Press outlets have spotted two new B650M motherboard models on ASRock's product site; the B650M Pro X3D and B650M Pro X3D WiFi (6E). According to the manufacturer's descriptions, both are advertised as: "optimized for AMD Ryzen X3D processors, delivering superior stability, compatibility, and enhanced performance, making it ideal for gaming and creating." The "Pro X3D" SKUs have not launched at retail, so pricing information is not available at the time of writing. ASRock could publish a dedicated press release in the near future, but we are looking at a very quiet reveal. Curiously, the Taiwan-based motherboard and graphics card specialist has seemingly "downcycled" its fairly new B850M Pro "Race Sport" RS board design.

VideoCardz's coverage of the Pro X3D series includes a handy image comparison tool. When lined up against each other (visually), the B650M Pro X3D and B850M Pro RS designs are nigh identical. Two of the images (below) show a minor difference in printed-on model names. As expected, the ASRock website comparison tool reveals only minor disparities between respective specification sheets. The standard B850M Pro RS variant is currently on sale for $148 (normally $180). The B650M Pro X3D (non-WiFi 6E) equivalent could arrive at retail with a slightly lower price point. ASRock has signalled that its "Pro X3D" mainboard series will only be available within certain regions. According to VideoCardz, a comprehensive global rollout is not planned.

GIGABYTE introduced its STEALTH series motherboard design at last summer's Computex event; where TechPowerUp staffers inspected a B650E AORUS STEALTH ICE sample model. The Taiwanese manufacturer was readying new board SKUs with backside connectors (power and I/O); destined to take on similar products from rival companies. GIGABYTE's debut wave of STEALTH did not include any AMD X670 chipset-based options, but a recent ECC filing points to possible forthcoming X870-based models. A weekend sleuthing session—performed by harukaze5719—unearthed multiple registrations of X870 and B850 boards. Two unannounced STEALTH ICE models were highlighted in the regional registry.

The X870 and B850 AORUS STEALTH ICE models are expected to arrive within the coming months, reportedly sporting familiar white designs—as seen on GIGABYTE's current-gen option. Insiders believe that a high-end X870E-based offering will not emerge, due to STEALTH occupying a very niche market segment. According to a Chinese leaker, B850 models could arrive in ATX and microATX form factors. Further up in product hierarchies, they reckon that the X870 AORUS STEALTH series: "comes standard with PCIe 5.0 and DDR5 overclocking support. The flagship model comes with dual Thunderbolt 4 interfaces." GIGABYTE's back-connected X870 and B850 board designs could demand high asking prices; their current B650E AORUS STEALTH ICE is not readily available, but in some regions it is selling for $320+.

One feature that gamers have loved about AMD Ryzen processors is the company's commitment to socket longevity. If you have a PC with an AMD Ryzen 7000 Series CPU and an AM5 motherboard, for example, you're able to upgrade to an AMD Ryzen 9000 Series CPU without stripping your PC down to the studs and replacing the motherboard. But perhaps you're starting from scratch with your first AM5 PC. In that case, you have several years' worth of AM5 motherboard options to consider, including the TUF Gaming B850-Plus WiFi from our B850 motherboard family.

For years, one of the most popular AM5 motherboards has been the TUF Gaming B650-Plus WiFi. This rock-solid, battle-proven board delivers on all fronts with its durable design, comprehensive cooling, and ruggedized aesthetic. Yet if you're building a new PC in 2025, we think you'll be happier in the long run with this board's successor, the TUF Gaming B850-Plus WiFi. Armed with key updates like a bolstered power solution, PCIe 5.0 x16 slot, Wi-Fi 7, and more and faster USB ports, this motherboard offers incredible value for your gaming rig.

Sapphire Technology has introduced a new NITRO+ motherboard model in China—weekend reports pointed to a listing on JD.com, where the latest addition resides alongside various previous-gen B650 options. This appears to be another region specific release—priced at 1299 RMB (~$179 USD). The NITRO+ B850M Wi-Fi model seems to share its overall aesthetic design with the preceding B650M-equipped equivalent. As surmised by VideoCardz, the Sapphire NITRO+ board's VRM patterning reminded them of the leaked premium-tier Radeon NITRO+ RX 9070 graphics card series.

