited to the older Gen 3), which would mean a slower NVMe storage sub-system.

The Chinese chipmaker Loongson has launched its newest desktop processors, the 4-core, 8-thread 3A6000 series, based on the company's LoongArch microarchitecture. We have previously reported that the company wants to match Intel's "Willow Cove" and AMD's Zen 3 instruction per clock (IPC) levels with its 3A6000 CPU series, and today we have the first preview of the performance. Powered by the LA664 cores, 3A6000 is built on a 14/12 nm manufacturing process, with clock speeds going from 2.0 to 2.5 GHz and power consumption of up to 50 Watts. It features 256 KB of L2 cache and 16 MB of L3 cache in total.

While several hardware partners are announcing new Loongson-powered solutions, ASUS China's "Uncle Tony" managed to get his hands on one of them and overclocker the CPU to 2.63 GHz on air cooling. In overclocking tests using liquid nitrogen cooling, a 3A6000 processor reached 3.0 GHz, though there are indications that there is still overhead. In standard out-of-the-box configuration, the 3A6000 performs similarly to Intel's Core i3-10100 four-core CPU, an achievement for Loongson but still behind Intel's latest offerings that clock nearly twice as high. This rapid development of Loongson IP has led to a massive performance increase, matching the IPC of modern CPUs. We are still left to see more information about these 3A6000 series SKUs; however, early benchmarks suggest a significant improvement. You can see the CPU benchmarks below, which include UnixBench and SPEC CPU 2006.

AMD Socket AM4 users are in for a treat, as the company plans two more processor models in the Ryzen 5000X3D series, according to chi11eddog, a reliable source with AMD leaks. Although based on the older "Zen 3" microarchitecture, these chips feature 3D Vertical Cache technology, which helps shore up their gaming performance to levels comparable at least to 12th Gen Intel Core "Alder Lake," giving Socket AM4 platform users a cost-effective upgrade path to prolong their gaming PC builds that could be as old as 5 years now. If you recall, AMD has formally extended "Zen 3" and 3D V-cache support to all Socket AM4 chipset generations, including AMD 300-series.

Among the two new processor models are the Ryzen 7 5700X3D, and the Ryzen 5 5500X3D. The 5700X3D is an 8-core/16-thread processor with 100 MB of total cache (that's 512 KB of L2 cache per core, plus 96 MB of L3 cache); while the Ryzen 5 5500X3D is a 6-core/12-thread chip with 99 MB of total cache. What sets the 5700X3D and 5500X3D apart from the 5800X3D and 5600X3D are lower clock speeds, and possibly, lower TDP. Both chips come with a base frequency of 3.00 GHz, compared to the 3.30 GHz of the 5600X3D and 3.40 GHz of the 5800X3D. The 5700X3D boosts up to 4.10 GHz compared to the 4.50 GHz of the 5800X3D; while the 5500X3D boosts up to 4.00 GHz when compared to 4.40 GHz of the 5600X3D. Both the 5800X3D and 5600X3D have their TDP rated at 105 W, so it's possible that AMD is using lower TDP and PPT values for the 5700X3D and 5500X3D. There's no word on when the two new chips are coming out, although AMD continues to release updates to the Socket AM4 AGESA microcode, with the latest version ComboAM4v2 1.2.0.B being released as recently as September 2023.

AMD Ryzen processors with 3D Vertical Cache technology, denoted with the "X3D" brand extension on processor model numbers, are showing unexpected popularity numbers with close to a quarter of respondents to a TechPowerUp Frontpage Poll question saying that they use one. In August, we asked our readers if they use a Ryzen X3D processor. The question was "Are you using an AMD Ryzen X3D CPU with 3D V-Cache?" This was a few months into the launch of the Ryzen 7000X3D processor series that restored the gaming performance leadership for AMD against Intel's 13th Gen Core "Raptor Lake" processors.

