During the Snapdragon Summit 2022, Qualcomm Technologies, Inc. introduced its latest premium mobile platform, Snapdragon 8 Gen 2. The Snapdragon 8 Gen 2 Mobile Platform will define a new standard for connected computing, intelligently engineered with groundbreaking AI across the board to enable extraordinary experiences. This new mobile platform will be adopted by global OEMs and brands including ASUS Republic of Gamers, HONOR, iQOO, Motorola, nubia, OnePlus, OPPO, REDMAGIC, Redmi, SHARP, Sony Corporation, vivo, Xiaomi, XINGJI/MEIZU, and ZTE, with the first commercial devices expected by the end of 2022.

"We are passionate about enabling people to do more, so we design Snapdragon with the user at the center. Snapdragon 8 Gen 2, will revolutionize the landscape of flagship smartphones in 2023," said Chris Patrick, senior vice president and general manager of mobile handsets, Qualcomm Technologies, Inc. "Snapdragon 8 Gen 2 delivers groundbreaking AI, unparalleled connectivity, and champion-level gameplay, enabling consumers to enhance every experience on their most trusted device."

MediaTek today launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6 GHz connectivity to consumers around the globe.

"MediaTek's Dimensity 9200 combines ultimate performance with significant power savings, extending battery life and keeping smartphones cool," said JC Hsu, Corporate Vice President and General Manager of MediaTek's wireless communications business unit at MediaTek. "With notably brighter image capturing and improved gaming speeds, along with the latest display enhancements, the Dimensity 9200 will bring new possibilities for next-gen smartphones that come in a variety of stylish and foldable form factors."

Handheld Group, a leading manufacturer of rugged mobile computers, today announced the release of the all-new Algiz 10XR, an ultra-rugged 10-inch Windows tablet that combines durability with robust field performance, 5G and future-proof features. The Algiz 10XR is a smaller, lighter, 10-inch Windows tablet that achieves more even while taking up less space. It brings two times better graphics and measurably faster performance. Future-proof 5G communication can handle live video streams and bandwidth-heavy tasks like mapping. The Algiz 10XR was developed for field work or other challenging environments within logistics, mining, public transport, public safety, waste management or GIS and has also been designed with modulization and customization in mind.

"The Algiz 10XR will bring some great performance gains for our partners and customers who rely on Windows tablets in the field," says Johan Hed, Handheld chief product officer. "We've worked with this segment for decades now and are confident that we've developed a device with not only great specs, but a complete accessory package to help our customers with their fieldwork."

Apple today announced the new iPad Pro with the M2 chip, delivering the ultimate combination of portability, versatility, and unbelievable performance. The new iPad Pro features a next-level Apple Pencil hover experience and superfast wireless connectivity, along with the world's most advanced mobile display, pro cameras, Face ID, Thunderbolt, and a four-speaker audio system. New features in iPadOS 16—including Stage Manager, full external display support, desktop-class apps, and Reference Mode—take pro workflows on iPad even further. Enabled by its advanced hardware and iPadOS 16, iPad Pro has an incredible ecosystem of powerful pro apps unlike any other device of its kind. The new iPad Pro is available to order starting today, and in stores beginning Wednesday, October 26.

"The next-generation iPad Pro pushes the boundaries of what's possible on iPad, bringing even more versatility, power, and portability to the ultimate iPad experience," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "Powered by the M2 chip, the new iPad Pro features incredible performance and the most advanced technologies, including a next-level Apple Pencil hover experience, ProRes video capture, superfast wireless connectivity, and powerful iPadOS 16 features. There's nothing else like it."

TCL, a pioneer in display technology and affordable, powerful connected experiences, unveils a new range of CPE devices at Broadband World Forum, including three latest generation 5G routers. TCL will also deliver the keynote address on the exhibition's final day on October 20th. TCL is committed to providing users with safe, high-speed, reliable, and seamless mobile broadband connection services. As a leading global broadband provider, TCL works with more than 150 carriers worldwide to meet network connection demands for home, business, mobile and machine-to-machine (M2M).

