Acer today announced two new gaming routers, leveraging the power of the Qualcomm Immersive Home Platform and tri-band Wi-Fi 7 for stable connections and enhanced wireless gameplay. The Predator Connect X7 5G CPE unleashes blazing-fast internet speeds through 5G and Wi-Fi 7, along with dual WAN connectivity to minimize disruptions. Fast, reliable, and vast network coverage is provided by the Predator Connect T7 Wi-Fi 7 Mesh Router with the expandability of its multi-link Wi-Fi mesh system, making wired-level latency possible in a mesh setup.

Powered by Qualcomm Technologies' advanced quad-core processor, the X7 and T7 provide gamers and streamers with accelerated online experiences, improved Spectrum Utilization with Wi-Fi 7, as well as enhanced MU-MIMO and OFDMA across connected devices.

Marvell Technology, a leader in data infrastructure semiconductor solutions, is enabling networking equipment and firewall manufacturers achieve breakthrough levels of performance and efficiency with two new OCTEON 10 data processing units (DPUs), the OCTEON 10 CN102 and OCTEON 10 CN103. The 5 nm OCTEON CN102 and CN103, broadly available to OEMs for product design and pilot production, are optimized for data and control plane applications in routers, firewalls, 5G small cells, SD-WAN appliances, and control plane applications in top-of-rack switches and line card controllers. Several of the world's largest networking equipment manufacturers have already incorporated the OCTEON 10 CN102 into a number of product designs.

Containing up to eight Arm Neoverse N2 cores, OCTEON 10 CN102 and CN103 deliver 3x the performance of Marvell current DPU solutions for devices while reducing power consumption by 50% to 25 W. Achieving SPEC CPU (2017) integer rate (SPECint) scores of 36.5, OCTEON 10 CN102 and CN103 are able to deliver nearly 1.5 SPECint points per Watt. The chips can serve as an offload DPU for host processors or as the primary processor in devices; advanced performance per watt also enables OEMs to design fanless systems to simplify systems and further reduce cost, maintenance and power consumption.

Ericsson, a massive player in networking and cellular technology, has announced their new lineup of RAN Compute (Radio Access Network) processors as well as new high bandwidth routers built around in-house silicon designs fabbed on Intel 4, beating Intel's own Meteor Lake processors to market. These new processors are not something the average person is going to be using in their PCs or home routers, but they are pivotal in the reliability and speed of current and future generation 5G networking as the devices they power handle the ever increasing traffic and bandwidth demands of modern networks. In its press release Ericsson notes that the new RAN Processor 6672 and Radio Processor 6372 offer four times more capacity at twice the efficiency compared to their previous generation. They claim that the power draw of their new processors on Intel 4 is between 30% and 60% lower than the industry benchmarks.

Ericsson signed on as one of Intel's largest customers when Intel announced their "Intel Foundry Services" initiative under the IDM 2.0 strategy to offer chip designers the ability to fab their processors at Intel fabs. The strategy has - at least outwardly - appeared to be a boon to Intel as they've signed on large partnerships ranging from big budget defense contractors to datacenter clientele and even ARM. The new RAN Compute systems from Ericsson packed full of technology built on "Intel 4" even ahead of Intel's own designs exemplifies that Intel is at the very least committed to the strategy, and Ericsson has already announced plans for even more chips on Intel's "18A" process slated for 2025.

Qualcomm Technologies, Inc. today announced the Snapdragon 7 Gen 3 Mobile Platform to amplify immersive experiences and bring premium performance to consumers' everyday life. The upgraded platform delivers across-the-board advancements to ignite on-device AI, fan-favorite mobile gaming, a creativity-charged camera and powerful 5G connectivity. The new platform is fully equipped to enable exciting new use-cases including up to 2.63 GHz peak CPU speeds, over 50% faster GPU performance, and 60% improved AI performance per watt while still delivering incredible power efficiency.

