According to news out of Taiwan, TSMC will hold a ceremony to mark the official mass production start of its 3 nm node on the 29th of December. This is said to help "shatter doubts about de-Taiwanization" or in simpler terms, that Taiwan will lose its golden goose as TSMC invests abroad. The 3 nm fab—known as fab 18—is based in southern Taiwan's Tainan and the ceremony also marks the start of an expansion of TSMC's most advanced fab. TSMC is said to be kicking off its N3E node production sometime in the second half of 2023, followed by its N3P node in 2024, all of which should take place at fab 18, which also produces 5 nm wafers.

In related news, according to Reuters, a Japanese lawmaker from the ruling party has said that TSMC is considering a second plant in Japan, in addition to its current joint venture that is already under construction. TSMC's response to Reuters was that the company isn't ruling out Japan for future fabs, but that the company doesn't have any current plans. At the same time, TSMC is said to be sending executives to Dresden, Germany in early 2023, for a second round of talks about building a fab to help support the European auto industry, although this would be a 28/22 nm fab, which is far from cutting edge these days, although a lot more advanced than most fabs making chips for the auto industry.

Big things are afoot at Intel's graphics chip division once again, as the company has just broken up its Accelerated Computing Systems and Graphics (AXG) business unit which will result in some big changes. For starters, Raja Koduri has been—what we can only refer to as—demoted, given he's back to being chief architect rather than being in charge of the AXG business unit. Some of his staff will be moved to other business units inside Intel as the AXG business unit will cease to exist. This doesn't mean Intel will stop making discrete consumer GPUs, with at least the Battlemage/Arc B-series launch still being planned to take place sometime in 2023.

At the same time, it looks like Raja Koduri will be out of action for what is likely to be at least a month since he posted on Twitter that he's had emergency back surgery while on a business trip. How this will affect his transition back to his role as chief architect is anyone's guess at this point in time. However, he will not be focusing solely on GPUs in the future, but the broader range of products that Intel offers—particularly the integration of GPU, CPU and AI architectures at Intel. We've posted an official statement from Intel after the break, which Intel provided to Tom's Hardware. We also wish Raja a speedy recovery!

Global market intelligence firm TrendForce reports that the revenue generation momentum of the global IC design industry slowed down in 3Q22. The main factors behind this development were the Russia-Ukraine military conflict, the recent COVID-19 lockdowns in China, the ongoing inflation, and clients undergoing inventory corrections. The total revenue of the global top 10 IC design houses came to US$37.38 billion for 3Q22, showing a QoQ decline of 5.3%. Qualcomm remained first place in the ranking of the global top 10 IC design houses by revenue for 3Q22. Broadcom returned to second place by overtaking NVIDIA and AMD, who slipped to third and fourth respectively due to weakening demand for PCs and cryptocurrency mining machines.

Regarding US-based IC design houses that were in the top 10 group for 3Q22, Qualcomm recorded a QoQ increase for the sales of smartphone SoCs and 5G modem chips. It also made gains in the automotive electronics market by expanding its collaborations with partners in the automotive industry. As a result, Qualcomm's 3Q22 revenue figures for mobile and automotive offerings reflected QoQ increases of 6.8% and 22.0% respectively. The revenue growth of these two major product categories offset the marginal decline in the revenue for RF front-end chips. Qualcomm's IC design revenue as a whole climbed up by 5.6% QoQ to US$9.90 billion for 3Q22. The company sat firmly at the top of the ranking.

The United States has recently imposed several sanctions on technology exports to China. These sanctions are designed to restrict the transfer of specific technologies and sensitive information to Chinese entities, particularly those with ties to the Chinese military or government. The primary motivation behind these sanctions is to protect American national security interests, as well as to protect American companies from unfair competition. According to Financial Times, we have information that Chinese tech Giant, Alibaba, can not access Arm licenses for Neoverse V1 technology. Generally, the technology group where Neoverse V-series falls in is called Wassenaar -- multilateral export control regime (MECR) with 42 participating states. This agreement prohibits the sale of technology that could be used for military purposes.

