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Intel Celeron 667

1
Cores
1
Threads
30 W
TDP
667 MHz
Frequency
N/A
Boost
Timna
Codename
Socket 370S
Socket
Front
Katmai500 @ VOGONS
Front
Back
Katmai500 @ VOGONS
Back
Intel Socket 370S
Intel Socket 370S
The Intel Celeron 667 was a desktop processor with 1 core, that was never released. It is part of the Celeron lineup, using the Timna architecture with Socket 370S. Celeron 667 has 128 KB of L2 cache and operates at 667 MHz. Intel is making the Celeron 667 on a 180 nm production node, the transistor count is unknown. The multiplier is locked on Celeron 667, which limits its overclocking potential.
With a TDP of 30 W, the Celeron 667 consumes only little energy. The highest officially supported memory speed is 400 MT/s, but with overclocking (and the right memory modules) you can go even higher. Actual memory technology support depends on the chosen motherboard, the processor itself supports multiple memory types, but most motherboards have only one kind of slot. For communication with other components in the computer, Celeron 667 uses a PCI-Express N/A connection. This processor features the Intel i752 integrated graphics solution.
Many games will refuse to start on this processor due to the lack of the SSE2/SSE3/SSE4 instruction set.

Physical

Socket: Intel Socket 370S
Foundry: Intel
Process Size: 180 nm
Die Size: 129 mm²
Package: FC-PGA

Processor

Market: Desktop
Production Status: End-of-life
Release Date: Never Released
Part#: QV18
Bundled Cooler: None

Performance

Frequency: 667 MHz
Turbo Clock: N/A
Base Clock: 133 MHz
Multiplier: 5.0x
Multiplier Unlocked: No
Voltage: 1.65 V
TDP: 30 W

Architecture

Codename: Timna
Generation: Celeron
(Timna)
Memory Support: unknown
Depends on motherboard
Rated Speed: 400 MT/s
Memory Bus: Single-channel
ECC Memory: No
PCI-Express: N/A

Core Config

# of Cores: 1
# of Threads: 1
SMP # CPUs: 1
Integrated Graphics: Intel i752

Cache

Cache L1: 32 KB
Cache L2: 128 KB

Features

  • MMX
  • SSE
  • IMC
  • IGP

Notes

"Timna" was cancelled in 2000 but engineering samples were produced and distributed in small quantities along with sample platforms featuring both RDRAM and SDRAM variants.

The processor die featured a sophisticated integration of a RDRAM memory controller and i752 graphics core as a means to decrease board complexity and cost. SDRAM boards were possible with the use of the Intel MTH translator chip which incurred a large performance penalty but further decreased cost at the time.
Nov 12th, 2024 16:17 EST change timezone

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