Samsung Electronics, the world leader in advanced semiconductor technology solutions, today announced that it is ramping up 50-nm class production of DDR3 memory chips this month - the most advanced system memory available. This is in response to increased demand stemming from Intel Corporation's launch of its Intel Xeon processor 5500 series.
Samsung's DDR3 enables OEMs to design servers that use up to 192 gigabytes (GBs) per system (16 GBx12) and provides numerous improvements over its predecessor, DDR2, including at least a 60 percent improvement in power consumption and double the system performance, with speeds up to 1333 Megabits per second (Mbps).

Jetway announced its newest line of mainstream motherboards for the AMD processor platform: XBLUE series. The two models currently part of the lineup include XBLUE-78GA3 (AMD 780G) and XBLUE-77A3 (AMD 770). Jetway used an identical PCB design for the two, with a few components' presence determined by the chipset. The core idea is to provide support for the entire range of processors right from AM2 to AM3. The board features two DDR2 (supports up to DDR2-1066 standard) and two DDR3 slots (supports up to DDR3-1333). For AM3 processors, either kind of memory can be used, while for AM2 and AM2+ ones the DDR2 slots have to be used.

On both the boards, Jetway implemented ATI Crossfire, not by using external PCI-E switching for the PCI-E x16 slot, but rather providing a PCI-E x4 slot powered by the SB700 southbridge. The XBLUE-78GA3 even packs SidePort memory for the IGP. Its output options include DVI, D-Sub and HDMI. The XBLUE-77A3 relies on discrete graphics. Other features include six SATA II ports, and six-channel HD audio. The company is yet to announce pricing and availability.

Team Group recently unveiled four new low-voltage DDR3 memory kits for high-performance desktop machines that boast Intel's DDR3 loving X58 chipset. The new kits are available in both 3 GB (3x1 GB) and 6 GB(3x2 GB) flavours and come in both 1066 MHz and 1333 MHz varieties. The memory modules itself feature a 6-layer PCB, 128x8 die layout, and operate at CL7-7-7-21 timings for the 1066 MHz and at CL9-9-9-24 for the 1333 MHz models. Operating voltage for all memories is 1.5V. All four Team Group Team Elite memory kits come with a lifetime warranty.

Intel's next big thing in the making, the Core i5 series processors are nearing launch, which is reportedly delayed to October. The new processors replace the Core 2 Quad and Core 2 Duo series of processors, while leaving the high-end market for Core i7 to play with. These processors are based on the LGA 1156 socket, and are incompatible with Core i7 motherboards. Recent reports shed light on three models in the making to start the lineup, all of which are quad-core processors based on the Lynnfield core, built on the existing 45 nm process.

The common features of these processors include: four x86 processing cores with support for HyperThreading technology, an integrated dual-channel DDR3 memory controller specified to run DDR3-1066 and DDR3-1333 modules, 8 MB of L3 cache, and support for TurboBoost technology. The three models will come with core clock speeds of 2.66 GHz, 2.80 GHz, and 2.93 GHz. The three will be priced at US $196, $284, and $562 respectively. With the TurboBoost technology enabled, the clock speeds card be stepped up to 3.2, 3.46 and 3.6 GHz respectively, on the fly. Shortly after launching these processors, Intel may introduce the industry's first 32 nm processors. With these prices, the chips clearly intrude the price-domain of Core i7, though perhaps their lower platform costs could serve as deal-makers.

AMD is attempting to set its record straight with the Phenom II series of 45 nm desktop processors. The company had started off its Dragon desktop platform with the introduction of its flagship CPU, the Phenom II X4 940. This processor however, is not compliant with the AM3 socket, and will not support DDR3 memory, unless an AM3 socket motherboard can provide DDR2 memory support. Come April 20, and AMD will have released its newest processor: Phenom II X4 955 Black Edition. Based on the 45 nm Deneb core, this processor supports AM3 socket motherboards, and DDR3 memory. It features a core clock speed of 3.20 GHz (16.0 x 200 MHz), 512 KB of L2 cache per core, and 6 MB of L3 cache. It is overclocker-friendly thanks to its unlocked bus multiplier, and the "massive headroom" AMD has been brandishing lately.

One of our sources from Hong Kong was able to make an early-purchase this processor in its retail "processor in a box" (PIB) package (marked with the OPN HDZ955FBGIBOX), from the Golden Computer Parts Center, who took a few snaps of the package. It could be bought for around HKD 2170 (US $280).

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today launched a new Chrome Series of extreme performance triple channel DDR3 kits for Intel Core i7 based enthusiast motherboards.
The new Chrome Series is Super Talent's highest performance line of DDR3, which supports extremely high memory clock speeds at a relatively low 1.65 Volts to match the requirements of the new breed of Core i7 based motherboards. The first four Chrome Series triple channel kits include 6 GB and 3 GB kits in DDR3-2000 and DDR3-1800 speeds.