Since the poll went live in August, we've seen 31,862 responses. From these, 14,732, or 46% say that they use a classic Ryzen processor (one without 3D V-cache). followed by 9,780 or 31% saying they use an Intel processor; an impressive 4,316 or 14% saying they use a Socket AM4 Ryzen 5000X3D series processor (5800X3D or 5600X3D); followed by 3,034 or 10% saying they use the latest 7000X3D series "Zen 4" processors. The X3D series together make 7,350 votes, or 23%.

A couple of slides from AMD's internal presentation were leaked to the web by Moore's Law is Dead, referencing what's allegedly the next-generation "Zen 5" microarchitecture. Internally, the performance variant of the "Zen 5" core is referred to as "Nirvana," and the CCD chiplet (CPU core die) based on "Nirvana" cores, is codenamed "Eldora." These CCDs will make up either the company's Ryzen "Granite Ridge" desktop processors, or EPYC "Turin" server processors. The cores themselves could also be part of the company's next-generation mobile processors, as part of heterogenous CCXs (CPU core complex), next to "Zen 5c" low-power cores.

In broad strokes, AMD describes "Zen 5" as introducing a 10% to 15% IPC increase over the current "Zen 4." The core will feature a larger 48 KB L1D cache, compared to the current 32 KB. As for the core itself, it features an 8-wide dispatch from the micro-op queue, compared to the 6-wide dispatch of "Zen 4." The integer execution stage gets 6 ALUs, compared to the current 4. The floating point unit gets FP-512 capabilities. Perhaps the biggest announcement is that AMD has increased the maximum cores per CCX from 8 to 16. At this point we don't know if it means that "Eldora" CCD will have 16 cores, or whether it means that the cloud-specific CCD with 16 "Zen 5c" cores will have 16 cores within a single CCX, rather than spread across two CCXs with smaller L3 caches. AMD is leveraging the TSMC 4 nm EUV node for "Eldora," the mobile processor based on "Zen 5" could be based on the more advanced TSMC 3 nm EUV node.

Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, workstations, and mini-PCs, today announced a newly designed ultra-compact, mainstream mini-PC for the GIGABYTE BRIXs lineup that adopts AMD Ryzen 7030 series processors. With AMD Zen 3 architecture and TSMC 7 nm process, AMD advanced its high-performance, efficient mobile processors for the mobile market to multitask and stay entertained. Even while adopting a compact size, all new mainstream BRIXs still delivers powerful computing that fits perfectly in any IoT deployment, whether for office use, education use, home use, digital signage, medical care, or KIOSK.

The most recent generation of mainstream BRIXs products in 2023 adopt an all-new chassis design. Computing performance has increased, but the design does not require an increase in the size of the chassis. Its appearance has curved, soft, and twisted lines with a liveliness that makes it very unobtrusive. By the way it was assembled and layered, and designing oblique angles around the base, a sense of simplicity is created to achieve a lightweight design. This allows users to enjoy ultimate computing performance while also having a stylish and elegant product.

Gamers Nexus has uploaded a video feature dedicated to the history of AMD's Zen CPU architecture—editor-in-chief and founder Stephen Burke ventured to Team Red's Austin, Texas-based test and engineering campus. Longer and more in-depth coverage of his lab tour will be released at a later date, but today's upload included an interesting segment covering unreleased hardware. The Gamers Nexus crew spent some time looking at several examples of current and past generation AMD 3D V-Cache CPUs. Prototype Ryzen 7000-series Zen 4 designs were shown off by principal engineer Amit Mehra and technical team member Bill Alverson. They also brought out older 5000-series Zen 3 units that never reached retail—the 16-core Ryzen 9 5950X3D was demonstrated as having a 3.5 GHz base clock, and it can boost up to 4.1 GHz. The 12-core Ryzen 9 5900X3D had 3.5 GHz base and 4.4 GHz boost clocks.

