Green House Japan released a pair of new 8 GB DDR3-1333 MHz (PC3-10600) memory modules. These consist of the GH-DRT1333-8GB and GH-DVT1333-8GB, which are 240-pin standard DIMM, and differ by the former having lifetime warranty, while the latter has 5 year warranty; and GH-DNT1333 and GH-DWT1333, which are 204-pin SO-DIMM modules with lifetime and 5-year warranties, respectively. Both kinds of modules are JEDEC standards-compliant, and run at DDR3-1333 MHz speeds with CAS latency of 9T, and 1.50V DRAM voltage.

Here are some of the first pictures of Acer Aspire E1-421, which caught the eye of a shopper in Asia. Its most distinctive feature is AMD E1-1200APU "Brazos 2.0", driving the machine. The dual-core APU is clocked at 1.40 GHz, and packs Radeon HD 7310 graphics. Other vital components include 2 GB of DDR3 memory, and 320 GB HDD storage. A DVD SuperMulti drive handles removable storage. The notebook's 14-inch screen packs 1366x768 pixels resolution, the GPU utilizes 256 MB from the system memory. 802.11 b/g/n WLAN, and a 6-cell battery make for the rest of it.

Team Group Inc. has been invested a great deal of efforts in developing commercial products that catch up with global trends. Now we are expanding our spectrum to industrial markets and dedicate ourselves in the development of industrial products that features high standard and resistance to extreme environmental conditions. This year, Team Group rolls out the new industrial control memory module series, including Registered DIMM, ECC U-DIMM, VLP U-DIMM and Micro-DIMM, in the largest embedded system exhibition, the ESEC, in Japan.

The "industrial control wide-temperature series," the point in the show, is the "mighty warrior" that is able to operate in an environment at a temperature ranging from -40°C to 95°C. It is like operating stably in an extreme environment in the Arctic Circle or a scorching desert. This is absolutely the top choice for your industrial control memories and server memories.

Foxconn's Channel brand introduced a new line of fanless compact PCs under the Nano PC brand. The two newly launched models include the AT-5300, which is driven by Intel Atom D2700, and the AT-5600, which is driven by by AMD E-450 "Brazos" APU. The two are barebones, and require at least one DDR3 SO-DIMM module (up to 4 GB) and a 2.5-inch HDD or SSD. Both models measure just 190 x 135 x 38 mm, and weigh about 600 g. Connectivity includes two USB 3.0 ports, four USB 2.0 ports, an SD/SDHC/MS/MS Pro/MMC card reader, 802.11 b/g/n, gigabit Ethernet, and display outputs that include D-Sub and HDMI. Available soon, the two Nano PC models will be priced under US $200.

Although at a much "smaller" scale, Raspberry Pi did to mini computers what iPad did to tablets (wake up a nearly dead product segment), and now a section of the market likes computers to be as small and potent as the ARM-driven Raspberry Pi. Although at a different end of the price and performance spectrum from the Raspberry Pi, Intel has reason to believe its NUC mini computer could achieve market success. NUC (Next Unit of Computing) is a mini box computer for the retail channel, which is roughly the size of a modern wireless router, but as powerful as a mainstream laptop.

The NUC owes its computing power to Intel Core i3/i5 "Sandy Bridge" dual-core processors (probably in the BGA-1023 package), with Intel HD 3000 graphics, and dual-channel DDR3 memory (SO-DIMMs). The logic board measures 100 x 100 mm, and has all the essential connectivity crammed into it, including umm...10 Gb/s Thunderbolt, USB 3.0, 802.11 b/g/n, and HDMI with multi-channel HD audio. This board is smaller than VIA's NANO-ITX (120 x 120 mm) form-factor. The rest of the ABS plastic enclosure's volume is spent housing the cooling assembly. Informed sources predict that while the NUC won't be priced in the hundereds or thousands of Dollars, it most certainly won't be priced at $25. A starting price of $100 seems realistic.

The versatile new MI-HM65T Mini ITX motherboard from Giada is at home in all environments, including the factory floor, tough monitoring and control applications, embedded computing, office desks, and the home. Built around Intel's HM65 chipset and the Sandy Bridge platform, this motherboard brings users high performance and almost unlimited connectivity, with economical power consumption. It offers all the industry-standard features of a desktop PC in a tiny package, to support a wide range of applications.

