M31 Technology Corporation, a leading global provider of silicon intellectual property (IP), today announced that its cutting-edge USB4 IP has achieved silicon validation on TSMC's 5 nm (N5) process. The newly validated IP enhances data transfer capabilities for a new wave of mobile and portable devices. The announcement coincides with M31's participation in TSMC's 2024 Open Innovation Platform (OIP) Ecosystem Forum in Taiwan. This milestone underscores the close collaboration between M31 and TSMC, reflecting M31's commitment to advancing high-performance IP solutions by leveraging TSMC's innovative platform to drive next-generation connectivity.

M31's USB4 IP is built on the latest USB4 specification and represents a major leap in the evolution of USB architecture. It supports multi-protocol tunneling, enabling simultaneous transmission of multiple data types—such as USB, DisplayPort, and PCIe—over a single connection. The USB4 IP achieves 40 Gbps data transfer rates, significantly enhancing bandwidth associated with previous USB standards. The IP is fully compatible with USB 3.2, USB 2.0, and Thunderbolt 3, ensuring seamless integration with existing and future devices.

Other World Computing (OWC), a trusted leader in delivering high-performance, secure, and sustainable technology solutions that enhance and extend the life of Macs and PCs, today announced the full compatibility of its OWC Thunderbolt 5 innovations—including its OWC Envoy Ultra SSD and OWC Thunderbolt 5 (USB-C) Cables—with the latest Mac mini powered by the new M4 Pro chip and MacBook Pro powered by the M4 Pro and M4 Max family of chips. With these cutting-edge OWC solutions, Apple users are empowered to unlock the full potential of Thunderbolt 5, and enjoy a new era of speed, reliability, and connectivity.

"Thunderbolt 5 unlocks a new world of possibilities for users, and OWC is proud to be at the forefront of this exciting evolution," said Larry O'Connor, CEO and Founder, Other World Computing (OWC). "With the Envoy Ultra SSD and our Thunderbolt 5 cables, we're giving Mac Mini and MacBook Pro users the speed, reliability, and power they need to push their workflows further than ever before - whether they're editing 8K video, managing massive data sets, or just staying connected on the go." He continued, "And, don't blink - because OWC is set to roll out even more Thunderbolt 5 innovations, including the powerful OWC Thunderbolt 5 Hub, set for release in November."

As Intel's Core Ultra "Arrow Lake-S" desktop processors near their launch, ASUS China put out a video presentation about its Z890 chipset motherboards ready for these processors, which included a technical run-down of Intel's first tile-based desktop processor, which included detailed die-shots of the various tiles. This is stuff that would require not just de-lidding the processor (removing the integrated heat-spreader), but also clearing up the top layers of the die to reveal the various components underneath.

The whole-chip die-shot gives us a bird's eye view of the four key logic tiles—Compute, Graphics, SoC, and I/O, sitting on top of the Foveros base tile. Our article from earlier this week goes into the die areas of the individual tiles, and the base tile. The Compute tile is built on the most advanced foundry node among the four tiles, the 3 nm TSMC N3B. Unlike the older generation "Raptor Lake-S" and "Alder Lake-S," the P-cores and E-core clusters aren't clumped into the two ends of the CPU complex. In "Arrow Lake-S," they follow a staggered layout, with a row of P-cores, followed by a row of E-core clusters, followed by two rows of P-cores, and then another row of E-core clusters, before the final row of P-cores, to achieve the total core-count of 8P+16E. This arrangement reduces concentration of heat when the P-cores are loaded (eg: when gaming), and ensures each E-core cluster is just one ringbus stop away from a P-core, which should improve thread-migration latencies. The central region of the tile has this ringbus, and 36 MB of L3 cache shared among the P-cores and E-core clusters.

