ECS showcased yet another upcoming motherboard during the ongoing CeBIT event: the LFH-A. Based on Intel's P55 chipset, the motherboard supports LGA-1156 socket. Featuring all the essentials the Ibex Peak platform provides, that includes two support for dual-channel DDR3 memory, six internal SATA ports, two PCI-Express 2.0 x16 slots and one PCI-E x4, the board also extensively supports Intel's Flexible Display Interface that links the IGP on the processor die to the connectors on the board: DVI, D-Sub and HDMI.

The P55 chipset is cooled by a small pre-production heatsink. It should also indicate that the P55 chip indeed runs cool enough to warrant a heatsink of that size, and that since most of the traditional chipset machinery has migrated to the CPU, there's very little the vendors need to do as far as chipset cooling goes. ECS LFH-A might feature in some of the first waves of motherboards to launch along with the launch of the platform itself.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced immediate availability of DDR3 Registered DIMMs (RDIMMs) and DDR3 ECC Unbuffered DIMMs (ECC UDIMMs).

Super Talent's 1GB and 2GB ECC UDIMMs are immediately available in production volumes and support speeds up to 1333MT/s for single DIMM per channel operation and 1066MT/s for two DIMM per channel operation. Super Talent's 1GB x8 RDIMM is also immediately available in production volumes and supports speeds up to 1333MT/s for single DIMM per channel operation, 1066MT/s for two DIMM per channel operation, and 800MT/s for three DIMM per channel operation. All these products are designed to be compatible with Intel's upcoming Nehalem EP Server Platform.

The ability of AMD's Phenom II X3 processors dole out an additional core thanks to flaws in BIOS programming, has been one of the most interesting events in the computer enthusiast industry this month. A simple toggle of an option would unlock the disabled core, appreciating the value of the processor. It was earlier known that only chips belonging to 0904 (fourth week of 2009) batch of the processors would be able to respond to the mod successfully, but now, a fresh finding by German website Hartware.net suggests that even chips made in the 51st week of 2008 batch responded to the mod, and the fourth core could be enabled. Hartware.net used Biostar's TA790GX A2+ motherboard for the feat.

Meanwhile, the only entity that stands to lose due to this rather bizarre "phenomenon" has stepped in. AMD has reportedly requested motherboard manufacturers to not to release motherboards with the "buggy" BIOS, and to devise a fix for the issue immediately. Manufacturers are requested to release fixed BIOS updates. Evidently Phenom II X3 could cannibalize higher quad-core chips by the firm. The company is yet to release an DDR3-supportive quad-core chip based on the Deneb core with the entire 6 MB cache enabled.

Kingston Technology Company, the independent world leader in memory products, today announced its 1333 MHz DDR3 server memory modules were validated by Intel for use on its Xeon processor-based motherboards. Kingston's registered ECC server ValueRAM DIMMs are optimized to take advantage of the triple-channel architecture for Intel's newest server platforms using the new Nehalem-based Xeon processors. The 1333 MHz DDR3 server modules will be available in 3 GB and 6 GB triple-channel kits. Kingston server memory is backed by a lifetime warranty and free, 24/7 technical support. For Intel validation information, please click here.

In yet another overclocking feat using AMD's Phenom II series processors, Team Finland set a new 3DMark06 world-record score of 35,698 3DMarks. The team consisted of renowned overclockers Petri "SF3D" Korhonen Sampsa Kurri and Sami "macci" Mäkinen. The team used AMD's DDR3-supportive AM3 platform and used high-performance DDR3 memory to demonstrate its overclocking capabilities. The bench consisted of:

• AMD Phenom II X4 6187MHz (4500MHz NB) under Dragon F1EE pot, liquid nitrogen cooling
• ASUS M4A79T Deluxe (790FX chipset)
• Corsair XMS3-2133 2x1GB DDR3-1800 CL7-7-7-1T
• 2x Radeon HD 4870 X2 830/950MHz with stock cooling
• Thermaltake Toughpower 1200W

As NordicHardware notes, for the first time in ages, an AMD-platform topped 3DMark06 Hall of Fame, crossing the previous record holder by 150 3DMarks. Validations of the score can be found here. A video of the feat has been posted on YouTube, and can be viewed here.