The US argues that Arm's Neoverse V1 IP is not only a product from UK's Arm but a design made in the US as well, meaning that it is a US technology. Since Alibaba's T-Head group responsible for designing processors that go into Alibaba's cloud services can not use Neoverse V1, it has to look for alternative solutions. The Neoverse V1 and V2 can not be sold in China, while Neoverse N1 and N2 can. Alibaba's T-Head engineer argued, "We feel that the western world sees us as second-class people. They won't sell good products to us even if we have money."

Ventana Micro Systems Inc. today announced its Veyron family of high performance RISC-V processors. The Veyron V1 is the first member of the family, and the highest performance RISC-V processor available today. It will be offered in the form of high performance chiplets and IP. Ventana Founder and CEO Balaji Baktha will make the public announcement during his RISC-V Summit keynote today.

The Veyron V1 is the first RISC-V processor to provide single thread performance that is competitive with the latest incumbent processors for Data Center, Automotive, 5G, AI, and Client applications. The Veyron V1 efficient microarchitecture also enables the highest single socket performance among competing architectures.

The worldwide semiconductor industry is projected to invest more than $500 billion in 84 volume chipmaking facilities starting construction from 2021 to 2023, with segments including automotive and high-performance computing fueling the spending increases, SEMI announced today in its latest quarterly World Fab Forecast report. The projected growth in global factory count includes a record high 33 new semiconductor manufacturing facilities starting construction this year and 28 more in 2023.

"The latest SEMI World Fab Forecast update reflects the increasing strategic importance of semiconductors to countries and a wide array of industries worldwide," said Ajit Manocha, SEMI president and CEO. "The report underscores the significant impact of government incentives in expanding production capacity and strengthening supply chains. With the bullish long-term outlook for the industry, rising investments in semiconductor manufacturing are critical to laying the groundwork for secular growth driven by a diverse range of emerging applications."

According to TrendForce's research, the total revenue of the global top 10 foundries rose by 6% QoQ to US$35.21 billion for 3Q22 as the release of the new iPhone series during the second half of the year generated significant stock-up activities across Apple's supply chain. However, the global economy shows weak performances, and factors such as China's policy on containing COVID-19 outbreaks and high inflation continue to impact consumer confidence. As a result, peak-season demand in the second half of the year has been underwhelming, and inventory consumption is proceeding slower than anticipated. This situation has led to substantial downward corrections to foundry orders as well. For 4Q22, TrendForce forecasts that the total revenue of the global top 10 foundries will register a QoQ decline, thereby terminating the boom of the past two years—when there was an uninterrupted trend of QoQ revenue growth.

Regarding individual foundries' performances in 3Q22, the group of the top five was led by TSMC, followed by Samsung, UMC, GlobalFoundries, and SMIC. Their collective global market share (in revenue terms) came to 89.6%. Most foundries were directly impacted by clients slowing down their stock-up activities or significantly correcting down their orders. Only TSMC was able to make a notable gain due to Apple's strong stock-up demand for the SoCs deployed in this year's new iPhone models. TSMC saw its revenue rise by 11.1% QoQ to US$20.16 billion, and the corresponding market share expanded to 56.1%. The growth was mainly attributed to the ≤7 nm nodes, whose share in the foundry's revenue had kept climbing and reached 54% in the third quarter. Conversely, Samsung actually experienced a slight QoQ drop of 0.1% in foundry revenue even though it had also benefited from the component demand related to the new iPhone series. Partially impacted by the weakening of the Korean won, Samsung's market share fell to 15.5%.

