Admidst the a virtual arms race between the two giants of the discrete graphics industry, information trickles about the memory configurations that the mid-range RV730 (Radeon HD4650 / HD4670) and entry-level RV710 (Radeon HD4450 / HD4470) come in.

NordicHardware reports that two different GDDR3 memory configurations could be seen with RV710. Both configurations operate at 800MHz, but the density varies from 512MB Hynix memory to 1024MB Samsung chips. This points to that the HD4450 and HD4470 models will be separated by GPU clock. RV730 offers a bit more variation with three different clock frequencies and two different densities. One 700MHz 512MB model, and two 900MHz models, of which one sports 512MB Hynix memory and one sports 1024MB Samsung chips. And finally, there is one model with 512MB Hynix memory operating at 1000MHz. It is assumed that the Radeon HD 4650 is the 700MHz cards, while the 4670 model is represented by the three remaining cards.

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today announced the expansion of its Intel Extreme Memory modules lineup, the latest memory solution that implements a high-performance specification optimized and predefined for the Intel X38 and X48 chipsets. The new modules are rated at DDR3-1333 and DDR3-1600 and feature the all-new Intel branded black XTC heatspreader. With a long history of providing the most innovative products to the enthusiast community, OCZ is excited to take advantage of Intel's interest and development of overclocking platforms with these latest additions to the series.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced that its HyperX 1800MHz DDR3 memory has been certified under the Intel Extreme Memory Profile (Intel XMP) validation program to offer PC builders and gaming enthusiasts, more performance memory options and tuning flexibility when constructing high-performance systems using select Intel X38/X48-series chipsets.

When it comes to hot news from MSI, my favourite source has always been bit-tech.net. These guys have some very good connections with MSI. Now a week before Computex 2008, they have convinced MSI to let them get a close-up look at Intel's next generation Nehalem architecture, which is based on the Bloomsfield CPU platform and Tylersberg chipset also known under the X58 nomenclature. The following pictures show a 1366-pin quad-core Bloomsfield CPU (no model and specs for now) with HT support and integrated DDR3 memory controller. All Bloomsfield processors will require a new cooling. Regular LGA775 coolers won't fit. The Tylersberg X58 motherboard made by MSI has six DDR3 memory slots. Six becuase you'll need a minimum of three DDR3 DIMMs to run in triple-channel mode. The chipset also features 36 lanes of PCI-Express 2.0, so you'll get a full x16 by x16 for at least two video card slots. The south bridge used with Tylersber is still ICH10, so don't expect extraordinary features when it comes to the number of SATA or USB 2.0 ports. Check out the rest of the pictures by the author Richard Swinburne over at bit-tech.net.

Corsair today announced that it will launch a new 4GB DOMINATOR DDR3 memory kit running at 2000MHz at CompuTex 2008, held June 3-7, 2008 in Taipei. Tested and guaranteed for operation at the lightning fast overclocked speed of 2000MHz, this 4GB DOMINATOR kit provides superior performance for desktop platforms. "Corsair is focused on building the industry's fastest memory available in the largest densities," said Richard Hashim, Sr. Director of Marketing at Corsair.

Super Talent Technology today announced the immediate availability of its DDR3 SO-DIMMs. Super Talent's new 1GB DDR3-1333 SO-DIMM supports transfer rates up to 10,664 MB/sec. That equates to 66% higher bandwidth than DDR2-800 SO-DIMMs, making this the world's fastest production DDR3 SO-DIMM. In addition to the faster speed, DDR3 SO-DIMMs require only 1.5V, compared to 1.8V for DDR2, resulting in power savings of up to 20% and less heat output. This 204-pin module, part number W1333SA1GS, is available now for under $99.

Apacer Technology has announced the launch of its Aeolus series of DDR3-1800MHz/1600MHz overclocking memory modules. These modules use DDR3 / 1Gbit / 128Mx8 die manufactured using Micron Technology's most advanced production process technology. The dual-channel architecture provides maximum bandwidth of 28.8GB (1800MHz) / 25.6GB (1600MHz) with low-latency CL7-7-7-20 timing, giving the Apacer Aeolus DDR3 memory modules outstanding performance in the 1800MHz / 1600MHz product category.

Kingston Technology today announced its HyperX 1800MHz DDR3 memory has been certified under the Intel Extreme Memory Profile (Intel XMP) validation program to offer PC builders and gaming enthusiasts more performance memory options and tuning flexibility when constructing high-performance systems using select Intel X38/X48-series chipsets.

