GIGABYTE, the world's leading premium gaming hardware manufacturer, today announced the AORUS C400 GLASS mid-tower gaming case, which has been honored with the 2024 Red Dot Design Award. The AORUS C400 GLASS features a vertical airflow cooling design, ensuring optimal stability and enhanced heat dissipation efficiency within the case. Its compact size of approximately 40 liters still provides an outstanding compatibility, ensuring that performance is not restricted by size limitations. Tool-less design adds convenience for gamers to assembly, enhancing a more user-friendly and efficient building process. Additionally, the case supports RGB FUSION lighting effects, allowing gamers to personalize their rigs' style with ease.⁠

Optimized Vertical Airflow Design
The airflow design of the case is one of the factors to affect the internal thermal performance. Inspired by the stack effect, the AORUS C400 GLASS enhances the speed of air convection, allowing air to rapidly circulate vertically within the case. This achieves more efficient heat dissipation, effectively reducing internal temperatures. The bottom, top, and front panels all feature large-area vent design, minimizing airflow obstructions and facilitating a large volume of intake and exhaust airflow. Additionally, the case comes with four 120 mm ARGB and PWM pre-installed fans positioned at the bottom and rear of the case, providing excellent airflow paths. This setup achieves high-efficiency heat dissipation, ensuring optimal ventilation and stable performance for the computer system.

MSI introduces a revolutionary case that departs from the traditional PC case design. This case features a panoramic view with 4 mm tempered glass using chamfering techniques allowing you to appreciate the internal setup from all angles. The rear of this case is decorated with metal nameplates, also comes with ARGB panels at the front bottom, presenting a subdued and refined style.

This case is compatible with both ATX and Micro-ATX Back-connect motherboards, enabling easy cable management to the back of the case. The dual-chamber design provides a spacious 90 mm area behind the motherboard for cable management. Don't worry about the cable management, the tool-free multi-functional cable covers to hide cables and install SSDs effortlessly. In addition, this case comes with tool-free panels on the top, sides, and front, reducing the hassle of dealing with screws. The integrated front I/O cable design solves the problem of small, hard-to-grasp cables and closely positioned ports, making assembly simpler. The well-arranged ventilation is on the side and bottom to provide fan installation options, and the magnetic dust filters at the side and bottom facilitate easy daily cleaning.

A market research of AMD Socket AM5 motherboards sold in South Korea by Danawa, provide some interesting insights on how gamers approach the platform. This research is confined to Korea, but can be extrapolated to other similar markets. The research studies the chipset model, and form-factor of Socket AM5 motherboards sold in the market. The most interesting finding of the research is that the AMD B650 is by far the most popular chipset for the platform, dwarfing even the entry-level A620 chipset by a factor of 8. A staggering 80% of the Socket AM5 motherboards being sold are based on the B650.

It's important to note here, that this figure does not include the B650E, which is separately shown making up just 2% of the volumes. The B650 (non-E) has nearly all platform features, with motherboards based on the chipset providing at least one Gen 5 M.2 NVMe slot that doesn't eat into the lanes of the x16 PEG slot; and with the current generation of GPUs not featuring the PCIe Gen 5 host interface, customers seem more than happy with the Gen 4 x16 PEG slot provided by B650 motherboards. What's more, you get CPU overclocking and memory overclocking on this mid-range chipset, so it appeals to a very wide demographic. The B650E, on the other hand, provides a Gen 5 x16 PEG slot, and motherboards based on this chipset tend to offer premium I/O features, such as a high-end onboard audio solution, premium wireless networking, among others.

ssupd, Lian Li's sister brand, is making an appearance at Computex 2024 with the launch of its newest FANTACY fan series and the XHUTTLE ATX case. The FANTACY fans are ssupd's first foray into the system fan market, and they come packed with a few features. Utilizing a magnetic series connection system, up to seven FANTACY fans can be daisy-chained together, minimizing cable clutter. While seven fans can be connected, SSUPD recommends using a maximum of six for optimal performance. One of the standout features of the FANTACY fans is their double-sided annular halo design. Each fan has two independently controllable LED rings, allowing users to create unique lighting effects on the front and back of the fans. The fans' matte and transparent sides ensure that the lighting effects are visible from all angles.