Although Morris Chang is no longer in charge of the day to day business at TSMC, the founder of the company is still getting his hands dirty. Chang attended the APEC Economic Leaders Meeting last week, as part of Taiwan's delegation and was questioned by the media about TSMC's future plans. The specific question was about TSMC's Arizona fab, which will initially produce chips using a 5 nm node. The US$12 billion plant is scheduled to kick off production at some point in 2024, by which time the 5 nm node should be a commonly used node rather than close to cutting edge.

When questioned about the future of the Arizona fab, Morris Chang answered that it will be moving to a 3 nm node, which is currently TSMC's most cutting edge node, that has gone into volume production earlier this year with th N3 node, which is set to be followed by the N3E node. According to Chang, there's interest by several countries to have TSMC set up fabs there, but apparently this is not something TSMC is considering at the moment. One potential reason for this would be a suitable labour force, something that has already proven to be tough for the Arizona fab.

During Snapdragon Summit 2022, Qualcomm Technologies, Inc. revealed the Snapdragon AR2 Gen 1 Platform, which delivers groundbreaking AR technology that will unlock a new generation of sleek, highly capable glasses. The Company built Snapdragon AR2 from the ground up to revolutionize the headworn glass form factor and usher in a new era of spatial computing experiences for the real-world/metaverse mix.

Purpose-built for AR: To help create the thinnest possible, high-performance AR glass, we have built a multi-chip distributed processing architecture combined with customized IP blocks. The main processor occupies a 40% smaller PCB area on glass and the overall platform delivers 2.5x better AI performance while consuming 50% less power to help achieve AR glasses that consume <1 W power. This enables rich AR experiences on glasses that can be comfortably worn for extended periods of time and meet the demands of both consumers and enterprise use cases.

MediaTek today announced its new Kompanio chipsets for Chromebooks: the Kompanio 520 and Kompanio 528. With upgraded computing performance and battery life for entry level Chromebooks, the newest Kompanio chipsets provide a seamless experience so consumers can browse, cloud game, stream and use Google Play apps while enjoying all-day battery life.

"Enhanced power efficiency, speedy performance and reliable connectivity are at the core of a great user experience, and that's exactly what MediaTek's new Kompanio chipsets deliver," said Adam King, Vice President and General Manager, Client Computing Business Unit at MediaTek. "As the No. 1 provider of Arm-based Chromebooks, MediaTek makes the latest AI, connectivity, display and imaging features accessible at every price point."

MediaTek today launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6 GHz connectivity to consumers around the globe.

"MediaTek's Dimensity 9200 combines ultimate performance with significant power savings, extending battery life and keeping smartphones cool," said JC Hsu, Corporate Vice President and General Manager of MediaTek's wireless communications business unit at MediaTek. "With notably brighter image capturing and improved gaming speeds, along with the latest display enhancements, the Dimensity 9200 will bring new possibilities for next-gen smartphones that come in a variety of stylish and foldable form factors."

In what can only be called an unusual move, several Chinese fabless chip makers—such as Alibaba and Biren Technology—who manufacturers at TSMC, are looking at running their chips slower. The reason for this is that they're trying to circumvent the US sanctions against Chinese chip makers. It should be noted that these are chips that have already taped out and gone into sample production, such as Biren's BR100 GPU.As reported earlier today, Alibaba even had one of its chips delisted from the official SPEC ranking, due to being unavailable and it's possible that it's one of the chips that's affected by the US sanctions.

Considering that the Chinese chip makers are dependent on the same cutting edge nodes at TSMC as the likes of Nvidia, AMD, Qualcomm etc. it would potentially lead to more capacity for these companies at TSMC. According to the report by the Financial Times, Biren has had to stop shipments of its GPUs, as the company is going to have to prove that its chips don't violate the US export control restrictions. Apparently the rules to work out if a chip falls under the US sanctions or not are anything but clear. One metric is apparently based on the bidirectional transfer rate, which is capped at below 600 GB/s between chips, but the tricky part is that this metric can be calculated in several different ways. As such, Biren has dropped the transfer rate from 640 to 576 GB/s according to the Financial Times. The sanctions are likely to cause longer term concerns for TSMC as well, as the company is likely to lose several big customers for its cutting edge nodes, at least for the time being.

