AMD is set to introduce its next-generation of Ryzen Threadripper processors in the coming weeks, and rumors are suggesting that it may happen at this year's CES. The new Ryzen Threadripper platform is codenamed Genesis Peak. If we take a look at the current 3000 series "Castle Peak" Threadripper processors, they were launched on CES 2020, with availability in February. So we are assuming that the upcoming 5000 "Genesis Peak" series is going to launch at the virtual CES event, during AMD's show. Thanks to the information from Yuri "1usmus" Bubliy, we found out that AMD is going to start the next-generation Threadripper lineup with a 16 core processor. "1usmus" posted a riddle on Twitter, that is actually a hex code that translates to "GENESIS 16 CORES".

The current generation of Threadripper Castle Peak processors is starting at 24 cores, and going up to 64-core models, so it would be interesting to see where AMD sees the 16-core model in the stack and why it chose to do it. The exact specifications of this processor are unknown, so we have to wait for the announcement event. It is also unknown if the existing TRX40 motherboard will offer support for Zen 3 based Genesis Peak 5000 series Threadripper processors or will AMD introduce a new platform for it.

Here are the first detailed die maps of the I/O controller dies of AMD's "Matisse" and "Rome" multi-chip modules that make up the company's 3rd generation Ryzen and 2nd generation EPYC processor families, respectively, by PC enthusiast and VLSI engineer "Nemez" aka @GPUsAreMagic on Twitter, with underlying die-shots by Fitzchens Fitz. The die maps of the "Matisse" cIOD in particular give us fascinating insights to how AMD designed the die to serve both as a cIOD and as an external FCH (AMD X570 and TRX40 chipsets). At the heart of both these chips' design effort is using highly configurable SerDes (serializer/deserializers) that can work as PCIe, SATA, USB 3, or other high-bandwidth serial interfaces, using a network of fabric switches and PHYs. This is how motherboard designers are able to configure the chipsets for the I/O they want for their specific board designs.

The "Matisse" cIOD has two x16 SerDes controllers and an I/O root hub, along with two configurable x16 SerDes PHYs, while the "Rome" sIOD has four times as many SerDes controllers, along with eight times as many PHYs. The "Castle Peak" cIOD (3rd gen Ryzen Threadripper) disables half the SerDes resources on the "Rome" sIOD, along with half as many memory controllers and PHYs, limiting it to 4-channel DDR4. The "Matisse" cIOD features two IFOP (Infinity Fabric over Package) links, wiring out to the two "Zen 2" CCDs (chiplets) on the MCM, while the "Rome" sIOD features eight such IFOP interfaces for up to eight CCDs, along with IFIS (Infinity Fabric Inter-Socket) links for 2P motherboards. Infinity Fabric internally connects all components on both IOD dies. Both dies are built on the 12 nm FinFET (12LP) silicon fabrication node at GlobalFoundries.

Bitspower unveiled the Summit ELX line of CPU water blocks optimized for 3rd generation AMD Ryzen Threadripper processors. The block's coolant channel is designed keeping in mind the layout of the "Castle Peak" MCM, such that coolant flows over even the CCDs farthest away from the center, which has the I/O controller die. This design should particularly benefit users of the Threadripper 3990X, which has eight CCDs. The block supports both sTRX4 and older TR4 sockets.

The primary material is nickel-plated copper, with a mirror finish at the base. There are three variants based on the type of top. The first one called "DRGB," (BP-CPUELXTRX40-DRGB), features a clear acrylic top with embedded addressable-RGB LEDs that plug into a standard 3-pin ARGB header. The second variant is called "Metal" (BP-CPUELXTRX40-MT), and features a metal alloy top with a chrome finish. The third variant, called "POM," (BP-CPUELXTRX40-POM), features a matte-black POM acetal top. The Summit ELX supports standard G 1/4" fittings, and measures 115 mm x 75 mm x 18 mm (LxWxH). The DRGB variant is priced at NTD 2,800, the Metal variant NTD 3,255, and the POM variant NTD 2,635.

DRAM Calculator for Ryzen by 1usmus is the definitive utility to demystify memory overclocking and optimization on AMD Ryzen-powered PCs. It lets you feed in settings you know, and calculates the most optimal related settings (such as latencies), so you get the most from your memory overclock. Version 1.7.0 adds certain memory benchmarks to the utility, including a benchmark for memory bandwidth (reads and writes), and AMD processor inter-core latency tests. The new version also spares you of having to manually input certain current values, by adding the ability to read current memory timings for machines powered by Ryzen 3000-series "Matisse" processors. The new version also adds support for Ryzen Threadripper 3000 "Castle Peak" processor series. Support is also added for SK hynix DJR memory modules. Grab DRAM Calculator for Ryzen from the link below.

DOWNLOAD: DRAM Calculator for Ryzen by 1usmus v1.7.0

With its 3rd generation Ryzen Threadripper "Castle Peak" HEDT processor family, AMD isn't bothering with 16-core models as the company's mainstream desktop socket AM4 platform already offers those many cores with the upcoming Ryzen 9 3950X. The lineup will begin with the Ryzen Threadripper 3960X, which is the 24-core/48-thread part. The model number "3950X" is already taken up by the 16-core socket AM4 chip. Confirmation of this came from an "Ashes of the Singularity" screenshot that references an "AMD Ryzen Threadripper 3960X 24-core Processor."

AMD's decision to start the lineup at 24 cores is interesting, as it looks to keep up its competitiveness against Intel, which recently launched its 10th generation "Cascade Lake-X" Core i9 HEDT processor series, with all parts priced under $1000, including the range-topping 18-core/36-thread one. It remains to be seen if the Threadripper 3960X can beat it while holding onto a sub-$1,000 price. The previous-generation 24-core 2970WX beat the i9-9980XE in some rendering and simulation tests that scaled with cores and which weren't too heavy on memory bandwidth. With its 3rd generation Threadripper series, AMD is eliminating a key memory bottleneck, giving each core on the chip an equal access to the processor's monolithic quad-channel memory interface.