Taiwan-based memory manufacturer G.Skill announced today right after Super Talent its new DDR3-1600 CL7-7-7-18 (F3-12800CL7D-2GBHZ) memory modules. The new high-end G.Skill memory guarantees clock speed of 1600MHz (PC3-12800) and timings of CL7-7-7-18. The new F3-12800CL7D-2GBHZ kit is available now in matched pair of 2x 1GB modules. G.Skill also offers lifetime warranty with these modules. For more information and specifications of the new PK series products, please go here.

Super Talent Technology today announced immediate availability of the world's most advanced DDR3 memory kits, dubbed Project X. Project X represents the most advanced DDR3 memory available. It is developed in Super Talent's Silicon Valley Engineering Labs to deliver the highest attainable DDR3 memory performance. Project X memory combines blistering fast clock speeds with aggressively tuned latencies.

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today announced production of the industry's first Intel Extreme Memory modules, a new memory solution that implements a high-performance specification optimized and predefined for the impending Intel X38 chipset.

Patriot Memory today announced the released of its newest DDR3 Extreme Performance Low Latency memory kit rated at 1600MHz (PC3-15000). With timings of 7-7-7-18 and running at 1.8V, Patriot's Extreme Performance DDR3 1600MHz is among the fastest in the market. Designed for Intel's latest P35 and X38 Express chipsets, these modules offer the highest level of performance required by today's gaming and enthusiast community. Available in 2GB kits they are also accompanied with a lifetime warranty. For more information on the Patriot's DDR3 modules, please visit this page.

Mushkin today announced the availability of HP3-10666 DDR3 modules available in 1GB single DIMMs and 2GB dual-channel kits, part numbers 991574 and 996574 respectively. Sporting 6-7-6-18 latencies, the new DDR3 modules are designed to give high-bandwidth, low-latency performance for current and future 3D gaming platforms.

Many enthusiasts have expressed disappointment in the high standard latency values of DDR3. With the HP3-10666 modules, we have attained a CAS latency value that is a full 3 clock cycles below standard-rated DDR3-1333 DIMMs available on the market today, allowing for more efficient use of bandwidth.

said Brian Flood, Mushkin director of product development. The HP3-10666 modules will become available worldwide in the next few weeks through Mushkin.com and its authorized resellers. Every module is hand-tested beyond its rated specification and features Mushkin's FrostByte heatspreader technology which keeps the modules within safe operating temperatures. Like all Mushkin products, the HP3-10666 modules are backed by a lifetime warranty and an industry-leading technical support staff.

Golden Emperor International (GeIL) has begun to stealthy showcase its upcoming RAM modules that feature a new cooling solution. Developed by Taiwan-based CompTake, the new heatspreader is made out of aluminum and copper, using top located heat pipe to transfer the heat. The new cooling system is set to be introduced together with GeIL's upcoming high-end DDR3 modules.

Patriot Memory, a global provider of premium quality memory module and flash memory solutions, announced the release of the fastest DDR3-1866MHz low latency memory modules on the market.

With latency timings of 8-8-8-20 and operating at 1.9V, these modules are ideal for PC gamers and PC enthusiasts looking to make their systems perform at their very best. These new modules will be offered in 2GB paired kits. They also are equipped with Patriot's "Bladed" heat shield technology which increases heat dissipation and lowers module temperatures by 5 to 7 percent.

MSC - German manufacturer of high-end electronics and memory modules - introduced today their DDR3-lineup under the CellShock brand which will be available immediately. The new product line includes two 2GB memory kits with 1600MHz (CS3222270) and 1800MHz (CS3222580) nominal working frequencies that boast competitive features compared with the other existing solutions. Based on Micron DDR3 ICs and binned to aggressive CL7-6-6-18 (1600MHz) and CL8-7-6-21 (1800MHz) timings both products represent the lowest latency 1600 and 1800 kits available on the market. Both DDR3 kits are already available in stores. Their recommended retail price is set at $439 and $499 respectively. CellShock modules come with 5-year warranty.

OCZ Technology Group, Inc. today released new 1600MHz memory modules as part of their Gold series, targeted at mainstream system builders, gamers, and professionals upgrading to the latest Intel platforms. The newest additions to the OCZ DDR3 family offer consumers beneficial system performance with blazing fast speeds of 1600MHz and 8-8-8 timings.

Super Talent Technology announced today the world's fastest production DDR3 kit. W1866UX2G8 is a 2GB kit that is tested and guaranteed to operate at 1866MHz (PC3-14900) at extremely low latencies. The W1866UX2G8 kit, the world's first 1866MHz 2GB kit (2x 1GB), supports ultra low 8-8-8-24 latencies. This kit is built with the fastest available, carefully screened DRAM chips, and is hand tested as a matched pair on a dual channel Asus P5K3 Deluxe motherboard at its rated specs at 1.9 volts.

