According to Igor's Lab, who has gotten their hands on a PCI-SIG draft engineer change notice, it looks like the not entirely uncontroversial 12VHPWR connector won't be long lived. The PCI-SIG is getting ready to replace it with the 12V-2x6 connector, which will be part of the ATX 3.1 spec and the PCI Express 6.0 spec. The new connector doesn't appear to have any major physical changes though, but there have been mechanical modifications, such as the sense pins having been recessed further back, to make sure a proper contact is made before higher power outputs can be requested by the GPU. The good news is that at least in the draft spec, the 12V-2x6 connector will be backwards compatible with 12VHPWR connectors.

One of the bigger changes, at least when it comes to how much power the new connector can deliver, is that there will be new 150 and 300 Watt modes in addition to the 450 and 600 Watt modes for the sense pin detection. The 12V-2x6 connector is rated for at least 9.2 Amps per pin and the new connectors will carry a H++ logo, with th older 12VHPWR connectors getting a H+ logo. The PCI-SIG has also added stricter requirements when it comes to the cable design and quality, which should hopefully prevent some of the issues the 12VHPWR implementations have suffered from. We should find out more details once the PCI-SIG has finalised the 12V-2x6 connector specification. In the meantime, you can hit up the source link for more technical drawings and details.

ENERMAX, an industry-leading force dedicated to designing extreme performance computer power supplies and cooling solutions, launches its latest Intel ATX 3.0 and PCIe 5.0 ready power supply series -the REVOLUTION D.F. X, from 850 W to 1600 W, featuring one native 600 W 12VHPWR cable, an extra 600 W 12VHPWR adapter cable for multiple GPUs usage, ARGB side panel and ENERMAX's patented Dust-free Rotation technology for self-cleaning function to make sure your systems run stable and stylish for years.

The REVOLUTION D.F. X power supply series is 80 Plus Gold certified and compliant with Intel ATX 3.0 and PCIe 5.0 standards in a compact 140 mm chassis in depth. To meet the demands of ultra-efficiency computing performance, REVOLUTION D.F. X is characterized by industrial-grade 100% Japanese capacitors, advanced LLC and Synchronous Rectifier (SR) design to deliver outstanding performance and unparalleled flexibility for PC enthusiasts and professionals.

ASRock Industrial is introducing new choices in industrial motherboards powered by 13th Gen Intel Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads that boost computer-intensive edge performance. They come equipped with Intel W680, Q670, and H610 chipsets, and offer support for up to DDR5-5600 memory modules and PCIe Gen 5, allowing expanded possibilities and seamless integration within industry-specific applications.

By harnessing the power of the 13th Gen Intel Core Processors, they leap up to 1.04x/1.34x/1.25x faster in single-thread, multi-thread, and CPU image classification inference performance, respectively, compared to the preceding 12th Gen Intel Core processors. The new 13th Gen Intel CPU motherboards with DDR5 support, available in Mini-ITX, Micro-ATX, and ATX form factors, have been specifically designed to cater to the unique requirements of the Edge AIoT applications in commerce, automation, robot, entertainment, and security industries.

Raijintek's exhibit at Computex 2023 was a captivating showcase of their innovative products for water-cooling enthusiasts. The company turned heads with its all-black brushed aluminium finish components, beautifully augmented with RGB lighting. Raijintek started off with their CPU water blocks, engineered to provide efficient cooling for high-performance CPUs. The RGB lighting breathed life into the elegant all-black blocks, rendering them both practical and stylish. Also featured was their state-of-the-art pump and reservoir combinations, with the same design ethos and a spotlight on efficient operation. Using the same black design, Raijintek extended their design to their radiators, with efficient heat dissipation to keep systems cool. Furthermore, their distribution plates continued to impress with their sleek designs, offering optimal flow paths for cooling fluid. There was a Chinese-inspired mod that showed usage of the company's components in the modded build.

SilverStone showed up to Computex with a variety of new cases on offer covering everything from a hybrid rack-mountable / pedestal 5U, to a retro-inspired April Fool's joke, to their largest and flashiest ATX full-tower to date. SilverStone has a reputation for quality and over engineering and it clearly shows in this year's selection. Starting off with the most engineered, and likely most expensive: the recently released Alta F2 was on display with a fully water cooled build showing off the expansive options available in the giant tower. Alta F2 utilizes a 90 degree rotated configuration taking design elements from the older Raven and Fortress series of cases. What the Alta F2 does different is where it allows the GPU to be installed; along the left side (traditionally the back) there are three expansion slots tilted at precisely 11.3 degrees.

