Today, the U.S. Department of Commerce shared the Biden-Harris Administration's strategic vision to strengthen the semiconductor supply chain through CHIPS for America investments. To advance this vision, the Department announced a funding opportunity and application process for large semiconductor supply chain projects and will release later in the fall a separate process for smaller projects. Large semiconductor supply chain projects include materials and manufacturing equipment facility projects with capital investments equal to or exceeding $300 million, and smaller projects are below that threshold.

The announcement leads into the Biden-Harris Administration's Investing in America tour, where Secretary Raimondo and leaders in the Administration will fan across more than 20 states to highlight investments, jobs, and economic opportunity driven by President Biden's Investing in America agenda and the historic legislation he's passed in his first two years in office, including the bipartisan CHIPS and Science Act.

TrendForce reports that explosive growth in generative AI applications like chatbots has spurred significant expansion in AI server development in 2023. Major CSPs including Microsoft, Google, AWS, as well as Chinese enterprises like Baidu and ByteDance, have invested heavily in high-end AI servers to continuously train and optimize their AI models. This reliance on high-end AI servers necessitates the use of high-end AI chips, which in turn will not only drive up demand for HBM during 2023~2024, but is also expected to boost growth in advanced packaging capacity by 30~40% in 2024.

TrendForce highlights that to augment the computational efficiency of AI servers and enhance memory transmission bandwidth, leading AI chip makers such as Nvidia, AMD, and Intel have opted to incorporate HBM. Presently, Nvidia's A100 and H100 chips each boast up to 80 GB of HBM2e and HBM3. In its latest integrated CPU and GPU, the Grace Hopper Superchip, Nvidia expanded a single chip's HBM capacity by 20%, hitting a mark of 96 GB. AMD's MI300 also uses HBM3, with the MI300A capacity remaining at 128 GB like its predecessor, while the more advanced MI300X has ramped up to 192 GB, marking a 50% increase. Google is expected to broaden its partnership with Broadcom in late 2023 to produce the AISC AI accelerator chip TPU, which will also incorporate HBM memory, in order to extend AI infrastructure.

Lam Research Corp. (Nasdaq: LRCX) today introduced Coronus DX, the industry's first bevel deposition solution optimized to address key manufacturing challenges in next-generation logic, 3D NAND and advanced packaging applications. As semiconductors continue to scale, manufacturing becomes increasingly complex with hundreds of process steps needed to build nanometer-sized devices on a silicon wafer. In a single step, Coronus DX deposits a proprietary layer of protective film on both sides of the wafer edge that helps prevent defects and damage that can often occur during advanced semiconductor manufacturing. This powerful protection increases yield and enables chipmakers to implement new leading-edge processes for the production of next-generation chips. Coronus DX is the newest addition to the Coronus product family and extends Lam's leadership in bevel technology.

"In the era of 3D chipmaking, production is complex and costly," said Sesha Varadarajan, senior vice present of the Global Products Group at Lam Research. "Building on Lam's expertise in bevel innovation, Coronus DX helps drive more predictable manufacturing and significantly higher yield, paving the way for adoption of advanced logic, packaging and 3D NAND production processes that weren't previously feasible."

Intel and the German federal government have signed a revised letter of intent for Intel's planned leading-edge wafer fabrication site in Magdeburg, the capital of Saxony-Anhalt state in Germany. The agreement encompasses Intel's expanded investment in the site, now expected to be more than 30 billion euros for two first-of-a-kind semiconductor facilities (also known as "fabs") in Europe, along with increased government support that includes incentives, reflecting the expanded scope and change in economic conditions since the site was first announced.

Intel acquired the land for the project in November 2022, and the first facility is expected to enter production in four to five years following the European Commission's approval of the incentive package. Given the current timeline and scale of the investment, Intel plans to deploy more advanced Angstrom-era technology in the facilities than originally envisioned. The Magdeburg site will serve Intel products and Intel Foundry Services customers.

The U.S. Patent Office tribunal has ruled in favor of Intel Corp in a significant $2.2 billion case against VLSI Technology LLC. Intel's bid to nullify a patent that constituted $1.5 billion of a $2.18 billion verdict it previously lost to VLSI in 2021 was accepted. The Patent Trial and Appeal Board invalidated the computer chip-related patent and another VLSI patent, accounting for the rest of the Texas federal court verdict. An Intel spokesperson expressed their satisfaction with the decision, criticizing the invalidated VLSI patents as "low-quality."