"Our vision is to create seamless connections for everyone", commented Sharon Xiao, GM of the Smart Connected Device Business at TCL Communication. "By 2027[1], 5G subscriptions are forecast to reach 4.4 billion. TCL's long-term partnership with top-tier operators means we can offer high-quality 5G Mobile Broadband (MBB) and Fixed Wireless Access (FWA) products to clients and consumers and make our vision a reality."

NETGEAR, Inc., the leading provider of award-winning connected products designed to simplify and improve people's lives, today launched a powerful addition to its unlocked 5G mobile hotspot lineup. At a time when access to fast, secure and reliable internet is more important than ever, the NETGEAR Nighthawk M6 Mobile Hotspot Router (MR6150) raises the mobile broadband experience to new heights by upping the maximum 5G speed that can be supported and adding 160 MHz capability to connect with the latest WiFi 6 client devices.

NETGEAR launched the world's first unlocked 5G hotspot in 2021 with the award-winning Nighthawk M5. Now the company is building on that achievement with the M6, which is 20 percent faster than the M5 at 2.5 Gbps over 5G and has the capacity to hit a maximum combined WiFi speed of up to 3.6 Gbps when connecting to 160 MHz WiFi 6 devices. Additionally, the M6 comes with a first of its kind new In-Home Performance Mode which boosts WiFi coverage up to 2,000 square-feet when the device is plugged in, and the battery is removed.

According to TrendForce research, due to steady weakening of overall demand for consumer electronics, inventory pressure has increased among downstream distributors and brands. Although there are still sporadic shortages of specific components, the curtain has officially fallen on a two-year wave of shortages in general, and brands have gradually suspended stocking in response to changes in market conditions. However, stable demand for automotive and industrial equipment is key to supporting the ongoing growth of foundry output value. At the same time, since the creation of a marginal amount of new capacity in 2Q22 led to growth in wafer shipments and a price hike for certain wafers, this drove output value among top ten foundries to reach US$33.20 billion in 2Q22. Quarterly growth fell to 3.9% on a weakening consumer market.

A prelude to inventory correction was officially revealed in 3Q22. In addition to intensifying severity in the initial wave of order slashing for LDDI/TDDI, and TV SoC, diminishing order volume also extended to non-Apple smartphone APs and peripheral IC PMIC, CIS, and consumer electronics PMICs, and mid-to-low-end MCUs, posing a challenge for foundry capacity utilization. However, the launch of the new iPhone in 3Q22 is expected to prop up a certain amount of stocking momentum for the sluggish market. Therefore, top ten foundry revenue in 3Q22 is expected to maintain a growth trend driven by high-priced processes and quarterly growth rate is expected to be slightly higher than in 2Q22.

Intel and MediaTek today announced a strategic partnership to manufacture chips using Intel Foundry Services' (IFS) advanced process technologies. The agreement is designed to help MediaTek build a more balanced, resilient supply chain through the addition of a new foundry partner with significant capacity in the United States and Europe. MediaTek plans to use Intel process technologies to manufacture multiple chips for a range of smart edge devices. IFS offers a broad manufacturing platform with technologies optimized for high performance, low power and always-on connectivity built on a roadmap that spans production-proven three-dimensional FinFET transistors to next-generation breakthroughs.

"As one of the world's leading fabless chip designers powering more than 2 billion devices a year, MediaTek is a terrific partner for IFS as we enter our next phase of growth," said IFS President Randhir Thakur. "We have the right combination of advanced process technology and geographically diverse capacity to help MediaTek deliver the next billion connected devices across a range of applications."

Elitegroup Computer Systems (ECS), the global leading motherboard, mini PC, notebook, mobile device, and smart solution provider, will physically and digitally participate the leading international faire for embedded technologies, Embedded World 2022 at Nuremberg, Germany from June 21 to 23 to showcasing the comprehensive LIVA Mini PC family and the latest commercial motherboards to apply in wide range applications.