At Computex 2024, DarkFlash, maker of PC hardware and accessories, unveiled the DY450 and DY450L computer cases. The DY450 and DY450L boast a versatile design that supports ATX, Micro ATX, and ITX motherboards, ensuring compatibility with a wide range of builds. While the DY450 offers ample interior space with dimensions of L451 x W258 x H491 mm, the DY450L takes it a step further with slightly larger dimensions of L451 x W258 x H568 mm. Both cases feature a sleek front I/O panel equipped with USB 3.0, Type-C, and HD Audio ports, providing seamless connectivity and immersive audio experiences. Constructed from durable SPCC 0.8 mm material, these cases are built to withstand the rigors of modern computing, ensuring long-lasting performance and sturdy build quality. The DY450 offers a generous drive bay configuration supporting up to 5 HDDs or SSDs, while the DY450L provides ample storage options with support for up to 4 drives. With 7 and 9 expansion slots, respectively, and support for 90-degree installation, these cases offer unparalleled versatility in component placement and arrangement.

ENERMAX unveiled a couple of new PC cases at the Computex 2024 show, including the Air240 mid-tower case, the Pano270 and the Pano D58. The new cases feature enhanced cooling performance, modular internal structure for easier installation and cable management, as well as support for motherboards with back connectors.

The new ENERMAX Air240 is a mid-tower case supporting up to ATX motherboards, and featuring standard three-side mesh panel design, which should enhance overall cooling performance, according to ENERMAX. The Air240 is pretty much a standard PC case, but it does have a unique feature which allows the PSU compartment baffle to be redirected in order to provide more airflow to the graphics card. The new ENERMAX Pano270 and Pano D58 PC cases certainly attracted a lot of attention as these are following the current design trend with a 270-degree curved glass panel, which provides a panoramic view of key hardware. The Pano270 supports motherboards with backside connectors, and while it is a smaller case that supports up to a Micro-ATX motherboards, it still supports up to 360 mm AIO coolers and up to nine fans. It also has 37 mm of cable management space, and can support up to 170 mm tall CPU air coolers. The Pano D58 is a slightly different and bigger counterpart and while it has the same panoramic glass, it isn't a curved one. Of course, since it is bigger, it supports ATX motherboards, up to 360 mm AIO coolers on the side and top, and up to nine fans. It supports up to 250 mm long PSUs, up to 420 mm long GPUs, and up to 180 mm tall CPU coolers. All three CPU cases should be available soon.

ALmordor is a Chinese case PC hardware maker focusing on providing sleek-looking aliminium PC cases. Coming from the name that stands for AL (aluminium) and Mordor (from J. R. R. Tolkien's fictional world), the ALmordor brand wants to be seen as an elegant and mysterious. On display, there were several interesting case builds like the SliverLining 160G ITX case, which serves as a dual-chamber ITX build capable of water cooling. Capable of supporting a 320 mm GPU and 240 mm water cooling radiator, the SilverLining 160G can hold an SFX PSU and an HDD attached next to it. Storage options include SSD expansion next to the motherboard.

At Computex 2024, Wizmax, a manufacturer of computer hardware such as cases, headphones, mice, etc., offered an interesting perspective on the inspiration for its computer cases. Diversifying from the regular sleek panels, Wizmax turned to more traditional art when designing its PC case lineup. Starting with the M60-Moon, the case brings a traditional Korean design pattern on its front bezel, carrying a touch of cultural elegance to modern PC setups. This ATX form factor case supports 410 mm-long GPUs and 160 mm-tall CPU coolers. It also includes room for a 360 mm front water cooler, ensuring adequate airflow and cooling performance.

Inside the G.Skill booth at Computex 2024, we spotted three new case models. The first case that draws attention is a prototype/concept, named Project Alpha it comes with unique shapes and ATX/BTX form factor conversion on the fly. The next two cases are Mid-towers, G351 and M5 Vision respectively, both supporting EATX, ATX, Micro-ATX, Mini-ITX motherboards and featuring large glass panels with a note about G351 wooden front connectors panel that make it look more stylish.

Alongside full support for water cooling systems (360 / 260 / 240 / 140 / 120), you can fit 9 fans on G.Skill G351 and a whooping 11 fans on M5 Vision. We cannot say for sure when and if the Project Alpha concept case will be available, the other two should arrive in stores later this year.More pictures follow.

Phanteks took the Computex 2024 show by force, showing off several new and improved cases, including the new Evolv X², the Eclipse G400A and G400N, which are successors to the P400 line, upgraded NV5 MKII and NV9 MKII cases, and the new Enthoo Pro II Server Edition XL case for the server market.

