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AMD Ryzen AI Max PRO 385

8
Cores
16
Threads
55 W
TDP
3.6 GHz
Frequency
5 GHz
Boost
Strix Halo
Codename
Socket FP11
Socket
Front
Front
AMD Socket FP11
AMD Socket FP11
The AMD Ryzen AI Max PRO 385 is a mobile processor with 8 cores, launched in January 2025. It is part of the Ryzen AI Max lineup, using the Zen 5 (Strix Halo) architecture with Socket FP11. Thanks to AMD Simultaneous Multithreading (SMT) the core-count is effectively doubled, to 16 threads. Ryzen AI Max PRO 385 has 32 MB of L3 cache and operates at 3.6 GHz by default, but can boost up to 5 GHz, depending on the workload. AMD is making the Ryzen AI Max PRO 385 on a 4 nm production node, the transistor count is unknown. The silicon die of the chip is not fabricated at AMD, but at the foundry of TSMC. The multiplier is locked on Ryzen AI Max PRO 385, which limits its overclocking potential.
With a TDP of 55 W, the Ryzen AI Max PRO 385 consumes typical power levels for a modern PC. ECC memory is supported, too, which is an important capability for mission-critical systems, to avoid data corruption. For communication with other components in the system, Ryzen AI Max PRO 385 uses a PCI-Express Gen 4 connection. This processor features the Radeon 8050S integrated graphics solution.
Hardware virtualization is available on the Ryzen AI Max PRO 385, which greatly improves virtual machine performance. Additionally, IOMMU virtualization (PCI passthrough) is supported, so that guest virtual machines may directly use host hardware. Programs using Advanced Vector Extensions (AVX) can run on this processor, boosting performance for calculation-heavy applications. Besides AVX, AMD has added support for the newer AVX2 and AVX-512 instructions, too.

Physical

Socket: AMD Socket FP11
Foundry: TSMC
Process Size: 4 nm
Package: FC-BGA
tJMax: 100°C

Processor

Market: Mobile
Production Status: Active
Release Date: Jan 6th, 2025
Part#: 100-000001422

Performance

Frequency: 3.6 GHz
Turbo Clock: up to 5 GHz
Base Clock: 100 MHz
Multiplier: 36.0x
Multiplier Unlocked: No
XDNA NPU:50 TOPS
TDP: 55 W
Configurable TDP:45-120 W

Architecture

Codename: Strix Halo
Generation: Ryzen AI Max
(Zen 5 (Strix Halo))
Memory Support: unknown
Packaged Memory:LPDDR5x
LPDDR5x Speed:8000 MT/s
Memory Bus: Quad-channel
Memory Capacity:128 GB
ECC Memory: Yes
PCI-Express: Gen 4, 16 Lanes
(CPU only)

Core Config

# of Cores: 8
# of Threads: 16
SMP # CPUs: 1
Integrated Graphics: Radeon 8050S

Cache

Cache L1: 80 KB (per core)
Cache L2: 1 MB (per core)
Cache L3: 32 MB (shared)

Features

  • MMX
  • SSE
  • SSE2
  • SSE3
  • SSSE3
  • SSE4A
  • SSE4.1
  • SSE4.2
  • AES-NI
  • AVX
  • AVX2
  • AVX-512
  • BMI1
  • BMI2
  • SHA
  • F16C
  • FMA3
  • AMD64
  • EVP
  • VBS
  • DASH
  • AMD-V
  • AMD-V SVM
  • AMD-V RVI
  • AMD AVIC
  • AMD-Vi
  • SLAT
  • SMAP
  • SMEP
  • SMT
  • GMET
  • NX Bit
  • Windows Secured-Core
  • AMD Secure Processor
  • Precision Boost 2

Notes

Radeon graphics dynamic frequency: 2800MHz

Int8 TOPS rated at up to 106 TOPS combining CPU cores, GPU cores, and NPU.
Jan 8th, 2025 15:00 EST change timezone

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