"Intelligently designed to balance performance and power efficiency, the Snapdragon 7 Gen 3 Mobile Platform delivers a selection of premium experiences that are brand new to the Snapdragon 7-series," said Christopher Patrick, senior vice president and general manager of mobile handsets, Qualcomm Technologies, Inc. "By working closely with our OEM partners, we're able to help make the next generation of in-demand features, such as enhanced AI and extraordinary camera capabilities, more widely accessible to consumers." Snapdragon 7 Gen 3 will first be adopted by key OEMs including HONOR and vivo with the first device expected to be announced this month.

MediaTek today announced the Dimensity 9300, its newest flagship mobile chip with a one-of-a-kind All Big Core design. The unique configuration combines extreme performance with MediaTek's industry-leading power efficiency to deliver unmatched user experiences in gaming, video capture and on-device generative AI processing.

"The Dimensity 9300 is MediaTek's most powerful flagship chip yet, bringing a huge boost in raw computing power to flagship smartphones with our groundbreaking All Big Core design," said Joe Chen, President at MediaTek. "This unique architecture, combined with our upgraded on-chip AI Processing Unit, will usher in a new era of generative AI applications as developers push the limits with edge AI and hybrid AI computing capabilities."

Professionals working in harsh environments require not only rugged durability but portable solutions that don't weigh them down in the field. Dell Technologies' new Rugged product achieves this combination. In fact, it is the world's lightest 10-inch fully rugged Windows tablet. Featuring a robust ecosystem of accessories and hot-swappable batteries for extended performance, the 7030 Rugged Extreme Tablet was designed for workers who spend most of their time away from a desk. So, whether you're on the factory line, in a machine shop or atop a snowy mountain, the 7030 Rugged Extreme Tablet will make for the ultimate companion.

Dell's Most Portable Fully Rugged Tablet
Marrying durability and mobility, the 7030 Rugged Extreme Tablet is Dell's most portable fully rugged tablet. Its lightweight 2.2-pound chassis and convenient accessories mean the tablet won't feel unwieldy, so your muscles get relief during a long shift on the warehouse floor, at the scene of an accident or when navigating construction sites.

Samsung Electronics today announced a new collaboration with AMD to advance 5G virtualized RAN (vRAN) for network transformation. This collaboration represents Samsung's ongoing commitment to enriching vRAN and Open RAN ecosystems to help operators build and modernize mobile networks with unmatched flexibility and optimized performance. The two companies have completed several rounds of tests at Samsung's lab to verify high-capacity and telco-grade performance using FDD bands and TDD Massive MIMO wide-bands, while significantly reducing power consumption. In this joint collaboration, Samsung used its versatile vRAN software integrated with the new AMD EPYC 8004 processors, focused on telco and intelligent edge. During technical verification, the EPYC 8004 processors combined with Samsung's vRAN solutions delivered optimized cell capacity per server as well as high power efficiency.

"This technical collaboration demonstrates Samsung's commitment to delivering network flexibility and high performance for service providers by building a larger vRAN and Open RAN ecosystem," said Henrik Jansson, Vice President and Head of SI Business Group, Networks Business at Samsung Electronics. "Samsung has been at the forefront of unleashing the full potential of 5G vRAN technology to meet rising demands, and we look forward to collaborating with industry leaders like AMD to provide operators the capabilities to transform their networks."

Apple today announced iPhone 15 and iPhone 15 Plus, featuring an industry-first color-infused back glass with a stunning, textured matte finish, and a new contoured edge on the aluminium enclosure. Both models feature the Dynamic Island, and an advanced camera system designed to help users take fantastic photos of everyday moments in their lives. A powerful 48MP Main camera enables super-high-resolution photos and a new 2x Telephoto option to give users a total of three optical zoom levels—like having a third camera. The iPhone 15 lineup also introduces the next generation of portraits, making it easier to capture portraits with great detail and low-light performance. Building on Apple's innovative satellite infrastructure, Roadside Assistance via satellite can connect users to AAA if they have car trouble while off the grid. With A16 Bionic for powerful, proven performance; a USB‑C connector; Precision Finding for Find My friends; and industry-leading durability features, iPhone 15 and iPhone 15 Plus represent a huge leap forward.

iPhone 15 and iPhone 15 Plus will be available in five stunning new colors: pink, yellow, green, blue, and black. Pre-orders begin Friday, September 15, with availability beginning Friday, September 22.

