Wednesday, January 17th 2018
Streacom Readies Fanless GPU Heatsink for DB4 Chassis
Expert fan-less case maker Streacom is putting final touches to its fan-less GPU heatsink for the DB4 cube-shaped chassis. The cooler transports heat drawn from the GPU onto the main body panels of the DB4, which dissipate it. Its design is similar to the CPU heatsink included with the case, in which a GPU base where four 6 mm-thick copper heat pipes make direct contact with the GPU, transport it onto a second block that makes contact with the innner wall of the body panel. The cooler comes with included heatsinks for memory and VRM of the graphics card, and is designed to handle thermal loads of up to 65-75W, which would mean lower-mainstream graphics cards such as the GeForce GTX 1050 (or below), and the Radeon RX 550 (or below).
Source:
FanlessTech
4 Comments on Streacom Readies Fanless GPU Heatsink for DB4 Chassis
Apple could do this with the trash can Mac Pro due to the custom motherboard. The lack of updates to the platform shows how limited its cooling potential is, though. Not to mention that Apple does not care about serviceability or upgradeability, of course. While this can't keep up with a 1060 (at least without adding a fan or two somewhere), that would indeed be sweet. Here's hoping Calyos starts licencing out their flexible pump-less loop systems and we get some smaller, cheaper cases with that. Preferably as nice-looking as this. That would be amazing.