The generational jump from AMD B650 to B850 chipset—as expected—yields only minor benefits (see below). The older NITRO+ B650M Wi-Fi model is a significantly cheaper prospect; coming in at 899 RMB ($124 USD). VideoCardz's weekend detective work settled on a nice improvement: "based on our research, the memory overclocking support has increased from 7600 MT/s+ to 8000 MT/s. Keep in mind that these figures may be higher for both motherboards; this is just what Sapphire guarantees when paired with a supported memory kit." Industry watchdogs believe that ASRock is likely involved in the contract manufacturing of Sapphire's motherboard offerings—the former has been long-involved in pumping out NZXT-badged products.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, small form factor PCs, and power supply units, proudly announces that its entire lineup of AM5 motherboards fully supports the AMD Ryzen 9 9950X3D and 9900X3D processors. With this seamless compatibility, gamers can harness the full potential of these flagship processors for an unparalleled gaming experience.

The AMD Ryzen 9 9950X3D and 9900X3D processors are the flagship models of the Ryzen 9000X3D series, designed for hardcore gaming enthusiasts who demand the ultimate in gaming performance. ASRock AM5 motherboards offer seamless compatibility with the Ryzen 9000X3D series, making them the ideal choice for gamers worldwide to experience the power of the AMD Ryzen 9 9950X3D and 9900X3D processors firsthand.

MSI introduced an impressive number of new AMD B850 and B840 chipset-based motherboards at January's CES trade event. According to a Wccftech report, the company's AM5—socketed lineup will expand in the near future—a leaked presentation slide provides an early preview of (allegedly) incoming budget-friendly offerings. MSI's leaked roadmap (Q1 to Q2 2025) shows new additions—mostly smaller form factor—across performance (MPG) and Pro Series product ranges. Their Arsenal Gaming (MAG) B850 range seems to be fully released, as of the first quarter of this year—consisting of models already unveiled at CES.

Five new models are seemingly lined up for release within the next couple of months—the Wccftech article listed the following SKUs: MPG B850I Edge WIFI (Mini-ITX), PRO B850M-P WIFI (M-ATX), PRO B850M-B (M-ATX), B850 Gaming PLUS WIFI PZ (ATX) and PRO B850M-A WIFI PZ (M-ATX). The publication commented on its discoveries: "as you can see, MSI will have at least one new variant within the MPG lineup which will feature a Mini-ITX design. The company has already released the full ATX-sized version of the EDGE TI WIFI, and it's nice to know that we will get a Mini-ITX variant too." The report proposes that MSI has prepped its new budget models with the latest connectivity features—most notably, Wi-Fi 7 rated at the full 320 MHz band. Support for Zen 4 and 5 Ryzen X3D CPUs is expected upon launch.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, PC peripherals, and IPC solutions, introduces the B850MT-E PRO motherboard, designed to deliver exceptional performance for office professionals and casual use. The BIOSTAR B850MT-E PRO motherboard is designed to meet the diverse needs of various users, offering a perfect blend of performance and reliability. Built on AMD 's B850 chipset, this motherboard combines superior features at an affordable price. It supports the latest AMD Ryzen 9000, 8000, and 7000 series processors, enabling seamless multitasking and efficient power management.

The B850MT-E PRO is expertly engineered for versatility, making it the definitive solution for office professionals, small businesses, and system integrators. It guarantees stable and efficient performance for everyday tasks and document management. With BIOSTAR's renowned 55 A Dr. MOS and Digital PWM technology, you can expect steady power delivery that ensures consistent performance and enhanced durability, even during extended work sessions.

GIGABYTE, the world's leading computer brand, unveils the new generation of Intel B860 and AMD B850 series motherboards at CES 2025. These new series are designed to unleash the performance of the latest Intel Core Ultra and AMD Ryzen processors by leveraging AI-enhanced technology and user-friendly design for a seamless gaming and PC-building experience. Equipped with all digital power and enhanced thermal design, GIGABYTE B800 series motherboards are the gateway to mainstream PC gamers.

