Kingston Technology today announced its family of HyperX DDR3 memory modules have been SLI-certified by NVIDIA Corporation, as part of its program to offer gaming enthusiasts solid platform/memory compatibility, stability and performance solutions when building high performance systems using the new series of NVIDIA nForce 790i SLI platforms.

OCZ Technology Group today unveiled blistering fast PC3-16000 DDR3 modules that are NVIDIA SLI certified to run at extreme 2GHz speeds on the next generation of NVIDIA nForce 790i Ultra SLI motherboards also released today. Designed to offer enthusiasts the rock-solid stability and speed they've been demanding since the mainstreaming of DDR3 platforms, the OCZ PC3-16000 SLI-Ready series makes use of the unbeatable overclocking capabilities of the nForce 790i Ultra SLI platform and takes DDR3 to new heights.

Lexar Media today announced the immediate availability of Crucial Ballistix PC3-16000 (DDR3-2000MHz) high-performance memory modules-some of the world's highest speed-rated DDR3 products to date. Crucial Ballistix DDR3-2000MHz memory modules feature Enhanced Performance Profiles (EPP) 2.0 and are SLI-Ready certified to work with new motherboards utilizing the new NVIDIA nForce 790i Ultra SLI platform. The NVIDIA nForce 790i Ultra SLI platform was designed and tested using Crucial Ballistix DDR3-2000MHz high-performance memory.

G.Skill International Enterprise, a worldwide leader in extreme performance and reliability memory announced today the new DDR3-1800 CL7. The DDR3-1800 CL7 is for enthusiasts upgrading to the next generation platforms. The DDR3-1800 HZ Series is available in 2GB dual channel kits to meet the specific needs of gaming systems or high performance workstations.

Mushkin today announced its new XP3 series DDR3 modules at the CeBIT Mushkin booth (Hall 21, Stand A09). "It's our pleasure to announce the XP3 series modules at CeBIT this year", said Brian Flood, Mushkin director of product development. "Our latest eXtreme Performance modules provide enhanced bandwidth over the aging DDR2 technology and allow overclocked multicore processors to perform to their fullest."

Part Numbers:

• 991600 - 1GB XP3-12800 (DDR3-1600) CL7-7-6-18 1.85-1.9V
• 996600 - 2GB (2x1GB) XP3-12800 (DDR3-1600) CL7-7-6-18 1.85-1.9V
• 991601 - 2GB XP3-12800 (DDR3-1600) CL7-7-6-18 1.85-1.9V
• 996601 - 4GB (2x2GB) XP3-12800 (DDR3-1600) CL7-7-6-18 1.85-1.9V
• 991602 - 1GB XP3-14400 (DDR3-1800) CL8-8-7-20 1.9-1.95V
• 996602 - 2GB (2x1GB) XP3-14400 (DDR3-1800) CL8-8-7-20 1.9-1.95V

The XP3 modules will be available worldwide in the beginning of April.

A-DATA is on display at CeBIT with some very innovative memory modules. In this scenario the focus is primary on cooling, not the highest clocks. These DDR3 memories will come in three flavours: basic version with regular heatsinks only, a heatsink with two fans attached and even a version that can be cooled by LN2.

Memory manufacturer Kingston has managed to achieve unprecedented memory speeds using overclocked HyperX DDR3 modules combined with NVIDIA's next-generation core-logic. The company managed to take its memory from stock speeds of 2.0GHz to 2.13GHz (a 6.5% overclock) using NVIDIA's nForce 790i chipset without any special cooling systems, although no details of voltages or latencies were disclosed. Up until now, the fastest DDR3 memory has only been capable of running at 2GHz - a figure which Kingston, A-Data, Walton Chaintech and Corsair have all managed to reach. The modules used, which were the so-far unannounced Kingston HyperX PC3-16000 (KHX16000D2K2/2G) modules, will be available during the first quarter of this year - so presumably within the next month.

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today announced two new Reaper HPC solutions for enthusiasts upgrading to next generation of cutting-edge platforms. The PC3-10666 Reaper HPC Series is available in both 2GB and 4GB dual channel kits to meet the specific needs of customized gaming systems or workstations, offering perfect compatibility with the latest platforms and chipsets at a price that will be attractive to upgraders with a specific budget in mind.

Corsair, a worldwide leader in high performance computer and flash memory products, announced today that new record breaking speeds have been achieved within the Corsair DDR2 and DDR3 lines of DRAM memory.

Available by the end of February, two new Corsair 4GB DDR2 module speed grades are being offered for high-performance enthusiast users: Corsair 1066MHz (PC2-8500) and 1142MHz (PC2-9136) 4GB memory kits (2X2GB). The new memory modules utilize Corsair's patented DHX technology, which employs a specially designed quadruple heat sink to dissipate heat through both convection and conductive methods. The results are maximum performance and extreme over-clocking capability for the demanding gaming enthusiast.

