Kingston Technology Company announced today that it is starting to ship select DDR2 and DDR3 HyperX memory modules with its new T1 heatspreaders. The taller heatspreaders utilize HyperX Thermal Xchange (HTX) technology to further diffuse heat buildup when overclocking. HTX technology is the latest innovation from Kingston's engineers. It includes bigger heatspreaders made of heavy-duty extruded aluminum and extended fins for maximum thermal conductivity. The new series includes both dual and triple channel kits. All Kingston HyperX products are backed by a lifetime warranty and free 24/7 technical support, the HyperX T1 series makes no exception.

• KHX16000D3T1K3/3GX - 3GB 2000MHz (CL9-9-9-27 @ 1.65v) DDR3 kit of 3 optimized for XMP - $ 435.00
• KHX14900D3T1K3/3GX - 3GB 1866MHz (CL9-9-9-27 @ 1.65v) DDR3 kit of 3 optimized for XMP - $ 403.00
• KHX14400D3T1K3/3GX - 3GB 1800MHz (CL9-9-9-27 @ 1.65v) DDR3 kit of 3 optimized for XMP - $ 397.00
• KHX16000D3T1K2/2GN - 2GB 2000MHz (CL9-9-9-27 @ 2.0v) DDR3 kit of 2 NVIDIA SLI-ready - $ 295.00
• KHX14400D3T1K2/2G - 2GB 1800MHz (CL8-8-8-24 @ 1.9v) DDR3 kit of 2 - $ 279.00
• KHX8500D2T1K2/4G - 4GB 1066MHz (CL5-5-5-15 @ 2.2-2.3v) DDR2 kit of 2 - $ 177.00
• KHX6400D2T1K2/2G - 2GB 800MHz (CL5-5-5-15 @ 2.0v) DDR2 kit of 2 - $ 55.00

Rambus Inc., one of the world's premier technology licensing companies specializing in high-speed memory architectures, today announced it has filed a complaint with the U.S. International Trade Commission (ITC) requesting the commencement of an investigation pertaining to NVIDIA products. The complaint seeks an exclusion order barring the importation, sale for importation, or sale after importation of products that infringe nine Rambus patents from the Ware and Barth families of patents. The accused products include NVIDIA products that incorporate DDR, DDR2, DDR3, LPDDR, GDDR, GDDR2, and GDDR3 memory controllers, including graphics processors, and media and communications processors.

Qimonda AG, a leading global memory supplier, today announced the commencement of commercial production of DRAM chips using its new Buried Wordline technology. Qimonda's revenues in October included the first sales of 1Gbit DDR2 chips using 65nm Buried Wordline technology. In addition, Qimonda has achieved first yields on the next generation 46nm Buried Wordline technology and has taped out what it believes is the worldwide smallest 2G DDR3 chip based on this technology. Qimonda's innovative Buried Wordline DRAM technology combines high performance, low power consumption and small chip sizes to further advance the company's product portfolio, which is now focused on DRAM for infrastructure and graphics applications.

After Corsair dropped off some of its latest Dominator 2 DDR3 memory kits for testing with the new Nehalem platform, various sites immediatelly acknowledged that there're some changes in the DHX coolers that cool the new memories. The new approach will be called DHX+ and it consists of a modified thick-sink design where an additional fins are bolted on the top of the cooler. Now HEXUS.net has unveiled that the DHX+ technology will also offer enthusiasts to futher cool the memory by attaching a water cooled TEC block on top. The block appears to be still in development, so we'll have to wait a little bit more until more information is available. The Pelt/waterblock combination should allow extra voltage to be pushed through appropriately selected RAM modules without killing them, potentially yielding higher clock rates and lower latencies.

Gingle, a relatively new entry to the DRAM market, has announced its first set of tri-channel DDR3 memory kits for the upcoming Intel X58 platform. There are two kits available with sizes of 3x 1GB and 3x 2GB. The memory can operate at 1600 MHz, with DRAM timings of 8-8-8-24, at 1.65V or 1800 MHz with the same timings at 1.8V. The modules by Gingle carry simplistic heat-spreaders. The company offers life-time warranty.Press-release follows:

Resisting the cold winter of industry, domestic leading memory-maker Team Group today announced two new DDR module series, Team Elite DDR3 1333/1066 for desktops and laptops in 1GB and 2GB capacities, with rich experience in R&D of DDR3 overclocking modules. Team also introduced the dual-channel kit for the Elite DDR3 LO-DIMM as a total solution for users upgrading their memory modules to avoid incompatibility among chips and with the motherboard. Team emphasized that every module has been tested to comply with all the relevant tests to ensure maximum compatibility and premium quality. Therefore, Team Elite DDR3 1333/1066 are the best choices for upgrading your PC efficiency!