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today expanded their memory lineup for AMD enthusiasts and power users with new DDR3 kits qualified and optimized specifically for the AM3 platform. The new low-voltage kits were designed exclusively for AMD's transition to DDR3 and are tailored to make full use of the latest computing environments as well as establish a future-proof system with restricted voltage requirements.

"AMD's new AM3 architecture is designed specifically for the gaming community, with emphasis on high data transfer rates between the system memory and the graphics subsystem," commented Dr. Michael Schuette, VP of Technology Development at OCZ. "The key improvement over the AM2 platform is the embracing of DDR3 technology where OCZ has a track record of being a market leader. These new AMD kits further establish our leading role in this category and show our commitment to both industry partners and the gaming community by complementing AMD's gaming platform with future-oriented, low voltage memory technology."

Patriot Memory, a global provider of premium quality memory modules and flash memory solutions, today announced their DDR3 12 GB Tri-Channel Viper kit.

Designed specifically for the Intel Core i7 processor/Intel X58 Express Chipset, the Patriot Viper 12 GB kit has been built to excel for the Core i7 triple channel tehcnology. The Patriot Viper 12 GB are hand tested extensively on X58 motherboards to ensure maximum compatibility and supreme quality. The kits will be offered in 1333 MHz and come in both CL7 and CL9. "With all memory slots utilized in all three channels, the Core i7 brings the effectiveness of a server to mainstream desktops, and for a fraction of the price, says Benny Chea, Patriot Memory's Applications Engineer. Mr. Chea went on to say, "Multi-applications users will appreciate the increased bandwidth."

Being on the forefront of technology adoption as far as its graphics products go, AMD will have a notebook platform with DirectX 11 compliant integrated GPUs ready by 2011, reveal company slides sourced by Expreview. The iGPU will be part of the company's "Accelerated Processing Unit" (APU) design approach to the PC's central processing. The APU draws parallels with Intel's upcoming processor designs where the CPU package holds both the CPU and northbridge dice in a multichip-module. One of the first AMD APUs, codenamed "Llano" will be part of the company's "Sabine" mobile platform. Typically consisting of the CPU, a DDR3 memory controller, a northbridge with integrated graphics processor, and the PCI-Express root complex, APU eliminates discrete northbridge from board design.

Slated for 2011, the Llano APU comes out at a time when DirectX 11 is expected to be an established API. The iGPU will also pack UVD 3.0, a next generation hardware-accelerated video decoder by AMD. It will be built on the 32 nm manufacturing process by AMD's foundry partner(s). It features up to 4 x86 processing cores, an iGPU, a memory controller supporting DDR3-1600 memory, 128-bit floating-point execution units (present even with current generation Phenom processors), and a BGA design with a low-TDP package. Llano will be accompanied by the SB9xxM series southbridge. This chip would make for most of the board's nucleated machinery apart from the APU. It will integrate the "DAC" (we interpret audio DAC), USB 3.0 hubs with 16 ports, a 6-port SATA controller, and clock-generator.

Micron Technology, today announced that its suite of DDR3 server memory modules are validated with Intel's next-generation Intel Xeon processor chips. Micron's validated 1, 2, 4 and 8-gigabyte (GB) DDR3 modules are performance-driven, delivering speeds of 1066 megabits per second (Mb/s) and 1333 Mb/s, greatly increasing server throughput. Additionally, Lexar Media, a wholly-owned subsidiary of Micron, has validated its corresponding Crucial-branded modules, leveraging Micron's award-winning DDR3 memory.

OCZ Technology Group, Inc., a worldwide leader in innovative, ultra-high performance and high reliability memory and computer components, today unveiled OCZ Vertex Mac Edition Solid State Drives and mobile memory solutions qualified by OCZ for ultimate compatibility with the latest family of MacBooks. These new premium offerings are designed for Mac enthusiasts demanding the latest technology in storage and memory to increase productivity and performance on their Apple notebooks.

"OCZ is excited to announce two new products that are specifically designed for Mac consumers," commented Ryan Edwards, Director of Product Management at the OCZ Technology Group. "Both the Vertex Series Mac Edition solid state drives and the new Mac Edition SODIMMS are designed to be an easy upgrade for consumers that want to boost the performance of their MacBooks, and have been tested in Apple's Development Center (ADC) to ensure stability and compatibility."

G.Skill International Co. Ltd., a world leader in extreme performance memory with solid quality, today launches Triple Channel DDR3 2000HMz "Trident" series at timings CL 9-9-9-24 designed for Intel Core i7 processors / Intel X58 Express Chipset.