Qimonda AG today announced that it has started to ship samples of 1GB and 2GB DDR3 SO-DIMMs (Double Data Rate 3 Small Outline Dual In-line Memory Modules) to key customers for deployment in next-generation notebook PCs. Qimonda optimized its new DDR3 SO-DIMM offerings for high power-savings in an effort to lead the industry. Power efficiency is the key value proposition of the new DDR3 memory interface in mobile computing, as it allows for extended battery life at higher performance levels for notebooks and other mobile computing applications.

According to DigiTimes, Intel's aggressive DDR3 strategy and DRAM makers approval of what's going on may result in a less than 10% price gap between DDR3 and DDR2 in the second half of 2008. Some DRAM makers believe that DDR3 will grow its role more obviously in 2008, after seeing DDR2 remain the mainstream memory standard for several years. The relatively high price premium of DDR3 over DDR2 so far has however discouraged PC OEMs to migrate. The price gap should shrink more noticeably this year, due to the aggressive push by Intel. The DRAM makers expect some PC vendors will be subsidized by Intel to migrate to DDR3-based platforms, and this should help encourage the entire industry to migrate accordingly. Some PC vendors will also introduce DDR3-based only systems in the second half of the year. As DRAM makers are expected to speed up their pace over DDR3 production, the price premium between the two standards is expected to shrink to 10% in the second half of the year.

It seems that the new barrier standard for high-performance DDR3 memory is at least 2000MHz. First Team Group, now Kingmax is showing off a 2GB memory module that is rated at 2000MHz. The DDR3 memory is claimed to work at 2.15V with CL9-9-9-24 timings and as you can see in the picture below, it is equipped with a heatsink very similar to that found on Corsair's Dominator modules. Apparently Kingmax is already taking orders for the new 2GHz memory so you should be seeing it and its price tag later this month.

The DDR3 has become more popular in the market since Intel's introduction the P35 and X38 chipsets. After introducing the high-level DDR3-1333 module for desktops and the high-level DDR3-1333 SO-DIMM for laptops, TwinMOS today introduces the TwiSTER over-clocking series, which includes DDR3-1600 and DDR3-1800 models, to fulfill the hardware requirements of professional game players and overclockers. The TwiSTER series is the highest quality product line from TwinMOS, made with selected original dies and high-standard production processes. More importantly, every module is tested to comply with the published specifications, and quality is controlled according to the highest standards. DDR3-1600MHz and DDR3-1800MHz memory modules of the TwiSTER series come with chips form Micron Technology in a 128Mx8 layout and are delivered in 1GB capacity. Other specifications of these modules include 240-pin design, working voltage at 1.8V, CL= 8-8-8-21, clock frequency at 1600MHz and 1800MHz. TwinMOS provides global, lifelong warranties for all memory products.

Team Group looks set to take the crown for having the fastest-rated DDR3 memory with the 2133MHz modules which it is showing off at CES. The memory will run with timings of 10-10-10-30 (not exactly aggressive) at require 2.1-2.2V, compared to the industry guidelines of 1.5V. The memory will feature special "Super Thermal Conduction" black heat spreaders and ship in 2GB kits, although no pricing details have been revealed.

Walton Chaintech, the worldwide renowned overclocking memory module specialist, announced today the world's first DDR3 1600 memory modules with 1.6V voltage application. The newest addition to the APOGEE GT DDR3 memory modules offers consumers beneficial system performance with CL 7-7-7-18, targeting at enthusiastic gamers and professionals upgrading to the latest Intel platforms.

Hardware company Walton Chaintech has introduced new DDR3 modules certified to run at 2000MHz with timings of 9-8-8-24. The Apogee GT modules are expected to ship as a 2GB dual channel kit, although the pricing has not yet been unveiled. As you can see from the image below, the memory features quite a substantial heatsink covering two sticks.

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today announced new 1800MHz Intel Extreme Memory modules, a performance solution that implements a specification predefined and specially tailored for the Intel X48 chipset. These top-speed modules are the ideal solution for enthusiasts looking for the extra performance gains optimized memory offers their system.

The pursuit of convenience and efficiency has become a new consumer's lifestyle. For this reason, the laptop, or notebook PC, has gradually replacing desktop PC and becoming consumer's choice. Following the launch of the Windows Vista, which has higher memory storage performance requirements, memory modules with higher capacity and speed have thus become the standard requirement for consumers. However, when the speed of memory modules evolved from SDR through DDR to DDR2 and even DDR3, leading wafer manufacturers like Micron Technology, Elpida Memory, and Qimonda AG had their DDR 3 chips development certified with Intel, TwinMOS R&D team remain devoted to technological and quality enhancement. The latter had launched close cooperation with leading wafer manufacturers to develop and design the new-generation, high-speed DDR3-1333 SO-DIMM. This demand fulfill high-level memory module consumption by new generation laptops.