Over the past few weeks, the legal dispute between Arm Ltd. and Qualcomm Inc. has been warming up the eyes of the entire tech community. However, as per the latest court filing, Arm could change its licensing strategy and shift its whole business model into a new direction that would benefit the company directly. Currently, the company provides the intellectual property (IP) that chip makers can use and add to designs mixed with other IPs and custom in-house solutions. That is how the world of electronics design (EDA) works and how many companies operate. However, in the Qualcomm-Arm legal battle, Qualcomm's counterclaim has brought new light about Arm's plans for licensing its hardware designs past 2024.

According to Dylan Patel of SemiAnalysis, who examined court documents, Arm will reportedly change terms to use its IP where the use of other IP mixed with Arm IP is prohibited. If a chip maker plans to use Arm CPU IP, they must also use Arm's GPU/NPU/ISP/DSP IPs. This would result in devices that utilize every design the UK-based designer has to offer, and other IP makers will have to exclude their designs from the SoC. By doing this, Arm directly stands against deals like the Samsung-AMD deal, where AMD provides RDNA GPU IP and would force Samsung to use Arm's Mali GPU IP instead. This change should take effect in 2025 when every new license agreement has to comply with new rules.

IBM Research has published information about the company's latest development of processors for accelerating Artificial Intelligence (AI). The latest IBM processor, called the Artificial Intelligence Unit (AIU), embraces the problem of creating an enterprise solution for AI deployment that fits in a PCIe slot. The IBM AIU is a half-height PCIe card with a processor powered by 23 Billion transistors manufactured on a 5 nm node (assuming TSMC's). While IBM has not provided many details initially, we know that the AIU uses an AI processor found in the Telum chip, a core of the IBM Z16 mainframe. The AIU uses Telum's AI engine and scales it up to 32 cores and achieve high efficiency.

The company has highlighted two main paths for enterprise AI adoption. The first one is to embrace lower precision and use approximate computing to drop from 32-bit formats to some odd-bit structures that hold a quarter as much precision and still deliver similar result. The other one is, as IBM touts, that "AI chip should be laid out to streamline AI workflows. Because most AI calculations involve matrix and vector multiplication, our chip architecture features a simpler layout than a multi-purpose CPU. The IBM AIU has also been designed to send data directly from one compute engine to the next, creating enormous energy savings."

Jon Peddie Research (JPR) has responded to the recent dramatic reports by Canalys, Gartner, and IDC showing a precipitous drop in Q3 2022 PC shipments. In addition, JPR is providing guidance on the impact to graphics chip and AIB shipments. Jon Peddie, president and founder of JPR, said, "Our advice to clients has been consistent since 2020: The pandemic boom was not a surge in demand brought about by real growth in the market. The PC market is now correcting itself after a period of extraordinary growth spurred on by spending from an overwhelming surge of users working from home."

Peddie continued, "People were forced to work at home in 2020 and 2021, and many needed equipment. As a result, PC sales surged. Those people have what they need, and some of them are going back to the office. They don't need new PCs, and won't for three to five years. So, we are back to the nominal growth of the PC market, which was, and will be again after two quarters' adjustment, tracking GNP growth."

The world is without a doubt entering a recession and now the first rumours of mass layoffs in the tech industry are starting. According to Bloomberg, Intel is considering laying off thousands of employees as a measure to cut costs, as its businesses are slowing down. Bloomberg is mainly citing the PC market, which the publication calls Intel's main business, although Intel's Client Computing Group (CCG) does a lot more than just selling PC chips, but the group was Intel's largest source of revenue in Q2 this year by quite some margin. That said, despite a revenue of US$7.7 billion in Q2, this was down 25 percent compared to 2021, which in all fairness was a record year for most companies in the PC industry.