These tilted slots are intended to offer as much forced air cooling as possible to the GPU from the bottom mounted 180 mm Air Penetrator 184i PRO fans, and SilverStone dialed in this angle to decimal precision to ensure this. There still exists a standard 9-slot layout along the top of the case (remember, everything is rotated 90 degrees so that's where the "back" is) for those that fill every slot on their motherboard. Since airflow moves bottom-to-top there are intake filters lining the lower chamber of the chassis, and the top panel is almost entirely open for exhaust. The lower chamber is also setup to allow four 3.5 inch drives to be mounted, while four more drives can be mounted in the optional forward mounted, and also angled, drive cages. The Alta F2 has already reached retail and demands a hefty $800 USD price point.

Editor's note: Our in-depth review of Endorfy Arx 700 Air is now live.

At Computex 2023, Endorfy has launched the Arx 700 Air and Arx 700 ARGB PC cases, designed with maximum cooling potential and easy component access. The cases accommodate a tall cooling system, up to 8 fans, and any current graphics card, with the Arx 700 Air featuring 5 Stratus 140 PWM fans and the Arx 700 ARGB including 4 illuminated Stratus 140 PWM ARGB fans. The design is minimalist, with a tempered glass side panel that allows internal component visibility. Both cases measure 486×228×472 mm (H×W×L) and support ATX, microATX, and ITX motherboards, with a graphics card clearance of 410 mm, CPU cooler clearance of 179 mm, and power supply clearance of 340 mm. They have 7 expansion slots and internal bays that include 1× 2.5"/3.5" and 6× 2.5". The cases can accommodate up to 8 fans and come with built-in dust filters. The front I/O includes 1× USB-C, 2× USB-A, 1× headphones (minijack 3.5 mm), 1× microphone (minijack 3.5 mm), and power and reset buttons. The Arx 700 Air and Arx 700 ARGB are priced at 109 and 119 EUR, respectively.

The Endorfy Arx 500 Air and Arx 500 ARGB are also shown; however, we don't have exact specifications yet, and we expect them to follow soon. Visually, we see that the 500 series is shorter than the 700 series. The cases are priced at 99 and 109 EUR, respectively.

AZZA, a company known for creating cases of interesting design, had a new lineup to show at Computex 2023. The star of the show may very well be AZZA's new Sanctum 810, a giant cube case with a cut corner that carries support for up to seven 120 mm fans, creating adequate airflow once configured. There is even room to mount a 360 mm radiator for a custom water cooling build, as shown in the pictures below.

Next, we have AZZA's oddly-shaped Mesa 811 -- a twisted cube case that supports E-ATX motherboards, has glass side panels, and even has perforated aluminium panels. It also fits three 120 mm fans in the front and only has one 120 mm in the back, but there is space to do a custom cooling loop.

be quiet!, a German company focusing on creating PC components and accessories, had a strong presence at Computex 2023. Showing off its cases and power supplies, the company introduced a few additions to its portfolio of offerings. For starters, be quiet! has introduced a new case series called Shadow Base. The new Shadow Base lineup is focused on maximum airflow and maximum performance, where the company has made a new open mesh design that allows for "exceptionally high airflow." Inaugurating model of the series is the Shadow Base 800, which comes in three flavors: standard, DX, and FX. The standard edition is just a regular case without flashy RGB; the DX model has an RGB strip, while the FX model is tailored for maximum RGB illumination across the case. With up to E-ATX motherboard support, the case supports three or four 140 mm fans, depending on the variant. You can see the specification sheet below.

The time has finally come for Streacom to reveal the fruits of their collaborative labor with CALYOS in creating the SG10 fanless chassis. Though originally based on the NSG S0 (or NSG0), the entire project has undergone a complete redesign over the last few years to deliver the SG10 being shown off at Computex 2023. The new design is a 15 kg metal and glass monster featuring two of CALYOS' specially designed "Loop Heat Pipe" evaporation cooling systems that pull heat from the CPU and GPU, then passively radiate that heat away via two large condensers at the top of the chassis. The main body of the chassis is assembled from steel and extruded aluminium, and features tempered glass side panels. The front, rear, top, and bottom are all open to allow air to move through the chassis. The interior of the chassis uses a dynamic rail system, similar to Streacom's other case designs such as the DA2 and DB4, where adjustable brackets mount to structural rails running along the top and bottom of the chassis. The main components, such as an ATX motherboard and the GPU, are to be mounted to these rails in an X configuration on opposite sides of the chassis, facing each of the glass panels, while the power supply mounts to the floor of the chassis behind the motherboard. For drive support the chassis features an array of extra brackets with slots for screws to affix five 3.5" or 2.5" drives to. The front and optional rear I/O plates mount to the vertical steel structures and can be placed anywhere on those sides.