Team Red only sells one AM4 3D V-Cache model at the moment, in the form of its well received Ryzen 7 5800X3D CPU. It was released over a year ago, but recent price cuts have resulted in increased unit sales—system builders looking to maximize the potential of their older generation Ryzen 5000-series compatible mainboards are snapping up 5800X3Ds. AMD could be readying a cheaper alternative, with previous reports proposing that a "Ryzen 5 5600X3D" is positioned to take on Intel's 13th Gen Core i5 series (with DDR4). The unreleased Ryzen 9 5950X3D and 5900X3D have 3D V-Cache stacks on both of their CCDs (granting 192 MB of L3 cache), which is unique given that all retail 3D V-Cache CPUs (released so far) restrict this to a single CCD stack. Apparently AMD decided to stick with the latter setup due to it offering the best balance of performance and efficiency, plus gaming benchmarks demonstrated that there was not much of a difference between the configurations.

AMD is finally coming around to the idea of a 6-core processor with 3D Vertical Cache technology, only this time it's for the older Socket AM4 platform. The new Ryzen 5 5600X3D could be positioned competitively against the lower end of Intel's 13th Gen Core i5 processor series, so it could attract a class of DIY gaming PC builders that can take advantage of cheap Socket AM4 motherboards and DDR4 memory to build formidable mainstream gaming PC builds.

The Ryzen 5 5600X3D is based on the same "Vermeer" 3DV cache MCM as the 5800X3D. It is a 6-core/12-thread processor with a base frequency of 3.30 GHz, and 4.40 GHz boost, which are both 100 MHz less than those of the 5800X3D. The processor gets the full 96 MB of last-level cache (that's 32 MB of on-die L3 cache + 64 MB of 3DV cache), which the 5800X3D offers. It bears the OPN "100-000001176." The company didn't reveal pricing, but given that the 5800X3D can be had for as low as $290, the 5600X3D could possibly target a $200-225 price, making it an attractive option, given that you can pair it with even cheap B450 chipset motherboards priced well under $100, and 32 GB of DDR4 memory that can be had around the $60-mark. The 5600X3D could also provide an affordable upgrade path to those still on the AM4 platform, with Ryzen 3000-series processors.

Chinese company Loongson, specializing in creating processors for usage in mainland China, has been steadily working on enabling its next-generation Loongson 3A6000 CPUs. Aiming to provide the performance level of Intel Willow Cove and AMD Zen 3, these new CPUs will use Loongson's custom LoongArch Instruction Set Architecture (ISA) with a new set of 64-bit superscalar LA664 cores. Today, thanks to the report from Phoronix, we find out that Loongson has submitted some Linux patches that enable the upcoming 3A6000 CPUs to work with Linux-based operating systems at launch. Interestingly, as the new CPU generation gets closer to launch, more Linux kernel patches begin to surface.

Today's kernel patches focus on supporting the hardware page table walker (PTW). As PTW can handle all fast paths of TLBI/TLBL/TLBS/TLBM exceptions by hardware, software only needs to handle slow paths such as page faults. Additionally, in the past, LoongArch utilized "dbar 0" as a complete barrier for all operations. However, this full completion barrier severely impacted performance. As a result, Loongson-3A6000 and subsequent processors have introduced various alternative hints. Loongson plans to ship samples to select customers in the first half of 2023, so we could see more information surfacing soon.

Researchers at the Technical University of Berlin have published a paper called "faulTPM: Exposing AMD fTPMs' Deepest Secrets," highlighting AMD's firmware-based Trusted Platform Module (TPM) is susceptible to the new exploit targeting Zen 2 and Zen 3 processors. The faulTPM attack against AMD fTPMs involves utilizing the AMD secure processor's (SP) vulnerability to voltage fault injection attacks. This allows the attacker to extract a chip-unique secret from the targeted CPU, which is then used to derive the storage and integrity keys protecting the fTPM's non-volatile data stored on the BIOS flash chip. The attack consists of a manual parameter determination phase and a brute-force search for a final delay parameter. The first step requires around 30 minutes of manual attention, but it can potentially be automated. The second phase consists of repeated attack attempts to search for the last-to-be-determined parameter and execute the attack's payload.

