Super Flower, a leader in high-performance power supply units (PSUs), is thrilled to announce the launch of a full product lineup that extends beyond their renowned PSUs. This comprehensive expansion includes air coolers, water coolers, case fans, and chassis, aiming to provide PC enthusiasts with a broader range of components that deliver both performance and aesthetic appeal. The new products are designed to meet the diverse needs of gamers, content creators, and tech enthusiasts who seek reliable, high-quality solutions for their custom builds.

Leading the lineup is the Leadex III ATX 3.1, available in 650 W, 750 W, 850 W, 1000 W, and 1300 W configurations. This PSU exemplifies Super Flower's commitment to excellence, offering unmatched performance, efficiency, and safety for even the most demanding systems. Its advanced features cater to gamers and power users alike, ensuring stability and reliability under intense loads.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is thrilled to release the TH240/280/360/420 V2 Ultra EX ARGB Sync All-In-One Liquid Cooler - Snow Edition. In addition to the previous black edition, the new color is perfect for users looking for an all-white PC build. The TH V2 Ultra EX ARGB Sync series offers an affordable AIO solution with cutting-edge MagForce 2.0 Design and a versatile LCD display. This advanced cooling system delivers exceptional convenience and visual appeal, surpassing your expectations!

The new series features the TH240/360 V2 Ultra EX ARGB Sync models, which utilize 120 mm CT EX ARGB Sync Fans, and the TH280/420 V2 Ultra EX ARGB Sync models, which are equipped with 140 mm CT EX ARGB Sync Fans. These fans are enhanced with the MagForce 2.0 Design, which allows you to connect multiple fans to the AIO with only one cable, and the Pogo pin contact pads included are twice as large as before. This improvement ensures a faster and more stable magnetic connection, making cable management easier and more efficient.

Applied Materials, Inc. today introduced materials engineering innovations designed to increase the performance-per-watt of computer systems by enabling copper wiring to scale to the 2 nm logic node and beyond. "The AI era needs more energy-efficient computing, and chip wiring and stacking are critical to performance and power consumption," said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials. "Applied's newest integrated materials solution enables the industry to scale low-resistance copper wiring to the emerging angstrom nodes, while our latest low-k dielectric material simultaneously reduces capacitance and strengthens chips to take 3D stacking to new heights."

Overcoming the Physics Challenges of Classic Moore's Law Scaling
Today's most advanced logic chips can contain tens of billions of transistors connected by more than 60 miles of microscopic copper wiring. Each layer of a chip's wiring begins with a thin film of dielectric material, which is etched to create channels that are filled with copper. Low-k dielectrics and copper have been the industry's workhorse wiring combination for decades, allowing chipmakers to deliver improvements in scaling, performance and power-efficiency with each generation.

The SG10 is an ambitious product designed to push the boundaries of fanless technology and create a gaming case capable of cooling high-performance CPUs and GPUs without the use of fans. This project collaboration between Streacom and Calyos is also aimed at showcasing the application of loop heat pipe technology in PC cooling and represents the first step in creating a viable mainstream high-performance solid-state alternative to water cooling solutions.

The spiritual successor to the SG10 began life as a Kickstarter project launched by Calyos as the NSG S0, and whilst having extensive expertise in cooling, the additional challenges of consumer product manufacturing proved to be a stumbling block. A search ensued to find a partner with suitable experience to get the project back on track, and with experience in both case manufacturing and fanless cooling, Streacom was the natural fit. As can be understood just by glancing at the image, the SG10 represents a complete redesign of the NSG S0. Not a single asset or component was carried over from the original case. This includes the Evaporator that pumps the coolant around the loop and the Condenser that radiates the heat, both core components that make this performance possible. Everything has been entirely re-engineered and improved far beyond the original specification and performance.

Cooler Master, renowned for its industry-leading PC components, today announced the MA824 Stealth, a cutting-edge air cooler designed to keep your machine cool during the most intense applications. The MA824 Stealth is a testament to our innovative approach to design, boasting a suite of advanced specifications encased in a modern, sleek exterior.

"This high-performance air cooler, featuring our groundbreaking Superconductive Composite Heat Pipe technology, raises the bar in both performance and design," Said Jimmy Sha, CEO Cooler Master." Sleek, efficient, and robust, the Stealth is a statement piece for any setup. We continue to push boundaries for PC enthusiasts, power users, and custom builders worldwide. Welcome to the next level of air cooling with Cooler Master."

