Monday, May 29th 2023
ADATA's Comprehensive SSD Cooling Solutions Debut
ADATA Technology Co., Ltd., the world's leading memory brand, is committed to exploring breakthroughs that lead to extreme performance. PCIe Gen 5 SSDs are extremely fast but this powerful performance generates a corresponding degree of heat. In order to enhance stability and prolong product lifespan as well as maintain optimal speeds, innovative cooling solutions are a must for these latest-generation SSDs. During Computex 2023, the company will announce the launch of a number of patented SSD cooling solutions, not only speeding past the competition but also taking the lead in heat dissipation. Project NeonStorm Gen 5 solid-state drive (SSD) is the first in the industry to introduce a liquid and fan-cooled heat dissipation design on an M.2 SSD.
It uses coolant to absorb and then dual fans to dissipate heat, creating a perfect convection ecosystem. The LEGEND 970 Gen 5 SSD adopts a dual-layer aluminium alloy heatsink and fan to create active air cooling and a surface crystallization coating to improve thermal conductivity. The SE920 USB4 external SSD has a built-in micro fan to quickly discharge heat which is activated by extending the retractable casing. The structural R&D and excellent heat-dissipating characteristics of these designs are expected to become the most influential benchmark for extreme storage in the consumer market.Project NeonStorm SSD - Dual cooling for ultimate heat dissipation
Project NeonStorm delivers transfer speeds of up to 14,000/12,000 MB per second, necessitating a dual-system design featuring both liquid and air cooling. When the heat rises off the SSD, it first passes through a metal heat spreader to increase the contact area. After being conducted into the liquid reservoir, heat energy is absorbed by a high thermal capacity coolant and then moves into the aluminium alloy heatsink. The heatsink acts as a medium between the coolant and the fans. When the fans at either end of Project NeonStorm are activated, heat is removed through the convection of hot and cold air. Compared with fan-type heat dissipation fins without liquid cooling, ADATA's inventive "patented dual-cooling heat dissipation" system can lower SSD temperatures by an additional 20%
LEGEND 970 SSD - Surface crystallization cools fast
The LEGEND 970 delivers read/write performance of up to 10,000/10,000 MB per second. It is designed with dual-layer extruded aluminium fins to create a dense air duct to divert hot and cold air. A built-in micro fan pulls in cool airflow and expels warm air from the sides of the heatsink. At the same time, the LEGEND 970's aluminium alloy fins are coated with surface crystallization, increasing overall contact surface area and maximizing air cooling system heat dissipation efficiency. This unique "patented active heat dissipation" design significantly reduces controller temperatures by 10% compared with fanless heatsinks, ensuring SSD stability and long-term high-performance operation. The LEGEND 970 begins mass production at the end of June and will be unveiled at Computex ahead of schedule. Stay tuned!
SE920 External SSD - Award-winning extendable cooling
The SE920 utilizes the latest generation USB4 transmission interface with a read/write of 3,800/3,200 MB per second and its heat dissipation system is equipped with a built-in micro fan. Simply pushing on the casing extends the chassis to quickly discharge heat. When the extendable case is retracted volume is reduced, facilitating storage. When extended, convection is strengthened, effectively dissipating heat while remaining light and portable. This ingenious "patented active cooling" design significantly reduces temperatures by 10% compared with fanless products of the same specifications and has won the Red Dot Design Award, Japan GOOD Design Award, and Taiwan Excellence Award in the last 2 years.
It uses coolant to absorb and then dual fans to dissipate heat, creating a perfect convection ecosystem. The LEGEND 970 Gen 5 SSD adopts a dual-layer aluminium alloy heatsink and fan to create active air cooling and a surface crystallization coating to improve thermal conductivity. The SE920 USB4 external SSD has a built-in micro fan to quickly discharge heat which is activated by extending the retractable casing. The structural R&D and excellent heat-dissipating characteristics of these designs are expected to become the most influential benchmark for extreme storage in the consumer market.Project NeonStorm SSD - Dual cooling for ultimate heat dissipation
Project NeonStorm delivers transfer speeds of up to 14,000/12,000 MB per second, necessitating a dual-system design featuring both liquid and air cooling. When the heat rises off the SSD, it first passes through a metal heat spreader to increase the contact area. After being conducted into the liquid reservoir, heat energy is absorbed by a high thermal capacity coolant and then moves into the aluminium alloy heatsink. The heatsink acts as a medium between the coolant and the fans. When the fans at either end of Project NeonStorm are activated, heat is removed through the convection of hot and cold air. Compared with fan-type heat dissipation fins without liquid cooling, ADATA's inventive "patented dual-cooling heat dissipation" system can lower SSD temperatures by an additional 20%
LEGEND 970 SSD - Surface crystallization cools fast
The LEGEND 970 delivers read/write performance of up to 10,000/10,000 MB per second. It is designed with dual-layer extruded aluminium fins to create a dense air duct to divert hot and cold air. A built-in micro fan pulls in cool airflow and expels warm air from the sides of the heatsink. At the same time, the LEGEND 970's aluminium alloy fins are coated with surface crystallization, increasing overall contact surface area and maximizing air cooling system heat dissipation efficiency. This unique "patented active heat dissipation" design significantly reduces controller temperatures by 10% compared with fanless heatsinks, ensuring SSD stability and long-term high-performance operation. The LEGEND 970 begins mass production at the end of June and will be unveiled at Computex ahead of schedule. Stay tuned!
SE920 External SSD - Award-winning extendable cooling
The SE920 utilizes the latest generation USB4 transmission interface with a read/write of 3,800/3,200 MB per second and its heat dissipation system is equipped with a built-in micro fan. Simply pushing on the casing extends the chassis to quickly discharge heat. When the extendable case is retracted volume is reduced, facilitating storage. When extended, convection is strengthened, effectively dissipating heat while remaining light and portable. This ingenious "patented active cooling" design significantly reduces temperatures by 10% compared with fanless products of the same specifications and has won the Red Dot Design Award, Japan GOOD Design Award, and Taiwan Excellence Award in the last 2 years.
15 Comments on ADATA's Comprehensive SSD Cooling Solutions Debut
Am I the only one getting the feeling that modern PC technology is regressing?
Larger heatsinks may cause clearance issues with air cooled build's. I know my D15 was 1mm away from touching my GPU back plate completely blocking access to primary NVME.
Altho, I have an m.2 expansion card (looks like a 90s oem blower GPU)with an itty bitty fan built into it and I can't say that I ever heard it. Nor can I say that it actually helped keep the drive any cooler either. So I suppose if they don't crank the RPMs to completely insane levels they may not be earsplitters but will they help at all if they aren't? I'd rather not find out being that the neonstorm version will be stooopid expensive of course.
IMHO, if an m.2 drive requires liquid AND air cooling just to operate at anything approaching normal speeds & temps, then somebody, somewhere, needs to seriously rethink this tech, like, yesterday :(
Having said that though, I might consider this useful on external drives, as any drive inside a small, mostly sealed enclosure, with limited airflow, will run hotter than when inside a pc case, where good airflow is moar readily available...
But like maxfly, I'll just stick with 850x's for now, at least until this nonsense gets fixed...
silence IS both golden, AND a virtue after all.. :D
But you're right as far as passive heatsinks are concerned.... as all of my work towers (168.73) contain 4x 850x's each (which ARE high-end gen 4's) with only the factory sinks on them, with good case airflow, running major 3D CAD/CAM processes 16 hrs/day x 6 days/wk, and I have yet to see any of them go over 60-68c :)
It's not unlike the amount of cooling you need for a 19999k or something lower.