GIGABYTE achieved the remarkable milestone of claiming the highest market share on X870 series motherboards due to fully supporting AMD Ryzen 5 7000 and 9000 series X3D processors. The new B800 series motherboards are also adopted with ultra-durable and high-end components and the revolutionary AI suite, D5 Bionics Corsa, integrates software, hardware, and firmware to boost DD5 memory performance up to 8600 MT/s on AMD B850 models and 9466 MT/s on Intel B860 motherboards. The AI SNATCH is an exclusive AI-based software for enhancing DDR5 performance with just a few clicks. Meanwhile, the AI-Driven PCB Design ensures low signal reflection for peak performance across multiple layers through AI simulation. Plus, HyperTune BIOS integrates AI-driven optimizations to fine-tune the Memory Reference Code on Intel B860 series motherboards for high-demand gaming and multitasking. Specially built for AMD Ryzen 9000 series X3D processors, GIGABYTE applies X3D Turbo mode on AMD B850 series motherboards by adjusting core count to boost gaming performance.

Earlier in the week, ASRock debuted its Intel B860/H810 and full range of AMD B850 motherboards—the TechPowerUp team headed across CES 2025's showroom floor to check whether the Taiwanese manufacturer had some of these newly announced products on display. Various white Steel Legend models were present, including an intriguing B850 mainboard sample sporting ASRock's back mount design (BMD). The B860M Pro BMD board was not in sight (or not captured on camera)—according to a press release from earlier in the week, BMD had its premiere on this Intel-based solution.

AsRock reps happily showed off two Intel B860-chipset Steel Legend boards with traditional all-front facing connectors—an ATX option as well as an M-ATX (B860M) model were examined from close-up. A Phantom Gaming B860 Lightning Wi-Fi model was presented to TechPowerUp—its darker aesthetic contrasts sharply when lined up against its pale Steel Legend neighbors.

ASUS extended its line of motherboards at CES 2025, featuring a design that moves power connectors to the back of the board. The company calls this approach "BTF" (Back To Future), aiming to improve cable management in PC builds. The TUF GAMING B850-BTF WIFI and B860-PLUS WIFI models demonstrate this new design, which can deliver up to 600 watts through the motherboard to support modern graphics cards. The boards include Wi-Fi 7 connectivity, PCIe 5.0 support, and multiple M.2 slots for storage devices. In the high-end segment, ASUS presented the ROG Maximus Z890 HERO BTF, compatible with Intel's LGA1851 processors. This board features DDR5 memory support, dual Thunderbolt 4 ports, and tools like Q-Release for easier graphics card removal.

For professional users, ASUS released the ProArt Z890 CREATOR WIFI, equipped with Thunderbolt 4 ports and specialized cooling systems. The company also showed new gaming-focused models including the ROG Crosshair X870E APEX, for the fastest Ryzen 9000X3D series gaming processors. The motherboards share several technical features across different price points. All models support PCIe 5.0 for graphics cards and storage, while most include Wi-Fi 7 capabilities. ASUS has added tool-free installation mechanisms for M.2 drives across the lineup. ASUS has not yet announced pricing or specific release dates for the new motherboards. The BTF design represents a significant change in motherboard layout, though it will require compatible PC cases and power supplies to function as intended. This marks one of the first major changes to standard motherboard design since the ATX format became common in the 1990s.

ASRock announces a full line-up of motherboards using the AMD B850 chipset. New products include high-end Phantom Gaming series line up covering Mini-ITX to ATX form factor, mainstream Steel Legend which features white PCB design and also Pro RS series for budget friendly users.

Ready to Power Everything!
The new ASRock B850 motherboards are designed with 14+2+1 power phase, 8-layer PCBs enabling excellent memory overclocking and exclusive low-ripple 1000μf 20K black capacitors that guarantee stable and superior performance for the CPU. The boards also support the latest PCI-Express Gen-5 Graphics card and equipped with Blazing M.2 (Gen5x4) SSD ports.

