Hynix Semiconductor today announced it has received validation on its DDR3 memory components and modules from Intel. The newly-validated DDR3 products are 1GB DDR3 SDRAM Unbuffered-DIMMs manufactured on 80nm process technology. These devices have operating speeds from 800MHz to 1066MHz with reduced voltage to 1.5V. These speeds are offered in latency combinations of 5-5-5 and 6-6-6 for the 800MHz, and 7-7-7 for the 1066MHz memory modules. Mass production of the 1GB DDR3 on the 80nm line will begin in the third quarter of this year. Hynix plans to manufacture the product on a 66nm process beginning in late 2007.

Akiba PC Hotline has pictures of DDR3 memory sticks that can be purchased in Japan. The price for a 1GB stick is ~$350.

Japanese Buffalo Ltd. anounced that it will ship its first DDR3 memory modules in Japan by the end of the month. The company will offer a kit of 512MB memory modules (2x 512MB), a single 1GB module as well as a 2GB set (2x1GB). The DDR3 memory standard is considered as the successor of the DDR2 SDRAM. It promises power consumption reduction of 40% compared to current DDR2 modules, allowing lower operating voltages (1.5V, compared to 1.8V in DDR2 modules). Buffalo's new modules run at 1,066MHz((PC3-8500) and maintain the 240-pin DIMM interface of DDR2. Intel has preliminarily announced that they expect to be able to offer support for DDR3 in mid 2007 with a version of their upcoming P35 Bearlake chipset. AMD's roadmap indicates their own adoption of DDR3 to come in 2008.

INTEL DEVELOPER FORUM, Beijing, April 17, 2007 -- Intel Corporation executives today detailed more than 20 new products, technology innovations and industry initiatives -- many of them industry firsts -- aimed at making the World Wide Web, computers and consumer electronics devices much more responsive, friendlier and secure.

Under the backdrop of Intel's leadership in 45nm Hi-k metal gate silicon technology and how it will ignite new innovation and growth opportunities, Intel executives at the Intel Developer Forum disclosed new performance details for its next-generation "Penryn" processor family. The company also unveiled two product roadmaps for Intel architecture (IA)-based System on Chip (SOC) consumer electronic (CE) devices and business uses.

There is one disturbing fact about DDR3. The timings will go bad but the speed of the memory will increase.

DDR3 800 memory will work at CAS latency 5 and 5-5-5 timings and as we all know DDR 2 can beat these settings as some good DDR 2 modules work at 3-4-4 timings and CAS Latency 3 (CL3). Well, that is not the worst latency you will see with DDR3. Some DDR3 800 modules will work at 6-6-6, CL6 timings but will probably end up cheaper.

DDR 3 1066 will start with CL7, 7-7-7 timings and DDR 2 at this speed works well at 5-5-5, CL 5 settings.

DDR3 1333 will work at CL8 with 8-8-8 settings while the fastest DDR 3 at 1600 will end up at 9-9-9, CL 9 settings. The good part is that all of these modules should work at 1.5 V.

We are sure that the companies such as OCZ and Corsair or similar ones will make these modules with even better settings and timings but these are the numbers to start with. CeBIT, the world's biggest IT tradeshow, will reveal a bunch of motherboards and DDR 3 memory modules.

Is the era of low-latency memory over for good?

Super Talent has completed construction of its first DDR3 prototype modules and will be the first to introduce commercial modules. As a member of JEDEC, Super Talent is devoting engineers and time to defining and finalizing the DDR3 specifications. DDR3 is set to be the next PC memory standard and the successor to DDR2 memory. It holds a number of technological advantages over its predecessor. Power consumption has been decreased to 1.5 Volts, while clock speeds have gone up ranging from 800MHz to 1600MHz. In addition, DDR3 modules will also use the same 240-pin form factor. They will not, however, be inter-compatible as DDR2 and DDR3 memory chips have the middle notch located at different positions. Super Talent expects to begin shipping its DDR3 modules long before motherboards supporting them are actually released. Current ship time is estimated at mid-2007.

Pictures of parts of a motherboard using Intel's P35 Express chipset have been posted at Chile Hardware:Motherboards featuring the upcoming Intel P35 Express variant from the upcoming Bearlake-family desktop chipsets will be some of the first to support DDR3 memory. They are officially slated for late 2007.

Apparently the chipset not only supports DDR3, but is also backwards compatible with DDR2. However, both cannot be used at the same time. The leaked motherboard supports up to four sticks of DDR3 memory rated at 800 MHz or 1066 MHz.

It will also support up to a 1333 MHz front-side-bus on Socket T, also known as LGA775 processors. LGA775 processors supported by the upcoming P35 Express-based board include Intel Core 2 Duo, Core 2 Quad and Celeron 4xx-series. There is no mention if previous Pentium 4, Pentium D and Celeron D processors for LGA775 remain supported on the new platform.