Tuesday, September 23rd 2008
![Intel](https://tpucdn.com/images/news/intel-v1723816949774.png)
Core i7 965 XE Unboxed, Stock Cooler and Processor Exposed
Intel would be rolling out an elite fleet of desktop processors based on the new Nehalem architecture soon. The first derivative, the Bloomfield core, is supposed to be the architecture's flagship for the desktop PC market. And for it, Core i7 Extreme 965 is supposed to be the leading processor. Priced at US $999, the processor is clocked at 3.20 GHz and features four cores and eight logical processors thanks to HyperThreading Technology (encore). Details of it are covered here.
Mobile01, unboxed the i7 965 before launch. The contents show a massive stock cooler and the processor itself. The stock cooler is composed of the same fins projecting radially, just that they are much thinner, and more in number (to boost surface area of dissipation). The cooler uses 50% of fins made of copper and the rest 50% made of aluminum. The large CPU contact base is made of copper and pre-applied TIM. The box pictured is the "white-box" part, expect the retail box to be of that exact size.
Source:
Mobile01
Mobile01, unboxed the i7 965 before launch. The contents show a massive stock cooler and the processor itself. The stock cooler is composed of the same fins projecting radially, just that they are much thinner, and more in number (to boost surface area of dissipation). The cooler uses 50% of fins made of copper and the rest 50% made of aluminum. The large CPU contact base is made of copper and pre-applied TIM. The box pictured is the "white-box" part, expect the retail box to be of that exact size.
74 Comments on Core i7 965 XE Unboxed, Stock Cooler and Processor Exposed
P.S. Take a look at just about any Zalman CPU cooler that uses the "spilt airflow" as part of the cooling... why their fins extend around the fan.
BUT THEY HAVE PUSHPINS!! :mad::shadedshu
I vote this is the worst fan design ever; the only way it could be worse is if they used all aluminium fins...
Does the larger cooler mean higher TDPs?
keep in mind that 90% of buyers use the box cooler anyway which support a small oc also and the rest will buy aftermarket cooler anyway
compared with older intel box cooler is a improvement for sure
AnandTech tested the Intel QuickPath Interconnect (4.8 GT/s version) and found the copy bandwidth using triple-channel 1066 MHz DDR3 was 12.0 GB/s. A 3.0 GHz Core 2 Quad system using dual-channel 1066 MHz DDR3 achieved 6.9 GB/s.[14]
Other than that, looks yummy.
Are you stupid? It's a big FAKE. Look out for the "INTEL CONFIDENTIAL" note on the processor! It's just az Engineering Sample.