Samsung Electronics announced the availability of its new 50nm-class DDR2 DRAM certified by Intel. Samsung technicians state that processing 1Gb DDR2 DRAMs in the 50nm range doubles productivity and improves the production efficiency by 50% in comparison to a 1Gb DDR2 DRAM fabricated using 80nm process technology. Samsung's 50nm-class DRAM processing technology will be used not only in DDR2 but also in DDR3, GDDR4 , GDDR5 and mobile DRAM.

OCZ Technology Group, the worldwide leader in innovative, ultra-high performance and high reliability memory, today unveiled the next step to achieving maximum performance on the latest PC platforms with the launch of the World's first production PC3-14400 DDR3 modules. These OCZ kits are meant to set industry performance standards as well as accelerate the development of next-generation enthusiast platforms.

OCZ Technology Group, Inc. today announces two new 1600MHz parts including the world's first enhanced bandwidth high speed DDR3. The newest additions to the OCZ DDR3 family offer enthusiasts performance they can really sink their teeth into and feature blazing fast speeds of 1600MHz and the incredibly fast latencies of 7-7-7 and 7-6-6 on ASUS motherboards.

Kingston Technology today announced its ultra low-latency, or ULL, DDR3 HyperX memory modules. The new ULL PC3 HyperX modules arrive capable of speeds up to 1375 MHz. Kingston rates the ULL PC3 1375 MHz HyperX with a CAS latency of 5, a new low for DDR3 latencies.

Kingston offers the new ULL PC3 1375 MHz HyperX modules in two packages - a single 1GB module or a 2x1GB kit for dual-channel. Manufacturer suggested retail pricing for the ULL PC3 1375 MHz HyperX modules start at $400 for the KHX11000D3UL/1G single 1GB module and $800 for the KHX11000D3ULK2/2G dual-channel kit.

Super Talent Technology today launched three significant new DDR3 memory modules. The W1600UX2G7 is a 1600MHz PC3-12800 2GB kit (2x1GB) that is tested at very aggressive 7-7-7-18 latencies at 1.8 volts. The W1600UX2G9 is a 1600MHz PC3-12800 2GB kit (2x1GB) that is tested at 9-9-9-21 latencies at 1.8 volts. These kits are built with the newest gigabit IC's, using eight pieces of 128M x 8 chips to produce a single-sided module. Last but not least comes the W1333UB2G8 - the world's first 1333MHz PC3-10660 single 2GB DDR3 DIMM. This product works at CL8-8-8-18 latencies with only 1.8 volts. Street price on the W1600UX2G7 will be approximately $648, while the W1600UX2G9 will sell for $598. The W1333UB2G8 single module will retail for approximately $417. Every Super Talent module built is hand tested under load to ensure the highest level of reliability, and backed with a lifetime warranty.

OCZ Technology Group, today announced the newest OCZ DDR3 product addition. The leading-edge PC3-10666 Platinum Edition was developed to offer the enthusiast community a solution that fully exhausts the capabilities of the Intel P35 and X38 Express chipsets. At 1333MHz, the OCZ PC3-10666 Platinum edition is rated to run CL7-7-7-20, featuring the ideal balance of sheer DDR3 speed and enhanced timings so users can truly take these next generation platforms to greater heights.

G.Skill announced today the availability of its new DDR3-1333 (PC3-10600) CL8 and CL9 kits rated to operate at 1.65 Volts. Available in 2x1GB matched pairs the new F3-10600CL8D-2GBHK (CL8-8-8-21) and F3-10600CL9D-2GBPK (CL9-9-9-24) kits will be available through G.Skill's authorized resellers and distributors worldwide. All G.Skill memory modules come with a lifetime warranty. For more information and specifications of the new PK series products, please click here.

Corsair, today unveiled the world's fastest production DDR3 memory rated at a blazing-fast 1600MHz (PC3-12800) and the world preview of the Corsair DOMINATOR memory running at 2000MHz (PC3-16000). Live demonstration of the new DOMINATOR memory will be on display in the Corsair VIP suite (#1334) at the Grand Hyatt Hotel. The TWIN3X2048-1600C10D DOMINATOR (CL10-8-8-24) is the latest addition to the Corsair line of high-performance memory modules. Also on display is the upcoming generation of DDR3 DOMINATORs, ranging from 1GB modules running at over 2000MHz and 2GB modules showing performance promise for 64-bit based applications. All DDR3 products have been developed to support the new Intel P35 and X38 Express platforms.