Powered by Intel's fast Core i7, i5, i3 or Celeron 867 CPUs, supported by up to 4GB of memory, with onboard integrated graphics and video support, the Giada MI-HM65T can easily take care of almost any task you throw at it. This tough but tiny powerhouse handles industrial control, monitoring and automation applications as well as office and productivity, or home entertainment.

Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the industry's first 100 Gbps full duplex network processor unit (NPU). Enabling the next wave of 100GbE optimized switches and routers for service provider networks, the fully programmable BCM88030 family features 64 custom processors running at 1GHz, delivering more than 2X the throughput of any NPU on the market. With the industry's highest level of integration, the BCM88030 solution eliminates costly external components, dramatically reducing system cost and power by up to 80 percent per 10 GbE port.

In 2012, the number of connected devices is set to exceed the world's population with an estimated 7 billion devices connected to the network(1). By 2015, 90 percent of content viewed on mobile devices will be streaming video and application downloads are expected to reach 47 billion per year(1). To satisfy this overwhelming appetite for bandwidth, service providers around the globe are racing to transform their networks by adopting higher bandwidth links. Analysts estimate a compound annual growth rate (CAGR) of more than 170 percent from 2011 to 2016 for 100G Ethernet ports as service providers rush to meet this demand(2).

AMD revealed performance numbers of its key product for mainstream notebooks, the A10-4600M, in an infographic for the Korean market. Besides detailing the part, it reveals some performance numbers. To begin with, A10-4600M is based on the 32 nm "Trinity" silicon with all its components enabled. It has four x86-64 cores spread across two "Piledriver" architecture modules, 4 MB of total cache (2x 2 MB), CPU clock speeds of 2.30 GHz (3.00 GHz TurboCore), and integrated Radeon HD 7660G graphics that has 384 VLIW4 stream processors, and GPU core speed of 685 MHz. The chip integrates a PCI-Express 2.0 root complex, and dual-channel DDR3-1600 MHz integrated memory controller.

Moving on to performance numbers, and as expected, the infographic doesn't touch comparative CPU performance with a barge-pole. Instead the focus is on graphics performance, with an emphasis on Dual GPU feature, where the integrated graphics can work in tandem with a discrete GPU of the same class, resulting in up to 75% performance increase. Based on data from this infographic, and its own testing data of other notebooks, NordicHardware compiled relative performance of the IGP and Dual Graphics setup involving the A10-4600M and Radeon HD 7670M discrete GPU.

BOXX Technologies, the leading authority on dedicated rendering and innovator in high-performance computing systems for product design, visualization, engineering, visual effects, and more, today introduced the 3DBOXX 4925, the industry's first single Intel Xeon processor workstation with support for up to four GPUs. The latest addition to the BOXX 4900 series workstation line, 4925 enables users of Autodesk Revit, Autodesk 3ds Max, SolidWorks, CATIA, and other professional software applications, to simultaneously design and render without bogging down the processes.

Eurocom Corporation, a developer of long lifespan, fully upgradable notebooks is adding the newest AMD Radeon HD 7970M GPU to their extensive options list of Ivy Bridge powered, high performance notebooks. The addition of the AMD Radeon HD 7970M offers users a new level of high performance GPU computing. Eurocom will also offer the AMD Radeon HD 6990M GPUs separately to existing customers as an upgrade option.

The addition of the AMD Radeon HD 7970M, the highest performing mobile solution from AMD, gives Eurocom customers a superior choice of video processor options to configure into their new Eurocom system or upgrade into their existing system. The addition of the AMD Radeon 7970M GPUs in single and CrossFireX offers customers a greater selection of video processor options to fit any preference or performance level.

TYAN, an industry-leading server platform manufacturer and subsidiary of MiTAC International Corp., announces new CPU support for the S5515 and S5517. These embedded motherboards now support the 3rd Generation Intel Core processor product family (codename: Ivy Bridge) with a quick bios update. These two platforms now deliver the benefits of Intel's 22 nm Core i3/i5/i7 processor architecture with stronger performance, consistent reliability, and low cost in small form factor that targets various applications in the embedded industry.