A lot has been said about AMD's rather mysterious new performance GPU, the RV790. Clues about the new GPU surfaced as early as in November last year, when we first reported about AMD working on a successor to the RV770 before the RV870 comes to be. During the course of time, we were given several scoops about its specifications, with some reports hinting at increased stream processor and TMU counts alongside increased clock-speeds to give out early projections of as much as 20% performance increments, taking its single-GPU flagship product to the domain of the GeForce GTX 285, but as multiple sources confirm now, none of that looks plausible.

The RV790 is essentially a reworked RV770 with higher clock-speeds. AMD seems to have reworked the design of the RV770, perhaps altered or removed rudimentary components that facilitate slightly higher clock speeds. While samples of the RV790 are spec'd to run at 850 MHz, one can expect a slightly increased overclocking headroom. The samples also carried Qimonda IDGV1G-05A1F1C-40X memory chips that are originally specified to run at 1 GHz, yet running at 975 MHz on the samples. The core continues to have 800 stream processors, 40 TMUs and 16 ROPs. It features a 256-bit wide memory interface to support GDDR5, GDDR4 and GDDR3 memory standards. It will be built on the existing 55 nm TSMC manufacturing node. Products based on the RV790 can be expected only by April.

Over the course of the last year, Foxconn's channel division emerged as a mature, seasoned and determined player in the high-end PC motherboard industry. For Intel's new Core i7 platform, Foxconn started off with an enthusiast-grade motherboard called the X58 Blood Rage, and a premium X58 Renaissance model. Over time, the X58 Blood Rage became a series of motherboards based on the scaling-down of its feature-set. The first variant to emerge out of it was the Blood Rage GTI, and now a newer "value" offering: the Blood Rage Flaming Blade.

Pictured by Japanese AKIBA PC Hotline, the Flaming Blade shows a distinct scaling-down of Blood Rage's feature-set, beyond that of the GTI variant, with a remodeled PCB, rearranged components and colour-theme. To begin with the CPU is powered by standard ferrite-core chokes as against the PWM circuitry on the original Blood Rage, and the semi-digital circuitry on the GTI variant. A standard 6-phase circuit is employed. The board continues having three DDR3 DIMM slots. Memory is powered by a two-phase circuit. Instead of four PCI-Express x16 connectors on the other variants, Flaming Blade makes do with only two, with a PCI-E x4 slot added to the mix. There is a notable amount of changes with the placement of connectors and headers. The board reduces the use of red in colour-coding the connectors and slots. The SONAR X-Fi sound card gets replaced by onboard audio, while the rest of the back-panel remains the same in terms of connectors. According to the source, Foxconn is looking to target the US $200~$220 price range with the Flaming Blade. For reference, the third picture below is that of the original Blood Rage.

MSI is said to be readying a custom graphics card called the N260GTX Lightning, based on NVIDIA's GeForce GTX 260 GPU. There is currently no word on clock speeds but one would expect this card to come factory overclocked. The graphics card has a custom red PCB, featuring 8+2 phase power, 5000 hour capacitors, 1792 MB of GDDR3, D-Sub, DVI and DisplayPort or HDMI and a dual slot, dual fan cooler, featuring 5 heatpipes. MSI will also be bundling an AirForce panel which appears to allow on the fly adjustments to core and memory voltage, core, shader and memory clock speeds, as well as profile selection and brightness and contrast adjustments. The MSI N260GTX Lightning is expected to make its first official appearance at CeBIT 2009.

Patriot Memory, a global provider of premium memory module and flash memory solutions, announced today the release of their DDR3 Tri Channel Signature Kits.