VLSI, the company holding the patent that has filed several infringement lawsuits against Intel, retains the option to appeal both decisions to the U.S. Court of Appeals for the Federal Circuit. In a separate case last year, VLSI secured a verdict worth $949 million against Intel in Texas. VLSI is a subsidiary of Fortress Investment Group, which is managed by investment funds from SoftBank Group. The patent board proceeding was initiated by South Dakota-based Patent Quality Assurance LLC, while another patent from the $2.18 billion verdict was contested by OpenSky Industries LLC. Despite initial sanctions for attempting to extort both Intel and VLSI, OpenSky was permitted to continue the proceeding with Intel at the helm.

According to the latest report from Reuters, a former Samsung executive was arrested by the South Korean authorities yesterday, being accused of stealing company secrets to build a similar chip production facility in China. The former executive had worked for SK Hynix before joining Samsung, where he was involved in the Samsung Electronics division responsible for semiconductor factories. According to the report, the person planned to build a competing factory 1.5 km from a Samsung chip manufacturing facility in Xian, China. The suspect, who was not identified publically, has a collective of 28 years of experience with the South Korean chip makers.

Interestingly, the suspect also caused financial harm to the company, which the Suwon District Prosecutors' Office estimates to be around 300 billion won ($233 million). Prosecutors have announced the indictment of six additional individuals suspected of involvement in the case, including an employee of an inspection company who is charged with allegedly disclosing the architectural blueprint of Samsung's semiconductor plant. A police official commented, "We will sternly deal with any leakage of our technology abroad and strongly respond to illegal leak of domestic companies' core technologies in semiconductor, automobile and shipbuilding sectors among other."

A legal dispute between Realtek and MediaTek has kicked off over Realtek claiming that MediaTek has gotten a third party company to sue Realtek over some unspecified patents involving technology used in smart TVs and set-top boxes. The third party involved goes under the name of IPValue Management Inc and appears to be what is generally known as a patent troll, i.e. a company that buys up patents and uses them to take legal actions against other companies, without actually producing anything related to the patents in question. Realtek claims that MediaTek is conspiring with IPValue to drive Realtek out of the market, leaving Mediatek in a close to monopoly situation in the market.

According to Reuters, Realtek told the publication that it filed the lawsuit against MediaTek to "protect free and fair competition in the industry" and "prevent further harm to the public." Neither MediaTek or IPValue have commented on the lawsuit to the publication. What makes this entire mess even more peculiar, is that MediaTek is said to have a licensing agreement in place with a subsidiary of IPValue called Future Link System LLC, which was signed in 2019. This agreement was brought up by the U.S. International Trade Commission (ITC) in a separate lawsuit last year, with the ITC calling it alarming and the court calling it improper. After the ITC criticism last year, Future Link apparently settled with several other companies such as Amlogic, but not with Realtek, which is why the company is now taking things to court. Realtek claims that MediaTek is trying to force any allegedly infringing chips out of the market and trying to make Realtek look like an unreliable partner and supplier to its customers. As such, Realtek wants the court to end the alleged conspiracy and is also asking for damages. Time will tell if Realtek is successful or not, but it seems strange that a patent troll would agree to licence its patents to some parties, but not all, since the only reason for a patent troll to exist is to make money from its patents.

Applied Materials, Inc. today announced a landmark investment to build the world's largest and most advanced facility for collaborative semiconductor process technology and manufacturing equipment research and development (R&D). The new Equipment and Process Innovation and Commercialization (EPIC) Center is planned as the heart of a high-velocity innovation platform designed to accelerate development and commercialization of the foundational technologies needed by the global semiconductor and computing industries.

To be located at an Applied campus in Silicon Valley, the multibillion-dollar facility is designed to provide a breadth and scale of capabilities that is unique in the industry, including more than 180,000 square feet - more than three American football fields - of state-of-the-art cleanroom for collaborative innovation with chipmakers, universities and ecosystem partners. Designed from the ground up to accelerate the pace of introducing new manufacturing innovations, the new EPIC Center is expected to reduce the time it takes the industry to bring a technology from concept to commercialization by several years, while simultaneously increasing the commercial success rate of new innovations and the return on R&D investments for the entire semiconductor ecosystem.

NVIDIA today announced a supercomputer built on the NVIDIA Grace CPU Superchip, adding to a wave of new energy-efficient supercomputers based on the Arm Neoverse platform. The Isambard 3 supercomputer to be based at the Bristol & Bath Science Park, in the U.K., will feature 384 Arm-based NVIDIA Grace CPU Superchips to power medical and scientific research, and is expected to deliver 6x the performance and energy efficiency of Isambard 2, placing it among Europe's most energy-efficient systems.