Streacom had a demo at their booth with the SG10 cooling a Core i9-13900K and GeForce RTX 4080 under a FurMark load with a total system power draw of around 680 W. While the RTX 4080 was sitting at a quite comfortable 75° C, the i9-13900K was stuck right up against its thermal limit of 100° C. Streacom claims the CPU and GPU loops of the cooler utilize identical designs with the only difference being the mounting bracket, however due to the GPU block being mounted directly to the GPU die the cooling is rated at 350 W rather than 250 W. They claim if the CPU loop is mounted direct-die it would perform similarly to the GPU loop, and it's possible to add 120 mm fans along the top, below the condensers, to further improve cooling. Another complication—not unlike with custom water cooling parts—is the GPU side of the cooler requires that mounting brackets and VRM/VRAM heatsinks be made to fit specific generations of cards. As such Streacom only advertises compatibility with the most recent generations of GeForce RTX 3000 and 4000 series, as well as Radeon RX 6000 and 7000, and only those which have a PCB shorter than 280 mm, but support is expected to improve with new bracket kits available after launch. The pricing has yet to be confirmed for the SG10 but it's rumored that it will land around the $1000 USD price point when it launches.

A new series of ENDORFY Arx 700 Air and Arx 700 ARGB PC cases has just been released, developed for gamers, creators, and technology enthusiasts who are looking for maximum cooling potential and convenient access to all internal components. These are the largest cases to date in ENDORFY's portfolio, able to accommodate, among other things, a tall cooling system, 8 fans, and virtually any graphics card currently available on the market.

The ENDORFY Arx 700 is designed to provide the best possible airflow, while ensuring easy and convenient installation and the maximum possible compatibility with air- and water-cooling systems or the latest, large-sized graphics cards. Arx 700 provides maximum cooling potential, wide possibilities of computer configuration, and freedom in the choice of components used.

During Computex 2023, EK Water Blocks, a company known for making all kinds of liquid cooling solutions, showed off a concept case in partnership with InWin. Called 977EK, the concept case is a pre-production model that centers around the idea of a brushed aluminium shell combined with tempered glass panels. The case is made out of the internal structure, and for the outside, the two brushed aluminium sheets meet in the back and at the bottom of the case, removing the visible lines of the 4 mm thick aluminium sheets meeting, improving aesthetics. On the sides, the case carries two tempered glass panels held by thumb screws in the corners. An odd shape perforates the top part of the aluminium sheet.

The internal structure is interesting, as the case is built for water cooling of the system. While the motherboard tray can support any format from Mini-ITX to E-ATX, the tray itself can be rotated, reversed, and removed entirely based on user preference. For radiator setup, the 977EK concept case can accommodate up to 420 mm radiators with 45 mm thickness at both the top and bottom of the chassis. Additionally, the case has support for 350 mm GPU, 7 or 8 PCIe slots (depending on the configuration), a PSU of 160 mm length, and an option for either one 3.5-inch drive bay or two 2.5-inch bays. The final production case will see some changes, as EK notes; however, they won't be too significant.

[Editor's note: Our in-depth review of Antec Performance 1 FT Case is now live]

With outstanding cooling performance and lots of useful features, Antec Inc. presents the latest flagship of full towers, the new Performance 1 FT. Featuring an airflow-enhanced front panel design, magnetic front filter, and four pre-installed PWM fans, this new chassis provides efficient airflow and great cooling performance. The case is now commercially available from MSRP US$159.99.

The new Antec flagship supports the latest RTX 40 Series GPUs. Considering the increasing demands for CPU and GPU cooling, Antec designed the Performance 1 FT to enhance the air intake, improve the cable routing, and enable an easy installation with various options. The new temperature display function allows to keep control of the components. The display screen located on the case top allows users to check the temperature of the GPU and CPU at a glance. It addresses the need for temperature monitoring without purchasing expensive cooling kits.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today unveiled the latest AMD A620 series motherboards with optimal memory performance and all-round features. With the perfect support of the latest AMD Ryzen 7000 series processors, GIGABYTE A620 motherboards deliver the most competitive AM5 platform for users to enjoy performance flexibly and affordably.