The "Trident" series provides the ultimate performance and speed for enthusiasts, overclockers and extreme gamers. The dynamic Trident heatsink blends the best in cooling effectiveness while retaining a stylish design and extreme performance at 2GHz or more. With G.SKILL Lifetime Warranty and ever ready technical back-up, Triple channel kit is total solution for all memory module enthusiasts. For more information, please visit our product page.

EVGA, the leading-edge 3D processor graphics cards and motherboard manufacturer, announces the EVGA GeForce GTX 275, offering first rate graphics, physics, and GPU computing performance. The EVGA GeForce GTX 275 appeals to today's value conscious gamers who desire a powerful GPU and support for both, enhanced 3D image quality and an extended range of 3D special effects that guarantee the best gaming experience for current and upcoming titles. The powerful 3D processor features the NVIDIA GeForce 275 GPU with a complete set of 240 processor cores plus super fast 0.8ns DDR3 memory. Also, EVGA is offering both 896MB and 1792MB versions ensuring you get enough memory to handle the highest of resolutions and texture quality.

Geil has announced the launch of its EVO ONE DDR3 gaming memory series. Both dual and triple channel memory kits will be available, ranging from 2 GB (2x 1GB sticks) in dual channel to 6 GB (3x 2GB sticks) in triple channel.

All memory kits feature Geil's EVO One Heatspreader with MTCD technology.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced it is shipping both 1333- and 1066MHz DDR3 server memory modules validated by Intel for use on its Xeon processor-based motherboards. Kingston's registered ECC server DIMMs and unbuffered ECC DIMMs are optimized to take advantage of the triple-channel architecture for Intel's newest server platforms using the new Nehalem-based Xeon processors.

The 1333- and 1066MHz DDR3 server modules are available immediately. Kingston server memory is backed by a lifetime warranty and free, 24/7 technical support. For more detailed information visit www.kingston.com. For Intel validation information visit this page.

Famed for its LANParty JR "junior" series high-end mATX motherboard lineup, DFI is preparing an addition: the JR 790GX-M3H5. This one features the AM3 socket, made for the latest AMD processors supporting DDR3 memory. Respecting the constraints this form-factor has, the board goes on to cover every feature one would expect from a larger ATX motherboard, which is the ideology behind the LANParty JR.

The CPU is powered by a 4+1 phase VRM circuit. Expansion includes two PCI-Express 2.0 x16 slots (electrically x8 when both are populated), a PCI-E x1, and a PCI slot. The 790GX IGP is assisted by 128 MB of DDR3 sideport memory. Display outputs include DVI-D and HDMI. The SB750 southbridge provides six SATA II ports with RAID support. This board will hit the shelves by the end of April.

Pursuing legal action against Intel for bringing its Intel-compatible platform development to a grinding halt due to legal complications, NVIDIA has kept its platform development for AMD on track. The company has made the nForce 980a SLI platform official, that supports the latest Phenom II series processors from AMD. The company published the product page on its website, and has pictured its reference design motherboard based on the chipset. The motherboard carries the "designed by NVIDIA" marking, which makes it a design that several of its AIC partners such as EVGA, XFX, Zotac, etc., can use simultaneously.

The motherboard sports the nForce 980a SLI chipset, paired with the nForce 200 PCI-Express bridge chip. The motherboard features a GeForce 8300-class IGP, with DVI-D and D-Sub outputs. It supports NVIDIA 3-way SLI and Quad-SLI. As an AMD platform, the chipset supports AM2, AM2+ and AM3 socket processors, with DDR3 and DDR2 memory support (depending on the processor). A 5-phase digital PWM circuit powers the processor. The nForce 980a SLI and nForce 200 chips are located adjacent to each other, and are cooled actively by a fan-heatsink. The product design looks production-grade and may attract partners to sell it.

With its new 790FX-GD70 receiving good reviews at the high-end AMD segment, MSI is quietly filling up its AM3 socket lineup. Its newest entry is the 770-C35. The board is MSI's first AM3 offering based on the RX780 (AMD 770) chipset. It is paired with the SB710 southbridge, that retains most of the SB750's feature-set except some RAID modes. Advanced Clock Calibration is supported. Four DDR3 DIMM slots support DDR3 memory at speeds of up to 1600 MHz. A single PCI-Express 2.0 x16, two PCI-E x1, and three PCI slots provide expansion. The SB710 southbridge provides support for six SATA devices. The 770-C35 should release soon, at a sub-$100 price-point.

Samsung Electronics, the world leader in advanced memory technology, announced today that it has just made the initial shipment of the world's first and smallest high-density memory modules based on 2-gigabit (Gb), 50 nanometer (nm)-class DDR3.
Samsung is shipping 18 configurations of its high-density, high-performance DDR3-based modules, which are designed for servers. They include a 16-gigabyte (GB) registered inline memory module (RIMM) and an 8 GB RDIMM (registered dual inline memory module). Last September, a 50 nm-class 2 Gb DDR3 was introduced for PC applications.