According to Bloomberg, Intel had 113,700 employees as of July this year and the publication said Intel is considering cutting as much as 20 percent of its sales and marketing staff. Bloomberg is expecting Intel to be looking at reducing fixed costs by 10 to 15 percent, although this is unlikely to affect key parts of Intel's business units. Last quarter, most of Intel's business units made a healthy profit, but only the Network and Edge Group had a significant revenue increase over the same quarter in 2021, with most other groups being down significantly. The third quarter results aren't expected to improve upon things, something that appears to be reflected in Intel's share price, which is down over 50 percent in 2022. That said, all of Intel's competitors are in the same boat and it's likely that we'll see more news about companies that are considering trimming back on their expenses and staff numbers in the near future. Intel is scheduled to report its third quarter earnings on the 27th of October.

Semiconductor manufacturers worldwide are forecast to expand 300 mm fab capacity at a nearly 10% compound average growth rate (CAGR) from 2022 to 2025, reaching an all-time high of 9.2 million wafers per month (wpm), SEMI announced today in its 300 mm Fab Outlook to 2025 report. Strong demand for automotive semiconductors and new government funding and incentive programs in multiple regions are driving much of the growth.

"While shortages of some chips have eased and supply of others has remained tight, the semiconductor industry is laying the groundwork to meet longer-term demand for a broad range of emerging applications as it expands 300 mm fab capacity," said Ajit Manocha, SEMI President and CEO. "SEMI is currently tracking 67 new 300 mm fabs or major additions of new lines expected to start construction from 2022 to 2025."

According to TrendForce research, due to steady weakening of overall demand for consumer electronics, inventory pressure has increased among downstream distributors and brands. Although there are still sporadic shortages of specific components, the curtain has officially fallen on a two-year wave of shortages in general, and brands have gradually suspended stocking in response to changes in market conditions. However, stable demand for automotive and industrial equipment is key to supporting the ongoing growth of foundry output value. At the same time, since the creation of a marginal amount of new capacity in 2Q22 led to growth in wafer shipments and a price hike for certain wafers, this drove output value among top ten foundries to reach US$33.20 billion in 2Q22. Quarterly growth fell to 3.9% on a weakening consumer market.

A prelude to inventory correction was officially revealed in 3Q22. In addition to intensifying severity in the initial wave of order slashing for LDDI/TDDI, and TV SoC, diminishing order volume also extended to non-Apple smartphone APs and peripheral IC PMIC, CIS, and consumer electronics PMICs, and mid-to-low-end MCUs, posing a challenge for foundry capacity utilization. However, the launch of the new iPhone in 3Q22 is expected to prop up a certain amount of stocking momentum for the sluggish market. Therefore, top ten foundry revenue in 3Q22 is expected to maintain a growth trend driven by high-priced processes and quarterly growth rate is expected to be slightly higher than in 2Q22.

NVIDIA's high-performance computing hardware stack is now equipped with the top-of-the-line Hopper H100 GPU. It features 16896 or 14592 CUDA cores, developing if it comes in SXM5 of PCIe variant, with the former being more powerful. Both variants come with a 5120-bit interface, with the SXM5 version using HBM3 memory running at 3.0 Gbps speed and the PCIe version using HBM2E memory running at 2.0 Gbps. Both versions use the same capacity capped at 80 GBs. However, that could soon change with the latest rumor suggesting that NVIDIA could be preparing a PCIe version of Hopper H100 GPU with 120 GBs of an unknown type of memory installed.

According to the Chinese website "s-ss.cc" the 120 GB variant of the H100 PCIe card will feature an entire GH100 chip with everything unlocked. As the site suggests, this version will improve memory capacity and performance over the regular H100 PCIe SKU. With HPC workloads increasing in size and complexity, more significant memory allocation is needed for better performance. With the recent advances in Large Language Models (LLMs), AI workloads use trillions of parameters for tranining, most of which is done on GPUs like NVIDIA H100.