Industry experts were expecting Apple to rely on their own in-house 5G modem tech once a previous deal with a development partner expired, but the big A has returned to pastures of old—Qualcomm Technologies yesterday announced: "that it has entered into an agreement with Apple Inc. to supply Snapdragon 5G Modem‑RF Systems for smartphone launches in 2024, 2025 and 2026. This agreement reinforces Qualcomm's track record of sustained leadership across 5G technologies and products."

Reports suggest that multiple issues have plagued development of Apple's proprietary 5G modem, with 2024's iPhone 16 lineup already rumored to rely on Qualcomm's RF system. Apple has invested heavily in its custom modem operation—the "majority" of Intel's smartphone modem business was acquired back in 2019, while 2021 insider talk had TSMC lined up as a manufacturing partner for 5G chips. According to their latest investment relations material, Qualcomm anticipates that it will supply around 20% of modem chips in Apple iPhones.

TrendForce expects that memory suppliers will continue their strategy of scaling back production of both DRAM and NAND Flash in 2024, with the cutback being particularly pronounced in the financially struggling NAND Flash sector. Market demand visibility for consumer electronic is projected to remain uncertain in 1H24. Additionally, capital expenditure for general-purpose servers is expected to be weakened due to competition from AI servers. Considering the low baseline set in 2023 and the current low pricing for some memory products, TrendForce anticipates YoY bit demand growth rates for DRAM and NAND Flash to be 13% and 16%, respectively. Nonetheless, achieving effective inventory reduction and restoring supply-demand balance next year will largely hinge on suppliers' ability to exercise restraint in their production capacities. If managed effectively, this could open up an opportunity for a rebound in average memory prices.

PC: The annual growth rate for average DRAM capacity is projected at approximately 12.4%, driven mainly by Intel's new Meteor Lake CPUs coming into mass production in 2024. This platform's DDR5 and LPDDR5 exclusivity will likely make DDR5 the new mainstream, surpassing DDR4 in the latter half of 2024. The growth rate in PC client SSDs will not be as robust as that of PC DRAM, with just an estimated growth of 8-10%. As consumer behavior increasingly shifts toward cloud-based solutions, the demand for laptops with large storage capacities is decreasing. Even though 1 TB models are becoming more available, 512 GB remains the predominant storage option. Furthermore, memory suppliers are maintaining price stability by significantly reducing production. Should prices hit rock bottom and subsequently rebound, PC OEMs are expected to face elevated SSD costs. This, when combined with Windows increasing its licensing fees for storage capacities at and above 1 TB, is likely to put a damper on further growth in average storage capacities.

Intel Corporation today reported second-quarter 2023 financial results. "Our Q2 results exceeded the high end of our guidance as we continue to execute on our strategic priorities, including building momentum with our foundry business and delivering on our product and process roadmaps," said Pat Gelsinger, Intel CEO. "We are also well-positioned to capitalize on the significant growth across the AI continuum by championing an open ecosystem and silicon solutions that optimize performance, cost and security to democratize AI from cloud to enterprise, edge and client."

David Zinsner, Intel CFO, said, "Strong execution, including progress towards our $3 billion in cost savings in 2023, contributed to the upside in the quarter. We remain focused on operational efficiencies and our Smart Capital strategy to support sustainable growth and financial discipline as we improve our margins and cash generation and drive shareholder value." In the second quarter, the company generated $2.8 billion in cash from operations and paid dividends of $0.5 billion.

Today, Intel announced a strategic collaboration agreement with Ericsson to utilize Intel's 18A process and manufacturing technology for Ericsson's future next-generation optimized 5G infrastructure. As part of the agreement, Intel will manufacture custom 5G SoCs (system-on-chip) for Ericsson to create highly differentiated leadership products for future 5G infrastructure. Additionally, the companies will expand their collaboration to optimize 4th Gen Intel Xeon Scalable processors with Intel vRAN Boost for Ericsson's Cloud RAN (radio access network) solutions to help communications service providers increase network capacity and energy efficiency while gaining greater flexibility and scalability.