The LANParty (DFI) P45 series has received numerous favorable comments. It is no matter whether we speak of the DK P45-T2RS and DK P45-T2RS Plus which have created a new Super Pi world record, or the most powerful microATX mainboard JR P45-T2RS which has created excellent achievements in DDR2 platform.
LANParty will release the DK P45-T3RSB Plus with DDR3 supports in November which inherits the circuit design of three former star products, providing more choices of mainboards for fans.

After OCZ, Corsair and G.Skill, Kingston is now launching new HyperX DDR3 triple-channel kits designed specifically for the new Intel-based X58 motherboards.
"Kingston is excited to bring the fastest DDR3 triple channel memory products to market as we are the first to deliver 2000MHz gaming kits of three with Intel's reduced voltage," said Mark Tekunoff, senior technology manager, Kingston. "All of our triple-channel kits can be overclocked manually or by using XMP-ready profiles. The 2GHz modules have been tested to support up to that speed on ASUS P6T Deluxe motherboards while the Intel DX58SO motherboards have been tested up to 1600MHz."
In addition to the top-of-the-line 2000MHz modules, Kingston's family of triple-channel kits include 1866MHz, 1800MHz, and low-latency 1600MHz and 1375MHz speeds. Kingston ValueRAM kits of three are also available in 1333MHz and 1066MHz speeds:

• KHX16000D3K3/3GX - 3GB (3x1GB) 2000MHz CL9-9-9-27 @ 1.65V, optimized for XMP $334.00
• KHX14900D3K3/3GX - 3GB (3x1GB) 1866MHz CL9-9-9-27 @ 1.65V, optimized for XMP $317.00
• KHX14400D3K3/3GX - 3GB (3x1GB) 1800MHz CL9-9-9-27 @ 1.65V, optimized for XMP $312.00
• KHX12800D3LLK3/3GX - 3GB (3x1GB) 1600MHz CL8-8-8-24 @ 1.65V, optimized for XMP $285.00
• KHX11000D3LLK3/3GX - 3GB (3x1GB) 1375MHz CL7-7-7-20 @ 1.65V, optimized for XMP $192.00
• KVR1333D3N9K3/6G - 6GB (3x2GB) 1333MHz CL9-9-9 @ 1.5V, ValueRAM kit $240.00
• KVR1333D3N9K3/3G - 3GB (3x1GB) 1333MHz CL9-9-9 @ 1.5V, ValueRAM kit $132.00
• KVR1066D3N7K3/6G - 6GB (3x2GB) 1066MHz CL7-7-7 @ 1.5V, ValueRAM kit $240.00
• KVR1066D3N7K3/3G - 3GB (3x2GB) 1066MHz CL7-7-7 @ 1.5V, ValueRAM kit $132.00

Keeping up with the competition, G.Skill Memory is also making debut with a full line of DDR3 performance memory products designed for the Intel Core i7 processors and the Intel X58 Express chipset. Included are a total of four G.SKILL 3GB and 6GB triple memory kits with DDR3 1333MHz and 1600MHz frequencies for enthusiasts, overclockers, and early-adopters:

• F3-10666CL9T-3GBNQ: 3GB (1GB x 3) DDR3-1333 (PC3 10666), CL9-9-9-24 @ 1.5-1.6V
• F3-10666CL9T-6GBNQ: 6GB (2GB x 3) DDR3-1333 (PC3 10666), CL9-9-9-24 @ 1.5-1.6V
• F3-12800CL9T-3GBNQ: 3GB (1GB x 3) DDR3-1600 (PC3 12800), CL9-9-9-24 @ 1.5-1.6V
• F3-12800CL9T-6GBNQ: 6GB (2GB x 3) DDR3-1600 (PC3 12800), CL9-9-9-24 @ 1.5-1.6V

All kits are backed by G.Skill's lifetime warranty.

