Friday, February 24th 2006
AMD Socket F up close
DailyTech has some nice screenshots on the upcoming Opteron socket F. It will have 1207 pins, and is an LGA type socket. The socket will be able to handle dual and future quad core CPUs, but we know all that already. Here are the pictures of the socket, taken from a Foxconn mainboard:
Source:
DailyTech
6 Comments on AMD Socket F up close
on the other hand, first gen intel 775 boards had alot of problems regarding the pins, since its harder to protect the pins while shipping and moving a board then a processor which would be in a plastic casing or fixed in a tray,
also in my opinion a processor is better held in place and its harder to bend the pins when theres a corresponding hole to every pin, in LGA, the pins on the motherboard touch against a metal pad on the processor, the pins are exposed from the sides, which can probobly be solved by adding a grid with holes to the processor (hope some intel or AMD engnieers are reading), or some lego styled thick pins that plug on the side to keep the processor stedy in place, or if the motherboard is perpendicular to the floor to keep the processor from falling off when you unlock the retention mechanism,
btw, im wondering about that poker dealer visor style retention mechanism, does it affect the seating of the heatsink against the core ?
so basicly, since its cheaper to replace a board then the processor, they took the most fragile part of the processor and put it on the board, which is the pins,
basicly invert the socket, more pins, more probability of bending or damaging one, better to have them sit stedy on the board insted of having to aim them in to holes, especialy if it had 1200 pins,
old socket, pins on the processors go in to holes in the socket, below each hole is a contact surface,
before that, when there were less pines, the socket would just have holes in it, and each hole would have 2 metal plates on the sides to press on the pin and complete the contact,
and before that, the pins on the chip would just go trough empty solder points on the PCB,
evolution, when you cant improve something further, just turn it around and say its new :)
i suspect that the next evolution would be removing the pins and using direct contact,
as if it was a layed PCB, having a thin insulated layer with cuts where interaction between layers is required,