ASUS today announced the B850 and B840 series of AM5 motherboards for AMD processors, which includes models from the ROG Strix, TUF Gaming and Prime families. These motherboards give builders higher speeds, more ports and more slots for USB devices and M.2 SSDs. Many ASUS B850 motherboards also break into the next generation of wireless networking with WiFi 7 support, and also provide robust support for fast DDR5 kits. In addition, each model makes the PC building process easier than ever with tool-free M.2 SSD installation, easy troubleshooting and hassle-free installation and removal of graphics cards.

Meanwhile, B840 motherboards are designed to serve the needs of builders who do not intend to overclock their CPUs or install a PCIe 5.0 M.2 SSD or graphics card. For anyone looking to build a very affordable and efficient PC—perhaps one centered around a CPU with powerful integrated graphics capabilities—ASUS B840 motherboards are a cost-effective choice. The first ASUS B840 motherboards all hail from the tried-and-true Prime family.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, today unveils its groundbreaking B850 and B840 series motherboards, introducing a new era of performance optimization and EZ-friendly design for the latest AMD Ryzen processors with full-line PCIe Gen 5 x16 graphics cards support.⁠

D5 Bionic Corsa: Redefining Memory Overclocking
At the heart of GIGABYTE's new B850/ B840 motherboard series lies the innovative D5 Bionic Corsa technology, a game-changing approach to memory performance. This breakthrough technology has achieved remarkable up to 8600 MT/s DDR5 speeds, setting a new standard for memory overclocking. Through the intelligent AORUS AI SNATCH software, users can now effortlessly enhance their system's performance with unprecedented ease. The AI-powered EXPO AI BOOST feature eliminates the traditional time-consuming trial and error process, delivering optimized memory profiles that balance performance and stability with just a few clicks.

MSI is proud to unveil its latest lineup of motherboards designed for AMD Ryzen B850 and B840 chipsets. These motherboards deliver a perfect blend of performance and innovation, ensuring exceptional reliability and ease of use. With their high performance and reliable design, they are built to empower mainstream users, gamers, and creators with next-level computing capabilities.

In addition to the new B850 and B840 motherboards, MSI is also expanding its X870E lineup with two new models: the MPG X870E EDGE TI WIFI and MAG X870E TOMAHAWK WIFI. These additions offer even more options tailored to diverse user needs—top-tier performance and, most importantly, cutting-edge connectivity. With the MPG X870E EDGE TI WIFI and MAG X870E TOMAHAWK WIFI, MSI continues to deliver innovative solutions that empower gamers, creators, and PC enthusiasts alike.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and PC peripherals, proudly introduces two new additions to its AMD motherboard lineup, the B850M-SILVER and the B850MT-E PRO motherboards. Built around the latest AMD B850 chipset, these motherboards deliver next generation technology and reliable performance, perfectly fitting office professionals, home entertainment enthusiasts, system integrators, and gamers.

The B850M-SILVER and B850MT-E PRO motherboards are expertly engineered to support the cutting-edge AMD Ryzen 9000, 8000, and 7000 series processors, delivering unparalleled computing power for any application. They are optimized for peak memory performance, accommodating up to 192 GB of DDR5 RAM at impressive overclocking speeds of up to 8000 MHz, boasting significantly higher bandwidth and enhanced energy efficiency compared to DDR4.

Earlier today, ASUS uploaded a first sneak peek of several upcoming AMD AM5 motherboards—which we assume will feature the B850 and B840 chipsets—which according to the post on Facebook, will be launching within a couple of weeks. The boards will most likely be on display at CES, which kicks off on the 7th of January. The picture is obfuscated for obvious reasons, but what is clear is that there will be several different SKUs from all of ASUS' typical sub-brands such as TUF Gaming and ROG.

What we can also make out is that there will be at least one Mini-ITX board and one micro-ATX board, with the latter being the TUF Gaming branded board. We tried to clean up the picture a bit, but ASUS has managed to hide all details of possible models names and most of the text is kind of hard to make out. Nothing really sticks out in terms of features, although it's clear we'll end up seeing some higher-end B850 boards, judging by the fact that there are at least three ROG Strix SKUs coming. The question is if there's a market for these boards, considering the B850 chipset is pretty much the same as the B650E chipset, but with optional PCIe 5.0 support for the M.2 slots and no USB4, unlike its X870 counterpart.