ECS presents the complete LIVA Mini PC family including compact-size Q series, multi-function Z series and high-performance One series and its wide range applications during the event.

Qualcomm Technologies, Inc. announced its latest lineup of mobile platforms, Snapdragon 8+ Gen 1 and Snapdragon 7 Gen 1, to power the next generation of premium and high-tier Android smartphones. The Company's newest flagship platform, Snapdragon 8+, is a premium-tier powerhouse delivering power and performance enhancements for the ultimate boost across all on-device experiences. Snapdragon 7 offers a selection of high-end, in-demand features and technologies and enables them for more people around the world. According to the latest findings from Counterpoint Research, IDC, and Strategy Analytics, Qualcomm Technologies is the global leader in premium Android smartphone SoC industry share.

"In the mobile segment, our primary focus is to deliver new, groundbreaking features and technologies to the industry, and for our customers' flagship devices. We implement these features first in our Snapdragon 8-series and then waterfall them down our mobile roadmap," said Christopher Patrick, senior vice president and general manager, mobile handsets, Qualcomm Technologies, Inc. "The new Snapdragon 8+ and 7 Gen 1 both deliver breakthrough user experiences in their respective tiers."

MediaTek today unveiled its new Genio platform for AIoT devices and introduced the first chip in the Genio family, the Genio 1200 designed for premium AIoT products. MediaTek Genio is a complete platform stack for the AIoT with powerful and ultra- efficient chipsets, open platform software development kits (SDKs) and a developer portal with comprehensive resources and tools. This all-in-one platform makes it easy for brands to develop innovative consumer, enterprise and industrial smart applications at the premium, mid-range and entry levels, and bring these devices to market faster. With MediaTek Genio, customers have access to all the hardware, software and resources needed to go from concept to design and manufacturing.

Customers can choose from a range of Genio chips to suit their product needs, and then use MediaTek's developer resources and the Yocto Linux open platform SDK to customize their designs. MediaTek also makes it easy for customers to access its partners' system hardware and software, and leverage partners' networks and sales channels. By offering an integrated, easy-to-use platform, MediaTek Genio reduces development costs and speeds up time to market, while providing long-term support for operating system updates and security patches that extend the product lifecycle. "Today MediaTek powers the most popular AIoT devices on the market. As the industry enters the next era of innovation, MediaTek's Genio platform delivers flexibility, scalability and development support brands need to cater to the latest market demands," said Jerry Yu, MediaTek Corporate Senior Vice President and General Manager of MediaTek's Computing, Connectivity and Metaverse Business Group. "We look forward to seeing the new user experiences brands bring to life with the Genio 1200 and its powerful AI capability, support for 4K displays and advanced imaging features."

M6 Pro elevates secure, mobile WiFi as the world's first mobile router to support WiFi 6E. Beginning April 22, AT&T customers will be able to access AT&T's 5G Network using the brand new NETGEAR Nighthawk M6 and Nighthawk M6 Pro mobile hotspots. Harnessing the revolutionary power of 5G, we're collaborating with AT&T again to transform the connected lives of people on the go and at home with excellent engineering and multi-gigabit Internet speeds. As the world continues to explore hybrid and mobile living, coupled with remote work and learning environments, the need for efficient and secure Internet access has become an integral part of daily life. In fact, 10.9 million Americans described themselves as digital nomads in 2020—an almost 50% increase from the previous year-- with another 19 million planning to become one in the next two to three years. Answering this critical demand, we've once again partnered with AT&T to provide two-tiered products in the M6 series, both of which are ideal for mobile or fixed wireless access in the home or office setting, even providing 4G LTE support when 5G is not available.