"With today's economy, 'value' has become even a greater concern for the consumer. Patriot Memory plans on making sure we provide solutions that provide value and the high quality that has made Patriot Memory a leader in the memory industry," says JR Wakabayashi, Marketing Manager for Patriot Memory.

Coming in kits of 3GB (3 x 1GB) and 6GB (3 x 2GB), Patriot's Signature Tri Channel is being offered at 1066MHZ, Cas Latency 7. The Patriot Tri Channel is compatible with all current X58 DDR3 motherboards.

Kingston Memory putting memory technology development in the right direction, by upping the per-module density to 4 GB. When produced in a large scale, the modules may go into making 2x 4 GB dual-channel, 3x 4 GB and 6x 4 GB triple-channel memory kits. The company put engineering samples of its new 4 GB ValueRAM modules to test.

In its teaser video (dubbed tech demo), using a Gigabyte GA-EX58-UD5 and Intel Core i7 920 based system, Kingston was able to demonstrate a mammoth 24 GB of system system memory by smoothly operating several virtual machines, which serves as a valid test to show how 24 GB of memory helps. The video was posted on YouTube and can be watched here. Kingston notes its pre-production 6x 4 GB kit to cost around $2000 to produce.

AMD found itself in a tricky situation with its launch schedule for the DDR3-supportive AM3 socket platform: the revision guide document for 10h family of processors disclosed a rather serious erratum with the processors, with the company not recommending the use of more than two DDR3-1333 memory modules in all, or more than one module per memory channel, stating unreliable operation as consequence (more here). We rose doubts on a certain statement in the document circling around what we saw as a potential solution to the problem, and hence sought the company's comment.

AMD replied to us with a set of things, not necessarily interrelated, though in some way connected to the erratum, and the company's approach towards the DDR3 memory standard:

• AMD confirms the issue as stated by the revision guide document, and is indeed working on a solution. The issue does not affect, in any way, using one DDR3-1333 memory module per channel
• The company has already specified the safest workaround for the issue: specifying the memory modules to run at the speeds of PC3-8500, 533 MHz (DDR3-1066). One can refer to hardware literature on how to do that
• AMD has given guidance to motherboard vendors on this issue. Some motherboards could rectify the issue by themselves, by operating the memory modules at PC3-8500 specifications. The incentive of tightening DRAM timings stays
• Good news for overclockers: You will be able to override the memory frequency control by motherboards, and can attempt to tweak frequencies at will. AMD product warranties, as always, don't cover damages caused by overclocking, even when overclocking is enabled via AMD Software
• Better news: Indications are that AMD is doing a lot more than creating a workaround for this issue, it may be devising a new feature altogether that, in the end, upholds the company's initiative to be enthusiast-friendly. Furthermore, AMD iterates that it is its intention to provide higher DDR3 frequencies as DDR3 becomes more prevalent

Barely a week into the introduction of the DDR3-supportive AM3 socket CPUs, the processors seem to be having design flaws. This, as circulated by AMD in its revision guide document for the 10h family of processors (found here, page 80). The issue, as described by AMD, centers around the DDR3 memory sub-system. On machines with more than one PC3-10600 (1333 MHz) memory module populating a memory channel, the users may experience unreliable operation. The company does not get into the specifics of the symptoms. This issue however, does not affect systems with a module per channel (one or two modules installed in the motherboard), and only those with three to four modules installed.

The AMD K10 memory controllers on AM3-socket processor provide a 128-bit wide memory interface (with DRAM Ganged mode enabled), which amount to two 64-bit wide memory channels. On most motherboards, four DIMM slots with two slots sharing a memory channel are present. With this issue, one is not recommended to use more than one DDR3-1333 memory module per channel. AMD recommends a quick fix for the issue for systems using more than one DDR3-1333 module per memory channel: to manually specify the memory to run at 533 MHz (1066 MHz DDR), and accordingly set DRAM timings. As a little compensation, one can tighten DRAM timings with the drop in frequency. AMD will fix this issue in the next stepping (sub-version) of the CPUs. The "x-factor" with this erratum revolves around DRAM voltage, a significant factor. One might note AMD saying "the processor memory subsystem may exhibit unreliable operation over the allowable VDDIO voltage range", which leads us to think if there is a potential workaround with adjusting the DRAM voltage beyond the allowable range (read: over-volting the memory). We hope to hear more from AMD on this.