Sapphire China has introduced a slightly cheaper alternative to its high-end Nitro Vapor-X card, based on AMD's Radeon RX 7900 XT GPU. The new Nitro OC L custom design (also translated as "XT 20G Ultra Platinum L") grants a saving of about $70 when stacked against the XT Nitro+ Vapor-X model. Local prices according to JD.com's listings are 6299 RMB (roughly $895) and 6799 RMB (around $966) respectively. The two cards appear to be very similar in appearance at first glance, but Sapphire has chosen to cut back on advanced cooling features and lighting.

The "Nitro OC L" comes with a more traditional copper base, which presumably helps reduce the unit's material cost, but this choice also lessens its cooling prowess - Sapphire's engineering team has lowered the card's clock speed boost down to 2450 MHz (from the Vapor-X's 2560 MHz), so performance is on-par with their RX 7900 XT PULSE model. The Nitro OC L features a single strip of RGB on the top of its shroud - its more expensive sibling sports a secondary lighting region on its underside (emitting in the direction of the motherboard). The Radeon RX 7900 XT Nitro OC L card has not been announced for launches in western markets yet, but we hope to hear more from Sapphire's international team very soon.

A Reddit user has shared their experience of passively cooling an AMD Ryzen 9 7950X, with some modifications to the setup. Using the Streacom DB4 passively cooled case, the user u/AromaticImpress7778 pulled off cooling a processor with 16 cores and 32 threads with a TDP of 170 Watts. Interestingly, the Streacom DB4 case rates CPU support for only 65 Watts, meaning some modifications were in place. To support the high-TDP CPU, the user used two of the one-kilogram copper bars and attached them to the case. Heat is transferred to the two one-kilogram blocks using the case's default plate and an additional 233-gram copper plate for the CPU and motherboard. These big copper blocks are not soldered to the case, but instead, the user puts Thermal Grizzly Conductonaut liquid metal between copper parts and Arctic MX-6 between the case and copper.

To cool the AMD Ryzen 9 7950X and MSI B650I board, accompanied by HDPlex GaN 250 W and 64 GB of memory, the system did well enough for a passive build. After running the system at full load, the CPU reached 95 degrees Celsius for CCD1 and 95 degrees Celsius for CCD2. The external panels of the Streacom DB4 case were getting 50C to 60C of heat. Additionally, the user noted that the usage of this system will be more relaxed, as it will not run under full load for a prolonged period. Regarding the system's total weight, the entire build weighs around 13 KG, with 4.4 KG of that being only copper. The case weighs 7.5 KG, and the other parts weigh about one kilogram.

Excellent cooling for industrial applications! With the ES Orbiter 360 TS, Alphacool introduces a compact external cooling system. The powerful ES Orbiter is equipped with two NexXxoS Full Copper radiators of the HPE variant. The increased number of water channels and copper fins allows more coolant to flow through the radiator for significantly increased cooling performance. The radiators are optimally ventilated by the three built-in Alphacool Core 120 mm fans. Thus, a high waste heat of up to 1500 watts can be effectively dissipated.

The compact design of the Orbiter 360 TS is kept simple. It not only has an illuminated, colored temperature display, but also two recessed handles that allow for easy lifting or transportation. On the fill level indicator on the front, it is possible to see how much coolant is in the cooling system. The fill port and the adjacent vent valve on the top make it easy to top up the liquid when needed.

An 8 lbs (roughly 4 kg) solid cylinder made of copper was used as a fanless heatsink to cool an Intel Core i9 processor. This isn't a heatsink in that it's made of extruded copper, but a literal hunk of copper that is used as raw material. The metal is both extremely malleable and ductile, so it's shipped in such cylinders. The best part—the contraption is surprisingly good at the job, with That-Desktop-User, the Redditor behind this feat, claiming 35 °C idle and 80 °C load temperatures. The processor is essentially a heat-source that's trying to heat up the entire block of metal (with much lesser surface area for heat-dissipation than a real heatsink), which is how temperatures are being held at only up to 80 °C.

Marvell (NASDAQ: MRVL) today announced the industry's first 800 Gbps or 8x 100 Gbps multimode platform solution, that enables data center infrastructure to achieve dramatically higher speeds for short-reach optical modules and Active Optical Cable (AOC) applications. As artificial intelligence (AI), machine learning (ML) and high-performance computing (HPC) applications continue to drive greater bandwidth requirements, cloud-optimized solutions are needed that can bring lower power, latency and cost to short-range data center interconnections. The new 800G platform, which includes Marvell's PAM4 DSP with a multimode transimpedance amplifier (TIA) and Driver, enables faster data center speeds scaling to 800 Gbps, using conventional cost-effective vertical-cavity surface-emitting laser (VCSEL) technology while accelerating time-to-market with plug-and-play deployment.