ASUS today unveiled a lineup of Z890 motherboards from the ROG Maximus, ROG Strix, TUF Gaming, Prime and ProArt families, supporting Intel Core Ultra processors (Series 2). ASUS is marking the occasion with all-new motherboard features that accelerate performance and streamline the build process. ASUS AI Advisor is a new natural-language build assistant powered by AI. AEMP III, NitroPath DRAM Technology and DIMM Fit unleash DDR5 memory kits. NPU Boost provides overclocking of the integrated NPU in an Intel Core Ultra (Series 2) CPU for accelerated AI performancei. ROG M.2 PowerBoost provides more M.2 slots on a motherboard than ever before. On top of all that, there is Thunderbolt 5, WiFi 7 and new PC DIY features to discuss.

Primed to perform with Intel Core Ultra processors (Series 2) in a new socket
Intel Core Ultra processors (Series 2) use the new LGA 1851 socket. Users of these processors will need an Intel 800 series motherboard to use one, and a Z890 motherboard specifically to take advantage of CPU overclocking. These options feature up to 24 cores in a new disaggregated architecture. Performance-cores, aka P-cores, take center stage with their high clock rates, while a cluster of Efficient-cores, aka E-cores, provide high-end multithreaded performance.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and HiFi audio products, introduces its lineup of Intel Z890 motherboards to the newly launched Intel Core Ultra 200 Series processors. The new Intel Z890 motherboards feature several technological improvement including 40 Gbps USB4 connectivity, Wi-Fi 7, and higher DDR5 memory support among others. Upon launch, COLORFUL presents seven Z890 motherboards designed to cater a wide range of users from casual desktop users to more demanding users such as gamers and content creators.

For high-end PC builders, COLORFUL introduces the iGame Z890 VULCAN X/W, iGame Z890 FLOW and iGame Z890 ULTRA motherboards. The iGame Z890 VULCAN X/W is the flagship motherboard, packed with premium features designed to deliver performance and aesthetics - available in black and white models. For mainstream users, the CVN Z890 ARK FROZEN, CVN Z890M GAMING FROZEN and BATTLE-AX Z890M-PLUS motherboard offer a great balance of features and latest technologies.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, today announced the launch of its revolutionary Z890 motherboards. These next-generation motherboards are set to redefine the standards in performance, AI integration, and user experience for enthusiasts and professionals alike. Powered by state-of-the-art artificial intelligence, these motherboards push the boundaries of what's possible in computing.⁠

Infinite Memory Performance
GIGABYTE Z890 lineup equips the D5 Bionic Corsa technology to create phenomenal new peaks in memory performance to DDR5 XMP 9500 and above. A true marvel of AI-enhanced overclocking technology for DDR5 memory, D5 Bionic Corsa boasts four key technologies from software, hardware to firmware side. The AORUS AI SNATCH and AI SNATCH Engine present AI-overclocking for ultimate performance, while AI-Driven PCB Design and HyperTune BIOS deliver AI-design for signal enhancement on motherboards. The AORUS AI SNATCH is an auto-overclocking software by AI model, and enables users to unleash utmost performance with one-click activation. The AI SNATCH Engine is the AI model served as the core of AORUS AI SNATCH software, trained by AI TOP on diverse overclocking datasets to improve precision and optimize performance with stability. The AI-Driven PCB Technology employs AI algorithms to optimize vias, routing and stackups, while the Hypertune BIOS uses AI to optimize MRC and adapt to signals for peak efficiency, significant memory clock boost, and enhanced overall performance.

With PC motherboard manufacturers implementing 40 Gbps USB4, one wonders what's next for the [mostly] universal connectivity standard. Turns out, it is USB4 2.0, which yields the connector 80 Gbps of data bandwidth per direction, and 60 W of power-delivery (PD). Power delivery for USB4 2.0 can be as high as 240 W (48 V, 5 A). Japanese PC peripherals maker Elecom is the first with certified cables for both 80 Gbps + 60 W PD and 80 Gbps + 240 W PD. Besides power and data, both cables support DisplayPort passthrough for up to 8K @ 60 Hz (7680 x 4320 pixels). USB-IF, the governing body of the USB standard, is expected to formally launch USB4 2.0 in December 2024. A typical USB4 2.0 host controller will require at least a PCI-Express 5.0 x4 system bus connection to reach the standard's maximum bandwidth.