It will achieve about 2.7 petaflops of FP64 peak performance and consume less than 270 kilowatts of power, ranking it among the world's three greenest non-accelerated supercomputers. The project is being led by the University of Bristol, as part of the research consortium the GW4 Alliance, together with the universities of Bath, Cardiff and Exeter.

Thanks to the latest release of the Power On newsletter from Mark Gurman, we have additional information about Apple's upcoming M3 Pro chip. Currently in testing and reported on by an App Store developer, Apple is looking to upgrade the microarchitecture of the forthcoming chip and add additional cores to the system for more performance. As the report notes, the entry-level M3 Pro chip currently in testing will have 12 CPU cores, six for efficiency and six for performance tasks, with 18 graphics cores, all manufactured on TSMC's 3 nm node. The current baseline for M2 Pro is 10 CPU cores, where four are dedicated to efficiency, and six are dedicated to performance. The current generation entry-level M2 Pro also features a 16-core GPU, which is two cores fewer than the upcoming model.

Generally, the M3 Pro chip will boost integrated memory across the board, as the sample spotted in testing shows 36 GB of memory. The M2 Pro offered 32 GB in that memory tier, so a four GB increase is inbound there. Presumably, the 16 GB version (if it exists) and 64 GB version will also get memory bumps by going the M3 Pro route. Of course, we have to wait for more information as these chips become more widely available to developers.

In a rather unexpected move, Samsung will reportedly open a chip development facility in Yokohama, Japan. According to the Nikkei, Samsung is readying a 30 billion yen or US$222 million investment near its current R&D institute in Japan. Samsung is hoping to be able to leverage a combination of Japanese and Korean expertise at the site, although exactly what kind of chip development that will take place at the site is currently unknown, beyond it being focused on the back-end processor of chip manufacturing. This generally involves the wafer packaging process or chip stacking, processes that have evolved a lot of the past few years.

The facility is said to be employing hundreds of people once it starts operating sometime in 2025. The Nikkei is also reporting that Samsung is hoping to take advantage of subsidies offered by the Japanese government, which might also be one of the reasons for opening the development unit in Japan. The subsidies are said to be in excess of 10 billion yen. Considering that Japan and Korea aren't on the best terms at the moment, for many reasons and most of them irrelevant to this news post, it's surprising to see Samsung making this move, as although it might be a fairly minor investment for the company, it's doing so on what could only be referred to as hostile soil.

Following the news that Oppo is likely to pull out of the French market, it now appears that the company has closed its chip design unit named Zeku. According to the South China Morning Post, workers at Zeku got less than a day's notice that the company was shutting down, which was on Thursday last week. Employees weren't even allowed back into the office to collect their personal belongings. As recent as two weeks ago, Zeku was still looking for new hires, which makes the abrupt closure even more peculiar, especially as Zeku is said to have employed upwards of 3,000 people.

Considering that Oppo is ranked as the fourth largest smartphone maker in terms of globally shipped units in Q1, the way the company has handled the closure of its chip design unit reeks of desperation. It should be noted that Zeku wasn't designing chips to power Oppo's phones, but presumably Zeku was behind the MariSilicon X, which was Oppo's own imaging co-processor. In all fairness, Oppo is far from the only company to have closed down business units this year, but the company is also said to be suffering in terms of shipments of smartphones, as the company saw a drop of 22 percent in shipments last year, to 103 million units. This appears to be part of the reason behind the shutdown of Zeku, but Oppo hasn't provided much in terms of details behind the closure.

The bipartisan Protecting Circuit Boards and Substrates Act of 2023 introduced by Representatives Blake Moore (R-UT-1) and Anna Eshoo (D-CA-16) finishes the job the CHIPS Act began by incentivizing investment in the domestic printed circuit board (PCB) industry. This bill is a necessary follow-on to the CHIPS Act: without a trusted, reliable domestic source of PCBs and substrates, computer chips don't connect to end use electronic devices.

Domestic PCB production shrunk over the past 20 years, falling from 30% to barely 4% of the world's supply. Ninety percent of the world's supply now comes from Asia…56% in China alone.