TYAN's S5515 and S5517 embedded motherboards now offer support for 3rd Generation Intel Core i3/i5/i7 Processors. Existing motherboards will only need a BIOS update to support the new processors. Intel's 3rd Generation Intel Core processors offer greater performance with multiple expansion options such as PCI-E x16 Gen.3 slots, SATA 6G/3G controllers, U-DDR3 1600/1333/1066 w/o ECC memory slots and USB 3.0 ports. These two products deliver enhanced computing performance, greater 3D (tri-gate) effect and more RAM support. This makes them the ideal platforms for customers with critical requirements from telecom, networking, storage, medical imaging, embedded severs, security and surveillance appliances.

G.SKILL, the worldwide leading high performance memory designer, has announced the new TridentX DDR3 memory kit for 3rd Generation Intel Core Processors and Z77 platform.

The ultimate speed up to DDR3 2800 MHz 16 GB(4 GBx4) & DDR3 2666 MHz 32 GB(8 GBx4)

Designed for overclocking enthusiasts, the TridentX series includes a complete lineup of extreme performance DDR3 memory, starting from 2400 MHz 8 GB to 2800 MHz 16 GB. The following screens show the TridentX 2800 MHz 16 GB kit has successfully achieved DDR3 3320 MHz speed, while the 32 GB 2666 MHz kit has achieved DDR3 2933 MHz speed, both results are with 4 DIMMs fully installed under LN2.

Eurocom Corporation, a developer of long lifespan, fully upgradable Notebooks, high performance Mobile Workstations and Mobile Servers is now supporting the Intel Core i7-3920XM Processor Extreme along with the Intel Core i7-3820QM, Intel Core i7-3720QM and Intel Core i7-3610QM in the Eurocom line of Notebooks including: EUROCOM Neptune 2.0, Racer 2.0 and Monster.

Eurocom's line of high performance Mobile Workstations and Gaming Notebooks will be bolstered by the introduction of the Intel Ivy Bridge processors and complete line of Intel 22nm processors. The Eurocom notebooks will be some of the world's first Ivy Bridge notebooks with Intel HM77 and HM76 chipsets using the uFPGA988B socket. Eurocom Notebooks are ideal for professionals and teams who frequently travel and need access to high performance computing.

Sony's VAIO E Series 14P notebooks went Ivy Bridge with model#SVE14A16FGH. This 14-incher (1600x900 pixels) is powered by an Intel Core i7-3612QM quad-core processor (2.10 GHz with 3.10 GHz boost), 4 GB of dual-channel DDR3 memory, and AMD Radeon HD 7670M graphics. A 750 GB HDD and DVD writer are at the helm of storage. USB 3.0, HDMI and D-Sub, wireless b/g/n, 1.3 MP webcam, and gigabit Ethernet make for the rest of it. It retains the E series 14P chassis that's already launched. The leak occurred at Sony Australia, SVE14A16FGH goes for AU $1,499 (US $1,554) Down Under.

ASUS is working on an AMD-powered notebook under the K53TK line. The K53TK-SX0A8 from ASUS is a 15.6-inch notebook that incorporates AMD A8-3520M "Llano", which is a quad-core APU clocked at 1.60 GHz, with Radeon HD 6620G graphics. The APU's integrated graphics works in tandem with a discrete Radeon HD 7670M GPU, that has 2 GB of dedicated memory. Other vital components include 8 GB of dual-channel DDR3-1333 MHz memory, and AMD A70M FCH chipset.

The 15.6-inch display packs 1366x768 pixels resolution. Display outputs include D-sub and HDMI. Storage is care of a 750 GB HDD and DVD SuperMulti drive. Connectivity includes 802.11 b/g/n, Bluetooth 3.0, gigabit Ethernet, SD/SDHC/MMC card reader, two USB 3.0 ports, two USB 2.0 ports, 1.3 MP webcam, and FireWire. The battery powering the beast can run it for 4 hours before needing a recharge. Measuring 391 x 266 x 30.5 ~ 40.5 mm (WxDxH), the notebook weighs 2.7 kg. Windows 7 Home Premium 64-bit operating system comes pre-loaded. It will be priced around 79,800 JPY (US $970).

ASRock is readying its second Fatal1ty-branded socket LGA2011 motherboard, the X79 Fatal1ty Champion. The company's first LGA2011 Fatal1ty motherboard is the X79 Fatal1ty Professional, which was launched in February. The new X79 Fatal1ty Champion will be launched on April 27. Those familiar with Creative Sound Blaster Fatal1ty line of sound cards will note Fatal1ty Champion as being a more feature-rich version of Fatal1ty Professional. In this case, the X79 Fatal1ty Champion is based on a completely new PCB, with the design idea of more expansion, and the latest Creative Sound Core3D audio solution.

