The 7th generation Core "Kaby Lake" processor, and its companion 200-series chipset are almost upon us, with the company planning to launch them this 2017 International CES (early January). It looks like the 200-series chipset is turning out to be what the 9-series chipset was to the 8-series; with a handful new features, but nothing extraordinary. Current 100-series chipset motherboards are already receiving BIOS updates from manufacturers to make them support the new processors. It looks like the succeeding 300-series chipset, which Intel plans towards the end of 2017, could stand out.

Intel is reportedly equipping the 300-series chipset with wireless networking becoming part of the feature-set. This means at least some variants of the chipset could feature native WLAN controllers (likely with external PHY for signal clarity). The company is also planning to implement native 10 Gb/s USB 3.1 (gen 2.0) controllers into the chipset. This decision could impact third-party WLAN and USB 3.1 controller manufacturers, observes DigiTimes.