Enhanced by GIGABYTE exclusive layout design and BIOS setting, the A620 lineup can achieve optimal memory performance of DDR5 EXPO/XMP overclocking up to DDR5-6400, which exerts the utmost value and performance of the AM5 platform. Boasted with comprehensive features, GIGABYTE A620 motherboards can best fit users' needs and budget, and become the best choice for users who plans on stepping up to the latest AM5 platform.Meanwhile, GIGABYTE's A620 motherboards boast the innovative PCIe EZ-Latch technology to simplify the upgrade of graphics cards, and to avoid accidental damage to the surrounding components. By GIGABYTE exclusive Q-Flash Plus feature, users can update the BIOS without installing any processor, memory, or even graphics card, making it possible for users to easily enjoy the benefits brought about by the new BIOS code and processors. Further with GIGABYTE GCC software platform, GIGABYTE delivers the competitive A620 platform with user-friendly features and multiple form factor options which covers Micro ATX to Mini ITX.

Raijintek today introduced the Arcadia III, an ATX mid-tower case that's designed to be taller than it is deep. The case measures 210 mm x 410 mm x 485 mm (WxDxH), and is made mainly of SECC steel. There are two variants based on the side-panel, the Arcadia III with its 4 mm-thick tempered glass panel; and the Arcadia III ST with an opaque SECC steel panel. Both feature airy mesh front intakes. Both cases only include one fan, a rather premium 120 mm spinner with hydraulic bearings, 43.2 CFM, but with 3-pin DC control.

Inside, the Arcadia III offers a conventional horizontally-partitioned layout with the bottom partition having a cutout for the PSU label to peek through the side-panel. The main chamber has up to 36.5 cm of length clearance for graphics cards (if no fan or radiator is mounted on the front panel); and height clearance of 16.5 cm for CPu coolers. Fan vents include two 140 mm or 120 mm top exhausts, three 140 mm or 120 mm front intakes, a 120 mm rear exhaust, and interestingly, two 120 mm bottom intakes. This gives you room for a radiator as large as 280 mm on top, and as large as 360 mm on the front (not big enough for 520 mm). The bottom vents aren't convenient for a radiator. Storage options include two 3.5-inch bays in the bottom compartment, and three 2.5-inch mounts. The company didn't reveal pricing.

ADLINK Technology Inc., a global leader in edge computing, a global supplier of industrial PCs and motherboards, and a Titanium member of the Intel Partner Alliance, announces the launch of the new IMB-M47H industrial ATX motherboard for 12th/13th Gen Intel Core i9/i7/i5/i3, Pentium and Celeron processors. The IMB-M47H ATX motherboard delivers scalable, high-performance computing power and supports three simultaneous independent displays, external USB, 2.5GbE, and high-performance add-on cards for complex processing tasks in smart manufacturing, 5G manufacturing, semiconductor, and machine vision applications.

The IMB-M47H industrial ATX motherboard supports Gen 12 Intel processors and importantly the latest Intel Core processors that utilize a high-performance hybrid architecture with up to eight E-cores (Efficient-cores) for multi-threaded background task management and multitasking, and up to eight P-cores (Performance-cores) for demanding single-threaded work such as graphics and video rendering. The 12th/13th Gen Intel Core processors boost single-thread performance by 1.36x and multi-thread performance by 1.35x compared to 10th Gen Intel Core processors delivering more power-efficient general-purpose processing and offering powerful processing for intensive operations.

Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), announces that all ATX, µATX and Mini-ITX motherboards supporting the 12th generation Intel Core i processor series will soon receive a comprehensive BIOS update to 13th generation. Equipped with Intel's Performance Hybrid Architecture, they offer a significant increase in performance with lower energy consumption. All boards belong to a product family with synergetic BIOS, uniform drivers and comprehensive tool set for customer-specific settings (default settings, thermal management, boot logo, etc.) and are "designed and made in Germany". They are suitable for IoT applications in the fields of industry, medicine, kiosk, digital signage, POS/POI, video surveillance and casino gaming. They will be available from Q2/2023.