The best-in-class M6 Pro offers advanced features such as 5G mmWave-Sub-6 dual connectivity, 2.5 G Ethernet port, switchable WiFi 6 and 6E capability, and 8x the capacity and speed of 4G, so users always have the fastest connection no matter where they are. The first mobile hotspot with WiFi 6E, the M6 Pro makes the 6 GHz band available for the newest, fastest connected devices. mmWave will serve users for many years to come, as data usage grows and 5G mmWave becomes more sophisticated. More people and devices can connect simultaneously to enjoy fast downloads, lag-free gaming, 8K streaming, and more throughout the home or office.

Extending a strategic relationship that spans a decade, Intel and Lockheed Martin have entered a new memorandum of understanding (MOU) that harnesses innovative 5G software and hardware solutions to enable faster and more decisive actions for the U.S. Department of Defense.

Intel's proven 5G solutions are integrated into Lockheed Martin's 5G.MIL Hybrid Base Station, which acts as a multi-network gateway for ubiquitous communications between military personnel and current and emerging platforms including satellites, aircraft, ships and ground vehicles. Lockheed Martin also leverages Intel's advanced processor technologies and innovations on network as well as edge to bring cloud capabilities to the areas of tactical need.

ADATA Technology (Taiwan Stock Exchange: 3260.TWO), a global leading brand of industrial-grade memory, including flash storage products and DRAM modules, today announces that its in-house developed firmware for 112-Layer (BiCS5) 3D NAND PCIe solid state drives has become University of New Hampshire InterOperability Laboratory (UNH-IOL) NVMe 1.4 certified. The certification reaffirms ADATA's core competencies in R&D and commitment to offering high performance SSDs. UNH-IOL is an independent test facility that provides interoperability and standards conformance testing for networking, telecommunications, data storage, and consumer technology products.

The IM2P32A8 M.2 2280 and IM2P32A4 M.2 2242 industrial-grade solid state drives will benefit from the newly certified firmware. What's more, both SSDs feature 112-layer 3D TLC Flash memory developed by WD and KIOXIA, supports the PCIe Gen3x4 interface, and provides large capacities of up to 2 TB. With ADATA's firmware, they provide improved performance and interoperability. In addition to processing large volumes of data, the SSDs can also serve as storage devices or a boot disk, which can fulfill the needs of applications such as 5G, Industrial Internet of Things (IIoT), smart cities, and telemedicine.

MediaTek today launched the Dimensity 8100 and Dimensity 8000 system-on-chips (SoCs) to bring flagship level technology - connectivity, displays, gaming, multimedia and imaging features - to premium 5G smartphones. Both chips borrow the advanced technology from MediaTek's powerful flagship Dimensity 9000 platform and package it into the new Dimensity 8000 series which is built on the ultra-efficient TSMC 5 nm production process with an octa-core CPU. The Dimensity 8100 integrates four premium Arm Cortex-A78 cores with speeds reaching 2.85 GHz, and the Dimensity 8000 has four Cortex-A78 cores operating at up to 2.75 GHz.

"You could say the MediaTek Dimensity 8000 series is the little brother to our flagship Dimensity 9000 chip. Meaning it brings flagship grade features and next level energy efficiency to the premium smartphone market," said CH Chen, Deputy General Manager of MediaTek's Wireless Communications Business Unit. Both chips combine an Arm Mali-G610 MC6 GPU with MediaTek's HyperEngine 5.0 gaming technologies for exceptional power-efficiency that extends play time, and best-in-class frame rates - 170fps for the Dimensity 8100 and 140fps for the Dimensity 8000. Quad-channel LPDDR5 memory and UFS 3.1 storage ensure ultra-fast data streams.

In 4Q21, NAND Flash bit shipments grew by only 3.3% QoQ, a significant decrease from the nearly 10% in 3Q21, according to TrendForce's investigations. ASP fell by nearly 5% and the overall industry posted revenue of US$18.5 billion, a QoQ decrease of 2.1%. This was primarily due to a decline in the purchase demand of various products and a market shift to oversupply causing a drop in contract prices. In 4Q21, with the exception of enterprise SSD, the supply of which was limited by insufficient upstream components, the prices of other NAND Flash products such as eMMC, UFS, and client SSD, all fell.