AMD today made four key announcements for its Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture. These mainly aim to improve upon the products as originally launched in August. To begin with, AMD announced a 105 W cTDP (configurable TDP) mode for the Ryzen 7 9700X and Ryzen 7 9600X processors, with full warranty coverage. This setting can be enabled in the UEFI setup program of a motherboard running its latest version of UEFI firmware, which encapsulates the AGESA ComboAM5 PI 1.2.0.2 microcode. The setting raises the PPT (package power tracking) value of the 9700X and 9600X to 140 W, and treats them as if they were 105 W TDP processors. These chips were originally launched by AMD with 65 W (88 W PPT), and as reviewers quickly found out, unlocking power improves performance at stock clock speeds, as it improves boost frequency residence of these chips.

Next up, is the AGESA PI 1.2.0.2 microcode itself, which introduces the 105 W cTDP mode for the 9700X and 9600X along with warranty coverage, which we just talked about; plus works to improve the core-to-core latency on the Ryzen 9 9900X and Ryzen 9 9950X. These are processors with two CPU complex dies (CCDs), each with either 8 or 6 cores enabled. To the software, this is still a single-socket (1P) CPU with 12 or 16 cores. Although some awareness of the dual-CCD architecture is added to the OS scheduler to help it localize certain kinds of workloads (such as games) to a single CCD, reviewers noted that core-to-core latency on the dual-CCD chips was still too high, which should affect performance when a software's threads are migrating between cores, or if a workload is multithreaded, such as media encoding. AMD addressed exactly this with the new AGESA PI 1.2.0.2 update.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, unveils cutting-edge AMD X870E/X870 motherboards. Designed with AI accelerated performance boost, premium thermal management, next-generation memory optimization, intuitive DIY-friendly features, state-of-the-art BIOS technology, GIGABYTE X870E/X870 motherboards maximize the capabilities of the latest AMD Ryzen 9000 series processors and power the gaming performance for AI era.

AORUS AI SNATCH
GIGABYTE X870E/X870 lineup boasts the innovative AORUS AI SNATCH, which can unleash ultimate performance with simple one click. Powered by an AI engine, the memory and system performance can be boosted with improved multitasking and overall system responsiveness. Users can overclock like an expert in a snap through simple interface while enjoy smart and safe overclocking. The AI processing is accelerated as well for better performance with optimal power efficiency.

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, and gaming monitors, today announced a full line-up of flagship to mainstream motherboards using the AMD X870E/X870 series chipset, which is designed expressly for the latest AMD Ryzen 9000 series processors using AM5 socket. New motherboards include the flagship series X870E Taichi and Taichi Lite, newly introduced flagship Phantom Gaming X870E Nova WiFi, mainstream gaming X870 Riptide WiFi, plus the always popular X870 Steel Legend WiFi, X870 Pro RS and Pro RS WiFi, which are both now available in a white design.

All the new ASRock X870E/X870 motherboards, from the flagship Taichi series to the mainstream Steel Legend and Pro RS WiFi, feature a highly robust design for extreme performance. The Taichi series combines SPS Dr.MOS power delivery of up to 24+2+1 phases, server-grade 8-layer PCBs enabling excellent memory overclocking up to DDR5-8200, and exclusive low-ripple 1000μf 20K black capacitors that guarantee stable and superior performance for the CPU.

MSI unveils the X870E and X870 motherboards, designed to harness the full power of AMD's Ryzen 9000 Series desktop processors. The lineup includes four models: MEG X870E GODLIKE, MPG X870E CARBON WIFI, MAG X870 TOMAHAWK WIFI, and PRO X870-P WIFI. These motherboards deliver exceptional value and performance with cutting-edge features and exclusive MSI innovations. Offering top components, innovative features, and easy DIY options, MSI's X870E and X870 motherboards make building and using your PC seamless.

