BIOSTAR, a leading manufacturer of IPC solutions, motherboards, graphics cards, and PC peripherals, is excited to introduce the MS-X6413E industrial system designed to meet the needs of a wide range of industries including automation machine builders, edge computing innovators, and HMI solution creators.

The MS-X6413E is tailored for businesses looking to stay ahead in today's fast-paced digital landscape. For system integrators, this product offers a seamless solution to keep business operations running smoothly, managing customer contact details, transaction history, and accounts with ease. Its unparalleled reliability ensures that businesses are always up-to-date and in control of their processes. Its versatility also extends to those building edge computing machines.

ASUS and Republic of Gamers (ROG) today announced a suite of innovative networking products at CES 2025, pushing the boundaries of Wi-Fi 7 connectivity for gamers, network enthusiasts and home users. In addition, ASUS RT-BE58 Go, a compact mini travels router with versatile connectivity; and ASUS 5G-GO, a sleek 5G mobile router with roaming support in up to 232 countries, both received the prestigious CES 2025 Innovation Award. The latest lineup includes ROG Rapture GT-BE19000AI, the world's first AI-powered gaming router with a built-in NPU; and the ZenWiFi outdoor series, a robust outdoor Wi-Fi 7 mesh solution. All of these solutions are designed to deliver unparalleled performance, security, and flexibility.

Edimax is pleased to announce the release of the D5G-8459 Industrial 5G NR DIN-Rail Router, a powerful solution for seamless wireless and wired connectivity in the most challenging environments. Capable of operating within a temperature range of -20°C to 70°C, this router delivers reliable 5G NR internet access in locations where fixed broadband is unavailable or impractical.

Equipped with the RM520-GL (Qualcomm Snapdragon x62), the D5G-8459 router offers enhanced reliability, compatibility, and high performance. It supports automatic failover between 5G NR and wired Ethernet, ensuring continuous connectivity even during network disruptions. This level of redundancy is vital for industries reliant on uninterrupted services, including payment systems, remote data transfers, online meetings, and video streaming, making it an indispensable tool in ensuring smooth operations.

NETGEAR, the leading provider of award-winning connected products designed to simplify and improve people's lives, today expanded its unlocked 5G mobile router lineup with the launch of the NETGEAR Nighthawk M3 Mobile Hotspot Router (MH3150). The new product meets the growing demands for accessible and powerful Wi-Fi coupled with advanced security features anywhere, anytime.

NETGEAR launched the world's first unlocked 5G mobile router and has continued to innovate, improving on-the-go connectivity experiences customers have come to enjoy. The Nighthawk M3 follows in the same vein, delivering 2.5 Gbps over 5G[1] with the capacity to reach a maximum aggregated Wi-Fi speed of up to 3.6 Gbps. Additionally, the M3 features in-home performance mode which boosts Wi-Fi coverage up to 1,000 sq ft when the device is plugged in, and the battery is removed.

Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, unveils a pioneering AI-powered FWA solution based on Snapdragon X75 5G Modem-RF System during Network X 2024. The solution aims to simplify configuration, enhance user experience and foster service personalization. The integration of AI into the 5G FWA devices significantly revolutionizes the user interaction with end devices and improves experience.

The 5G AI FWA solution is designed to utilize AI intelligence to understand and respond to users' requests and streamline task management processes through voice input or text messages to OpenAI's Whisper service, or the conversations can be realized through the web interface. Offering a seamless, intuitive communication system, significantly expands the CPE capability and improves user experience. The AI-powered FWA solution also extends its intelligence to network optimization, latency reduction to meet customer satisfaction, serving as a hub for unified task management.

TCL, a pioneer in display across feature-rich smartphones, tablets, and connected devices, today showcased its latest 5G AI CPE device and 5G RedCap Family products at the Broadband World Forum 2024, part of Network X, held from 8-10 October in Paris, France. The event featured the AI-driven 5G CPE TCL LINKHUB 5G HH516, a device enhancing user experiences with advanced AI technology, and the TCL LINKPORT IK511, the industry's first 5G RedCap USB Dongle for consumer & M2M scenarios. These recent releases highlight TCL router's commitment to 'Connect the Unconnected and Create Seamless Connection' by leveraging its technological prowess and supporting global 5G adoption with a diverse range of products.