The star of the show is definitely the new Evolv X², a case that Phanteks says is redefined to fit modern consumer needs. It certainly has the modern and refined aesthetic to appeal to the wider audience, with brushed aluminium interior panels and full front to side glass panel. Some of the key features include integrated cable management, key fan positions to cool down and show off most hardware components, as well as support for rear-connector mainboard, something that most modern motherboards will have.

MSI, a leading global server provider, today announced the availability of high-performance server platforms supporting AMD EPYC 4004 Processors for small and medium businesses and regional-hosted IT service providers to deliver essential security capabilities and energy efficiency. "Businesses across all scales are discovering the advantages of advanced computing, connectivity, and analytics capabilities as applications and services become more widespread," said Danny Hsu, General Manager of Enterprise Platform Solutions. "MSI server platforms, supporting AMD EPYC 4004 Processors, empower our customers to implement high-performance computing with cost-effective, ease of deployment, and manageability features. This capability addresses challenges such as system costs, limited IT expertise, and other infrastructure constraints that were previously prohibitive."

"The new AMD EPYC 4004 Series CPUs, along with our strong ecosystem of technology partners, bring enterprise solutions to a traditionally underserved market and ensure that small and medium businesses have access to highly-performant technologies that help them stay competitive," said John Morris, corporate vice president, Enterprise and HPC Business Group, AMD. "The AMD EPYC 4004 CPUs fill an important market gap, providing cost-optimized solutions with enterprise-grade dependability, scalability and security in cost-optimized system configurations that make sense for smaller businesses and dedicated hosters."

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of premium gaming hardware, today announced the new AORUS ELITE series power supplies. This series offers four models to meet the needs of different users, including: AORUS ELITE P1000W 80+ Platinum Modular PCIe 5.0 (Black), AORUS ELITE P850W 80+ Platinum Modular PCIe 5.0 (Black), AORUS ELITE P1000W 80+ Platinum Modular PCIe 5.0 ICE (White), and AORUS ELITE P850W 80+ Platinum Modular PCIe 5.0 ICE (White).
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Certified with 80 Plus Platinum and fully compliant with Intel ATX 3.0 and PCIe Gen 5.0 standards, the AORUS ELITE series power supplies cater to high-end gamers and users with stable computing needs, offering exceptional performance and reliability. Their compact design packs a 120 mm Fluid Dynamic Bearing (FDB) smart silent fan and the AORUS unique magnetic plate, combining quiet operation with a stylish look.

Cooler Master, a global leader in PC components, gaming peripherals, and tech lifestyle solutions, has today launched the MasterBox 600 - the latest offering in their renowned ATX case lineup. The MasterBox 600, is packed with features designed to provide great performance and is still easy to build. Features like a back-connected motherboard support to versatile cooling options and a removable HDD cage, ensure the MasterBox 600 is designed to provide the ultimate case for just about any type of build.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today launched multiple products for the discerning gamer on a budget. In hopes of fulfilling the needs of PC builders of all levels, XPG has delivered a new line of entry level Gold efficiency power supply units and ARGB PWM fans. With the new XPG CORE REACTOR II VE and XPG VENTO PWM fans, upgrading your system has never been easier.

CORE REACTOR II VE
While it is always a challenge to strike a balance between cost and performance, XPG always puts the needs of end users first. Although the CORE REACTOR II VE is being sold as a Value Edition product, the specs on this PSU are anything but cheap. Inspired by the design of the award winning CORE REACTOR II, through the use of XPG's exclusive PSU topology, this power supply still delivers performance that surpasses Intel ATX 3.1 standards. Between the Gold efficiency, DC-DC circuit design, and the dedicated 12V-2x6 connector, this power supply unit is perfect for your modern gaming needs. With 650 W, 750 W, and 850 W models available, XPG CORE REACTOR II VE is the perfect foundation for a current gen build.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is excited to launch the Dr. Power III, an enhanced portable power tester that supports the latest ATX12V v3.1 standard. This tester simplifies the process of checking the operational status of different PSU connectors. Compared to its predecessor, the Dr. Power III additionally supports a 12+4pin connector, enabling it to test the next-gen power supplies which are designed for high power consumption GPU.