Power Quotient International Co., Ltd. (PQI) officially announces the release of DDR3 tri-channel memory kits. Compatible with current Intel X58 chipset's coupled with Intel i7 series CPU, the tri-channel technology provides significant memory bandwidth improvements over dual channel mode. It provides the ultimate performance for enthusiasts wanting the very best system performance every time they turn on their computers.

Due to software programming complexity and hardware requirements, the increased bandwidth and memory capacity definitely plays a major role in ones PC performance. Using specially picked DRAM modules in 128M*8 configuration combined with stringent testing methodology, its full compatibility and performance is ensured. PQI's DDR3 tri-channel kit offer users extra memory capacity and greater bandwidth compared to DDR2 modules.

Hynix Semiconductor today announced the validation of the HMT31GR7AUP4C, the world's first MetaRAM based 8 GB 2-rank DDR3 RDIMM, on Intel's Nehalem CPU based Tylersburg-EP platform
When fully populated with 3 DIMMs per channel, the Hynix 8 GB RDIMM operates at 1066 MHz speed. Competing industry standard modules exhibit performance degradation to 800 MHz when operating under full load. The Hynix 8 GB DDR3 RDIMM enables a maximum capacity of 144 GB operating at 1066 MHz in a dual processor Tylersburg-EP platform, not possible with industry standard DIMMs.

Mushkin Memory has just released two new Redline DDR3 kits. The triple channel Mushkin Redline memories, model numbers 998691 and 998692, both consist of three 2 GB modules for a total of 6 GB. They both operate at 1600 MHz with CL6-7-6-18 timings and 1.65 V. Model number 998691 comes with Mushkin's usual heatspreader known from the past, while the 998692 kit ships with the company's new Ascent heatspreaders that use a technology developed by Celsia technologies, called eVCI (enhanced Vapor Chamber Interface). Both triple channel kits are to be offered with a lifetime warranty.

Talks with potential investors regarding a solution to keep Qimonda in operation will continue beyond the end of March 2009. "Various investors have signaled their interest, but as yet there are no binding offers on the table. As anticipated, it will not be possible to reach a conclusive solution by the end of March," announced preliminary insolvency administrator Dr. Michael Jaffé today after a meeting with the creditors committee.

The employees of the insolvent Qimonda AG and Qimonda Dresden OHG will be able to claim compensation by means of statutory insolvency payments until the end of March 2009. By the end of March, the bankruptcy court in Munich will also have received the preliminary insolvency administrator's report on the basis of which the court will make a decision on whether to open insolvency proceedings.

EVGA is set to announce the X58 Classified motherboard. The Intel Core i7 compatible motherboard is set to be one of the most feature-rich and expensive LGA-1366 motherboards till date. The design focus of this motherboard is based on the power-circuitry that fuels its various components. A 1.33 MHz 10-phase digital PWM circuitry with dual 8-pin 12V inputs, along with 4-phase circuit for the DDR3 memory, and 3-phase NB power. Four PCI-E x16 slots driven by the Intel X58 chipset in conjuction with NVIDIA's nForce BR-03 chipset adds 3-way SLI + an additional slot for a GeForce accelerator dedicated to process PhysX. Elaborate heatpipe-driven coolers over the board's northbridge and VRM areas keep temperatures under check. The X58 Classified is priced at US $449, and will start selling shortly. The product has made it to EVGA's catalogues and its product page online. A demonstration video of the product by EVGA can be viewed here.

During CeBIT, MSI showcased two AMD 790GX motherboards that combine support for both DDR2 and DDR3 on the same board. Although both the MSI 790GX-8D and the MSI P45-8D are designed for different platforms, the enormous RAM capacity support - both offer four DDR2 slots and four DDR3 memory slots - makes them really unique. The AM3 board 790GX-8D featuring the 790GX chipset, supports DDR2-1066 or DDR3-1333 RAM. It is also capable of supporting socket AM2+ processors with DDR2 RAM. Moreover, the 790GX-8D allows overclockers to increase the RAM frequencies at any time using an onboard control dial. Users can even erase the CMOS RAM with the touch of a Reset button or switch into power saving mode by pressing the "Green Power" button. The board offers two PCIe x16 slots, two PCIe x1 slots, and a vanilla PCI slot.
As for the P45-8D, this motherboard makes use of Intel's P45 +ICH10/ICH10R chipset and supports Intel's 45nm and 65nm Core 2 (Extreme) processors. The board has one PCIe x16 slot, one PCIe Gen2 (1x16) slot, one PCIe x1 slot, and three vanilla PCI slots. The P45-8D should be widely available already, while the MSI 790GX-8D AM3 child is still unavailable.
MSI nicknamed the boards - "Memory Lover".