The compact Mini-ITX motherboards K3833-Q and K3832-Q are equipped with the powerful Intel Q670E chipset, which offers extensive features such as vPro Manageability, Stable Image (SIPP) or RAID. They have Dual Intel LAN interfaces incl. teaming as well as TSN and real-time support (TCC), a PCIe x16 Gen 5 expansion slot, USB 3.2 Gen 2 interfaces, an M.2 Key-M and Key-E slot as well as two DIMM sockets for DDR5 memory.

Antec Inc., a Californian supplier of high-performance computer components and accessories for the gaming, PC upgrade and Do-It-Yourself market, presents the AX90, a model oft he new budget-friendly AX series of Gaming cases. The mid-tower is equipped with three 120 mm ARGB fans in the front as well as one in the rear and is now available at a very affordable price of € 99.99 (recommended retail price including VAT).

The new AX series from Antec offers a large selection of gaming cases with LED lighting and eye-catching front panel designs - all at an affordable price. The new AX90 case has a side panel made of tempered glass and puts the built-in components in the limelight. Diamond-shaped frames in a mesh front panel create not only a visual highlight but also allow for excellent airflow.

AMD's high-end X670E motherboard chipset combines two Promontory 21 chips working together to deliver a single solution. With regularly-sized ATX motherboards, having two chips to form a chipset is fine, as there is much room on the PCB. However, with Mini-ITX motherboards, packing two Promontory 21 chips is difficult as the PCB area is limited. To combat this, ASUS introduced an interesting solution to solve the problem and allowed the company to ship the high-end X670E chipset inside a Mini-ITX form factor. Thanks to UNIKO's Hardware's findings, we look at the exciting solution ASUS used to solve this problem.

Instead of two Promontory 21 chips side by side, one is placed on the motherboard directly, while the other stands vertically attached by M.2 PCIe slot. Below, the chipset's pictures and the highlight show how it looks disassembled.

With a massive mesh front and metal panel design and flexible configuration options, Antec Inc. presents the latest two additions to the Antec Performance Series: the P20C (with glass side panel) and the P20CE (with sound-dampening side panel). Both versions are now commercially available from 124,99€ (suggested retail price including VAT).

The P20C / P20CE allows limitless possibilities for building a show case. The new flagship is ready to provide users with a more flexible layout as it features seven reusable PCI-E slots for vertical GPU installation. By supporting dual CPU motherboards with a width of up to 330 mm, the P20C / P20CE is the evolution of compatibility. The new chassis adopts a unique metal design, providing a massive airflow. With the full-size dust filter, the case reaches the balance between cooling and easy maintenance. The pin-type metal front panel is effortlessly removable, and the clip-on dust filters make the cleaning process a walk in the park.

ASUS Republic of Gamers (ROG) today announced the ROG Hyperion GR701, a completely reimagined full tower gaming case that offers an uncompromising vision of luxury and performance, engineered to take DIY builds to new heights.

A new benchmark for airflow
The world of PC building has changed. From next-gen graphics cards like the NVIDIA GeForce RTX 4090 to faster-than-ever USB data rates and charging, a PC case needs to support the latest and greatest technologies. ASUS built the ROG Hyperion to be a durable, elegant chassis that is ready for the future of DIY gaming rigs—with an airflow-focused design that keeps components running in top shape.

Leading global motherboard manufacturer, ASRock, proudly announces its new series of Intel B760 motherboards, including B760M Steel Legend WiFi, B760M Pro RS, and special edition B760M PG SONIC WiFi. These feature-filled motherboards are designed to bring supreme performance and the latest technologies - including up to PCI-Express 5.0 & overclocked DDR5 - to benefit more PC enthusiasts, gamers, and office/workstation builds than ever before. The B760 chipset is designed for the latest 13th Generation Intel Core 'K' or 'non-K' series processors (socket LGA1700), while also supporting the previous 12th generation.