"With over two decades of experience in cellular technology, TCL continues to forge paths in 5G connectivity by broadening access to advanced network technologies through our innovative product offerings," said Jesse Wu, General Manager of Smart Connected Device Business Unit at TCL. "Entering the 5G RedCap market is a strategic move to address the burgeoning demand for enhanced 5G capabilities in a variety of consumer and industrial applications."

Qualcomm Technologies, Inc., a global leader in wireless technology innovation, today announced the launch of the Qualcomm Networking Pro A7 Elite, a groundbreaking wireless networking platform set to transform how people will experience their networks with edge AI integration. Leveraging an AI co-processor with 40 TOPS of NPU processing power, the platform delivers elevated Wi-Fi 7 connectivity and networking performance, while also equipping connected devices with powerful and centralized generative AI processing capabilities.

This transformative integration of computing power into the network unlocks opportunities for operators and enterprises to deploy innovative applications and services in areas such as security and surveillance, energy management and automation, personalized virtual assistants, aging in place and health monitoring among others. Edge AI can enhance privacy by processing sensitive information on the gateway, while enabling personalization through contextualized understanding of the environment and immediacy through near real-time responses. This approach unlocks the power of advanced AI for more devices, even legacy ones, enabling a more reliable and harmonized user experience across connected devices.

Samsung Electronics today unveiled the Galaxy Tab S10 Ultra and Galaxy Tab S10+, Samsung's first tablets purposefully built for AI. The premium hardware includes 14.6-inch and 12.4-inch Dynamic AMOLED 2X displays—the ideal canvas for the intuitive S Pen bundled with both models. Performance upgrades for the Galaxy Tab S10 Ultra include an 18% increase in CPU, 28% increase in GPU and 14% increase in NPU compared to the Galaxy Tab S9 Ultra.

This improved processing power enables faster and more responsive AI features, which are now easily accessible with written prompts using the new Galaxy AI Key on the Book Cover Keyboards to customize AI assistant. Cutting-edge software includes features such as Note Assist and Drawing Assist, optimized for the tablet form factor. The Galaxy Tab S10 series also acts as a home AI device, with a 3D Map View that gives a visual overview of the home and all connected devices to streamline device management across the SmartThings ecosystem. Robust Samsung Knox security ensures data privacy and control, while innovative materials underscore Samsung's commitment to a more sustainable future.

NETGEAR, Inc., the leading provider of innovative and secure solutions for people to connect and manage their digital lives, today expanded its portfolio of high-performance WiFi 7 devices with the introduction of the Nighthawk M7 Pro Mobile Hotspot (MR7400). Based on NETGEAR's nearly 30 years of pioneering network expertise, powered by the Qualcomm Snapdragon SDX75 chipset and running on AT&T's reliable 5G network, the M7 Pro provides flexible, high-speed connectivity for consumers and businesses anywhere, anytime.

Whether it's working remotely, staying in touch with family and friends, or enjoying entertainment on the go, having a reliable, secure and fast internet connection anywhere can make a huge difference in productivity, convenience, and satisfaction. The Nighthawk M7 Pro Mobile Hotspot conveys the benefits of WiFi 7 and 5G technology, which offer faster speeds, lower latency, and better coverage than ever before. The M7 Pro provides a strong, reliable connection with 5G speeds of up to 6 Gbps. With tri-band WiFi 7 and dual-band concurrent operation, it unleashes aggregated WiFi speeds of up to 5.8 Gbps.

Lenovo, a global leader in technology innovation, proudly announces a series of groundbreaking products at Lenovo Innovation World 2024, each designed to redefine the future of professional computing and artificial intelligence. At a special event hosted in Berlin, the highlights include the newly designed premium Lenovo ThinkPad X1 Carbon Gen 13 Aura Edition powered by the latest Intel Core Ultra processors (Series 2), and the innovative Lenovo Auto Twist AI PC proof of concept. Lenovo also featured the ThinkPad T14s Gen 6 and the all new ThinkBook 16 Gen 7+ powered by the latest AMD Ryzen AI processors. Additionally, Lenovo introduced the ThinkBook 16 Gen 7 powered by the Snapdragon X Plus 8-core processor. Together, these innovations showcase Lenovo's commitment to delivering cutting-edge technology, exceptional user experiences, and enhanced productivity and creativity for enterprise customers.