Once these steps are completed, the attacker can extract any cryptographic material stored or sealed by the fTPM regardless of authentication mechanisms, such as Platform Configuration Register (PCR) validation or passphrases with anti-hammering protection. Interestingly, BitLocker uses TPM as a security measure, and faulTPM compromises the system. Researchers suggested that Zen 2 and Zen 3 CPUs are vulnerable, while Zen 4 wasn't mentioned. The attack requires several hours of physical access, so remote vulnerabilities are not a problem. Below, you can see the $200 system used for this attack and an illustration of the physical connections necessary.

AMD announced that it is bundling "Company of Heroes 3" with retail PIB packages of Ryzen 5000 series "Zen 3" desktop processors. The WWII-setting real-time strategy (RTS) is being bundled with new purchases of Ryzen 9 5950X, 5900X; Ryzen 7 5800X3D, 5800X, 5700X; Ryzen 5 5600X, 5600, and 5500. The 5700G and 5600G APUs are not eligible for this promotion. The bundle is limited to participated retailers, and in select markets. The company also has a separate running promotion for Ryzen 7000 series "Zen 4" desktop PIBs, where the company is giving away "Star Wars Jedi: Survivor."

Minisforum announced its first Mars series mini PC MC560 last December, and today it is finally going on sale. Unlike previous versions, the MC560 upgrades the CPU from Ryzen 5 5600U to Ryzen 5 5625U. It has 6 cores and 12 threads and is based on the Zen 3 architecture. The based clock is 2.30 GHz and can be boosted up to 4.30 GHz. The chip is manufactured on the 7 nm TSMC process. The MC560 is different from other mini PCs. It is an all-in-one conference mini PC that combines feature of computer, camera, mic and speakerphone all together to reduce wasted space and cross cabling by taking off unnecessary devices.

It has a 2.5K webcam with HDR support and a 93.8-degree field of view. The adjustable base offers 10°tilt change to the view. With the help of 4 Ω/3 W dual independent speaker design, the maximum sound distortion does not exceed 5%, reflecting authentic human voice. The microphone uses the MEMS dual array with an independent DSP chip for assistance. Combined with the AI intelligence algorithm, it can not only suppress the reverberation, intelligently recognize human voice, but also eliminate environmental noise, thereby accurately restoring human voice.

ASUS Turkey has jumped the gun and revealed ASUS' upcoming Zenbook 14 laptop, which in itself might not be a big deal, but the UM3402 as the specific model is known as, will apparently be available with an AMD Ryzen 7 7730U CPU. As AMD has as yet to unveil such a CPU, it appears that ASUS Turkey has gotten ahead of things. A quick search for the Zenbook 14 SKU in question reveals that the current UM3402 model has a Ryzen 5825U processor.

The remaining specs appear identical to the current model, but this is clearly not a typo, as the CPU SKU is mentioned at multiple points on the product page. Based on AMD's CPU model name "decoder", the Ryzen 7 7730U is based on a Zen 3 or a Zen 3+ core that sits in the 15-28 W TDP range. According to Videocardz, it will be using an AMD Vega based GPU. Beyond that, we don't know any specifics about the CPU, but one thing that stands out and may or may not be correct, is that the Zenbook 14 is only listed as supporting two USB 3.2 10 Gbps USB-C ports, rather than USB4, which seems a bit odd. Then again, this is a lower-tier CPU, so it's possible that this is the reason for lack of USB4 support. The fact that ASUS has moved to an IPS based display, from an OLED display on the current UM3402 SKU, also suggests that this might be a cheaper model in ASUS lineup.