Patriot Memory, a global provider of premium quality memory modules and flash memory solutions, has decided to add some color to its Viper memory kits by bundling them with Futuremark's 3DMark Vantage benchmarking software. The bundle offers selected Patriot high-performance DDR2 and DDR3 Viper series gaming memory kits with the Advanced Edition of Vantage and even better, the software comes preloaded on a Patriot 2GB Xporter Razzo USB flash which is also included in the bundle. The product bundles are listed below:

• PVS32G2000LLKNB - DDR3 2GB 2000MHz Low Latency (9-9-9-24) with NVIDIA EPP 2.0 support
• PVS32G1800LLKNB - DDR3 2GB 1800MHz Low Latency (8-8-8-20) with NVIDIA EPP 2.0 support
• PVS34G1333LLKB - DDR3 4GB 1333MHz Low Latency (7-7-7-20)
• PVS24G8500ELKNB - DDR2 4GB 1066MHz Enhanced Latency (5-5-5-15) with NVIDIA EPP support
• PVS24G6400LLKNB - DDR2 4GB 800MHz Low Latency (4-4-4-12) with NVIDIA EPP support

Patriot Memory, a global provider of premium quality memory module and flash memory solutions, today announced the release of their Viper series Tri-Channel memory kits designed for the forthcoming Intel Core i7/Intel X58 Express Chipset. Available in both 3GB and 6GB kits, these newly engineered memory kits come with the award winning Viper series heat shields and are the perfect balance of speed and latency while achieving lower voltage requirements.

"Intel's Nehalem architecture shows significant improvements over previous platforms," says Les Henry, Technical Director for Patriot Memory.

"High performance DDR3 DIMMs from Patriot Memory, combined with the phenomenal memory bandwidth & processing capability of Intel's upcoming Core i7 microprocessors, will deliver exciting levels of performance to PC enthusiasts worldwide," said, Steve R. Peterson, Intel's Director of Chipset & Graphics Marketing.

Corsair, a worldwide leader in high performance computer and flash memory products, announced today that it is launching a full line of DDR3 performance memory products designed for Intel Core i7 processor.

Designed to take advantage of the Core i7 processor's triple-channel memory controller, Corsair will offer memory solutions supporting three different DDR3 memory speeds in triple memory packs: 1333MHz, 1600MHz and 1866MHz. The 1866MHz Corsair DDR3 modules will be the world's fastest Intel Core i7 solution. Each memory speed will feature kits of three 1 Gigabyte or 2 Gigabyte modules for a total of 3 Gigabyte or 6 Gigabyte kits. The 1600MHz and 1866MHz DDR3 memory kits will also feature the industry's highest performance memory technology, Corsair's patented Dual-Path Heat Exchange (DHX), for maximum performance and reliability. With six total products available, Corsair is launching the most comprehensive product line available for the Intel Core i7 processor.

Corsair has announced the availability of two tri-channel DDR3 memory kits for the upcoming Core i7-supportive X58 platform. Corsair claims to have extensively tested these kits for stable operation on various X58 chipset-based motherboards. The kits are value-oriented, and come under the XMS3 series.

There's a 3GB (3x 1GB, model: TR3X3G1333C9) kit, and a 6 GB (3x 2GB, model: TR3X6G1333C9) kit. Both kits operate at 1333 MHz, with timings of 9-9-9-24. The modules use simplistic aluminum heatspreaders, with no fancy DHX cooling mechanisms. This could be attributed to the fact that they are value oriented, and that they could be operating at low voltages of 1.60V, and therefore, small thermal footprint. The 3 GB kit is priced at US $ 167, while the 6 GB kit is priced at $ 316.

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today unveiled the industry's first triple channel memory kit designed specifically for the impending Intel Core i7 processor / Intel X58 Express Chipset. Optimized for the Core i7's triple channel mode, these new 3GB and 6GB kits ensure optimal performance via an ideal combination of low voltage requirements, speed, and latency.