Whether pre-build checks or troubleshooting existing setups, the Dr. Power III can offer straightforward voltage and PG value detection. To initiate testing, easily use cables to attach connectors between the power supply and the Dr. Power III, press the check button, and the test will begin. The Dr. Power III supports various connectors, including the latest 12+4pin, 24pin, PCIe 6/8pin, SATA, CPU 4/8pin, and peripheral connectors. It is compatible with all contemporary ATX PSU, Dr. Power III meticulously detects the SENSE0/SENSE1 sideband signals of the latest PCIe 12+4pin connector, distinguishing power levels of 150 W, 300 W, 450 W, and 600 W.

ENERMAX, an industry-leading force dedicated to designing high-performance computer hardware and cooling solutions, launches its latest power supply series, the REVOLUTION D.F. 12, the world's smallest ATX 3.1 power supply with only 122 mm in-depth. This design maximizes space for airflow within PC cases while delivering robust power in line with the ATX 3.1 specifications, including up to a 235% power excursion. Equipped with a 600 W 12V-2x6 cable, the REVOLUTION D.F. 12 ensures uncompromised performance for high-end graphics cards and cutting-edge AI computing. The REVOLUTION D.F. 12 also fits seamlessly into micro ATX cases, providing ample room for efficient cable management.

Committed to sustainable computing, REVOLUTION D.F. 12 offers a highly technical power solution aimed at enhancing power conversion efficiency and reducing carbon emissions. This commitment to sustainability is further demonstrated in the product's shipping and packaging innovations. The REVOLUTION D.F. 12 features an innovative 115 mm dual-ball bearing fan with ENERMAX's patented Dust-free Rotation (D.F.R.) technology, providing a self-cleaning function and an activated switch button to enhance system longevity by minimizing dust accumulation inside the power supply. The power supply operates in fanless mode when under 50% load, ensuring complete silence at low and medium workloads. Additionally, users will be able to manually activate the D.F.R. function using the D.F.R. switch button, which can also serve as a power-on indicator.

ASUS today announced the TUF Gaming GT302 ARGB chassis, a case that makes it easy to build a high-performance PC with great cooling. Prepped and ready for great out-of-the-box cooling, equipped for wide compatibility with high-performance parts, and thoughtfully constructed inside and out for an easy PC DIY experience, the GT302 ARGB resets expectations for a mainstream case.

Great cooling - right out of the box
Most PC builders go big on cooling to ensure an excellent balance of performance and quiet operation. From the moment it is pulled out of the packaging, the TUF Gaming GT302 ARGB gives users a superb foundation for high-end cooling. This starts with a front panel designed first and foremost to maximize airflow efficiency. It is constructed of a wide-open, high-porosity square-type mesh that leaves ample room for fresh air to enter a PC. Four pre-installed 140 mm ARGB case fans move cool air through the chassis. These fans are exceptionally thick, measuring 28 mm in depth. These fans deliver up to 3 mmH2O static pressure and 115 CFM airflow for excellent cooling with quiet operation.

EK, the leading name in custom loop liquid cooling, is proudly announcing the launch of the latest water-cooling-focused PC case made in collaboration with InWin, the renowned case manufacturer. The new EK-Quantum InWin 977EK was engineered from scratch with water cooling and ease of use in mind. It's a premium quality PC case that can accommodate two 420 mm radiators, has dedicated mounts for pumps, reservoirs, and combo units, and offers the ultimate user-friendly experience for custom loop liquid cooling enthusiasts.

EK-QUANTUM InWin 977EK
Crafted from a single, robust piece of 4 mm-thick, high-quality brushed aluminium, the outer shell of this PC case proudly embodies the iconic InWin aesthetic. Meticulously bent by skilled artisans using hand-operated techniques, it showcases their dedication to craftsmanship.

Corsair today announced its re-entry into the dual chamber PC case market. Building on the direct airflow and impressive performance of the 680X and 280X cases, the new 6500 and 2500 Series deliver unprecedented levels of customization. Whether you need the spacious mid-tower chassis of the 6500 for a powerhouse desktop or the compact mid-tower design of the 2500 for a micro ATX build, their dual chamber layout makes building easier, promoting efficient cooling alongside a clean and professional look. With support for the latest reverse connector motherboards, options to convert from fully mesh airflow to tempered glass panels, and a range of functional and aesthetic accessories, these new cases mark a leap forward in dual-chamber case design.