According to data from Mercury Research posted on Twitter, AMD has gained CPU market share against Intel over the past year. AMD has gone from a 27.7 percent market share in Q1 2022 to a 34.6 percent market share in the first quarter of 2023, which is an increase of 6.9 percent, whereas Intel has gone from 72.3 percent to 65.4 percent, still placing Intel at almost two thirds of the market of x86 CPUs. It should be noted that this includes all types of CPUs, but it's unclear if it includes the chips AMD sells to Microsoft and Sony for their respective consoles.

A separate screenshot posted by @firstadopter details server CPU market share, excluding IoT, although it's unclear what that means in this specific case. Here, AMD has gained 6.3 percent market share, but the company has only gone from a meager 11.6 percent last year, to 18 percent this year, with Intel holding a massive 82 percent market share. AMD's gain here was lower than overall, but it shows that larger corporations are starting to adopt more and more AMD hardware on the server side, where in all fairness, AMD has taken something of a lead over Intel when it comes to the maximum amount of CPU cores each company can offer, even though the per core performance still lags behind Intel to a degree. It'll be interesting to see if AMD can maintain its momentum in market share gain once Intel launches more competitive products later this year, especially in the server market space.

Rather unexpectedly, a mostly unknown Chinese company called PowerLeader—who seems to have mainly been in the server market space until now—has launched an unheard of x86 compatible CPU. There's no product information on the company website, not even a press release on the CPU which was announced only yesterday according to IT Home. Fortunately, there's a picture of the new CPU, which gives us a few more details. The CPU appears to be called the Pstar P3 and has the model name P3-01105. Luckily the clock frequency of the CPU, which is 3.7 GHz, is also printed on the chip.

However, a closer look at the picture would have most people that are interested in tech scratching their heads, as it appears to be an Intel CPU using the LGA-1200 socket. Even the model name and what is supposedly the spec ID of the CPU, follows Intel's style of naming its CPUs. The comments on IT Home and elsewhere, all suggest that this is simply a re-branded Intel Core i3-10105 CPU, although it's entirely possible this is a chip that only looks like an Intel CPU. It's entirely possible that this is some kind of unannounced licensing deal by Intel, but if so, it would be the first such licensing deal Intel has done since the 286 days, to our knowledge. PowerLeader claims that the CPU is specifically designed for desktop computers and the company is expecting to sell 1.5 million units per year.

At VLSI Symposium 2023, scheduled to take place between June 11-16, Intel is set to demonstrate its PowerVia technology working efficiently on an E-Core chip built using the Intel 4 node. Conventional chips have power and signal interconnects distributed across multiple metal layers. PowerVia, on the other hand, dedicates specific layers for power delivery, effectively separating them from the signal routing layers. This approach allows for vertical power delivery through a set of power-specific Through-Silicon Vias (TSVs) or PowerVias, which are essentially vertical connections between the top and bottom surfaces of the chip. By delivering power directly from the backside of the chip, PowerVia reduces power supply noise and resistive losses, optimizing power distribution and improving overall energy efficiency. PowerVia is set to make a debut in 2024 with Intel 20A node.

For VLSI Symposium 2023 talk, the company has prepared a paper that highlights a design made using Intel 4 technology and implements E-Cores only in a test chip. The document states: "PowerVia Technology is a novel innovation to extend Process Scaling by having Power Delivery on the backside. This paper presents the pre and post silicon findings from implementing an Intel E-Core in PowerVia Technology. PowerVia enabled standard cell utilization of greater than 90 percent in large areas of the core while showing greater than 5 percent frequency benefit in silicon due reduced IR drop. Successful Post silicon debug is demonstrated with slightly higher but acceptable throughput times. The thermal characteristics of the PowerVia testchip is inline with higher power densities expected from logic scaling."

TSMC, a Taiwanese semiconductor giant, is reportedly talking to its partners to develop an $11 billion (€10 billion) factory in Germany with the help of a few European partners. Currently assessing the plant location for Saxony in Germany, the fab wouldn't only be exclusively made by TSMC but will bring in NXP, Bosch, and Infineon that, will create a budget of around 7 billion Euros, including state subsidies, while the total budget is leaning closer to 10 billion Euros in total. However, it is essential to note that TSMC is still assessing the possibility of a Europe-based plant altogether.

Asking for as much as 40% of the total investment to be European-backed subsidies, TSMC wants to create a European facility that will be focused on a growing sector--automotive. If approved in August, the TSMC plant will become the company's first European facility and will first focus on manufacturing 28 nm chips. As one of the first significant EU Chips Act €43 billion investment, it will heavily boost European semiconductor manufacturing.