Co-operation between manufacturers have become a common thing these days. That helps them to better sell and promote their products and satisfy user's hunger for new products. G.Skill International in partnership with Thermaltake launched today new GT1 DDR3 series memory running at PC3-16000 and featuring Thermaltake's unique RamOrb heatsinks. The RamOrb thermal solution combines a RAM sink, single heatpipe and a blower fan that lowers the temp significantly. Available in 4GB (2x2GB) kits, the new G.SKILL PC3-16000 GT1 memory is also optimized for NVIDIA's 790i chipset platforms, of course that does not mean it would not work on other DDR3 compatible systems just as well. With each G.SKILL memory you'll also receive a lifetime warranty and free technical support, the PC3-16000 GT1 is no exception. For more information please go here.

Earlier this year, Mushkin acquired Exceleram to expand its technological expertise and manufacturing footprint. Exceleram had been in the business of high-performance gaming system memory modules for quite some time. Post acquisition, Mushkin lets Exceleram products, both current and future, retain the Exceleram brand name and product logos. News is, that the company launched two dual-channel DDR3 memory kits.

The EX3-21800X2-S2 is a 2x 1GB kit, that operates at 1800 MHz DDR, with timings of 8-8-8-24 and DIMM voltage of 1.85~1.90 V. The EX3-41600Q2-SM is a 2x 2GB kit. This is where the bank density eats into other parameters such as timings and frequency. It operates at 1600 MHz DDR, with looser timings of 9-9-9-27. On a positive note, the module voltage has been pushed down to 1.7 V, and it won't be too far-fetched to estimate, that the modules could operate at 1333 MHz at much lower voltages. While there's no word out on the pricing yet, Mushkin on its part states that the products would sell at "unbeatable prices".

Remember the A-DATA DDR3 triple channel memory and the ASUS P6T Deluxe motherboard? They are both detailed on our page, but this story aims to show how both parts perform when working coupled with a quad-core Core i7 engineering sample CPU. The results you're about to see below are achieved by three 1600MHz A-DATAs overclocked to over 2000MHz. The result is system memory read/write speeds of up to the incredible 20515/16946 MB/s. The latency time is also worth mentioning - 22.9ns.

Lexar Media announced today the immediate availability of Crucial Ballistix Tracer PC3-10600 (DDR3-1333MHz) high-performance, low-latency memory modules. These modules are the first Crucial DDR3 Tracers, and as such they incorporate the company's proprietary activity-indicating Light-Emitting Diodes (LED). These new modules feature a black printed circuit board (PCB) and black integrated heat spreaders, as well as an additional eight blue ground-effects LEDs that emit constantly, when the system is running. Crucial is shipping now the Ballistix Tracer DDR3 memory in single 1GB ($54.99) and 2GB ($99.99) modules, as well as in 2GB ($109.99) and 4GB ($199.99) kits. All Tracer DDR3 parts operate at 1333MHz with CL6-6-6-20 latencies and 1.8V.

Nehalem does promise to be a processor to look out for, it would be Intel's next installment, post the successful Core 2 series processors. This time however, Intel made a core modification with the way the system handles memory. The Bloomfield processors house a massive 192-bit wide memory controller for supporting tri-channel DDR3 memory. It however was found that the controller could bring in limitations to the DIMM voltages that the system could support.

The retail version of ASUS P6T Deluxe OC Palm Edition motherboard was unboxed by XFastest. Being the retail product, as usually, it comes with precautionary labels attached to parts of the motherboard. The one that covers the 6 DDR3 DIMM slots reads:

According to Intel CPU SPEC, DIMMs with voltage setting over 1.65V may damage the CPU permanently. We recommend you to install DIMMs with voltage setting below 1.65V.

A-DATA Technology Co., Ltd., a worldwide leader in high performance memory products, announced today that it is expanding its overclocking DRAM dual channel line with tri-channel kits at 1600 MHz and 1333 MHz.

Recent next generation Intel Core i7 platform using the latest DDR3 technologies has proven that i7's internal controller gives a notable performance increase while using DDR3 tri-channel modules. A-DATA is now ready for production of DDR3-1600+ and DDR-1333+ tri-channel kits. These new modules will be available in 3GB and 6GB configurations and are expected to be available this quarter.