UPDATE (02/13): AMD replied to the report, saying that work is in progress toward fixing the issue. While not getting into the specifics, AMD indicated to us that apart from addressing the issue, the company is also working toward something "which will make you 'feel cozy' about the DDR3 support". The statement is ambiguous, and is best left uninterpreted at this point in time.

Corsair, a worldwide leader in high-performance computer and flash memory products, today announced the launch of the new Dominator GT line of ultra high-performance DDR3 memory modules for Intel Core i7-based systems.

Sporting a new racing red color scheme and the next-generation of Corsair's patent-pending Dual-path Heat eXchange (DHX) technology, the new Dominator GT comes in 3-up 6GB kit, running at 2000MHz with latencies of 7-8-7.

Mushkin, one of the leading manufacturers of high performance computer components, announces the availability of a new DDR3 Triple-Channel-Kit. It's called: "998679r" and is equipped with 6GB and a high frequency of 1600 MHz. The memory will be delivered in a noble aluminium case assembled with unqiue "radioactive" heatspreaders.
"This kit is the ultimate combination of newest technology and fancy design." Proclaims Steffen Eisenstein, CEO of Mushkin Logistic GmbH very proudly, and continues: "The response for the "radioactive" heatspreader was huge, now we will have a hell of a party on DDR3!"

Transcend Information Inc., a global leader in the manufacture of high performance memory modules, is proud to unveil 4GB aXeRam DDR3-1800 memory upgrade kits. Designed specifically for hard-core gamers using only top-binned, premium quality DRAM chips and custom high-purity aluminum heat sinks with cooling fins, aXeRam DDR3-1800 dual-channel kits deliver amazing high-speed overclocking performance while maintaining cool temperatures and rock-solid system stability.

Transcend's 4GB aXeRam DDR3-1800 kit's two identically-matched 240-pin unbuffered 2GB DDR3 1800MHz DIMMs are carefully paired for use in dual-channel configuration, which together provide memory bandwidth of up to 28.8GB/s. To ensure extra-stability and signal integrity at high clock speeds, all aXeRam modules use robust eight-layer PCBs that fully comply with JEDEC standards. The aXeRam 128Mx8 DDR3 DRAM chips are selected with the strictest quality and performance standards and are manufactured using small Fine-Pitch Ball Grid Array (FBGA) packages to assure better thermal dissipation, electrical efficiency and improved overclocking performance. Transcend's aXeRam DDR3-1800 modules also support new Intel Extreme Memory Profile (XMP) technology, which allows users with high-performance motherboards to easily overclock their memory with aXerRam's built-in aggressive speed-maximized profiles, or manually input their own memory timing parameters to take their system to the next level.

Mushkin Enhanced, one of the leading manufacturers for High Performance Computer Parts announced today the release of its XP3-15000 DDR3 modules. Rated for 933MHz (1866MT/s data rate) and 8-9-8-24 latencies, the XP3-15000 modules provide astonishing performance on Intel X58 platforms while using a safe 1.65V supply voltage.

"Following our tradition of innovation in the high performance memory market, the new XP3-15000 brings Core i7 triple-channel kits to an elevated standard", said Brian Flood, Mushkin's director of product development. "Enthusiasts and gamers alike will enjoy the flexibility and stability of this new product while overclocking their machines."

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has made a significant advancement in the push for higher volume memory chips by developing the world's first four gigabit (Gb) DDR3 DRAM chip, using 50 nanometer (nm) process technology.

With more and more data centers seeking a reduction in the number of servers they use, the development of low-power 4Gb DDR3 has become critical in reducing data center costs, improving server time management and increasing overall efficiency.