The new reverse connector motherboards are a game-changer for PC builders. These motherboards, such as the ASUS BTF and MSI Project Zero, feature connections discreetly tucked away behind the motherboard tray. This layout, especially when combined with the Corsair iCUE LINK ecosystem, dramatically simplifies the building process and enables a nearly cable-free view within the main chamber of the case. iCUE LINK technology takes this a step further by enabling fans and other internal components to connect to each other seamlessly, reducing the need for multiple types of cables and connectors.

[Editor's note: Our in-depth review of the Corsair 6500X case is now live]

ASUS IoT, the global AIoT solution provider, today announced the launch of its new lineup of industrial motherboards and edge AI computers powered by the latest Intel Core (14th gen) processors. These cutting-edge solutions offer supreme computing performance, enhanced power efficiency, and accelerated connectivity, making them ideal for a wide range of industrial applications. One of the key features of these new solutions is the accelerated transfer speeds and enhanced power efficiency offered by DDR5 memory. Compared to DDR4, DDR5 memory provides 50% faster transfer speeds and 8% improved power efficiency, ensuring reliability with ECC technology.

ASUS IoT industrial motherboards also support double-speed PCI Express (PCIe) 5.0, which doubles the speed of PCIe 4.0, while maintaining full backward compatibility for system flexibility. This allows for faster data transfer and expandability, meeting the demands of modern industrial applications. The integrated Intel UHD Graphics technology in ASUS IoT motherboards supports up to 8K60 HDR video and multiple 4K60 displays, providing vivid graphics and powerful AI acceleration. This makes them ideal for various applications, including retail, healthcare and AI in smart factories.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, introduces the BIH61-AHA industrial motherboard, designed for smooth, seamless industrial application from AIOT machines, Edge computing, HMI machine, Digital Signage and more. Built based on the Intel H610 chipset, the BIOSTAR BIH61-AHA motherboard is engineered to support the latest Intel Core i7/i5/i3 processors (LGA1700). Featuring the latest DDR5 technology with support for 2x DDR5-4800 MHz LONG-DIMM up to 96 GB max, it offers extensive customization to meet the intricate needs of various industries.

Targeting a diverse audience, from system integrators looking to build sophisticated AIoT machines to enthusiasts aiming to construct powerful automation or edge computing systems, the BIH61-AHA provides unparalleled connectivity and expansion options. With 10 COM ports, 5 PCI slots, dual Intel GbE LAN ports for reliable and high-speed network communication, extensive USB connectivity with 6x USB2.0 & 4x USB 3.2 Gen 1 ports, and multiple storage interfaces, including 4x SATA 6 Gb/s and 1x M.2 M-KEY socket. Its support for a wide operating temperature range (0 ~ 60 degrees C) and ATX power input also ensures the motherboard's adaptability in challenging environments.

Thermaltake today rolled out the View 270 TG ARGB, a line of ATX mid-tower cases featuring a pillarless front-left corner, for a more unimpeded view of your build. Much like the ZALMAN P10, this case doesn't feature a wrap-around single-piece glass, but rather two planar tempered glass panels that meet at the corner, so you'll notice the edge line. Still, this is better than an inch-thick pillar. Also like the ZALMAN P10, the Thermaltake View 270 TG ARGB features a horizontally partitioned layout that extends to even its exterior—the tempered glasshouse only covers the upper compartment. The bottom compartment with the PSU- and drive bays feature static perforated panels along the left- and front sides; and is only accessible from the single piece right side-panel. The right panel features perforations toward the front, aligning with the side-facing radiator mount. An interesting aspect about this mount is that it's located entirely in the crawlspace behind the motherboard tray, it doesn't intrude into the motherboard tray compartment, and so you can mount a 360 mm radiator without its fans impeding your long graphics cards in any way.

The motherboard tray seats E-ATX (or smaller) motherboards with 7 expansion slots; you get room for graphics cards up to 42 cm in length, and CPU coolers up to 18 cm in height, so there's plenty of room to wrestle with your graphics card's 12VHPWR cable. Fan and radiator mounts, besides the 3x 120 mm side-facing mount detailed above, include three 140 mm / 120 mm top mounts that can hold a radiator as large as 360 mm; and a 120 mm rear exhaust. The partition dividing the bottom and top compartments is perforated, and you can mount up to three 120 mm fans here. The case measures 230 mm x 454 mm x 456 mm (WxDxH), weighing 6.3 kg. All its metal bits are made of SECC steel. The case comes in four color trims—Black (CA-1Y7-00M1WN-00), Snow (CA- 1Y7-00M6WN-00), Hydrangea Blue (CA-1Y7-00MFWN-000, and Matcha Green (CA-1Y7-00MEWN-00). The included rear 120 mm fan comes with addressable RGB lighting. The company didn't reveal pricing.