Update Jan 1st: ASUS posted a picture of their upcoming mid-range Intel boards on Facebook as well, but as with the AMD boards, ASUS obfuscated the image, although not quite as badly this time around. For its Intel lineup, there's also a lower-end Prime board included, in addition to the TUF Gaming and ROG Strix boards. ASUS didn't reveal any launch window for the Intel boards.

In the first week of the 2025 International CES, Intel and AMD are expected to expand their desktop processor product stacks, with the introduction of 65 W models; and with them, more affordable motherboard chipset models. AMD is expected to launch the AMD B850 and AMD B840; while Intel debuts the Intel B860 and H810. Board Channels, a site that tracks hardware launches at the retail channel level, says that AMD is expected to set January 15 as the market availability date for motherboards based on the AMD B850 and B840. The chipset will be announced at AMD's January 7th event.

Meanwhile, Intel is expected to announce its mid-range Intel B860 and entry-level Intel H810 on its own event slated for January 7, but with product availability on January 13. The AMD B850 is essentially a rebadged B650, but motherboard vendors can optionally enable Gen 5 PEG instead of Gen 4, at which point the platform would essentially be an AMD X870, but without the mandatory discrete USB4 host controller. The AMD B850 supports CPU overclocking. The AMD B840 lacks this, and is functionally similar to the AMD B550 chipset from the Socket AM4 platform, except that it lacks CPU overclocking support. Meanwhile, the Intel B860 is expected to feature a similar I/O as the Intel B760 from the Socket LGA1700 platform. The H810 is expected to be a lean entry-level option. Both the Intel B860 and H810 are expected to lack CPU overclocking support, but the B860 probably retains memory overclocking capability.

Here are some of the first pictures of ASRock's upcoming Live Mixer series motherboards based on mid-range chipsets from AMD and Intel. The Live Mixer brand of motherboards has a similar positioning in ASRock's product stack as Steel Legend, but with a variation in product design, and a mid-range onboard audio solution that uses audio codecs such as the ALC1200 or ALC4080. There's nothing that particularly stands out in this audio solution (no fancy amp circuits or exotic I/O). The B850 Live Mixer Wi-Fi is an ATX board based on the AMD B850 chipset. This is essentially a re-brand of the popular B650, but with out-of-the-box support for the latest Ryzen 9000 series processors, including the 9000X3D series. The board offers three M.2 NVMe slots, one of which is Gen 5, and the others Gen 4. The WLAN solution is very likely Wi-Fi 6E.

Next up, is the ASRock B860 Live Mixer Wi-Fi. This Socket LGA1851 motherboard is based on Intel's mid-range chipset for its "Arrow Lake" processors, the Intel B860. Much like the previous generation B760, it is expected to lack CPU overclocking support. This board visually looks a lot similar to its AMD B850-based sibling, you could almost confuse the two if you're not looking at the CPU socket. You get three M.2 NVMe slots here, too; one of which is Gen 5, and doesn't eat into the x16 PEG slot. We expect this board to offer Wi-Fi 6E, just like the B850 Live Mixer Wi-Fi. Lastly, there's the B860M Live Mixer Wi-Fi, a Micro-ATX variant of this board, with mostly the same feature-set, it's just that the third M.2 slot is without a heatsink; and the second PCIe slot is physically x8 instead of x16, which shouldn't matter since the slot is likely electrical x4 on both motherboard models. Intel and AMD are expected to debut the B850 and B860 in January.