"As our work together evolves, this is a significant milestone with Ericsson to partner broadly on their next-generation optimized 5G infrastructure. This agreement exemplifies our shared vision to innovate and transform network connectivity, and it reinforces the growing customer confidence in our process and manufacturing technology," said Sachin Katti, senior vice president and general manager of the Network and Edge group at Intel. "We look forward to working together with Ericsson, an industry leader, to build networks that are open, reliable and ready for the future."

Samsung Electronics and MediaTek completed the successful testing of 5G Standalone Uplink (UL) 2CC Carrier Aggregation (CA) with C-Band UL MIMO to reach top uplink speeds, marking a groundbreaking achievement in wireless mobile capabilities. This approach used three transmit (3Tx) antennas to improve upload experiences, ushering in an era of enhanced connectivity for consumers worldwide.

The demands on uplink performance are increasing with the rise of live streaming, multi-player gaming and video conferences. Upload speeds determine how fast your device can send data to gaming servers or transmit high-resolution videos to the cloud. As more consumers seek to document and share their experiences with the world in real-time, enhanced uplink experiences provide an opportunity to use the network to improve how they map out their route home, check player stats online and upload videos and selfies to share with friends and followers.

Zebra Technologies Corporation, a leading digital solution provider enabling businesses to intelligently connect data, assets, and people, today announced the launch of the ET6x series of rugged Android tablets. Designed to help front-line workers in warehouses, manufacturing plants, ports, yards, field service and emergency medical environments be more productive and efficient, the ET6x series debuts the industry's only heated touch screen and vehicle dock for forklifts and other material handling vehicles.

The ET60 and ET65 are Zebra's first 2-in-1 Android tablets with a friction-hinge keyboard that transforms the tablets into a laptop to make heavy data entry easy in the office and in the field. The products feature consumer styling that can handle harsh indoor and outdoor environments from sub-zero cold to extreme heat. The tablets are dustproof, corrosion proof and tested for vibration, thermal shock, and solar radiation. Two of the most vulnerable tablet elements - the display and optional scanner exit window - are protected with shatter-and scratch-resistant Corning Gorilla Glass.

TrendForce reports that inventory reduction in Q1 fell short of expectations and coincided with the industry's traditional off-season, leading to overall subdued demand. However, due to new product release and a surge in urgent orders for specialized specifications, Q1 revenue of the global top ten IC design houses remained on par with 4Q22, with a modest QoQ increase of 0.1% for a total revenue of US$33.86 billion. Changes in ranking included Cirrus Logic slipping from the top ten as well as the ninth and tenth positions being replaced by WillSemi and MPS, respectively. The rest of the rankings remained unchanged.

The smartphone supply continues to grapple with overstock, but AI applications are entering a period of rapid growth
Qualcomm witnessed an uptick in its revenue, largely attributed to the launch and subsequent shipments of its latest flagship chip, the Snapdragon 8Gen2. The company saw 6.1% in QoQ growth in its smartphone business, which effectively offset the downturn from its automotive and IoT sectors. As a result, Qualcomm's Q1 revenue increased marginally by 0.6%, cementing its position at the top of the pack with a market share of 23.5%.

Today Apple announced a new multiyear, multibillion-dollar agreement with Broadcom, a leading U.S. technology and advanced manufacturing company. Through this collaboration, Broadcom will develop 5G radio frequency components - including FBAR filters - and cutting-edge wireless connectivity components. The FBAR filters will be designed and built in several key American manufacturing and technology hubs, including Fort Collins, Colorado, where Broadcom has a major facility.

"We're thrilled to make commitments that harness the ingenuity, creativity, and innovative spirit of American manufacturing," said Tim Cook, Apple's CEO. "All of Apple's products depend on technology engineered and built here in the United States, and we'll continue to deepen our investments in the U.S. economy because we have an unshakable belief in America's future."