Lenovo also announced AI PC Fast Start, a solution designed to help organizations swiftly transition to AI-ready devices, maximizing ROI through AI-powered advisory and simplified deployment. Backed by Lenovo's award-winning support, these services accelerate AI adoption and ensure seamless implementation.

ASUS today announced the ROG Rapture GT-BE19000, ASUS RT-BE86U and ROG USB-BE92 during Gamescom 2024. These three devices showcase the ASUS commitment to offering an array of perfomant, reliable and robust featured Wi-Fi 7 products. These three products offers demanding digital homes and offices alongside networking enthusiast and gamers outstanding range, throughput and low latency ensuring outstanding wired and wireless connectivity. Additionally, the ROG Rapture GT-BE19000 alongside the latest Intel Wi-Fi 7 BE200 network card are being demonstrated in a dedicated section at the ASUS Gamescom 2024 booth, where attendees can see these two latest gen devices work ideally to deliver an ultra performance Gigabit+ network experience.

Wi-Fi 7 functionality is coming to Windows 11 later this year, and the new ROG GT-BE19000 can unleash Wi-Fi 7 gaming experiences with speeds up to 2.4 times faster and coverage up to 73% greater. Its ROG Gaming Network feature uses Guest Network Pro to deliver a dedicated Gaming Network SSID and VLAN with complete game-acceleration technology. Meanwhile, the new ASUS RT-BE86U offers up to 20 Gbps of wired capacity, triple that of the RT-AX86U, with 30% more CPU power and rich Ethernet backhaul options to create a feature-packed AiMesh extendable network. And the ROG USB-BE92 tri-band Wi-Fi 7 USB adapter supports both USB Type-A and USB 3.2 Gen 1 x1 Type-C connections, and give users access to the wide-open 6 GHz band for low-interference networking.

Qualcomm Technologies, Inc. today announces the Snapdragon 4s Gen 2 Mobile Platform - designed to make 5G more accessible and reliable. This new platform is another example of how Qualcomm is committed to engineering human progress, pioneering the global transition from 4G to 5G to empower communities and industries alike. Snapdragon 4s Gen 2 is also packed with feature-rich enhancements, including robust CPU performance for seamless multitasking and productivity, dual band navIC for better position accuracy, AI-enhanced audio, and entertainment experiences like smooth gameplay and powerful video streaming.


"The Snapdragon 4s Gen 2 Mobile Platform is a significant leap forward in making 5G technology more accessible, so more people can navigate the world at 5G speeds," said Chris Patrick, senior vice president and general manager of mobile handsets, Qualcomm Technologies, Inc. "Thanks to cutting-edge engineering, we balanced affordability with strong performance and all-day battery life, as well as widespread access to 5G for more enhanced mobile experiences."

D-Link Corporation, a global leader in networking solutions, proudly announces the launch of its cutting-edge G530 5G NR AX3000 Wi-Fi 6 router. This advanced router empowers users to harness the full potential of 5G technology by using a mobile carrier's SIM card to deliver high-speed 5G connectivity through a robust Wi-Fi 6 network. Engineered with the renowned MIT (Made in Taiwan) quality assurance, the G530 provides a fast, reliable, and flexible networking solution ideal for homes, offices, remote sites, and temporary setups where traditional wired connections are limited or unavailable.

Ultra-Fast Speed
The G530 unlocks the next generation of connectivity, offering 5G speeds of up to 3.4 Gbps and Wi-Fi 6 capabilities reaching AX3000. Leveraging Wi-Fi 6 technology, the G530 expands Wi-Fi bandwidth to 160 MHz and incorporates bi-directional MU-MIMO and OFDMA technologies, enhancing data rates and reducing latency for multiple users and devices. Whether users are gaming online, streaming 4K/8K content, participating in conference calls, or downloading large files, the G530 ensures a seamless, high-speed connection without lag.