Introducing MSI's Ultra Connect feature in the X870E and X870 motherboards, offering next-gen networking, storage, and expansion. With built-in 5G LAN and Wi-Fi 7, users can enjoy lightning-fast speeds, reaching up to 5.8 Gbps. As well as TriLink Connectivity, Expansion is made to future-proof with PCIe Gen 5.0 for next-gen graphics cards and SSDs. The USB4 ports, which are Thunderbolt compatible, enable fast data transfers and support a wide range of next-gen devices, including display output through USB-C.

Other World Computing (OWC), a trusted leader in delivering high-performance, secure, and sustainable technology solutions that enhance and extend the life of Macs and PCs, today announced the launch of the Envoy Ultra Thunderbolt 5 SSD - ready for pre-order today (shipping in October). Designed to maximize the performance of Mac and PC devices with Thunderbolt 5, Thunderbolt 4 Thunderbolt 3, and USB4, this groundbreaking SSD sets a new benchmark with revolutionary speeds exceeding 6000 MB/s—making it up to twice as fast as Thunderbolt 4 and USB4.

"Intel's innovative Thunderbolt 5 technology sets a new standard for performance and simple connectivity, and OWC's Envoy Ultra SSD is a perfect example of how this technology can be harnessed to meet the needs of today's most demanding users," said Larry O'Connor, Founder and CEO, Other World Computing (OWC). "OWC continues to push the boundaries of what's possible, delivering a solution that not only leverages the full potential of Thunderbolt 5 but also opens up new possibilities for professionals and creatives alike."

Parade Technologies, a leading supplier of high-speed interface, video display, and touch controller ICs, proudly introduces the PS9010 USB4 dock controller as the newest member of Parade's USB4 product family. Designed to meet the rising demand for high-speed, multi-protocol connectivity, the PS9010 sets a new standard for USB4 peripheral controllers, offering unprecedented performance, versatility, and power efficiency.

The PS9010 is built to optimize the user experience in modern computing environments where high-bandwidth data transfers and display connections are critical. The chip seamlessly integrates support for USB4, Thunderbolt 3, DisplayPort 2.1, and SuperSpeed USB, ensuring compatibility with a wide range of devices and peripherals.

Acer today announced its entry into the handheld gaming space with the launch of the new Acer Nitro Blaze 7 (GN771). The device combines cutting-edge technology and a compact design to always bring next-level gaming and entertainment within reach. Acer's first-generation handheld AI gaming PC features an AMD Ryzen 7 8840HS processor, with Ryzen AI that optimizes performance and responsiveness across a wide range of games and applications.

The design allows users to easily slip the device into their bags or pockets for instant playing time on the go. It features a 7-inch Full HD (FHD) IPS display with a touch interface, plus AMD FreeSync Premium technology, and a blazing-fast 144 Hz refresh rate. This allows players to experience enhanced visuals and responsive controls while playing their favorite AAA titles. The system runs on Windows 11 and features the new Acer Game Space application which supports the addition of games from multiple platforms.

GIGABYTE just released its second AMD 800-series chipset motherboard following last week's debut of the X870E AORUS Master, the more affordable X870 AORUS Elite WIFI7. This board is based on the slightly more affordable AMD X870 (non-E) chipset, which offers connectivity nearly identical to that of the previous-generation AMD B650E, but with the addition of USB4. The board is built in the ATX form-factor, and features a 6-layer PCB. It draws power from a combination of 24-pin ATX and two 8-pin EPS power connectors. The CPU VRM solution consists of a 16+2+2 phase setup, with the vCore side of it being 8-phase with phase doubling. The Socket AM5 is wired to four DDR5 DIMM slots for up to 256 GB of memory.