An alleged AMD client product roadmap slide leaked to the web confirms the Ryzen 7000X3D series. This also builds on a confirmation by Robert Hallock that 3DV Cache technology remains a continued part of the company's client processor roadmap. The 3DV Cache tech played in instrumental role in shoring up gaming performance of AMD's previous-generation "Zen 3" microarchitecture to levels matching or exceeding those of the Intel "Alder Lake," with a performance uplift in the range of 10 to 25 percent. The expectations for 3DV Cache to work a similar miracle with "Zen 4" are set rather high.

While "Zen 4" has achieved gaming performance parity with "Alder Lake," Intel's next-generation "Raptor Lake" is right around the corner, with the company claiming 10-15% single-threaded performance uplifts that should restore the its gaming performance leadership over AMD. The alleged AMD roadmap does not specify when exactly the Ryzen 7000X3D comes out, but is part of the block that spans Q3-2022, deep into 2023. Rumors are abuzz that the company could unveil the 7000X3D in the first half of 2023.

AMD today introduced the Ryzen Embedded V3000 Series processors, adding the high-performance "Zen 3" core to the V-Series portfolio to deliver reliable, scalable processing performance for a wide range of storage and networking system applications. With greater CPU performance, DRAM memory transfer rate, CPU core count and I/O connectivity when compared to the AMD Ryzen Embedded V1000 series, the new AMD Ryzen Embedded V3000 Series processors deliver the performance and low-power options required for some of the most demanding 24x7 operating environments and workloads.

Now shipping to leading embedded ODMs and OEMs, AMD Ryzen Embedded V3000 processors address the growing demands of enterprise and cloud storage, as well as data center network routing, switching and firewall security features. AMD Ryzen Embedded V3000 processors can power a variety of diverse use-cases ranging from virtual hyper-converged infrastructure to advanced systems at the edge.

The first reliable benchmark figures of AMD's Ryzen 7000-series CPUs have arrived, courtesy of SiSoftware. The benchmark suite software developer has released benchmark figures for the Ryzen 5 7600X and Ryzen 9 7950X. Keep in mind that these benchmarks are limited to the different tests in SiSoftware Sandra. Also note that the graphs for the Ryzen 5 7600X have typos, as the SiSoftware wrote Ryzen 5 7760X instead of 7600X and the Core i5-12600K is listed as a Core i7 CPU. Starting with the 7600X, the CPU appears to perform similar to, or slightly slower than the Intel Core i5-12600K in the arithmetic tests. On the other hand, it handily crushes the older Ryzen 5 5600X in every test here, by somewhere between 17 and 36 percent depending on the test.

Moving on to the vector SIMD tests, AMD's Zen 4 architecture shows much greater performance improvements, beating the Intel Core i5-12600K in all but one of the tests, where it loses by a fairly small margin. Here it beats the Ryzen 5 5600X by anything from 28 to a massive 86 percent. Where AMD's Zen 4 architecture really kicks things up a notch is in the image processing test, at least compared to the Zen 3 architecture, thanks to its AVX512 capabilities. As such, it's over twice as fast in many of the tests, but it still loses out in half of the tests to Intel's Core i5-12600K. AMD has also improved the inter-thread/core latency in the same module, by a not insignificant amount. Where the Ryzen 5 7600X doesn't fare so well is when it comes to performance vs. power, largely due to the fact that AMD moved the TDP from 65 to 105 W, but it still offers better performance per Watt than Intel's current models.

Update 17:31 UTC: Updated with the Ryzen 7 7700X results.

The Minisforum Neptune HX90G all-AMD high-performance mini-PC went on sale at introductory prices. The lunchbox-sized mini-PC packs some serious kit, which includes an AMD Ryzen 9 5900HX "Zen 3" 8-core/16-thread processor, Radeon RX 6600M RDNA2 graphics with 8 GB VRAM, memory options that include dual-channel DDR4 16 GB, 32 GB, and 64 GB; and storage options that include a M.2 NVMe Gen 4 SSD with up to 512 GB capacity. You can also buy it as a barebones, and drop in your own SSD and DDR4 SO-DIMM memory.

