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AMD EPYC 7352

24
Cores
48
Threads
155 W
TDP
2.4 GHz
Frequency
3.3 GHz
Boost
Rome
Codename
Socket SP3
Socket
Connectivity
Connectivity
AMD Socket SP3
AMD Socket SP3
The AMD EPYC 7352 is a server/workstation processor with 24 cores, launched in August 2019. It is part of the EPYC lineup, using the Zen 2 (Rome) architecture with Socket SP3. Thanks to AMD Simultaneous Multithreading (SMT) the core-count is effectively doubled, to 48 threads. To further increase overall system performance, up to two EPYC 7352 CPUs can link up in a multi-processor (SMP) configuration. EPYC 7352 has 128 MB of L3 cache and operates at 2.4 GHz by default, but can boost up to 3.3 GHz, depending on the workload. AMD is building the EPYC 7352 on a 7 nm production process using 3,800 million transistors. The silicon die of the chip is not fabricated at AMD, but at the foundry of TSMC. The multiplier is locked on EPYC 7352, which limits its overclocking capabilities.
With a TDP of 155 W, the EPYC 7352 is extremely power hungry, which means you need top-notch cooling. AMD's processor supports DDR4 memory with an eight-channel interface. The highest officially supported memory speed is 3200 MT/s, but with overclocking (and the right memory modules) you can go even higher. ECC memory is supported, too, which is an important capability for mission-critical systems, to avoid data corruption. For communication with other components in the computer, EPYC 7352 uses a PCI-Express Gen 4 connection. This processor lacks integrated graphics, you might need a graphics card.
Hardware virtualization is available on the EPYC 7352, which greatly improves virtual machine performance. Additionally, IOMMU virtualization (PCI passthrough) is supported, so that guest virtual machines may directly use host hardware. Programs using Advanced Vector Extensions (AVX) will run on this processor, boosting performance for calculation-heavy applications. Besides AVX, AMD is including the newer AVX2 standard, too, but not AVX-512.

Physical

Socket: AMD Socket SP3
Foundry: TSMC
Process Size: 7 nm
Transistors: 3,800 million
Die Size: 74 mm²
Package: FCLGA-4094

Processor

Market: Server/Workstation
Production Status: Active
Release Date: Aug 7th, 2019
Part#: 100-000000077

Performance

Frequency: 2.4 GHz
Turbo Clock: up to 3.3 GHz
Base Clock: 100 MHz
Multiplier: 24.0x
Multiplier Unlocked: No
TDP: 155 W

Architecture

Codename: Rome
Generation: EPYC
(Zen 2 (Rome))
Memory Support: DDR4
Rated Speed: 3200 MT/s
Memory Bus: Eight-channel
ECC Memory: Yes
PCI-Express: Gen 4

Core Config

# of Cores: 24
# of Threads: 48
SMP # CPUs: 2
Integrated Graphics: N/A

Cache

Cache L1: 96 KB (per core)
Cache L2: 512 KB (per core)
Cache L3: 128 MB (shared)

Features

  • MMX
  • EMMX
  • SSE
  • SSE2
  • SSE3
  • SSSE3
  • SSE4.1
  • SSE4.2
  • SSE4A
  • AVX
  • AVX2
  • ABM
  • BMI1
  • BMI2
  • FMA3
  • AES
  • RdRand
  • SHA
  • ADX
  • CLMUL
  • F16C
  • Real
  • Protected
  • SMM
  • FPU
  • NX bit
  • SMT
  • AMD-Vi
  • AMD-V
  • SME
  • TSME
  • SEV
  • SenseMi
  • Boost 2
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