According to Tom's Hardware, Microsoft is busy hiring engineers to help the company design its own Arm based SoC for Windows 12. Based on job listings, Microsoft is adding people to its "Silicon team," which is currently involved in designing products for Microsoft's Azure, Xbox Surface and HoloLens products. That said, the specific job listings mentioned by Tom's Hardware mentions "optimizing Windows 12 for Silicon-ARM architecture" suggesting we're looking at a custom Arm SoC, with others mentioning "internally developed silicon components" and "building complex, state-of-the-art SOCs using leading silicon technology nodes and will collaborate closely with internal customers and partners."

That said, Microsoft is currently working with Qualcomm and the Microsoft SQ3 found in the Surface Pro 9 is the latest result of that partnership. This brings the question if Microsoft has decided to make its own chip to compete with the Apple M-series of silicon, or if Microsoft is simply looking at working closer with Qualcomm by hiring inhouse talent that can help tweak the Qualcomm silicon to better suit its needs. With Windows 12 scheduled for a 2024 release, it looks like we'll have to wait a while longer to find out what Microsoft is cooking up, but regardless of what it is, it looks like Windows on Arm isn't going anywhere.

It appears it's not only AMD that is eyeing a move to Samsung, when it comes to fabricating upcoming chips, as reports are now suggesting that Qualcomm is considering a second attempt at making flagship mobile SoCs at Samsung's foundry. However, in this case, we're talking 3 nm chips in the shape of the Snapdragon 8 Gen 4, which is expected to launch in devices sometime in 2024. This is said to be Qualcomm's first chip based on cores built by Nuvia, a company that Qualcomm acquired in 2021.

That said, Qualcomm will apparently not rely on Samsung alone, but will also be making the Snapdragon 8 Gen 4 at TSMC. This might be because of past experience with Samsung, but the report out of Taiwan, suggests that the chips made by Samsung's foundry business will be used in Samsung branded phones, whereas the TSMC made chips might end up in devices by Qualcomm's other customers. It could also be a bet for Qualcomm to try and get better pricing by both foundries or a means of hedging their bets, to see which foundry produces the better chips. Then there's the situation between the PRC and the ROC, which could potentially put Qualcomm in a situation where it has no chips, so going with Samsung could be a means of covering for all potential risk scenarios.

MIT researchers have developed a groundbreaking technology that allows for the growth of 2D transition metal dichalcogenide (TMD) materials directly on fully fabricated silicon chips, enabling denser integrations. Conventional methods require temperatures of about 600°C, which can damage silicon transistors and circuits as they break down above 400°C. The MIT team overcame this challenge by creating a low-temperature growth process that preserves the chip's integrity, allowing 2D semiconductor transistors to be directly integrated on top of standard silicon circuits. The new approach grows a smooth, highly uniform layer across an entire 8-inch wafer, unlike previous methods that involved growing 2D materials elsewhere before transferring them to a chip or wafer. This process often led to imperfections that negatively impacted device and chip performance.

Additionally, the novel technology can grow a uniform layer of TMD material in less than an hour over 8-inch wafers, a significant improvement from previous methods that required over a day for a single layer. The enhanced speed and uniformity of this technology make it suitable for commercial applications, where 8-inch or larger wafers are essential. The researchers focused on molybdenum disulfide, a flexible, transparent 2D material with powerful electronic and photonic properties ideal for semiconductor transistors. They designed a new furnace for the metal-organic chemical vapor deposition process, which has separate low and high-temperature regions. The silicon wafer is placed in the low-temperature region while vaporized molybdenum and sulfur precursors flow into the furnace. Molybdenum remains in the low-temperature region, while the sulfur precursor decomposes in the high-temperature region before flowing back into the low-temperature region to grow molybdenum disulfide on the wafer surface.

Bosch is expanding its semiconductor business with silicon carbide chips. The technology company plans to acquire assets of the U.S. chipmaker TSI Semiconductors, based in Roseville, California. With a workforce of 250, the company is a foundry for application-specific integrated circuits, or ASICs. Currently, it mainly develops and produces large volumes of chips on 200-millimeter silicon wafers for applications in the mobility, telecommunications, energy, and life sciences industries. Over the next years, Bosch intends to invest more than 1.5 billion USD in the Roseville site and convert the TSI Semiconductors manufacturing facilities to state-of-the-art processes. Starting in 2026, the first chips will be produced on 200-millimeter wafers based on the innovative material silicon carbide (SiC).