Panasonic announced today the world's premier rugged notebook for the Defence industry can now be equipped with the Eclypt Core Encrypted Internal Solid State Drive from global communications company, Viasat Inc. (NASDAQ: VSAT), making the Panasonic TOUGHBOOK 40 unrivalled in its capabilities for the military, border control and emergency services. Available in May 2023, the TOUGHBOOK 40 notebook with solid state self-encrypting hard drive is certified for use in the UK for securing Top Secret information and all security levels below, as well as certified for use by NATO and other European countries.

"This is the next step in extending our partnership with Viasat to offer the highest-level security drives across the TOUGHBOOK range," said Jon Tucker, General Manager Engineering, Product & Mobility Solutions, at Panasonic Mobile Solutions Business Division. "With the current geopolitical tensions across Europe and beyond, the demand for this type of highly secure, rugged and modular flexible device is growing every day."

Ericsson is boosting its Open RAN and Cloud RAN ecosystem commitment through an agreement with US-based global ICT industry leader AMD. The agreement - intended to strengthen the Open RAN ecosystem and vendor-agnostic Cloud RAN environment - aims to offer communications service providers (CSPs) a combination of high performance and additional flexibility for open architecture offerings.

The Ericsson-AMD collaboration will see additional processing technologies in the Ericsson Cloud RAN offering. The expanded offering aims to enhance the performance of Cloud RAN and secure high-capacity solutions. The collaboration will enable joint exploration of AMD EPYC processors and T2 Telco accelerator for utilization in Cloud RAN solutions, while also investigating future platform generations of these technologies.

DFI, a global leader in embedded motherboards and industrial computers, today announced that they will be participating in Embedded World 2023 and joining Qualcomm Technologies, Inc. to showcase the world's first SBC equipped with the high-performance Qualcomm QRB5165 processor. With high integration capability and anti-vibration features, the product can be applied in fields such as industrial automation and AMR. It is expected to increase the overall AI edge computing efficiency and bring more capabilities to the industry.

For the first time during the three-day Embedded World 2023 exhibition, DFI will integrate the QRB551 industrial-grade motherboard built with the Qualcomm Robotics RB5 platform with 5G connectivity and AMR requirements. The solution will be applied to a smart factory environment while executing appearance recognition, defect detection, and human body posture recognition, which are commonly seen in industrial automation.

Qualcomm Technologies' 6th generation modem-to-antenna solution is the first ready to support 5G Advanced, the next phase of 5G. It introduces a new architecture, a new software suite and includes numerous world's first features to push the boundaries of connectivity including coverage, latency, power efficiency and mobility. Snapdragon X75 technologies and innovations empower OEMs to create next generation experiences across segments including smartphones, mobile broadband, automotive, compute, industrial IoT, fixed wireless access and 5G private networks.

Snapdragon X75 is the first Modem-RF System with a dedicated hardware tensor accelerator, Qualcomm 5G AI Processor Gen 2, enabling over 2.5 times better AI performance compared to Gen 1 and introduces Qualcomm 5G AI Suite Gen 2 with new AI-powered optimizations to achieve better speeds, coverage, mobility, link robustness and location accuracy. The Qualcomm 5G AI Suite features advanced AI-based capabilities including world's first sensor-assisted mmWave beam management and AI-enhanced GNSS Location Gen 2, which uniquely optimize Snapdragon X75 for superior 5G performance.

Getac has today announced the expansion of its flagship X600 rugged mobile workstation range with the launch of the X600 Server and X600 Pro-PCI. The new models will sit alongside the recently launched X600 and X600 Pro, creating a comprehensive lineup of rugged mobile workstations that are purpose-built to meet the demands of professionals working in challenging industries, such as defence, manufacturing and oil & gas.

X600 Server: The fully rugged mobile server
The all-new Getac X600 Server delivers a powerful commercial off-the-shelf (COTS) rugged mobile server that can be folded to a slim profile for easy transportation.

