The AMD Ryzen AI 9 HX PRO 375 is a mobile processor with 12 cores, launched in January 2025. It is part of the Ryzen AI 9 lineup, using the Zen 5 (Strix Point) architecture with Socket FP8. Thanks to AMD Simultaneous Multithreading (SMT) the core-count is effectively doubled, to 24 threads. Ryzen AI 9 HX PRO 375 has 16 MB of L3 cache and operates at 2000 MHz by default, but can boost up to 5.1 GHz, depending on the workload. AMD is building the Ryzen AI 9 HX PRO 375 on a 4 nm production process, the transistor count is unknown. The silicon die of the chip is not fabricated at AMD, but at the foundry of TSMC. The multiplier is locked on Ryzen AI 9 HX PRO 375, which limits its overclocking capabilities.
With a TDP of 28 W, the Ryzen AI 9 HX PRO 375 consumes only little energy. AMD's processor supports DDR5 memory with a dual-channel interface. The highest officially supported memory speed is 5600 MT/s, but with overclocking (and the right memory modules) you can go even higher. For communication with other components in the machine, Ryzen AI 9 HX PRO 375 uses a PCI-Express Gen 4 connection. This processor features the Radeon 890M integrated graphics solution.
Hardware virtualization is available on the Ryzen AI 9 HX PRO 375, which greatly improves virtual machine performance. Additionally, IOMMU virtualization (PCI passthrough) is supported, so that guest virtual machines may directly use host hardware. Programs using Advanced Vector Extensions (AVX) will run on this processor, boosting performance for calculation-heavy applications. Besides AVX, AMD has added support for the newer AVX2 and AVX-512 instructions, too.