Based on a report by Tom's Hardware, AMD's CEO Lisa Su is planning a trip to Taiwan in the next couple of months. It is said that she is planning to meet with multiple partners in Taiwan, such as ASUS, Acer and maybe more importantly, ASMedia, which will be the sole maker of chipsets for AMD, once the X570 chipset is discontinued. AMD is apparently also seeing various less well known partners that deliver parts for its CPUs, such as Nan Ya PCB, Unimicron Technologies and Kinsus Interconnects.

However, it appears that the main reason for Lisa Su herself to visit Taiwan will be to meet with TSMC, to discuss future collaboration with CC Wei, TSMC's chief executive. This is so AMD can secure enough wafer allocation on future nodes, such as its 3 nm and 2 nm class nodes. The move to these nodes is obviously not happening in the near future for AMD, but considering that TSMC is currently the leading foundry and is operating at capacity, it makes sense to get in early, as the competition is stiff when it comes to getting wafer allocation on cutting edge nodes. It's unclear which exact 3 nm class node AMD will be aiming for, but it might be the N3P node, which is said to kick off production sometime next year. Lisa Su is also said to have meetings with TSMC, SPIL and Ase Technology when it comes to advanced packaging for AMD's products. This includes technologies such as chip-on-wafer-on-substrate (CoWoS) and fan-out embedded bridge (FO-EB), with AMD already being expected to use some of these technologies in its upcoming Navi 3x GPUs.

NVIDIA's CEO has gone out on a limb during a video call with the media, where he claimed that Moore's Law is Dead, in response to the high asking price for its latest graphics cards. For those not familiar with Moore's law, it's an observation by Intel's Gordon Moore that says that transistors double in density inside dense integrated circuits every two years, while at the same time, the cost of computers are halved. The follow-on to this observation is that there's also a doubling of the performance every two years, if maintaining the same cost. This part doesn't quite hold true any more, due to all major foundries having increased the cost when using their cutting edge nodes. We're also reaching a point where it's getting increasingly difficult to shrink process nodes in semiconductor fabs. However, Jensen Huang's statement has nothing to do with the actual node shrinks, which makes his statement a bit flawed.

Jensen's focus seems to be on the latter half of Moore's law, the part related to semiconductors getting cheaper, which in turn makes computers cheaper. However, this hasn't been true for some time now and Jensen's argument in this case is that NVIDIA's costs of making semiconductors have gone up. Jensen is quoted as saying "A 12-inch wafer is a lot more expensive today than it was yesterday, and it's not a little bit more expensive, it is a ton more expensive," "Moore's Law is dead … It's completely over, and so the idea that a chip is going to go down in cost over time, unfortunately, is a story of the past." What he actually meant is that we shouldn't expect semiconductors to be as cheap as they've been in the past, although part of the issue NVIDIA is having is that their products have to be produced on cutting edge notes, which cost significantly more than more mature nodes. It'll be interesting to see if AMD can deliver graphics chips and cards with a more competitive price point than NVIDIA, as that would refute some of Jensen's claims.

According to Dylan Patel of SemiAnalysis sources, Apple is moving its embedded cores from Arm to RISC-V. In Apple's Silicon designs, there are far more cores than the main ones that power the operating system and end-user applications. For example, embedded cores are present, and there are 30+ in M1 SoCs responsible for all kinds of workloads not related to the operating system. These tasks are usually associated with other functions such as WiFi/BlueTooth, ThunderBolt retiming, touchpad control, NAND chips having their own core, etc. They run their own firmware and power everything around the central cores that run the OS, so the whole SoC functions appropriately.

It appears that a lot of these cores are based on Arm M-series or lower-end A-series IP that Apple is currently looking to replace with RISC-V. Given that a large portion of software runs on the main big.LITTLE configuration, other secondary SoC tasks can migrate to a different ISA like RISC-V, with a small firmware adjustment. Given that these cores can be placed with custom IPs, Apple would save licensing fees if custom RISC-V cores were used. Additionally, developing firmware for these cores at an Apple engineering team size shouldn't be a problem. Of course, we have no information about when these custom cores will appear inside Apple Silicon. Even when they are used, no formal announcement is expected given that the main cores remain to be powered by Arm ISA, with everything else invisible to the end-user.