The X79 Fatal1ty Champion features eight DDR3 DIMM slots (X79 Fatal1ty Professional has four), and a PCIe-only expansion slot layout. The LGA2011 socket is powered by a 12-phase DigiPower VRM, similar to the one on the Professional. The VRM heatsink is assisted by two other secondary heatsinks, to which heat is conveyed by a heat-pipe. One of these is connected to the PCH heatsink. Power is drawn by 24-pin ATX, 8-pin EPS, and one 4-pin Molex (angled, optional). The board features consolidated voltage measurement points, which are socketed to hold your multimeter's leads in place. The board will be augmented by a feature-rich UEFI BIOS setup program, and ASRock-exclusive features such as XFastLAN, XFastUSB, and XFastRAM will be included.

Kingston launched a fleet of new system-specific SO-DIMM memory packages. Each of these packages contain memory that's tested for 100% compatibility and rated performance on the notebook makes they're specific to. These include HP, Dell, Apple, Lenovo, Sony, and Toshiba. The new packages make it easy for ground-store buyers to pick the right memory for their notebooks off the rack, with minimal help from the storekeepers. Newer batches of Kingston DDR3 SO-DIMM memory for notebooks will implement the new packaging.

An anonymous overclocker cracked a staggering DRAM speed (for dual-channel), using Intel Core i7-3770K processor (engineering sample) and ASUS Maximus V Gene motherboard, at DDR3-3256 MHz. The overclocker started off at DDR3-3153 (~1576 MHz actual) on boot, and carefully notched it up to DDR3-3256 (1628 MHz actual) in Windows. 16 GB of memory of an unknown make, was used.

What makes the feat impressive is that such DRAM clock speeds are difficult for dual-channel/multiple-module setups, and reserved only for single-module feats. Ahead of the launch of the 3rd Generation Core "Ivy Bridge" platform, every motherboard vendor is covertly showing off similar overclocking feats.A video recording of the feat follows.

G.Skill unveiled its newest line of memory for extreme overclocking, the Trident X. Its launch is timed to follow that of Intel's Core "Ivy Bridge" processor family, and is optimized for 7-series chipset motherboards (due to their support of latest Intel XMP 1.3 specification). Pictured below is what Trident X series modules look like: a black PCB with a slightly long black metal heatsink, which has a detachable crown heatsink (red). One can notice a slot for heat pipes in the juncture between the crown heatsink and the module's main heatsink.

Aesthetically, the Trident X series modules don a black+red color scheme, which goes well with the black+red motherboard in the background (in the press-shot). Pictured below are the DDR3-2400 MHz (PC3-19200) modules in dual-channel configuration. The XMP profile runs the module at its 2400 MHz DDR (1200 MHz real) speed, with timings of 10-12-12-31T, and DRAM voltage of 1.65V. The modules will be available in various other speed/timing configurations, and in densities of 4 GB and 8 GB, making up for 8 GB and 16 GB dual-channel kits, for the new "Ivy Bridge" platform; 16 GB and 32 GB quad-channel kits for the Sandy Bridge-E platform. The older Sandy Bridge LGA1155 platform might not be 100% compatible, since it lacks XMP 1.3 support. G.Skill Trident X will be formally announced on May 4.

VIA is out with its latest addition to the Artigo family of compact barebones PCs, the Artigo A1200, the company's latest addition after Artigo A1150. The A1200 is powered by VIA Nano X2 E dual-core processor clocked at 1.20 GHz, and VIA VX900 chipset that packs integrated graphics with enough compute power for smooth 1080p video playback, with hardware-accelerated decoding of MPEG-2, WMV9 and H.264 HD video formats. The system packs one DDR3 DIMM slot, supporting up to 4 GB of memory. There is room for one SATA HDD. Display outputs include D-Sub and HDMI. Other connectivity includes two gigabit Ethernet interfaces, one USB 3.0 and four USB 2.0 ports, optional 802.11 b/g/n, Bluetooth, and one CFAST interface. The system is fan-less, and passively cooled by heatsinks. Pricing and availability information is not known.