MediaTek today announced the Dimensity 7300 and the Dimensity 7300X, a pair of ultra-efficient 4 nm chips for high-tech mobile offerings. Providing best-in-class power efficiency and excellent performance, the Dimensity 7300 chipsets enable effortless multitasking, superior photography, accelerated gaming, and AI-enhanced computing; additionally, the Dimensity 7300X is designed with flip-style foldable devices in mind, providing support for dual displays.

Both MediaTek Dimensity 7300 chipsets have an octa-core CPU consisting of 4X Arm Cortex-A78 cores operating at up to 2.5 GHz paired with 4X Arm Cortex-A55 cores. The 4 nm process provides up to 25% lower power consumption in the A78 cores compared to the Dimensity 7050. The CPU works together with the latest Arm Mali-G615 GPU and a suite of MediaTek HyperEngine optimizations to accelerate gaming experiences. In comparison to competitor alternatives, the Dimensity 7300 series offers 20% faster FPS and 20% improved energy efficiency. To further enhance gaming experiences, the new chips utilize smart resource optimization, optimize 5G and Wi-Fi game connections, and support Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.

Today, Lenovo launched the Lenovo ThinkPad P14s Gen 5 designed for professionals who need top-notch performance in a portable 14-inch chassis. Featuring a stunning 16:10 display, this mobile workstation is powered by AMD Ryzen PRO 8040 HS-Series processors. These processors are ultra-advanced and energy-efficient, making them perfect for use in thin and light mobile workstations. The AMD Ryzen PRO HS- Series processors also come with built-in Artificial Intelligence (AI) capabilities, including an integrated Neural Processing Unit (NPU) for optimized performance in AI workflows.

The Lenovo ThinkPad P14s Gen 5 is provided with independent software vendor (ISV) certifications and integrated AMD Radeon graphics, making it ideal for running applications like AutoCAD, Revit, and SOLIDWORKS with seamless performance. This mobile workstation is ideal for mobile power users, offering advanced ThinkShield security features and passes comprehensive MIL-SPEC testing for ultimate durability.

United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced the industry's first 3D IC solution for RFSOI technology. Available on UMC's 55 nm RFSOI platform, the stacked silicon technology reduces die size by more than 45% without any degradation of radio frequency (RF) performance, enabling customers to efficiently integrate more RF components to address the greater bandwidth requirements of 5G.

As mobile device manufacturers pack more frequency bands in newer generations of smartphones, the company's 3D IC solution for RFSOI addresses the challenge of integrating more RF front-end modules (RF-FEM) - critical components in devices to transmit and receive data - in a device by vertically stacking dies to reduce surface area. RFSOI is the foundry process used for RF chips such as low noise amplifiers, switches, and antenna tuners. Utilizing wafer-to-wafer bonding technology, UMC's 3D IC solution for RFSOI resolves the common issue of RF interference between stacked dies. The company has received multiple patents for this process, which is now ready for production.

The US government is investigating the potential national security risks associated with China's involvement in the development of open-source RISC-V chip technology. According to a letter obtained by Reuters, the Department of Commerce has informed US lawmakers that it is actively reviewing the implications of China's work in this area. RISC-V, an open instruction set architecture (ISA) created in 2014 at the University of California, Berkeley, offers an alternative to proprietary and licensed ISAs like those developed by Arm. This open-source ISA can be utilized in a wide range of applications, from AI chips and general-purpose CPUs to high-performance computing applications. Major Chinese tech giants, including Alibaba and Huawei, have already embraced RISC-V, positioning it as a new battleground in the ongoing technological rivalry between the United States and China over cutting-edge semiconductor capabilities.

In November, a group of 18 US lawmakers from both chambers of Congress urged the Biden administration to outline its strategy for preventing China from gaining a dominant position in RISC-V technology, expressing concerns about the potential impact on US national and economic security. While acknowledging the need to address potential risks, the Commerce Department noted in its letter that it must proceed cautiously to avoid unintentionally harming American companies actively participating in international RISC-V development groups. Previous attempts to restrict the transfer of 5G technology to China have created obstacles for US firms involved in global standards bodies where China is also a participant, potentially jeopardizing American leadership in the field. As the review process continues, the Commerce Department faces the delicate task of balancing national security interests with the need to maintain the competitiveness of US companies in the rapidly evolving landscape of open-source chip technologies.