What's new here are the introductory prices. The barebones (which gives you the processor and GPU, but not memory or SSD), is priced at $799, down from its $940 regular price. The model with 2x 8 GB memory and 512 GB SSD, is priced at $909, compared to its $1,069 regular price. The 2x 16 GB memory + 512 GB SSD model is going for $969, compared to $1,129 regular price. The top model with 2x 32 GB RAM + 512 GB SSD, can be had at $1,079, compared to its $1,269 regular price.

AMD's "Zen 3" architecture, particularly in its low-power mobile iterations, change their clock speeds at a very high rate of speed (switching between lower idle clock-speeds to higher boost clock bins), finds a study by Chips and Cheese, which tested 17 processors across brands and machine-architectures, including mobile SoCs. The interesting finding here is that the Ryzen 7 5800U "Zen 3" mobile processor has a much faster speed-ramp than even SoC powering handhelds, such as the Qualcomm Snapdragon 821, returning a ramp-time of just 1.6 ms, compared to 19.6 ms on the Snapdragon. We now see why AMD likes its processors to run detached from the 10 ms tick-rate of Windows internal power-management (the rate at which the OS reports its workload to the processor, so it could respond with a higher performance state). A rapid boost clock ramp rate allows the processor to better ration its power budget in response to workload.

AMD is allegedly ready with a working "Zen 4" chiplet that has stacked 3D Vertical Cache (3DV cache) memory, which supplements the on-die L3 cache, and is found to massively improve gaming performance. "Moore's Law is Dead" reports that the Zen 4 + 3DV Cache chiplet will be used with various Ryzen 7000X3D SKUs, as well as special EPYC "Genoa" SKUs.

The 3DV Cache deployed with the "Zen 4" chiplet is a second-generation to the one on the "Zen 3 + 3DV cache" chiplet, and AMD has worked on a number of bandwidth and latency improvements, so it performs in-sync with the generationally-faster on-die L3 cache of the "Zen 4" chiplet. Unlike the CCD below it that's built on TSMC N5 (5 nm EUV), the L3D (the stacked die with the 3DV cache) is possibly be built on an older node, such as N6 (6 nm), since it only contains a slab of memory and doesn't warrant N5. "Moore's Law is Dead" reports that AMD expects to repeat the magic of the 5800X3D when it comes to gaming performance, and expects Ryzen 7000X3D processors to dominate Intel's 13th Gen "Raptor Lake" processors. This was echoed by another reliable source, greymon55.

AMD is readying a handful new Ryzen PRO 5000 series desktop processor models, according to a leaked Lenovo datasheet for commercial desktops. These Socket AM4 processors are based on either the 7 nm "Renoir" monolithic silicon with "Zen 2" CPU cores; or the "Vermeer" MCM with "Zen 3" cores; all feature 65 W TDP, and the AMD PRO feature-set that rivals Intel vPro, including a framework for remote management, AMD PRO Security, PRO Manageability, and PRO Business (a priority tech-support channel).

Models in the lineup include the Ryzen 3 PRO 4350G, a "Renoir" based APU with a 4-core/8-thread "Zen 2" CPU clocked up to 4.00 GHz, and Radeon Vega 6 integrated graphics. The Ryzen 5 PRO 5645 is based on "Vermeer," and is a 6-core/12-thread "Zen 3" processor with 32 MB of L3 cache, and up to 4.60 GHz clock speeds. The Ryzen 7 PRO 5845 is the 8-core/16-thread model in the lineup, clocked up to 4.60 GHz. Leading the pack is the Ryzen 9 5945, a 12-core/24-thread chip clocked up to 4.70 GHz. From the looks of it, these processors will be exclusively available in the OEM channel, but AMD's OEM-only chips inevitably end up in the retail channel where they're sold loose from trays.