Kingston raised the barrier today, with the release of its 2GHz HyperX DDR3 memory modules, the fastest-performing DDR3 available to date. Shipping immediately in 2GB memory kits, the new HyperX PC3-16000 memory offers gaming enthusiasts top-of-the-line Enhanced Performance Profile (EPP) ready memory with CL9-9-9-27 @ 1.9v timings. "Two Gigahertz is now the sweet spot for many benchmarking enthusiasts and Kingston's new 2GHz HyperX DDR3 memory is fully tested at specified frequency and timing values so it's ideal for anyone seeking to boost performance," said Mark Tekunoff, senior technology manager, Kingston. With the addition of the 2GHz kit, Kingston now offers a full slate of DDR3 memory products available in a variety of speeds and capacities. The New Kingston PC3-16000 kit (KHX16000D3K2/2GN) is available now for US $227.00. All HyperX modules are backed by a lifetime warranty and free 24/7 tech support. For more detailed information please visit Kingston.

After yesterday's ASUS P6T Deluxe quick introduction, today is time for the heavy artilery to come by and stop at our front door. For sure ASUS, one of the biggest brands in the computer industry is not going to have only one or two motherboards to support Nehalem. Although the platform is not yet officially introduced, ASUS is ready with its Rampage II Extreme motherboard. As the name suggests this will be the enthusiast range of motherboard offerings support for LGA 1366 processors, triple-channel DDR3 memory and up to three PCI-Express x16 graphics cards. The new Republic of Gamers machinery might not have a fancy heat pipe cooling (it might not need one) but it has a few other tricks, such as a special VTT CPU power card that provides a 16-phase CPU and 3-phase memory power design. The board also features a number of strange buttons that will help experts overclock their hardware. The Rampage II Extreme also has six SATA 3.0 Gbps connectors, dual Gigabit Ethernets, FireWire, eSATA ports and most likely support for both ATI CrossFire X and NVIDIA triple SLI technology. Let the pictures finish this post:

Samsung Electronics Co., the world leader in advanced memory technology, announced today that it is sampling the industry's smallest two gigabit (Gb) DDR3 devices. By using 50 nanometer (nm) class circuit technology, productivity of the new devices is 60 percent higher than DDR2 devices of an equivalent density. The new 2Gb DDR3-based modules, which enable use of up to 16 gigabyte (GB) RIMMs (registered in-line memory modules), will save over 40 percent of the power of 1Gb DDR3 memory modules.
"We have focused on maximizing density alternatives and power savings to make our 2Gb DDR3 solution as flexible as possible for designers," said Jim Elliott, Vice President, Memory, Samsung Semiconductor, Inc.

Elpida and Buffalo Technologies have unearthed a memory standard never before heard, and thought by many, as the limits of current DDR3 technology, given the silicon fabrication process current DRAM chips are made with. The elusive PC3-19200 standard has been achieved. Elpida has tested stable, a prototype memory module that runs at 2400 MHz DDR (1200 MHz actual clock-rate). The modules use Elpida's 2.5 Gbps DRAM chips.

These speeds, however, come at the cost of latencies and voltages. The module was tested stable at 2400 MHz only at 11-11-11-34, and a voltage of 2.1 V, which is high, by DDR3 standards. However, the module locks a surprise when it comes to the same numbers: The module was tested stable at 2096 MHz, at amazingly low 1.5V, with much tighter timings of 9-10-9-24. The companies wish to put this to mass production soon.

AMD would be releasing its first desktop processors based on the 45nm silicon fabrication process, based on the newer Deneb core. The company is said to have made several tweaks to the original K10 design and equipped the core with 300% the amount of L3 cache as its 65nm Agena parts. The only thing got us wondering was what would be its nomenclature like? Well, be surprised to know that after Phenom X4 9000 series, the company plans to continue the numbering with a 5-digit model number scheme with x1000 unit deviations between models. A rather confusing naming scheme, as suggested by the chart provided, seems to have been adopted.

It is now clear, that there will be two distinct kinds of Phenom X4 45nm chips: those which continue support for DDR2 memory on the existing AM2/AM2+ sockets, and those which are exclusive to the AM3 socket and feature support for DDR3 memory, DDR3 1333MHz at that. The processors would feature dual 64-bit memory controllers, which could be ganged for a single 128-bit wide memory interface, or un-ganged to step up multi-tasking efficiency.