Today's data centers are packed with equipment utilizing optical modules or AOCs connected by multimode optical fiber optimized for communication over short distances within data centers. This 100G per lane multimode fiber provides cost-effective, low-power, short-reach connectivity. To support multi-gigabit transmissions, multimode architectures often use VCSEL transmitters, which offer the cost benefits of reliability, power efficiency and easy deployment.

Alphacool today presents the HPE-45 and HPE-60 X-Flow, the new generation of high-performance radiators from Alphacool's proven NexXxoS full copper radiator series. What is new? With the HPE series, Alphacool increases the number of cooling channels within the radiator. This change gives a significant increase in cooling performance without increasing the restriction in the radiator. Another performance-enhancing feature of Alphacool's HPE series is the high fin density. With a fin spacing of 15 or 16 FPI, it enables an optimal flow of air. If the radiator is equipped with 80 mm fans on both sides in push/pull mode, a significant reduction in water temperature is demonstrably possible compared to standard radiators.

The NexXxoS HPE-60 all-copper radiators also feature Alphacool's proven X-Flow technology. This means that the Inlets and outlets are located on the opposite sides and thus enable an easy realisation of a water circuit within a server rack. The 60 mm thick radiators can be equipped with three or four 80 mm fans per radiator side.

After the long reign of the most popular water block on the market, the EK-Quantum Velocity, it's time to push the boundaries yet again and step into the future. Enter the next generation EK Quantum Line water block - the EK-Quantum Velocity². The water block showcases the EK-Matrix7 initiative, a standard where increments of 7 mm manage the height of products and the distance between ports. This product uses a socket-specific cooling engine to ensure the best performance and optimal flow with low restrictions on every platform. Three years after the original Velocity water block launch, EK is officially launching the Velocity² 1700, which is engineered for the Intel LGA 1700 socket and Alder Lake series desktop processors. Other Velocity² CPU water blocks will also follow shortly, tuned specifically for each CPU socket and IHS geometry on the market.

This new water block kept the name "Velocity" because it retained the ability to be responsive and agile in the world of liquid cooling. Embedded in the Velocity² is a next-generation EK CPU water block cooling engine that is socket-specific. A combination of mounting pressure and cold plate geometry, tailored for the IHS and die layout of Intel LGA 1700 socket processors, is used to achieve low hydraulic flow restriction and high performance. Thе lathe-turned cold plate is made with precision to cover the IHS effectively and put optimal pressure on the die area.

Today, we got another report about the potential problems with motherboards and graphics cards. At the moment of writing, the global supply chain of electronics is still under the shortage caused by the lack of sufficient supply of semiconductors and some other electronic components that cannot meet demand. There is a reported scarcity of copper and copper-clad laminates (CCLs), used as a base plate for manufacturing printed circuit boards (PCBs) that power every electronics product currently available. According to DigiTimes, the costs of copper foils used to make these CCLs are rising, putting significant pressure on motherboard and GPU makers to increase their price quotes.

As the materials used to create motherboards and GPUs are experiencing rising costs, that usually results in two types of actions taken by the manufacturer: a price increase or a reduced profit margin of the product. Copper pricing has risen by 35% since Q4 2020, so price growth is inevitable. With the increased MSRP representing a common trend in the computer industry for the past period, it could very easily translate into manufacturers boosting their pricing structure. That means that we, as consumers, could see higher prices of motherboards and graphics cards, especially those models with PCBs made out of high amount of copper layers.

With the NexXxoS XT45/UT60 Dual-Flow and the NexXxoS ST25 radiators, Alphacool is once again expanding its range of high-performance all-copper radiators. The NexXxoS XT45/UT60 360 mm Dual-Flow radiators have been specially developed for use in servers. A new feature is that the dual-flow radiator based on Alphacool's X-Flow technology is split in the middle and this consists of two smaller X-Flow radiators. Due to the limited space in servers, the use of multiple radiators is often not possible. With dual-flow radiators from Alphacool, tubing can be routed easily and, depending on the scenario, it is even possible to create two separate water loops.