Verified and validated by CPU-Z, Corsair Labs achieved an astounding speed of 2462MHz at CL=9 with a single-rank 1GB module. This new world record eclipses all previous CPU-Z validated memory benchmarks. This record was set using Corsair's award winning DOMINATOR DDR3 memory module paired with an Asus P5E3 Premium motherboard based on the Intel X48 chipset. This is now the highest achieved DDR3 frequency of all time. Validated results and setup details can be found at valid.x86-secret.com/show_oc.php?id=361829.

Transcend Information (Transcend), one of the world's leading memory module manufacturers, today released its retail-packaged DDR3-1066 and DDR3-1333 240-pin DIMMs. Currently available in 1GB and 2GB capacities respectively, they operate at 1066MHz (CL7-7-7-20) and 1333MHz (9-9-9-24) using 1.5V. More over, the DDR3 modules incorporate an all-new "Fly-by" architecture that provides more efficient direct communication between the controller and each DRAM chip. This technology also includes dynamic On-DIMM Termination (ODT) for improved signal quality. Transcend memory modules are built to the highest specifications with the finest chips and materials available, and also come with a lifetime warranty.

OCZ Technology Group today announced the Special Ops Urban Elite DDR3 Series, available in high-speed PC3-12800 kits featuring the high densities and stability gamers demand. These blazing fast modules are ideal for users taking advantage of the incredible performance of DDR3 gaming platforms, offering the speeds, density, and reliability required for the latest DirectX 10 PC titles. Featuring a unique "urban" camouflage motif heatspreader design, the DDR3 Special Ops Urban Elite Series was designed to lend some extra style to system builds while unleashing the performance potential of your entire gaming platform.

OCZ Technology Group today announced two new Reaper HPC solutions for enthusiasts upgrading to next generation of cutting-edge platforms. The PC3-14400 and PC3-12800 Reaper HPC Series are now available in both 2GB and 4GB dual channel kits to meet the specific needs of customized gaming systems or workstations, offering perfect compatibility with the latest platforms and chipsets at the height of DDR3 performance.

OCZ Technology Group today premiered the world's first PC3-16000 4GB (2x2048MB) DDR3 kits to provide even greater performance and productivity on the latest DDR3 platforms. Designed to offer the earliest adopting enthusiasts the advantages of high-density memory coupled with the highest speeds available, the OCZ PC3-16000 4GB kits make use of the unbeatable overclocking capabilities of the latest platforms and takes DDR3 to unimaginable performance levels.

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today announced the Special Ops Edition DDR3 Series, available in both PC3-8500 and PC3-10666 kits featuring the high densities and stability gamers demand. These DDR3 kits are ideal for users advancing to the next generation of memory platforms, offering the speeds, density, and reliability required for the latest DirectX 10 PC titles.

Super Talent has become the first high-performance memory manufacturer to offer DDR3-1800 PC3-14400 4GB Kit (2x 2GB), part of the company's overclocking friendly Project X family. The kit is rated with latencies of CL8-8-8-24 at 1.9V and comes backed by a lifetime warranty. "This represents another major first-to-market milestone for Super Talent", commented Super Talent Marketing Director, Joe James. "While competitors are only able to produce 4GB kits up to DDR3-1600, we've engineered a kit that performs at elevated clock speeds while still supporting aggressive latencies." The W1800UX4GP kit is available now for under $499.

It is estimated that memory consumes approximately 15% of power in data center server systems today, a figure which is expected to rise with the increased memory requirements needed for virtualization and multi-core data processors. Addressing this power challenge, Micron Technology is expanding its energy-efficient Aspen Memory module portfolio with the addition of 1Gb-based DDR3 modules operating at 1.35-volts as well as 2Gb-based DDR2 modules operating at 1.5-volts; providing the server industry with the lowest voltage DDR2 and DDR3 memory designs for reduced power consumption.

Super Talent Technology is following other memory makers, with the introduction of the popular Project X in a new DDR3-2000 2GB (2x1GB) kit. This Project X kit is built with the fastest available, carefully screened DRAM chips, and is hand tested as a matched pair on a dual channel ASUS Striker II Extreme motherboard. Labeled as DDR3-2000 PC3-16000 2GB Kit (2x 1GB), the W2000UX2GP can operate using CL9-9-9-28 timings and only 1.9V. Project X memory is designed, built and tested in Super Talent's San Jose, California headquarters, and is backed with a lifetime warranty. The W2000UX2GP kit will begin shipping today at street prices under $400.