In this way, Bosch is systematically reinforcing its semiconductor business, and will have significantly extended its global portfolio of SiC chips by the end of 2030. Above all, the global boom and ramp-up of electromobility are resulting in huge demand for such special semiconductors. The full scope of the planned investment will be heavily dependent on federal funding opportunities available via the CHIPS and Science Act as well as economic development opportunities within the State of California. Bosch and TSI Semiconductors have reached an agreement to not to disclose any financial details of the transaction, which is subject to regulatory approval.

Yesterday SK Hynix reported its Q1 2023 results and to say that they were abysmal is being kind, as the company reported a 3.4 trillion won operating loss, or just over US$2.5 billion. That's no small hit to take for any company, especially when it's only the performance for a single quarter. However, SK Hynix is apparently trying to see its situation from a positive perspective and believes that the memory chip market will rebound in the second half of this year. The positive outlook isn't just based on what SK Hynix believes though, as various analysts and securities companies believe in an upswing in the second half of the year.

That said, Micron, one of SK Hynix main competitors, has a more drab outlook for the remainder of 2023 and is expecting a tough year ahead. SK Hynix is expecting production cuts by itself, Micron and Samsung to start to take effect sometime in the second quarter this year, which should see inventory drop to more normal levels for all three companies. SK Hynix is also expecting to see a higher demand for DDR5 DRAM later this year, especially in the mobile and server market space. Finally, SK Hynix is hoping that its customers will buy higher density memory products this year, replacing older, lower density solutions, be that DRAM or NAND flash related. SK Hynix is expecting to launch its Gen 5 10 nm DRAM and 238-layer NAND sometime next year, which the company is also hoping will bring more income to its coffers, but the company still has to make it through the rest of 2023 first.

Ansys and TSMC continue their long-standing technology collaboration to announce the certification of Ansys' power integrity software for TSMC's N2 process technology. The TSMC N2 process, which adopts nanosheet transistor structure, represents a major advancement in semiconductor technology with significant speed and power advantages for high performance computing (HPC), mobile chips, and 3D-IC chiplets. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on N2, including the effects of self-heat on long-term reliability of wires and transistors. This latest collaboration builds on the recent certification of the Ansys platform for TSMC's N4 and N3E FinFLEX processes.

"TSMC works closely with our Open Innovation Platform (OIP) ecosystem partners to help our mutual customers achieve the best design results with the full stack of design solutions on TSMC's most advanced N2 process," said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. "Our latest collaboration with Ansys RedHawk-SC and Totem analysis tools allows our customers to benefit from the significant power and performance improvements of our N2 technology while ensuring predictively accurate power and thermal signoff for the long-term reliability of their designs."

Samsung Electronics today reported financial results for the first quarter ended March 31, 2023. The Company posted KRW 63.75 trillion in consolidated revenue, a 10% decline from the previous quarter, as overall consumer spending slowed amid the uncertain global macroeconomic environment. Operating profit was KRW 0.64 trillion as the DS (Device Solutions) Division faced decreased demand, while profit in the DX (Device eXperience) Division increased.

The DS Division's profit declined from the previous quarter due to weak demand in the Memory Business, a decline in utilization rates in the Foundry Business and continued weak demand and inventory adjustments from customers. Samsung Display Corporation (SDC) saw earnings in the mobile panel business decline quarter-on-quarter amid a market contraction, while the large panel business slightly narrowed its losses. The DX Division's results improved on the back of strong sales of the premium Galaxy S23 series as well as an enhanced sales mix focusing on premium TVs.

Future Japanese chipmaker Rapidus has announced that their first fab will be located in Chitose, Hokkaido, located in northern Japan. The planned 2 nm fab will be one of the most advanced fabs in the world once it's ready and construction is said to be starting in September, thanks to approval by the related Japanese government agencies. So far, the Japanese government has approved 330 billion yen for Rapidus, with the most recent investment being 260 billion yen or the equivalent of US$1.94 billion.

However, the total investment into the 2 nm fab is expected to end up somewhere around 5 trillion yen (~US$37.5 billion) in total investments before the fab is ready for mass production. Rapidus is collaborating with IBM and has already sent a group of researchers to its Albany Nanotech facility in upstate New York, which is one of the world's most advanced semiconductor research facilities. At the same time, Japan is working on building a local talent pool of researchers and semiconductor plant workers, by spearheading specialised training for select university students from Japan's top universities. Time will tell if this gamble pays off for Japan, as it's going to be a huge investment before the new fab stands ready in early 2025.