Thermalright is on a roll with top-flow CPU cooler launches lately, and just added its latest creation, the AXP90-X47 Full Copper. Fit for low-profile builds, this 47 mm-tall top-flow cooler, as its name suggests, uses a heatsink that's made almost entirely of copper, complete from the base-plate to the heat-pipes, to the dissipation-fins, with the only non-copper bits being the retention module.

Four 6 mm-thick copper heat-pipes make indirect contact with the CPU through a C1100-grade copper base, conveying heat to a stack of 54 copper fins. This 32 mm-tall heatsink is ventilated by a 15 mm-tall TL-9015R 90 mm fan. Featuring a hydraulic bearing, the fan spins at 2,700 RPM, pushing up to 42.58 CFM of airflow at 1.33 mm H₂O static pressure, and 22.4 dBA minimum noise. Measuring 95 mm x 94.5 mm x 47 mm (WxDxH, including fan), the AXP90-X47 Full Copper weighs 520 g. CPU socket types supported are AM4, LGA1200, and LGA115x. The company didn't reveal pricing.

Colorful Technology Company Limited, a professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions, and high-performance storage, is thrilled to announce the launch of its limited-edition variant of the NVIDIA GeForce RTX 3090 graphics card - the iGame GeForce RTX 3090 KUDAN. COLORFUL will only produce 1000 units of the graphics card. It comes with the brand's most advanced premium features to deliver excellent cooling for extreme performance. The KUDAN's hybrid cooling thermal design is a perfect balance of air cooling and liquid cooling, enabling the KUDAN to reach extreme overclocks with superb stability. The KUDAN comes with COLORFUL's signature One-Key OC delivering extreme performance in a switch of a button, pushing boost clocks to 1860 MHz.

The iGame GeForce RTX 3090 KUDAN sports a black and gray color theme on its precision CNC machined aluminium alloy shroud and backplate. The KUDAN features intricate patterns along with the iconic Golden Gears and gold accents to complete its luxurious look - styling that's fitting for a king. The KUDAN also features an LCD display and vibrant RGB lighting elements on the graphics card and radiator.

An undeniable force is here. The planets align as the next evolution of the ultimate gaming experience has emerged. The EVGA GeForce RTX 30 Series Graphics Cards have arrived. These new cards are colossally powerful in every way, giving you a whole new tier of performance. They are powered by the NVIDIA Ampere architecture, which doubles down on ray tracing and AI performance with enhanced RT Cores, Tensor Cores, and new streaming multiprocessors. The EVGA GeForce RTX 30 Series are the absolute definition of ultimate performance.

The new NVIDIA GeForce RTX 30 Series GPUs, the 2nd generation of RTX, features new RT Cores, Tensor Cores and streaming multiprocessors, bringing stunning visuals, amazingly fast frame rates, and AI acceleration to games and creative applications. Powered by the NVIDIA Ampere architecture, which delivers increases of up to 1.9X performance-per-watt over the previous generation, the RTX 30 Series effortlessly powers graphics experiences at all resolutions, even up to 8K at the top end. The GeForce RTX 3090, 3080, and 3070 represent the greatest GPU generational leap in the history of NVIDIA.

Alphacool today unveiled five new NexXxoS series DIY liquid cooling radiators. These include the XT45 Full Copper 1260 mm SuperNova, XT45 Full Copper 1080 mm Nova, XT45 Full Copper 200 mm, XT45 Full Copper 400 mm, and ST30 Full Copper 560 mm radiator V.2 The XT45 Full Copper 1260 mm SuperNova Radiator has 400 x 400 x 45 mm of pure cooling surface for nine 140 mm or four 200 mm fans. No other Alphacool radiator offers as much surface area in a single product. Priced at 139.96€. Alphacool NexXxoS XT45 1080 mm Nova offers 350 x 350 x 45 mm of pure cooling surface for nine 140 mm or four 200 mm fans. Only one other Alphacool Radiator offers more cooling surface in one unit. The Alphacool NexXxoS XT45 1260 SuperNova Radiator. Priced 99.95€.

As usual, Alphacool also uses pure copper for the NexXxoS 200 mm XT45 Radiator. The end chambers, water channels and cooling fins are all made of copper and are a unique selling point worldwide. As a result, Alphacool radiators have been among the most popular and best on the market for many years, providing the perfect foundation for every water cooling system. Priced at 59.95€.