PC power supply manufacturer Seasonic has introduced a new limited-edition variant of its Vertex 1000 W 80+ Gold certified modular power supply featuring an eye-catching design inspired by cherry blossoms. Dubbed the "Vertex Sakura," this specially-themed PSU sports a clean white color scheme with pink Sakura flower graphics and a unique textured paint finish. The Vertex Sakura caters specifically to PC enthusiasts and case modders in Japan who want to build a themed rig coordinated around the colors and aesthetic of traditional Japanese cherry blossoms. It offers the same fully modular cabling as the standard Vertex 1000 W model, allowing builders flexibility in cable management.

The PSU also meets the latest ATX 3.0 specifications, including a 12VHPWR connector to support next-generation high-wattage GPUs. Seasonic showcased the Vertex Sakura 1000 W unit at 30,000 yen (around $200 USD) in Japan, where retailers recommend interested buyers preorder as soon as possible due to limited availability. Specific regional launch details outside of Japan are still forthcoming. But the Vertex Sakura's blend of technical prowess and stunning cherry blossom visual flair will likely attract global attention from PC builders looking to add an extra touch of style to their high-end systems.

In a surprising turn of events, SK Hynix has hinted at the possibility of the Compression Attached Memory Module (CAMM) standard, initially designed for laptops, being introduced to desktop PCs. This revelation came from a comment made by an SK Hynix representative at the CES 2024 in Las Vegas for the Korean tech media ITSubIssub. According to the SK Hynix representative, the first implementation is underway, but there are no specific details. CAMM, an innovative memory standard developed by Dell in 2022, was certified to replace SO-DIMM as the official standard for laptop memory. However, the transition to desktop PCs could significantly disrupt the desktop memory market. The CAMM modules, unlike the vertical DRAM sticks currently in use, are horizontal and are screwed into a socket. This design change would necessitate a complete overhaul of the desktop motherboard layout.

The thin, flat design of the CAMM modules could also limit the number that can be installed on an ATX board. However, the desktop version of the standard CAMM2 was announced by JEDEC just a month ago. It is designed for DDR5 memory, but it is expected to become mainstream with the introduction of DDR6 around 2025. While CAMM allows for higher speeds and densities for mobile memory, its advantages for desktops over traditional memory sticks are yet to be fully understood. Although low-power CAMM modules could offer energy savings, this is typically more relevant for mobile devices than desktops. As we move towards DDR6 and DDR7, more information about CAMM for desktops will be needed to understand its potential benefits. JEDEC's official words on the new standard indicate that "DDR5 CAMM2s are intended for performance notebooks and mainstream desktops, while LPDDR5/5X CAMM2s target a broader range of notebooks and certain server market segments." So, we can expect to see CAMM2 in both desktops and some server applications.

In addition to the new AIO coolers and PSUs, ENERMAX brought a full lineup of new PC cases to the CES 2024 show, including the new ENERPAZO lineup, the new EK98, and the SK30 V2 PC cases. The ENERPAZO lineup with the ENERPAZO EP33 mid-tower and the ENERPAZO EP23 mini-tower PC cases, and the EK98 mid-tower PC case, all come with built-in USB 3.2 Gen 1 and USB 3.2 Gen 2 Type C ports and reusable PCIe slots, as well as feature recognizable ENERMAX design with grill front and glass side panel.

The ENERPAZO EP33 supports up to an E-ATX motherboards, has support for a 420 mm AIO liquid CPU cooler and up to 11 fans, while the ENERPAZO EP23, as mini-tower PC case, supports up to a micro-ATX motherboard and a 360 mm AIO liquid CPU cooler and up to 8 fans. The EK98 supports up to a 360 mm AIO liquid CPU cooler and up to 9 fans, as well as comes with vertical GPU installation support with rotatable PCIe slots and pre-installed 4 ARGB PWM fans. ENERMAX also showcased the new SK30 V2 PC case mid-tower PC case which also comes with USB 3.2 Type-C ports, supports up to 360 mm AIO liquid CPU cooler ass well as comes with the same vertical GPU installation support and couple of pre-installed ARGB PWM fans.