G.Skill International Enterprise, a leading provider of high performance memory, is launching a new heat spreader design for mid-high end memory. Based on providing better heat dissipation, G.Skill "π" series heat spreader design increases the air contact surface 100% more than traditional design. Under high voltage, G.Skill claims that "π" can lower the module temperature at least 20% to 30% more than other memory cooling systems. G.Skill's "π" series heat spreader will be implemented with a whole new "HZ" series of dual-channel kits ranging from DDR2-800 to DDR3-1600. These modules will be available through G.Skill's authorized resellers and distributors worldwide.

Gearing up for the increased DDR3 demand, Kingston is now selling more affordable 1600MHz-rated DDR3 memory modules and kits. "With more new chipsets able to take advantage of DDR3 memory, the time was right for Kingston to release 1600MHz modules to fill the need for an economic alternative to higher priced 1600MHz modules on the market," said Dara Sun, strategic alliance manager, Kingston. "Our goal with this new offering is to meet the demand for a more mainstream performing DDR3 product while complementing our high frequency top-performing memory technology." The HyperX 1600MHz PC3-13000 are available in 1GB or 2GB single modules as well as in 2GB and 4GB kits certified to operate from 1.7V to 1.9V with latencies of CL9-9-9-27. The recommended prices for the new memory stand at $198 (1GB module), $395 (2GB module/kit) and $790 (4GB kit). All Kingston HyperX memories are backed by a lifetime warranty and free 24/7 technical support.

Lexar Media is now the first global memory provider to announce the immediate availability of Crucial DDR3-1066 (PC3-8500) 204-pin SODIMM memory modules. Crucial PC3-8500 SODIMM modules support module bandwidths up to 10.6 GB/s with a data rate of 2,133 MT/s at a respective clock frequency of 1066MHz - effectively doubling the data rate of DDR2 1066MHz memory. In addition, DDR3 supply voltage is 1.5V compared to DDR2's 1.8V, reducing power consumption by up to 30 percent and also generating less heat. The DDR3 modules are able to obtain these advantages by utilizing improved package, pin-outs, and signaling on the components, as well as an improved overall module design. The Crucial SODIMMs are available in 1GB and 2GB densities plus they come with a lifetime warranty.

Micron Technology today announced that it is sampling 4GB DDR3 modules, designed using 2Gb components, to provide the industry's highest density DDR3 modules for notebook computers. High-density memory modules are becoming increasingly important for notebook computers as graphic-intensive operating systems and other content heavy applications continue to make their way onto the market. The fast speeds, high-density and low-power of Micron's portfolio of DDR3 modules - ranging in density from 512MBs to now 4 GBs - allow these systems and applications to perform more effectively and utilize power more efficiently.

Power Quotient International (PQI) has released a new DDR3 dual channel memory kit. Part of the Phoenix Series of DRAM products, the Turbo Immortality Edition DDR3-1600 4GB (2x2GB, CL9-9-9-24)) dual channel kit is aimed at being paired up with the latest Intel X38, X48 and NVIDIA nForce 790i motherboards. The two modules also feature aluminum heat-spreaders with a phoenix graphics engraved on them. Set to work at 1600MHz DDR3 frequency and beyond, the XMP (Extreme Memory Profiles) supporting modules make use of Elpida's 70nm 128Mx8 DRAM chips. The new 4GB kit is backed up by a lifetime warranty. Pricing and availability haven't been announced yet.

Kingston Technology today announced its family of HyperX DDR3 memory modules have been SLI-certified by NVIDIA Corporation, as part of its program to offer gaming enthusiasts solid platform/memory compatibility, stability and performance solutions when building high performance systems using the new series of NVIDIA nForce 790i SLI platforms.

OCZ Technology Group today unveiled blistering fast PC3-16000 DDR3 modules that are NVIDIA SLI certified to run at extreme 2GHz speeds on the next generation of NVIDIA nForce 790i Ultra SLI motherboards also released today. Designed to offer enthusiasts the rock-solid stability and speed they've been demanding since the mainstreaming of DDR3 platforms, the OCZ PC3-16000 SLI-Ready series makes use of the unbeatable overclocking capabilities of the nForce 790i Ultra SLI platform and takes DDR3 to new heights.

Lexar Media today announced the immediate availability of Crucial Ballistix PC3-16000 (DDR3-2000MHz) high-performance memory modules-some of the world's highest speed-rated DDR3 products to date. Crucial Ballistix DDR3-2000MHz memory modules feature Enhanced Performance Profiles (EPP) 2.0 and are SLI-Ready certified to work with new motherboards utilizing the new NVIDIA nForce 790i Ultra SLI platform. The NVIDIA nForce 790i Ultra SLI platform was designed and tested using Crucial Ballistix DDR3-2000MHz high-performance memory.