Achronix Semiconductor Corporation, a leader in high-performance FPGAs and embedded FPGA (eFPGA) IP, today announced that their VectorPath accelerator card featuring the Speedster 7t FPGA has been certified by PCI-SIG and added to the CEM Add-In card integrators list supporting PCIe Gen4 x16. The VectorPath S7t-VG6 accelerator card is designed to reduce time to market when developing high-performance compute and acceleration functions for AI, ML, networking and data center applications. The VectorPath accelerator cards are available and shipping today for new orders.

"Achronix is an important, strategic partner for BittWare. The Speedster7t FPGA has an innovative architecture that provides significant differentiation in the high-performance FPGA market segment," said Craig Petrie, VP of sales and marketing at BittWare. "Designers can now use the VectorPath accelerator card in PCIe Gen4-based system with the confidence of PCI-SIG certification."

POINTek, Inc., a global leader and provider of high performance athermal AWGs, announced launching of new Application- Specific Optical Fiber Array Products, Silicon Photonics (SiPh) Fiber Arrays, which is capable of supporting the back-end packaging for Silicon Photonics Integrated Circuits (PIC). This new Silicon Photonics Fiber Arrays have the excellent characteristics of a fine fiber-end mirror-surface quality and an accurate fiber protrusion length uniformity to match with the prefabricated V-grooves on a Silicon PIC chip. The required fiber protrusion length is typically 5 mm with ≤ ±2 um length uniformity in an array. Both Single Mode (SM) Fiber Arrays and Polarization Maintaining (PM) Fiber Arrays are available with or without 12-channel MT ferrule termination.

"This new SiPh Fiber Array is designed to passively align the multiple optical fibers into the wafer-fabricated V-grooves on the Silicon PIC chip without the expensive and complicated active alignment equipment, and furthermore, the passive alignment of the Array can be accomplished without monitoring the optical power," according to Dr. Donald Yu, CMO of POINTek, operating from Los Angeles, California. Yu explains that the optical fiber array is a key component to efficiently assemble the PIC devices for coupling the multiple fibers into the multiple I/O waveguides on a PIC chip. In the conventional optical active alignment assembly process, the expensive automatic precision alignment equipment should be utilized while monitoring the optical power in the packaging process, and it often takes the long processing time. "However, for this new SiPh Fiber Array, the fibers can be precisely placed in the Silicon PIC's V-grooves with the minimal operation costs. Therefore, the passive alignment of Silicon PIC could result in the very affordable SiPh device price in the market," Yu adds.

Starting next year, AMD will move to a new model number scheme for its mobile processors and it appears that the company has decided to use the first digit to represent the model year, which should alleviate some past confusion. The second digit in the model name will represent where in the product stack the specific chip will sit and here we're potentially getting some new 6 and 8 models, although nothing guarantees that AMD will actually implement these segments into real products. The third digit represents the architecture, so a four equals Zen 4 for example.

The last digit in the model names is a new addition where AMD has sub SKUs that offer some performance advantage of the base SKU of a specific model and this digit will apparently only be represented by a 0 or a 5. Finally AMD has added a new suffix too, where C stands for Chromebook. This translates to 15-28 Watt chips that have been designed specifically for Chromebook usage. The current HX, HS and U suffix lettering will carry over, alongside the lower-case e for 9 W versions the U SKUs. AMD has also segmented it's mobile CPUs according to the chart below, to try and deliver a clearer use case for its various CPU models. The chart is pretty self explanatory, although some of the segmentation will apply to updated models of current designs, whereas others will only apply to new laptop designs. The new model numbering scheme will apply to at least 2025.