Samsung Electronics and Qualcomm Technologies, Inc. today announced that the companies successfully completed 1024 Quadrature Amplitude Modulation (QAM) tests for both Frequency Division Duplex (FDD) and Time Division Duplex (TDD) spectrum bands, marking an industry-first for FDD. This innovative milestone and collaboration demonstrate the companies' dedication to supporting operators increase 5G throughput and boost spectral efficiency of their networks.

QAM is an advanced modulation technology to transmit data or information more efficiently. This directly relates to how many bits of data can be delivered in each transmission. While 256 QAM is widely used in commercial networks, Samsung and Qualcomm Technologies recently accomplished the latest 1024 QAM defined in 3GPP Release 17 specifications. This enhanced QAM technology helps operators maximize their use of spectrum resources and allows mobile users to seamlessly enjoy various mobile services such as live video streaming and online multi-player gaming, which require higher download speeds.

In what is a solid hint that Arm-based SoCs such as the Qualcomm Snapdragon X don't just intend to serve as cheaper alternatives to x86-based U-segment processors from Intel and AMD, but also compete in the high-end on virtue of their performance and battery life advantages; Samsung is designing a line of premium thin-and-light notebooks around the upcoming Qualcomm Snapdragon X Elite processor. Snapdragon X crams in the company's most advanced Arm CPU IP, and the latest generation Qualcomm Adreno iGPU; with Qualcomm claiming to offer 2x the CPU and graphics performance over x86 processors in its price-class, at 1/3rd the power (in other words, over 2x the battery life). It also packs a powerful NPU with 45 TOPS AI inferencing performance on tap. The Snapdragon X Elite is essentially Qualcomm's answer to the M3.

With the Snapdragon X Elite, Samsung has designed the new Galaxy Book 4 Edge, and WinFuture has some specs. Apparently the notebook comes in a 14-inch thin-and-light form-factor. The Snapdragon X Elite will be paired with 16 GB of LPDDR5/X memory, and 512 GB of NVMe-based SSD storage. Comms will include a 5G MODEM for connectivity anywhere; and possibly Wi-Fi 7 BE. Although we can't tell from the company images, it stands to reason that Samsung is using an AMOLED touchscreen display. WinFuture reports that Samsung plans to price the Galaxy Book 4 Edge at €1,759, which should put it in competition with several models of M3-powered MacBooks. The best part? The notebook is powered by Windows 11, and comes with a Microsoft-supplied translation layer for running legacy PC apps on it.

CTL, a global cloud computing solution leader for education and enterprise, will demonstrate the world's first Chromebook supporting 5G RedCap connectivity powered by, which was the world's first announced commercial release 17 5G RedCap modem RF system. CTL is preparing its Chromebook product lines for the future, where 5G will replace LTE connectivity. With more schools and enterprises standing up private cellular networks for anytime, anywhere connectivity, CTL is at the forefront of bringing built-in 5G connectivity to Chromebook devices.

Erik Stromquist, CTL's CEO, said, "CTL is committed to developing and introducing affordable solutions for the education and enterprise markets. We believe there is a big opportunity to address the digital divide by providing more advanced and affordable private network solutions to extend internet access to every user regardless of location. We are thrilled to collaborate with Qualcomm Technologies in demonstrating 5G next-gen possibilities at this year's Mobile World Congress."

Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a new series of 5G RedCap module integrated with MediaTek's T300 5G modem, which is the world's first 6 nm radio frequency system-on-chip (RFSOC) single die solution for 5G RedCap. By integrating a single-core Arm Cortex-A3 processor in a significantly compact PCB area, the FM330 series are optimal solutions that offer extended coverage, increased network efficiency and device battery life for industry customers.

Compliant with 3GPP R17 standards, the FM330 series supports mainstream 5G frequency bands worldwide and is capable of reaching a maximum bandwidth of 20 MHz, thus ensuring the peak data rate of up to 227 Mbps downlink and 122 Mbps uplink, sufficient to meet the demand for 5G applications with less data throughput while balancing the power efficiency. In hardware design, it adopts the M.2form factor measured at 30x42mm benefiting from the unique RFSOC solution integrated with T300, in addition to the optimized antenna design in 1T2R, which significantly saves the PCB area. Moreover, FM330 series is pin-compatible with Fibocom LTE Cat 6 module FM101, easing the concerns for customers' migration from 4G to 5G. Furthermore, the module provides 64QAM/256QAM (optional) modulation scheme to greatly optimize the cost and size.

Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, delivers an expanded portfolio of purpose-built infrastructure solutions to accelerate performance and increase efficiency in 5G and telecom workloads. With one of the industry's most diverse offerings, Supermicro enables customers to expand public and private 5G infrastructures with improved performance per watt and support for new and innovative AI applications. As a long-term advocate of open networking platforms and a member of the O-RAN Alliance, Supermicro's portfolio incorporates systems featuring 5th Gen Intel Xeon processors, AMD EPYC 8004 Series processors, and the NVIDIA Grace Hopper Superchip.

"Supermicro is expanding our broad portfolio of sustainable and state-of-the-art servers to address the demanding requirements of 5G and telco markets and Edge AI," said Charles Liang, president and CEO of Supermicro. "Our products are not just about technology, they are about delivering tangible customer benefits. We quickly bring data center AI capabilities to the network's edge using our Building Block architecture. Our products enable operators to offer new capabilities to their customers with improved performance and lower energy consumption. Our edge servers contain up to 2 TB of high-speed DDR5 memory, 6 PCIe slots, and a range of networking options. These systems are designed for increased power efficiency and performance-per-watt, enabling operators to create high-performance, customized solutions for their unique requirements. This reassures our customers that they are investing in reliable and efficient solutions."

To answer network operators' demands for energy-efficient scaling, Intel Corporation disclosed two major updates to drive footprint, power and total cost of ownership (TCO) savings across 5G core networks: the preview of its Intel Xeon next-gen processors, code-named Sierra Forest, with up to 288 Efficient-cores (E-cores), and the commercial availability of the Intel Infrastructure Power Manager (IPM) software for 5G core.

"Communication service providers require greater infrastructure efficiency as 5G core networks continue to build out. With the majority of 5G core networks deployed on Intel Xeon processors today, Intel is uniquely positioned to address these efficiency challenges. By introducing new Efficient-cores to our roadmap and with the commercial adoption of our Intel Infrastructure Power Manager software, service providers can slash TCO while achieving unmatched performance and power savings across their networks," said Alex Quach, Intel vice president and general manager of Wireline and Core Network Division. Energy consumption and reduction of the infrastructure footprint remain top challenges that network operators face in building out their wireless 5G core network.

SmartCow, an AI engineering company specializing in building complex hardware and software solutions for artificial intelligence at the edge, announces the launch of their latest product, Uranus Plus, an AI fanless embedded system powered by the latest NVIDIA Jetson Orin NX and Jetson Orin Nano system-on-modules. With its thermally efficient design and compact form factor, Uranus Plus is suitable for various smart applications. Uranus Plus comes with options for 5G, 4G, and Wi-Fi connectivity and includes a 256Gb NVMe SSD, enabling the simultaneous operation of multiple neural networks and processing of high-resolution images, enhancing a groundbreaking benchmark in AI-driven capabilities at the edge with support up to 100 TOPS of AI compute.

Uranus Plus supercharges vision AI application development at the edge with NVIDIA Metropolis Microservices for Jetson through app stack modernization. Uranus Plus developers now get access to the latest generative AI capabilities through simple API calls, along with a far faster path to development and cloud-native deployment of vision AI applications at the far edge.

At MWC 2024, Intel announced new platforms, solutions and services spanning network and edge AI, Intel Core Ultra processors and the AI PC, and more. In an era where technological advancements are integral to staying competitive, Intel is delivering products and solutions for its customers, partners and expansive ecosystem to capitalize on the emerging opportunities of artificial intelligence and built-in automation, to improve total cost of ownership (TCO) and operational efficiency, and to deliver new innovations and services.

Across today's announcements, Intel is focused on empowering the industry to further modernize and monetize 5G, edge and enterprise infrastructures and investments, and to take advantage of bringing AI Everywhere. For more than a decade, and alongside Intel's customers and partners, the company has been transforming today's network infrastructure from fixed-function to a software-defined platform and driving success at the edge with more than 90,000 real-world deployments.