In Q1 2025, AMD is expected to expand its Ryzen 9000 series "Granite Ridge" desktop processor family with new 65 W processor models, alongside the introduction of the new cost-effective AMD B850 motherboard chipset. The B850 is expected to be a single-chip solution, just like the X870, but makes PCIe Gen 5 optional for the x16 PEG slot. You still get at least one Gen 5 M.2 NVMe slot. USB4 is made optional for this chipset model, too. The B850, hence, is essentially a rebadged B650. CPU and memory overclocking are supported, so you can expect features like "X3D Boost" to carry over from the X870 series motherboards. Videocardz scored clear images of one of the first production AMD B850 chipset motherboards, the GIGABYTE B850M AORUS Elite Ice. This particular variant comes with integrated Wi-Fi 6E, and the "Ice" denotes a white PCB, along with white slots and connectors. You can expect variations of this board with black PCB, and other wireless networking solutions, or lacking one altogether.

The Micro-ATX board appears feature-packed, including an easy ejection lever for the PCIe x16 slot. It draws power from a combination of 24-pin ATX and 8-pin EPS power connectors. Expansion slots include what is very likely a Gen 4 PCI-Express x16 slot, a Gen 4 x4 (physical x16) PCIe slot, and the space between them being dominated by an M.2 SSD heatsink that very likely conceals a Gen 5 M.2 slot wired to the CPU, and a Gen 4 M.2 slot that's either wired to the CPU (since there's no discrete USB4 controller), or the FCH. USB connectivity consists of 20 Gbps USB 3.2 for a few type-C ports (including a type-C header), and a combination of 10 Gbps and 5 Gbps USB 3.x ports.

Motherboard vendors have been sporadically announcing their new premium- and high-end motherboards based on the AMD X870E and AMD X870 desktop chipsets, however, we've had a hard time finding or ordering these online. It turns out that although AMD allowed its motherboard partners to tease or announce their products based on the new chipset models, their market availability is timed.

Apparently, you should be able to buy these motherboards starting September 30, 2024. In the run-up to their availability, various online retailers have put up these motherboards at fairly high prices. Motherboards based on the cheaper AMD X870 are typically priced above $250, while those based on the top X870E start around $325. It is widely rumored that the mid-range AMD B850 will launch early next year. Until then, you always have the option of older AMD B650 chipset motherboards. If you want to pair these with newer Ryzen 9000 series "Granite Ridge" processors, you can take advantage of the UEFI BIOS Flashback feature.

AMD has reportedly pushed the launch of mid-tier models from its AMD 800-series chipset to early 2025, reports ComputerBase.de. With the Ryzen 9000-series "Zen 5" processors already launched earlier this month, and compatible with existing AMD 600-series chipset motherboards with a BIOS update, motherboard vendors are leisurely announcing their motherboards based on the AMD X870E and AMD X870 chipsets. Motherboards based on both offer drop-in compatibility with Ryzen 9000-series processors, and introduce new connectivity features such as 40 Gbps USB4 and Wi-Fi 7.

The company probably wants the two to have some time in the Sun before they're joined by the more affordable B850, which gamers could be drawn to. The AMD B850 has mostly identical platform I/O to the AMD X870, except Gen 5 support for the PCI-Express x16 slot is optional (motherboard vendors can choose to wire this out as Gen 4). The 40 Gbps USB4 is also optional here. You still get CPU overclocking support. The B840 is an entry-level chipset that's being launched to probably phase out the A620 and A620A, since it features similar I/O features to the A620A, but will probably come with drop-in compatibility for 65 W Socket AM5 processors. A deferred launch of the mid-tier chipset isn't too off character for AMD. It launched its popular B450 and B550 chipsets several months after the X470 and X570, respectively.

Gigabyte's new Stealth series of motherboards has to date only had a single product, the Z690 Aorus Elite Stealth, but now, Gigabyte has added its first Stealth board for AMD CPUs. The B650E Aorus Stealth Ice not only has all of its connectors on the back of the board, but it also has a white/silver PCB with a similarly coloured front and back cover. Apart from the DIMM slots, all connectors are also in somewhat matching colours, although judging by the pictures, the colours don't quite match on all the connectors and slots. That aside, the B650E Aorus Stealth Ice is a pretty competent board, as long as you're not interested in adding anything more than a graphics card and some NVMe SSDs, as it has zero additional PCIe expansion slots. It's a rather bold move by Gigabyte, but at the same time, most gamers and consumers don't tend to add PCIe devices to their computers outside of additional storage these days.