Expansion slots include a PCI-Express 5.0 x16 wired to the CPU, a PCI-Express 4.0 x16 (electrical Gen 4 x4), and a third PCI-Express 3.0 x16 (electrical Gen 3 x2). The main Gen 5 x16 PEG slot gets a quick-release lever. You press a button, and it ejects the graphics card. Storage connectivity includes three M.2 Gen 5 x4 slots, two of these are wired to the CPU's dedicated Gen 5 x4 NVMe lanes, while the third slot subtracts 8 lanes from the Gen 5 x16 PEG slot. There is a fourth M.2 slot, which is Gen 4 x4, and wired to the X870 FCH. All four slots get heatsinks. Four SATA 6 Gbps ports make for the rest of the storage connectivity.

Leading global motherboard manufacturer, ASRock has announced that its W790 series workstation motherboards, including the W790 WS and W790 WS R2.0, now support the newly released Intel Xeon W-3500 series and Xeon W-2500 series processors. This enables consumers to experience the superior performance of the latest Intel Xeon series processors.

The ASRock W790 WS series workstation motherboards feature up to 2 TB DDR5 ECC RDIMM support, PCI-Express 5.0 expansion slots, USB4/Thunderbolt 4 and Dual 10 Gbps Ethernet. A flagship-class 14-layer PCB and 20+2 phase CPU VRM ensures ultimate performance and superb reliability, even when subjected to the most demanding sustained workloads.

ASMedia announced that its USB4 host controller chip, ASM4242, has received Thunderbolt 4 certification, following its USB-IF certification earlier this year. This marks a significant milestone for the ASM4242, toward providing a comprehensive high-speed transmission solution and an outstanding user experience. The Thunderbolt 4 certification signifies that ASM4242 meets Thunderbolt's stringent standards in signal quality, compatibility, and reliability, ensuring exceptional connection stability and compatibility.

Thunderbolt 4 is fully compatible with USB4, integrating power, data transmission, and video display into a single interface, offering up to 40 Gbps bandwidth to meet the demands of high-speed file transfer, 100 W fast charging, and multi-display setups. A single cable can daisy-chain up to 5 devices, driving high-bandwidth data, power, and video transmission. Gamers, creators, and professionals can connect multiple displays and accessories through this powerful connection standard. They can also enjoy a clean and convenient workspace.

GIGABYTE today debuted its AMD 800-series motherboards with the launch of the premium X870E AORUS Master. This will go on to be the company's second most premium product on this chipset, as the company is also planning the X870E AORUS Xtreme. The AORUS Master is still packed to the gills with everything this chipset has to offer, along with high-end onboard devices. The board is built in the ATX form-factor, and draws power from a combination of 24-pin ATX and two 8-pin EPS power connectors. It offers a 16+2+2 phase digital VRM featuring 110 A power stages. The board is laid out on a premium 8-layer PCB. You get tall extruded aluminium heatsinks for the CPU VRM, and the topmost M.2 NVMe Gen 5 slot.

The AMD Socket AM5 is wired to four DDR5 DIMM slots that support up to 192 GB of dual-channel DDR5, at speeds of over DDR5-8000. It also puts out no less than three M.2 NVMe Gen 5 slots. Two of these are wired to the dedicated x4 interfaces from the AMD "Raphael" or "Granite Ridge" processor, while one of them subtracts 4 lanes from the board's PCI-Express 5.0 x16 PEG slot. The board's fourth M.2 NVMe slot is Gen 4, and wired to the chipset. The only other expansion slots are a couple of PCI-Express 4.0 x16 (electrical Gen 4 x1). Besides the M.2 slots, you get four SATA 6 Gbps ports completing the board's storage connectivity.

AMD has reportedly pushed the launch of mid-tier models from its AMD 800-series chipset to early 2025, reports ComputerBase.de. With the Ryzen 9000-series "Zen 5" processors already launched earlier this month, and compatible with existing AMD 600-series chipset motherboards with a BIOS update, motherboard vendors are leisurely announcing their motherboards based on the AMD X870E and AMD X870 chipsets. Motherboards based on both offer drop-in compatibility with Ryzen 9000-series processors, and introduce new connectivity features such as 40 Gbps USB4 and Wi-Fi 7.