Patriot Memory, a global provider of premium memory module and flash memory solutions, today announced it will be showcasing its award-winning products at CeBIT, which will be held in Hannover, Germany March 3-8, 2009. CeBIT attendees can expect to see Patriot's full line of DRAM and flash memory solutions.

"Europe was our second largest market in the world in 2008 and continues to show incredible growth potential," says Johnny Van Esch, General Manager for Patriot Memory, B.V. "CeBIT gives us the opportunity to meet with new and existing customers and to showcase our newest products for 2009 and beyond."

Better late than never, AMD is embracing the DDR3 memory standard. Its newest desktop CPU socket, the AM3, connects the processor to dual-channel DDR3 memory. Initial specifications about AMD's processors on the new socket suggest that DDR3 1333MHz (PC3-10600) will be held as the memory standard the integrated memory controllers on AMD's processors support. The far-east team of Tom's Hardware posted the first series of benchmarks of a Phenom II AM3 processor, when paired with DDR3-1333. The benchmarks featured Gigabyte's MA790FXT-UD5P motherboard along with Corsair's dual-channel DDR3-1333 kit running at DRAM timings of 9-9-9-24. The CPU-Z window also shows that the memory modules are running unganged, meaning that the two memory controllers of the Deneb core are independent, with each controller handling a 64-bit wide memory channel. This state is somewhat comparable to that of single-channel memory, except that multi-threaded applications will still be able to independently address memory on each channel, utilizing all the bandwidth on offer.

At the center of the test-bench was the AMD Phenom II X4 910, the company's first flagship quad-core AM3 processor. The X4 910 features a default clock speed of 2.60 GHz. The same chip was tested in two settings: default clock-speeds, and overclocked to 3.12 GHz (240 x 13.0 @ default vCore). The screenshots below show the test results for WPrime. The overclocked chip scored a crunch-time of 46.613 s (1M). The overclock did not affect SuperPi at all, with insignificant differences in the scores between the two. PC Mark 05 got a decent boost, while 3DMark06 didn't. Memory bandwidth and latency tests showed something strange, with the overclocked CPU (in effect memory) turning up with lesser latency (while normally, increase in clock speeds tend to step up latencies). The tests show that there are increments in performance with the use of DDR3 memory, though they are merely proportional to the clock speeds the memory is running at.

A-DATA Technology Co. Ltd., a worldwide leading manufacturer in high performance memory products, announced today that its XPG DDR3 memory modules have broken a new world record on SuperPi 32m. The record was set by utilizing the DFI Lanparty UT X58 motherboard and XPG X Series v2.0 memory, the DDR3-2133X v2.0 2GBx3 triple-channel kit.
The SuperPi 32m record of 6min 40sec 360ms was achieved at a speed of 2237 MHz and latency settings of 8-7-7-21 using DDR3-2133X v2.0 2GBx3 triple-channel kit.

Leading CPU makers Intel and AMD have adopted memory standards in fairly quick succession in the past. This however, doesn't seem to be the case with DDR3. AMD is yet to release a CPU that supports DDR3 memory, and is two years behind Intel with its DDR3 implementation plans. Intel on the other hand has managed 100% DDR3 dependency with only its premium Core i7 platform, with DDR3 not completely replacing DDR2 in any of its mainstream or value lineups.

Market factors, namely the DRAM manufacturing industry, are increasingly posing difficulties to CPU makers to bring DDR3 memory at a consumer-friendly price point. With manufacturing costs refusing to come down and the Core i7 not able generate the expected demand that justifies selling triple channel kits at sub-$100 price-points, CPU makers are rethinking their large-scale DDR3 standard transition plans for their entire lineups. Intel on its part is contemplating on postponing its 5-series mainstream platform for the Intel Core i5 series processors. AMD on the other hand, is still struggling with technical difficulties in achieving stability and compatibility with DDR3 memory on its DDR3-supportive memory controllers the upcoming AM3-socket CPUs come with. So the company is also unlikely to transition to DDR3 until it is able to come out with a workable BIOS, sources add. It could be as long as 2010 by when a 100% industry-wide implementation of DDR3 can take place.