Followed by the success and critical acclaim of the ASRock Z790 PG SONIC, the company has released another officially licensed motherboard featuring SEGA's Sonic the Hedgehog: the B760M PG SONIC WiFi. Based on the mainstream Intel B760 chipset, this micro ATX motherboard features all the exciting SONIC elements in a small form factor and budget friendly design.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today unveiled the latest Intel B760 series motherboards. With enhanced XMP and hardware design of memory, the full B760 DDR5 lineup can achieve superb Z790-like memory performance of DDR5-7600. Featuring up to 16+1+1 phases of 60 amps digital power VRM design with full-coverage heatsink, GIGABYTE's B760 lineup provides premium power and thermal design for the high-frequency operation of Intel 13th gen processors. Meanwhile, the innovative PCIe and M.2 EZ-Latch technology are implemented to simplify the upgrade of graphics cards and M.2 SSDs, and to avoid accidental damage to the surrounding components. Moreover, the features of 2.5 GbE LAN, Wi-Fi 6E, USB 3.2 Gen 2x2 Type C with 20 Gbps, and up to 3 sets of PCIe 4.0 x4 M.2 slots with armor on select models offer superb connectivity. Further with the latest GIGABYTE PerfDrive technology and GCC software platform, GIGABYTE delivers the outstanding B760 platform with the optimal hardware, software, and firmware which covers from DDR4 to DDR5 with full form factor options of ATX, Micro ATX, and Mini ITX.

In the Intel product plan, the "Z" chipset is the only platform to support CPU and memory overclocking. However, the B chipset with limited DDR frequency tuning offers more budget friendly options, especially those only require memory overclocking. In order to provide solid power for high-performance operation of CPU and XMP overclocking, GIGABYTE B760 AORUS motherboards are geared up to 16+1+1 power phases with 60 amps DrMOS design, while the well-received B760 AORUS ELITE features 12+1+1 power phases, and the leading power design of 14+1+1 phases on B760M AORUS PRO. These power designs allow GIGABYTE B760 AORUS motherboards of all configuration to deliver the most stable power, as well as to provide sufficient power when the CPU runs full loading. Meanwhile, enhanced by full-coverage heatsink, 5 W/mK thermal pad, and 2x copper PCB, B760 AORUS MASTER/ PRO/ ELITE/ GAMING X lineup covers from ATX to micro ATX models boast superb thermal design to improve the stability and keep the power supply area which is most likely to generate heat staying cool.

Introducing new, enhanced PC cases: Genesis Irid 505 v2 and Irid 503 v2. Better ventilation, design and enhanced filtering for superior protection from dust - these are the most important traits of the new Genesis PC cases: Irid 505 v2 and Irid 503 v2. Enhanced PC cases, Irid 505 v2 and 503 v2, are the company's answer to increasing user demand for spacious PC cases which can include a new generation of multi-core CPUs and highly efficient graphics cards.

A thicker front mesh of the Genesis Irid 505 v2 and 503 v2 provides better filtration for air that goes into the cases in a wide stream thanks to its open front design. The 0.8 mm openings make the front mesh more restrictive dust-wise when compared to other, standard anti-dust filters. Additionally, it is very easy to clean, for example with a wipe, without the need to dismantle anything.

North helps to reimagine the gaming station, introducing natural materials and bespoke details for a case which integrates stylishly into the living space. Merging design and airflow engineering, the case features fine-patterned mesh ventilation and an open front with real walnut or oak panels. The design is complemented by sleek brass or steel details and an integrated tab for easy access to the top of the case.

Developed for an enjoyable building and gaming experience, North offers an intuitive interior layout and generous compatibility. It supports GPUs up to a length of 355 mm, or up to 300 mm with a 360 mm front radiator. For a smooth start, it includes two 140 mm Aspect PWM fans, a USB-C port and drive mounts for up to four 2.5" drives and two 3.5" drives out of the box.

[Editor's note: Our in-depth review of the Fractal Design North is now live]

For those of you familiar with CaseLabs, the demise of the company in 2018 was most likely a sad time when it comes to the history of PC component manufacturers. However, it appears that the company is back in business, under new management and in a new location. CaseLabs was originally from California in the US, but the new owners have moved the company to Sweden. In fact, the key person is said to be a CaseLabs enthusiast by the name of Emil Rytterstedt who bought the rights to the CaseLabs brand in 2021, as well as what appears to be the rights for all of the products that the original company made. For now, the CaseLabs website is back up and running, but the company isn't selling any products, yet.

Based on the information available on the CaseLabs website, the company will initially offer spare parts for existing CaseLabs products, as well as offer support and customer service through it. This will be followed by at least some of the cases that CaseLabs used to offer, which will see some updates, especially when it comes to the I/O options and some other additions such as vertical GPU brackets. However, the longer term plan is to offer new products under the CaseLabs brand, which will apparently start with a smaller form factor case. All the new products will apparently be made in Sweden, so expect CaseLabs products to remain in the premium price segment. For those in the US, the company has already mentioned that the prices will be more expensive than in the past, due to shipping costs. Expect things to kick off sometime in early 2023 when it comes to actual product availability.