Thermaltake, leading DIY chassis brand, is launching the world's first SideClick EasySwap HDD docking mid-tower with integrated USB 3.0 SuperSpeed connector particularly designed for AMD Leo gaming PCs, the ARMOR A60 AMD Leo Edition. Thermaltake lined up with AMD to design a computer chassis particularly catering to the latest AMD Leo gaming platform. It shows the typical bullet-proof armory contours of this series while the front panel has gotten an even fiercer AMD-red color ornamentation, with the left side panel sporting an AMD Leo tattoo.

The otherwise entirely black design with metal mesh elements lend the ARMOR series an extremely stylish and powerful appearance that attracts gamers and enthusiasts alike. The top and front red LED-fans enhance the overall combat ambience, resembling the typical MMORPG ambience but also providing ideal cooling characteristics for the AMD Leo platform. A special lock mechanism for your mouse and keyboard ensures that you'll always stay in arms.

AMD is planning to create a desktop implementation of its Opteron "Istanbul" monolithic six-core processor. Codenamed "Thuban" (named after a star in the Draco constellation, which means Dragon), the new processor will be based on the socket AM3 package for compatibility with existing and future desktop core logic. It features six cores, 9 MB of total cache (6 x 512 KB L2 + 6 MB L3). Thuban is aimed to make for AMD's high-end desktop processor, as the company prepares to face competition from a near-complete lineup of processors based on the Nehalem/Westmere architectures from Intel. It is expected to be the posterboy for AMD's "Leo" high-end consumer desktop platform that succeeds its current Dragon platform.

Some of the key components that make up AMD Leo platform are the upcoming AMD 890FX and 890GX chipset, companion SB800 series southbridge chips, and members of AMD's Evergreen family of DirectX 11 compliant graphics processors. On the software front, AMD will give its Fusion and Overdrive utilities some big updates. The SB800 series southbridge chips will feature native support for SATA 6 Gb/s and USB 3.0; connectivity is further enhanced by integrated Broadcom MAC Ethernet interfaces. While the Leo platform is expected to launch almost simultaneously with the 8-series chipsets, the six-core Thuban processor on the other hand comes later. It is due only in Q3 2010. Thuban will have come out an year after its enterprise implementation in the form of Opteron "Istanbul".