The Viper Series, is Patriot Memory's newest line of memory, that utilizes aluminum-copper composite (ACC) heat spreaders for premium heat dissipation. Lab tests show that after placing the Viper memory under an intense load for 45 minutes, the memory chips themselves were 20% cooler as compared to Patriot's previous bladed heat spreaders. The Patriot Viper series DDR3 modules, are available now in the following dual channes kits:

• PVS32G1866LLK PC3-15000 2GB Kit 8-8-8-24 @ 1.9V
• PVS34G1600LLK PC3-12800 4GB Kit 7-7-7-20 @ 1.9V
• PVS32G1600LLK PC3-12800 2GB Kit 7-7-7-18 @ 1.9V
• PVS34G1333LLK PC3-10666 4GB Kit 7-7-7-20 @ 1.7V
• PVS32G1333LLK PC3-10666 2GB Kit 7-7-7-20 @ 1.7V

The overclocking memory module specialist, Walton Chaintech, today showed an individual approach of cooling their own APOGEE GT overclocking DDR3 memory modules. Called "Cool It Smart" the heatsink system is claimed to add almost 50 percent of cooling efficiency without using any heat pipe technology. Cool It Smart ships with the deluxe package of APOGEE GT DDR3 1800MHz (CL8-8-8-24) and represents a well-balanced and positioned with 4 screws light-weight aluminum heatsink mounted on top of the memories, and optionally cooled by two fans. In test environment the temperature of APOGEE GT DDR3 1800 memory modules before using the Cool It Smart heatsink was 73°C. After using the heatsink system, the module temperature had dropped to 52°C, which shows an apparent 21 degrees decrease. Additionally, when the optional dual fans were added on top of the heatsink block, the running memory modules' temperature had reduced to as low as 38°C, very close to the room temperature of 23°C.

Hynix Semiconductor (Hynix) announced it has received the validation from Intel Corporation on its 1Gb DDR2 DRAM with company's leading edge 50nm-class process technology. The production efficiency of Hynix's 50nm-class 1Gb DDR2 DRAM products is increased by 50% over its 60nm-class process technology and the lower costs of production are expected accordingly. Hynix adopts new technologies of "three-dimensional transistor" architecture and "W-DPG (Dual Poly Gate)" technology. These technologies significantly minimize leakage to further reduce overall power consumption and increase performance by optimizing its speed. The adoption of technologies will be extended to DDR3 DRAM and the mass production of validated 1Gb DDR2 DRAM as well as DDR3 products will begin in the second half of next year. As the demand for higher capacity memory is expected to grow, Hynix plans to enhance capacity on the 50nm-class products in order to suit needs from the market. Hynix's 50nm-class DDR2 DRAM processing technology will be also used in producing various applications not only mass storage PC DRAM but also Graphic DRAM, Mobile DRAM.

Mushkin Inc., announced the availability of its EM3 and SP3 DDR3 modules. With standard latency and voltage specifications, the EM and SP product lines offer buyers superior compatibility and reliability."Our commitment to providing the highest quality products and raising the memory bar continues with our DDR3 offerings, providing a hassle-free and rewarding experience right out of the box for early adopters of DDR3 technology." said Brian Flood, Mushkin director of product development. The EM3 and SP3 modules are available worldwide in 1GB and 2GB single modules and 2GB (2x1GB) and 4GB (2x2GB) dual-channel kits. The EM3 series features Mushkin's FrostByte heatspreader which keeps the modules within safe operating temperatures. Like all Mushkin products, these modules are backed by a lifetime warranty and an industry-leading technical support staff.

OCZ Technology Group today unveiled two high-speed, high-capacity memory products designed with hardcore gamers in mind. Itching to experience the incredible graphics and FPS action of EA's highly-anticipated Crysis, gamers across the world will improve their gaming experience from upgrading their PC components and benefit from the optimizations of premium memory. The latest OCZ PC3-10666 and PC2-8000 ReaperX 4GB memory kits feature the ideal blend of speed, latency, bandwidth, and up to 4GB capacities to help DirectX-10 PC games reach their full potential on the latest DDR2 and DDR3 platforms.

Building on its heritage of innovation in DRAM technology, Micron Technology, today announced the industry's first 2 gigabit (Gb) double data rate (DDR) 3 component. Micron's newest DRAM innovation is the highest density DDR3 component available on the market. By using 2Gb components, Micron can enable 8 gigabyte (GB) and 16GB modules for servers and 4GB modules for desktop and notebook PCs, which are the industry's highest density DDR3 modules available.

Competing with other memory manufacturers, Kingston announced today four new modules optimized for the latest Intel X38 and P35 motherboards. The first two new products that work at 1625MHz, are the KHX13000D3LL/1G (1GB module) and KHX13000D3LLK2/2G (2GB kit), both certified to work with latencies of 7-7-7-20-1T at 1.9V and costing $224 and $448 respectively. The higher-end HyperX offers are certified to run at 1800MHz with latencies of 8-8-8-24-1T at 1.9V. The 1GB PC3-14400 module is named KHX14400D3/1G and costs $227 while the 2GB kit, nicknamed KHX14400D3K2/2G has a price tag of $453. All Kingston memory comes with a lifetime warranty and 24/7 technical support.