After last week's launch of nano-ITX Cedartrail motherboards, J&W launched mini-ITX motherboards under its iconic Minix brand. The new motherboards are designed keeping HTPCs and compact desktops in mind. These include the Minix D2700-HD (Atom D2700, HDMI), and Minix Minix D2500-HD (Atom D2500, HDMI). Pictured below is the Minix D2700-HD.

The Minix D2700-HD runs an Atom D2700 dual-core processor clocked at 2.13 GHz, with two SO-DIMM memory slots supporting up to 4 GB of single-channel DDR3-1066 MHz memory. Its lone expansion slot is a PCI-Express 2.0 x1. The board draws power from a 2-pin DC external input, and gives out a 4-pin Molex output to power connected SATA drives. Connectivity includes dual gigabit Ethernet, two SATA 3 Gb/s, two USB 3.0, 6-channel HD audio, and display outputs that include HDMI and D-Sub. The Minix D2500-HD is driven by Atom D2500 dual-core processor clocked at 1.85 GHz, it is largely identical to its bigger sibling, except for the lack of USB 3.0, and the second Ethernet connection. Pricing and availability information is awaited.

Embedded systems and IPC maker J&W unveiled the first Atom "Cedar Trail" motherboard in the nano-ITX form-factor. The board measures just 120 x 120 mm, and is designed for embedded computing devices. It draws power from a 2-pin 12V DC input. It holds a dual-core Intel Atom D2700 (2.13 GHz) or D2500 (1.83 GHz) processor, one DDR3 SO-DIMM slot (reverse side), which supports up to 4 GB of DDR3-1066/800 MHz memory, and basic connectivity. The lone expansion slot is a mini-PCIe, designed to hold WLAN adapters.

Display outputs include D-Sub (by header), LVDS, and HDMI. Connectivity options include one SATA 3 Gb/s (AHCI), five USB 2.0 ports (three type-A connectors, two via headers), gigabit Ethernet, 6-channel HD audio over HDMI and 2-channel analog audio, RS232 Serial, SD/SDHC card reader, SIM card slot (3G option), consumer IR, and PS/2 (header). The CPU and core logic can be passively cooled. The Cedar Trail Nano-ITX board from J&W will be available to embedded systems and IPC markets, soon.

ZOTAC unveiled a monster LGA1155 motherboard aimed at professional overclockers, and based on the new Intel Z77 Express chipset, the ZT-Z77-U1D. Pictured below, the designers' focus was evidently on giving the motherboard a very strong VRM, apart from just enough expansion and connectivity features for 2-way multi-GPU setups. To begin with, the LGA1155 socket is powered by a 27-phase VRM, which consists of AIO ferrite-core solid-state chokes, DrMOS, tantalum capacitors, and a super-ML multiphase capacitor to condition power. The VRM is controlled by a VRD12-compliant controller.

The LGA1155 socket is wired to four DDR3 DIMM slots, supporting dual-channel DDR3-2133+ MHz memory, and two PCI-Express 3.0 x16 slots (x8/x8, when both are populated). Other expansion slots include four PCI-Express 2.0 x1, wired to the Z77 PCH. All six SATA ports from the PCH are assigned as internal ports, that's two SATA 6 Gb/s, and four SATA 3 Gb/s. Display connectivity includes DVI, HDMI, and DisplayPort. Other connectivity includes 8+2 channel HD audio, 802.11 b/g/n, Bluetooth 3.0, gigabit Ethernet, six USB 3.0 ports (two on the rear panel, four via headers), and a number of USB 2.0 ports.

Centon Electronics is proud to announce the release of a high density memory upgrade. Centon is rolling out a 16 GB ECC Registered DIMM that comes in a single module or in kit of two 8 GB's. This high powered module comes in a VLP and LP form which reaches a voltage of 1.35. This family of DDR3 products is available in a 240 pin and 204 pin SODIM. These high density DDR3 memory modules range from Non-ECC to ECC to ECC Registered.

Memory overclocking feats over 3000 MHz, aren't new. Last month, we've seen G.Skill and and GIGABYTE achieve a whopping 3736 MHz on the dual-channel AMD "Llano" platform. The duo has now cracked the 3000 MHz mark with four modules, achieving 3077 MHz. The record (>3000 MHz with four modules) was set by Coolaler, using an Intel Core i7-3770K "Ivy Bridge" processor, and GIGABYTE Z77X-UD5H motherboard. The memory of course was four 4 GB G.Skill DDR3-2600 MHz modules. The entire setup was air-cooled.A video of the feat follows.