Qualcomm Technologies, Inc. today announced Snapdragon X35 5G Modem-RF System, the world's first 5G NR-Light modem-RF system. NR-Light, a new class of 5G, fills the gap in between high-speed mobile broadband devices and extremely low-bandwidth NB-IoT devices. NR-Light devices, powered by Snapdragon X35, can be smaller, more cost-efficient, and provide longer battery life than traditional mobile broadband devices.

With its optimized design and breakthrough performance, Snapdragon X35 offers a device platform that bridges the complexity and capability gap between the extremes in 5G today and addresses the need for mid-tier use cases. This lower cost option provides device makers with a long-term migration path to replace LTE CAT4+ devices, ultimately increasing 5G adoption and allowing for faster transition to a unified 5G network.

NETGEAR, Inc the leading provider of award-winning connected products designed to simplify and improve people's lives, today raised the bar once again by supporting the new 6 GHz band for client devices on its Nighthawk M6 mobile hotspot routers. The ultra-fast M6 Pro 5G WiFi 6E Hotspot Router (MR6450) supports 5G internet up to 6 Gbps‡ and WiFi speeds up to 3.6 Gbps. Evolving work and lifestyle changes have spurred the growing need for always-on, secure, high-speed internet connectivity for multiple connected devices anywhere and everywhere. On the road, traveling for business or pleasure, via commercial transport or in a car or RV, WiFi you can trust is imperative. Public WiFi, while convenient, is not secure and not worth risking a critical business transaction or personal bank transfer.

The M6 Pro provides a portable, secure WiFi connection with a built-in firewall for up to 32 devices in any place that has cellular coverage. Travelers and/or mobile workforces can enjoy uninterrupted video streaming, Zoom calls, online games, social media updates and large file uploads/downloads, all at the same time without risk of intrusion. And worldwide roaming support helps them stay connected no matter where they go. Also ideal for home or holiday home use, the M6 Pro can boost WiFi coverage up to 1,000 square feet with In-Home Performance Mode, simply by removing the battery and using the power adapter. In larger homes, the hotspot can be used together with an existing WiFi router by plugging it into the 2.5 Gbps Ethernet port. For locations where cellular signal is not strong, external antennas (sold separately) can increase 5G reception when plugged into the M6 Pro's antenna ports. The onboard USB-C port can be used to charge devices or as an ultra-fast wired connection, up to 5 Gbps, to a computer or a laptop.

ASUS today announced Mini PC PL64, an industrial mini PC featuring a fanless design and powered by up to a 12th Generation Intel Core i7 (15 W) processor. Each PL64 unit has been subjected to a battery of reliability tests, and the fanless design ensures optimal performance even in ambient temperatures of up to 50°C. This mini PC features dual LAN ports, including 2.5 Gbps Ethernet, dual COM ports, five USB ports, along with triple 4K display support at 60 Hz.

Mini PC PL64 employs a new, almost-silent fanless design that minimizes dust ingress into the chassis to prolong product life. The fanless design and 15-watt CPU support make PL64 ideal for industrial applications where reliability, durability, and low noise are paramount. The cooling system in PL64 efficiently dissipates heat, enabling this mini PC to be deployed in hot environments reaching 50°C.

MediaTek today announced the Dimensity 8200, the company's newest chipset for premium 5G smartphones. Smartphones powered by the Dimensity 8200 will offer flagship level experiences - including connectivity, gaming, multimedia, displays and imaging - at a more accessible price point. Built on the 4 nm-class process, the new chipset delivers unparalleled power efficiency. It also integrates an octa-core CPU with four Arm Cortex-A78 cores operating at up to 3.1 GHz, along with a powerful Mali-G610 graphics engine, for better performance across applications.

To enhance gaming performance, the chipset takes advantage of MediaTek's HyperEngine 6.0 gaming technologies so users can enjoy smooth high framerate gameplay without suffering connection drops, FPS jitter, or gameplay hiccups. MediaTek's Intelligent Display Sync 2.0 technology intelligently adjusts the display refresh rate according to the game frame rate detected, which helps provide smoother viewing experiences.