The company probably wants the two to have some time in the Sun before they're joined by the more affordable B850, which gamers could be drawn to. The AMD B850 has mostly identical platform I/O to the AMD X870, except Gen 5 support for the PCI-Express x16 slot is optional (motherboard vendors can choose to wire this out as Gen 4). The 40 Gbps USB4 is also optional here. You still get CPU overclocking support. The B840 is an entry-level chipset that's being launched to probably phase out the A620 and A620A, since it features similar I/O features to the A620A, but will probably come with drop-in compatibility for 65 W Socket AM5 processors. A deferred launch of the mid-tier chipset isn't too off character for AMD. It launched its popular B450 and B550 chipsets several months after the X470 and X570, respectively.

ZOTAC GAMING proudly announces the much-anticipated premium gaming handheld, the ZOTAC GAMING ZONE, is ready to begin accepting preorders in select regions and e-tailer platforms. The ZONE, which emphasizes premium hardware and elite controls, was announced COMPUTEX 2024 with great anticipation. Visitors arriving at GAMESCOM 2024, one of the largest video game trade fairs held annually in Cologne, Germany, will be the first to experience the thrills of gaming on the ZONE. The ZOTAC GAMING ZONE is the first handheld gaming PC on the market to incorporate premium hardware and elite control features that players will not find on other handheld PCs, offering gamers more immersion and advantages in PC games like non-other.

The ZOTAC GAMING ZONE is powered by AMD's Ryzen 7 8840U, an efficient powerhouse with bleeding edge Zen 4 architecture and RDNA 3 graphics that enables even AAA gaming at native 1080p resolution. Along with the 16 GB of LPDDR5X-7500 Memory on board, the ZONE makes the full spectrum of experiences that PC gaming can offer through stunning visuals and performance, and take advantage of AMD's driver-level Fluid Motion Frames (FMF) and FidelityFX Super Resolution technology to enhance gameplay performance and immersion further. Also featured are a full-sized 2280 512 GB M.2 NVMe PCIe 4.0 x4 SSD and a UHS-II microSD card reader to cover every gamer's storage needs.

Cable Matters, a leader in developing cutting-edge connectivity solutions, introduces a USB4 20 Gbps Switch, meeting the diverse needs of today's dynamic remote workforce. This versatile, powerful device seamlessly blends performance, adaptability, and cost efficiency, offering users an unparalleled connectivity solution.

"The vision of this product grew from the needs of today's remote workforce," says Jeff Jiang, CEO of Cable Matters. "People are doing more than ever with multiple devices and require connectivity solutions that provide performance and flexibility at an affordable price." Unlike traditional switches, the USB4 20 Gbps Switch is engineered to handle two USB-C, USB4 or Thunderbolt enabled devices concurrently, effortlessly scaling to match the demands of gadget-intensive users. Users can instantly share a USB-C, USB4 or Thunderbolt monitor or docking station between two devices, and easily switch between them using either the unit's button or the included remote control.

Minisforum today announced the G7 Ti Powerhouse, a Versatile mini-PC that offers AI-enhance creativity and raw power. Featuring Intel Core i9-14900HX or i7-14650HX processors and NVIDIA GeForce RTX 4070 graphics, Minisforum G7 Ti delivers unparalleled performance for AI-based workloads. The powerhouse mini-PC solution is optimized for AI features, powered by up to an Intel Core i9-14900HX CPU, and NVIDIA GeForce RTX 4070 Graphics. Minisforum G7 Ti offers avid gamers an unmatched experience and endless possibilities for creators.

Utilized the 14th Gen Intel Core i9-14900HX and i7-14650HX Processor, the AI-enabled CPU delivers 24 cores and 32 threads with 36 MB L3 high-speed cache, that rates the single-core turbo frequency up to 5.8 GHz and max performance at 90 W. The beast CPU helps AI applications, achieving 20% higher performance in the Cinebench R23 test versus previous-generation processors, making Minisforum G7 Ti capable of handling AAA games, video rendering, 3D design, and AI projects.