Besides the PCIe 5.0 x16 slot, you get two M.2 sockets wired to the CPU, one PCIe 5.0—with its own, larger heatsink—and one PCIe 4.0, as well as a third PCIe 4.0 M.2 socket via the chipset. There's also support for four SATA 6 Gbps drives if more storage is needed. Gigabyte has also added an internal HDMI 1.4 port that's limited to 1080p30, which is intended to be used with Gigabyte's LCD Edge View display. Other connectivity on the back of the PCB includes a USB 3.2 Gen 2x2 (20 Gbps) port, a USB 3.2 (5 Gbps) pin-header as well as the usual USB 2.0, fan headers and LED headers that you'd expect from a modern motherboard. The VRM design is a 12+2+2 design with a 60 Amp DrMOS configuration for the 12+2 phases for the CPU and GPU.

AMD is debuting its Ryzen 9000 series "Granite Ridge" desktop processors powered by the "Zen 5" microarchitecture later this year. These chips are compatible with existing AMD 600-series chipset motherboards with a simple UEFI firmware update, but the company is also taking the opportunity to launch the AMD 800-series chipset family alongside these chips. The lineup will be led by the AMD X870E, followed by the X870. These two chipsets should launch immediately alongside the new processors, but will later be joined by the AMD B850 and B840. There's no entry-level chipset planned, the AMD A620 will continue to hold the fort for AMD here. There is an interesting new mix of product differentiation, according to a leaked GIGABYTE slide scored by VideoCardz.

If you recall, the X670E and X670 were differentiated by a lack of Gen 5 PCI-Express x16 PEG slots on the X670, which instead was limited to Gen 4 on the PEG slot. The X670 still had Gen 5 NVMe slots attached to the CPU, and had practically the same I/O features as the X670E, including the same counts of downstream PCIe Gen 4 general purpose lanes. Both the X670E and X670 are 2-chip solutions, in that the second chip is a connected to the general purpose PCIe lanes of the first chip, which in turn is connected to the processor. Things are going to change with the 800-series. The top-spec X870E will be a 2-chip solution, with PCIe Gen 4 general purpose lane counts resembling the X670E; but the X870 is a single-chip solution that more closely resembles the B650E in I/O. The X870 (non-E) now gives you Gen 5 PCI-Express x16 PEG, just like the X870E and the B650E, and at least one Gen 5 x4 NVMe slot attached to the CPU, but has fewer downstream Gen 4 general purpose PCIe lanes than the X670. Both the X870E and X870 assure USB4 connectivity, and support CPU overclocking. Things get very interesting in the mid-range.

AMD is readying the new 800-series motherboard chipset to launch alongside its next-generation Ryzen 9000 series "Granite Ridge" desktop processors that implement the "Zen 5" microarchitecture. The chipset family will be led by the AMD X870E, a successor to the current X670E. Since AMD isn't changing the CPU socket, and this is very much the same Socket AM5, the 800-series chipset will support not just "Granite Ridge" at launch, but also the Ryzen 7000 series "Raphael," and Ryzen 8000 series "Hawk Point." Moore's Law is Dead goes into the details of what sets the X870E apart from the current X670E, and it all has to do with USB4.

Apparently, motherboard manufacturers will be mandated to include 40 Gbps USB4 connectivity with AMD X870E, which essentially makes the chipset a 3-chip solution—two Promontory 21 bridge chips, and a discrete ASMedia ASM4242 USB4 host controller; although it's possible that AMD's QVL will allow other brands of USB4 controllers as they become available. The Ryzen 9000 series "Granite Ridge" are chiplet based processors just like the Ryzen 7000 "Raphael," and while the 4 nm "Zen 5" CCDs are new, the 6 nm client I/O die (cIOD) is largely carried over from "Raphael," with a few updates to its memory controller. DDR5-6400 will be the new AMD-recommended "sweetspot" speed; although AMD might get its motherboard vendors to support DDR5-8000 EXPO profiles with an FCLK of 2400 MHz, and a divider.