Following announcements by most motherboard manufacturers about their AM3 CPU compatibility lists, plans of motherboards based on the new DDR3-supportive platform socket have been coming to surface. After a list of eight motherboards by ASUS under the M4A and M4N series, Gigabyte's first motherboard based on the AM3 socket has been pictured. The GA-MA790FXT-UD5P is the company's first AMD motherboard that uses the Ultra Durable 3 construction, with 2-oz copper layered PCB, high-grade conductive polymer capacitors, and MOSFETs with lower RDS.

As the name suggests, this motherboard is based on the AMD 790FX chipset. It features two full-bandwidth PCI-Express 2.0 x16 slots supporting ATI CrossfireX, four DDR3 DIMM slots supporting DDR3-1600+ MHz memory. The motherboard supports AM3 socket processors with TDP of up to 140W. A total of 10 SATA II ports are provided, six of which are routed to the SB750 southbridge, four to an additional SATA II controller. Other features are common with Gigabyte motherboards in its class, with high-quality 7.1 ch audio, two gigabit Ethernet connections, twelve USB 2.0 ports (8 external), and FireWire. Gigabyte is planning two more AM3 socket models: GA-MA770T-UD3P and GA-MA790X-UD4P based on the AMD 770 and 790X chipsets respectively.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced the release of an ultra-low latency (ULL) version of its 2GHz HyperX DDR3 triple channel memory. Shipping immediately in 6GB and 3GB kits, the HyperX 2GHz memory carries a lower CAS latency of 8, for increased performance in the Core i7 and X58 platforms.

"Kingston is following up its first-to-market 2GHz triple-channel kits released in October 2008 with a second generation 2GHz HyperX kit that gives gaming enthusiasts and benchmarking teams even more headroom to go further," said Mark Tekunoff, senior technology manager, Kingston. "The new ultra low latency triple channel kits take maximum advantage of the T1 heatspreaders' HyperX Thermal Xchange (HTX) technology to optimize system functionality at 1.65 volts in Core i7 based motherboards designed for extreme performance."

Empowering consumers to get elite-level computing performance for under $900 U.S. dollars, AMD today launched "Dragon" platform technology for desktop PCs featuring the new AMD Phenom II X4 processor. Even the most demanding users such as enthusiasts and high-end gamers desire affordable systems capable of delivering HD entertainment, graphic-intensive game play at the highest settings their monitors can handle, as well as quick and easy transfer of video entertainment to and from mobile devices. Dragon platform technology provides the power to do it all by combining AMD's highest-performing CPU, the AMD Phenom II X4 processor, with award winning ATI Radeon HD 4800 Series graphics and AMD 7-Series chipsets. And it's offered at an incredible value with Dragon-based systems available for up to $1,200 U.S. dollars less than competing systems that deliver comparable performance.

Leading global PC manufacturers HP, Dell and Alienware plan to offer Dragon platform technology-based desktop systems in the first quarter of 2009, with Dell offering immediate availability in its Dell XPS desktop line. "The XPS 625 desktop powered by AMD's Dragon platform technology features new AMD Phenom II processors to enable a significant boost in speed for enhanced gaming, as well as the flexibility to enable multi-tasking and HD video capabilities free from delays, stalls and lags," said Arthur Lewis, general manager of Dell Gaming Group. "The XPS 625 gives gamers the unbelievable experience they expect at a price point that won't break the bank."

Lexar Media, a leading global provider of memory products for digital media, today announced the immediate availability of Crucial Ballistix Tracer DDR3-1333 (PC3-10600) memory modules in three vibrant new colors - green, blue and red. Performance memory enthusiasts and system modders can choose from a variety of Crucial Ballistix Tracer module colors to match their case color scheme or to suit their individual style. The new color modules are available in 3GB and 6GB kits through select resellers worldwide and directly from Crucial's website here.