ORICO, an industry-leading brand in data storage solutions, is proud to announce the launch of Data Matrix. It's the world's first hybrid storage for revolutionizing instant post-production workflow. With its sleek, Apple-inspired design, it is set to attract content creators, filmmakers and professionals alike, who require high-performance storage solutions to manage 4K/8K content efficiently. Traditional storage solutions often suffer from frequent downtime, slow speeds, and limited space, failing to meet the urgent needs of modern content creators. In cooperation with West Digital (WD), ORICO has designed the Data Matrix to provide a one-stop, cost-efficient production service that balances high speed, large capacity, and strong flexibility. Also, address the concerns about high investment in every 256 GB upgrade for Mac users.

CFexpress Type-B slot delivers an impressive 1500 MB/s import speed during pre-production, reducing the Mac import time by 95%. The 312 MB/s SD V4.0 card reader supports UHS-II 4K video capture. After filming, Digital Imaging Technicians (DIT) can import the camera source files into Data Matrix, transcode videos, save and start 8K 3D video editing instantly. On-site personnel can immediately output the footage from the Data Matrix to a large screen via HDMI (8K @ 30 Hz) for detailed viewing and confirmation, resulting in clearer image quality. The team can also perform initial edits on-site using Thunderbolt 4/3/USB4 significantly reducing the post-production team's workload.To back the project, visit the Kickstarter page.

The first die shot of AMD's new 4 nm "Strix Point" mobile processor surfaced, thanks to an enthusiast on Chinese social media. "Strix Point" is a significantly larger die than "Phoenix." It measures 12.06 mm x 18.71 mm (L x W), compared to the 9.06 mm x 15.01 mm of "Phoenix." Much of this die size increase comes from the larger CPU, iGPU, and NPU. The process has been improved from TSMC N4 on "Phoenix" and its derivative "Hawk Point," to the newer TSMC N4P node.

Nemez (GPUsAreMagic) annotated the die shot in great detail. The CPU now has 12 cores spread across two CCX, one of which contains four "Zen 5" cores sharing a 16 MB L3 cache; and the other with eight "Zen 5c" cores sharing an 8 MB L3 cache. The two CCXs connect to the rest of the chip over Infinity Fabric. The rather large iGPU takes up the central region of the die. It is based on the RDNA 3.5 graphics architecture, and features 8 workgroup processors (WGPs), or 16 compute units (CU) worth 1,024 stream processors. Other key components include four render backends worth 16 ROPs, and control logic. The GPU has its own 2 MB of L2 cache that cushions transfers to the Infinity Fabric.

Since its reveal last week, we got a slightly more technical deep-dive from AMD on its two upcoming processors—the "Strix Point" silicon powering its Ryzen AI 300 series mobile processors; and the "Granite Ridge" chiplet MCM powering its Ryzen 9000 desktop processors. We present a closer look into the "Strix Point" SoC in this article. It turns out that "Strix Point" takes a significantly different approach to heterogeneous multicore than "Phoenix 2." AMD gave us a close look at how this works. AMD built the "Strix Point" monolithic silicon on the TSMC N4P foundry node, with a die-area of around 232 mm².

The "Strix Point" silicon sees the company's Infinity Fabric interconnect as its omnipresent ether. This is a point-to-point interconnect, unlike the ringbus on some Intel processors. The main compute machinery on the "Strix Point" SoC are its two CPU compute complexes (CCX), each with a 32b (read)/16b (write) per cycle data-path to the fabric. The concept of CCX makes a comeback with "Strix Point" after nearly two generations of "Zen." The first CCX contains the chip's four full-sized "Zen 5" CPU cores, which share a 16 MB L3 cache among themselves. The second CCX contains the chip's eight "Zen 5c" cores that share a smaller 8 MB L3 cache. Each of the 12 cores has a 1 MB dedicated L2 cache.