TrendForce's summary of NAND Flash market sales performance in 2021 is as follows: although there have been signs of weakening since 2H21, thanks to remote services and cloud demand driven by the pandemic, revenue performance still grew significantly compared to 2020. Revenue reached US$68.6 billion, up 21.1% YoY, the second-biggest increase since 2018.

From 2020 to 2025, the compound annual growth rate (CAGR) of 12-inch equivalent wafer capacity at the world's top ten foundries will be approximately 10% with the majority of these companies focusing on 12-inch capacity expansion, which will see a CAGR of approximately 13.2%, according to TrendForce's research. In terms of 8-inch wafers, due to factors such as difficult to obtain equipment and whether capacity expansion is cost-effective, most fabs can only expand production slightly by means of capacity optimization, equating to a CAGR of only 3.3%. In terms of demand, the products primarily derived from 8-inch wafers, PMIC and Power Discrete, are driven by demand for electric vehicles, 5G smartphones, and servers. Stocking momentum has not fallen off, resulting in a serious shortage of 8-inch wafer production capacity that has festered since 2H19. Therefore, in order to mitigate competition for 8-inch capacity, a trend of shifting certain products to 12-inch production has gradually emerged. However, if shortages in overall 8-inch capacity is to be effectively alleviated, it is still necessary to wait for a large number of mainstream products to migrate to 12-inch production. The timeframe for this migration is estimated to be close to 2H23 into 2024.

Exponential demand growth for remote and unmanned terminals in smart home, logistics, manufacturing and other end-user applications has driven iterative updates in Wi-Fi technology. Among the current generations of technologies, Wi-Fi 5 (802.11ac) is mainstream while Wi-Fi 6 and 6E (802.11ax) are at promotional stages, according to TrendForce's investigations. In order to meet the connection requirements of industry concepts such as the Metaverse, many major manufacturers have trained their focus on the faster and more stable next generation 802.11be Wi-Fi standard amendment, commonly known as Wi-Fi 7. Considering technical characteristics, maturity, and product certification status, Wi-Fi 6 and 6E are expected to surpass Wi-Fi 5 to become mainstream technology in 2022, with global market share expected to reach 58%.

Worldwide semiconductor revenue increased 25.1% in 2021 to total $583.5 billion, crossing the $500 billion threshold for the first time, according to preliminary results by Gartner, Inc.

"As the global economy bounced back in 2021, shortages appeared throughout the semiconductor supply chain, particularly in the automotive industry," said Andrew Norwood, research vice president at Gartner. "The resulting combination of strong demand as well as logistics and raw material price increases drove semiconductors' average selling price higher (ASP), contributing to overall revenue growth in 2021.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced its new premium mobile processor, the Exynos 2200. The Exynos 2200 is a freshly designed mobile processor with a powerful AMD RDNA 2 architecture based Samsung Xclipse graphics processing unit (GPU). With the most cutting-edge Arm -based CPU cores available in the market today and an upgraded neural processing unit (NPU), the Exynos 2200 will enable the ultimate mobile phone gaming experience, as well as enhancing the overall experience in social media apps and photography.

"Built on the most advanced 4-nanometer (nm) EUV (extreme ultraviolet lithography) process, and combined with cutting-edge mobile, GPU, and NPU technology, Samsung has crafted the Exynos 2200 to provide the finest experience for smartphone users. With the Xclipse, our new mobile GPU built with RDNA 2 graphics technology from the industry leader AMD, the Exynos 2200 will redefine mobile gaming experience, aided by enhanced graphics and AI performance," said Yongin Park, President of System LSI Business at Samsung Electronics. "As well as bringing the best mobile experience to the users, Samsung will continue its efforts to lead the journey in logic chip innovation."

congatec - a leading vendor of embedded and edge computing technology - introduces the 12th Generation Intel Core mobile and desktop processors (formerly code named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel's innovative performance hybrid architecture. Offering of up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low power Efficient-cores (E-cores) and DDR5 memory support to accelerate multithreaded applications and execute background tasks more efficiently.