Thermalright rolled out the AXP-90 Full Copper top-flow CPU cooler for low-profile PC builds. A smaller sibling of the AXP-100 Full Copper, and a variant of the aluminium-based original AXP-90, this cooler features a dense copper fin-stack that's arranged along the plane of the motherboard. Four 6 mm-thick copper heat pipes make indirect contact with the CPU over a mirror-finish copper base-plate, pulling heat through the fin-stack. A 15 mm-thick 92 mm TL-9015R fan ventilates the fin-stack. This fan takes in 4-pin PWM input, spins at speeds of up to 2,700 RPM, pushing up to 42.58 CFM of air, with as low as 22.4 dBA of noise output. With the fan in place, the AXP-90 Full Copper measures 97 mm x 92 mm x 47 mm (WxDxH), weighing 490 g. There are two sub-variants of the cooler specific to CPU socket type supported, the AXP-90 Full Copper LGA115X, and AXP-90 Full Copper AM4. Available on Chinese e-tailers such as T-Mall, the AXP-90 Full Copper is priced at RMB 299, or the equivalent of USD $42.70.

The last time Thermalright gave a "Full Copper" twist to one of its bestselling CPU coolers was 10 years ago. The AXP-100 Full Copper sees the coming together of a pure copper fin-stack, six 6 mm exposed copper heat pipes, a copper base for indirect transfer to the heat pipes, and a reddish-orange fan. The height of the heatsink is 44 mm, which interestingly, is less than even that of the AXP-100 RH (reduced height) variant. The heatsink measures 108 mm x 121 mm x 44 mm (WxDxH), weighing 640 g, almost double that of the AXP-100 RH, and about the same as the AXP-100 Muscle. The included TY-100 fan is a 120 mm spinner, with a range of 900 to 2,500 RPM, PWM input, 16 to 44.5 CFM air-flow, and 22 to 30 dBA noise output. Among the sockets supported are LGA2066, LGA115x, and AM4. The company didn't reveal pricing.

Swiftech is proud to announce the latest advances in All-in-one Liquid Cooling CPU Cooler, the Drive X3. The new X3 AIO series has received a number of improvements, along with a new sizing and naming convention as well.

The Swiftech X3 will be available in two radiator sizes, dual 120mm fans and triple 120mm fans at the time of the release. These will include a new 120mm fan design that include improved static pressure and maximum discharge, lower operation noise level, and Swiftech IRIS compatible addressable RGB's built into the frame of the fans.

After nearly a year from first announcing the Cu line of full copper coolers PC cooling innovator CRYORIG is now releasing the C7 Cu copper enhanced SFF ITX cooler. The C7 Cu is built from the award winning C7 architecture with one obvious upgrade, the extravagant use of copper for the whole heatsink body. By exchanging for a full copper build from aluminum has allowed the C7 Cu see improvements of up to 15% in thermal performance. The increased thermal performance without increased size is a key advantage of the C7 Cu especially in ultra compact SFF/ITX builds where space is limited.

Aimed at solving the space limits of Small Form Factor ITX systems, the C7 Cu was set with the task of further improving performance but without increasing size or fan speed. Utilizing higher thermal conductive materials was the only answer for the C7 Cu. Copper is nearly twice as thermal conductive as aluminum but nearly three times as expensive. That's why copper is normally only used on the most thermal critical components such as heatpipes and heatsink base plates. With the C7 Cu, CRYORIG has swapped out the aluminum elements of the C7 with pure copper. Thermal performance gains are close to 15% when compared to the original C7.

Watercool started development on their waterblocks for AMD Threadripper processors back in August. The brand made an announcement today on their Facebook stating that waterblocks are ready to come out of the oven. The Heatkiller IV waterblocks will come in three variants: copper, nickel, and nickel/black. All three models are available for preorder tomorrow. If you're quick enough to pull the trigger, you can also net yourself a nice 10% preorder discount. According to Watercool, the copper model ships on November 10th, while the other two remaining nickel models will start shipping on November 24th.

The full copper model is a waterblock aimed at copper lovers. It comes with an unique, huge Threadripper cooling plate made entirely of copper. The massive top is milled out of one solid block of copper. On the other hand, the nickel block caters to those who prefer a more glossy look. Both the huge cold plater and top are milled out of solid copper; then consequently nickel plated. Lastly, Watercool calls the nickel/black model the jack of all trades. The copper cold plate is nickel plated, while the top is manufactured from acrylic (Plexiglas GS) and comes with a black anodized aluminum cover. RGB lighting is present thanks to the preinstalled RGB LED strip which connects to the RGB LED headers on X399 motherboards through a black, paracord sleeved cable.