Corsair, a worldwide leader in high performance computer products, has formally announced a range of XMS3 modules to complement Intel's Bearlake chipsets. The TWIN3X2048-1066C7 is a 2GB DDR3 kit of matched memory that operates at an effective 1066MHz with 7-7-7-21 timings, representing JEDEC-approved values. The TWIN3X2048-1333C9DHX sports even-faster speeds of 1333MHz with 9-9-9-27 timings. Corsair also expects to launch 1600MHz DDR3 memory modules in the coming months. Presumably, all Corsair DDR3 memory products will be backed by a lifetime warranty and complete customer support.

OCZ Technology Group, today announced their official crossover into DDR3 memory to coincide with the recent launch of the Intel Bearlake Chipset. OCZ's hand-tested DDR3 solutions enable ardent enthusiasts to take advantage of the highly-anticipated P35 platform while experiencing the legendary quality and reliability of OCZ memory. The first OCZ DDR3 products will accommodate standard JEDEC specifications for third generation DDR and offer Gold Series memory kits in PC3-8500 (1066MHz) and PC3-10666 (1333MHz) speed grades. OCZ Gold DDR3 modules are currently available in limited quantity in 2x512MB and 2x1024MB dual channel kits, backed with lifetime warranty and free technical support. For more information on the new OCZ DDR3 solutions, please click here.

Memory maker Super Talent Technology, today officially launched its new line of extreme performance 1333MHz and 1066MHz DDR3 modules. These JEDEC compliant 1GB modules and 2GB kits were designed specifically for the new Intel P35-Bearlake platform, and have already been validated on multiple P35 motherboards. These modules feature custom black cast aluminum HE heat spreaders for optimum thermal performance.

W1333UX2G9 2GB DDR3 Kit (2x 1GB) 1333MHz PC3-10600 9-9-9-27
W1333UB1G9 1GB DDR3 module 1333MHz PC3-10600 9-9-9-27
W1066UX2G7 2GB DDR3 Kit (2x 1GB) 1066MHz PC3-8500 7-7-7-20
W1066UB1G7 1GB DDR3 module 1066MHz PC3-8500 7-7-7-20
These products are all sampling now, and will be shipping in volume in June. W1066UX2G7 is expected to retail for approximately $489.

Two of the world's biggest memory makers - Samsung and Elpida have been validated today on Intel Corporation's reference platform to work with Intel's next generation DDR3 chipsets. This is the largest number of DDR3-based solutions to have passed the validation program. Samsung's Intel-validated solutions include 13 modules and eight monolithic devices in combinations of 512MB/1GB densities with speeds of 800 or 1066MHz. In addition, Japanese Elpida Memory, Inc. has also received Intel's validation of its DDR3 main memory based on the G33 chipset reference platform. As a leading vendor of DDR3, Elpida has a diverse line-up of DDR3 products that include 512MB and 1GB DDR3 modules rated to run 800MHz at CL5-5-5 and 1066MHz at CL7-7-7 timings. DDR3 memory will provide at least twice the bandwidth of today's primary memory - DDR2 - with data transfer rates now up to 1.6Gb/s and default operating voltages down to 1.5V. Samsung and Elpida plan to begin full-scale mass production of its DDR3 chips later this quarter.

Hynix Semiconductor today announced it has received validation on its DDR3 memory components and modules from Intel. The newly-validated DDR3 products are 1GB DDR3 SDRAM Unbuffered-DIMMs manufactured on 80nm process technology. These devices have operating speeds from 800MHz to 1066MHz with reduced voltage to 1.5V. These speeds are offered in latency combinations of 5-5-5 and 6-6-6 for the 800MHz, and 7-7-7 for the 1066MHz memory modules. Mass production of the 1GB DDR3 on the 80nm line will begin in the third quarter of this year. Hynix plans to manufacture the product on a 66nm process beginning in late 2007.

Akiba PC Hotline has pictures of DDR3 memory sticks that can be purchased in Japan. The price for a 1GB stick is ~$350.

Japanese Buffalo Ltd. anounced that it will ship its first DDR3 memory modules in Japan by the end of the month. The company will offer a kit of 512MB memory modules (2x 512MB), a single 1GB module as well as a 2GB set (2x1GB). The DDR3 memory standard is considered as the successor of the DDR2 SDRAM. It promises power consumption reduction of 40% compared to current DDR2 modules, allowing lower operating voltages (1.5V, compared to 1.8V in DDR2 modules). Buffalo's new modules run at 1,066MHz((PC3-8500) and maintain the 240-pin DIMM interface of DDR2. Intel has preliminarily announced that they expect to be able to offer support for DDR3 in mid 2007 with a version of their upcoming P35 Bearlake chipset. AMD's roadmap indicates their own adoption of DDR3 to come in 2008.