As the global vaccination rate rose, and border restrictions in Europe and North America eased, social activities also began to enter a period of recovery, with the consumer electronics market seemingly ready for the arrival of the traditional peak season in 2H21, according to TrendForce's latest investigations. At the same time, however, the global supply chain was affected by delays in maritime transport, skyrocketing shipping costs, and component shortages, in addition to already-prohibitive price hikes for certain components in 1H21. Given the parallel rise in both material and manufacturing costs, the market for end products has not undergone the expected cyclical upturn in 2H21. Even so, the overall demand for and shipment of smartphones, notebook computers, and monitors experienced QoQ increases in 3Q21, thereby driving up businesses for major OSAT (outsourced semiconductor assembly and test) companies. For 3Q21, the revenues of the top 10 OSAT companies reached US$8.89 billion, a 31.6% YoY increase.

NETGEAR, Inc., the leading provider of award-winning connected products designed to simplify and improve people's lives, today introduced the first 5G Tri-band WiFi 6 mesh system for use in homes and businesses. The latest addition to the brand's high performance Orbi product line, the NETGEAR Orbi 5G WiFi 6 Mesh System (NBK752), provides high-speed 5G Internet, especially to those with limited or unreliable access to wired broadband services.

Today about 42 million Americans have no access to high speed wired Internet service. Many homes and home-based businesses in areas with limited or unreliable (DSL, satellite) access to Internet services may be using cell phone hotspots as the only way to connect to the Internet and share mobile broadband to all their devices. Modern households with dozens of smart devices need a more robust network than a hotspot can provide. Average LTE Internet speeds can be slow, especially during peak hours. For home-based businesses that depend on reliable Internet connectivity, limited broadband options can stifle productivity.

While the global electronics supply chain experienced a chip shortage, the corresponding shortage of foundry capacities also led various foundries to raise their quotes, resulting in an over 20% YoY increase in the total annual revenues of the top 10 foundries for both 2020 and 2021, according to TrendForce's latest investigations. The top 10 foundries' annual revenue for 2021 is now expected to surpass US$100 billion. As TSMC leads yet another round of price hikes across the industry, annual foundry revenue for 2022 will likely reach US$117.69 billion, a 13.3% YoY increase.

TrendForce indicates that the combined CAPEX of the top 10 foundries surpassed US$50 billion in 2021, a 43% YoY increase. As new fab constructions and equipment move-ins gradually conclude next year, their combined CAPEX for 2022 is expected to undergo a 15% YoY increase and fall within the US$50-60 billion range. In addition, now that TSMC has officially announced the establishment of a new fab in Japan, total foundry CAPEX will likely increase further next year. TrendForce expects the foundry industry's total 8-inch and 12-inch wafer capacities to increase by 6% YoY and 14% YoY next year, respectively.

Gigabyte, a leading manufacturer of motherboards and graphics cards, showcased a new concept 5G gaming PC, Project Cielo by AORUS. Combining 5G connectivity, modular design, and portability, Project Cielo, which stands for sky in Spanish, gives an intriguing depiction of the future of PC gaming with endless possibilities.

Project Cielo is a gaming PC with built-in 5G connectivity. Compared to the traditional wired or 4G wireless networks, 5G makes PC gaming on the go possible by offering greater bandwidth, ultra-low latency and near-instant access to cloud gaming. Project Cielo comes with an accommodating falcon-wing antenna that symbolizes AORUS. The design also cleverly integrates the 5G antenna into PC chassis. Players can save the expense of purchasing additional 5G antennas and the trouble of cable arrangement; at the same time they can enjoy the ultimate gaming experience on the go brought by 5G.