Apacer, one of the world's leading brands of memory modules, has announced its brand-new "Giant II DDR3 Overclocking Memory Module series" in response to the global trend of gaming economics, helping fervent gaming players build their ultra-speed gaming PC. Apacer's "Giant II DDR3 Overclocking Memory Module series" inherit the huge heatspreader design of the Giant Series and further adopt the unique "air-fall" vents for quick heat dissipation even at overclocking high temperature, maintaining great operation stability while the player can enjoy the sensational gaming experience.

Apacer's "Giant II DDR3 Overclocking Memory Module Series" selects the best-performing Elpida's 1Gbit, 128x8 particles suited for overclocking, which are screened in the triple channel test environment using the advanced test fixture and programs under diversified parameters of voltage and time sequences. Stricter than other brands' screening standards, the particles are further tested in the high temperature and high pressure environment for 72 hours to wash out unstable ones and ensure best overclocking performance and stability. The much-tested "Giant II DDR3 Overclocking Memory Module Series" has four models: DDR3-1600MHz, 1866MHz, 2000MHz, and DDR3-2133, the most stable and performing model in the market, with two capacity choices: 3GB (1GBx3) and 6GB(2GBx3), to meet the different requirements of professional players who demand ultra game performance.

In response to Intel's recent official release of its latest quad-core processors Core i7-800 series and Core i5-700 series, Apacer Technology Inc., the leading memory module manufacturer, unveils two DDR3 dual-channel overclocking memory modules-Golden and Aeolus series. They target desktop and overclocking users to by delivering extreme performance and fully support Core i7 and Core i5 processors that use Intel's Nehalem microarchitecture for optimum platform compatibility for mainstream desktop computers. Excellent overclocking performance thus comes realized.

To support P55 chipset-based Intel Core i7 and Core i5 platforms, Apacer's new DDR3 overclocking memory modules can be powered by 1.65V low voltage supply. When running under the dual-channel mode, Golden series can achieve bandwidth up to 1800 MHz. Aeolus series featuring unique Dual-layer Heat Spreader can reduce the temperature by as much as 20°C and also support maximum frequency of 2200 MHz. Exclusively designed for hardcore gamers and overclocking users, the overclocking memory modules allow users to experience the extreme overclocking performance.

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today expanded their lineup of DDR3 to include certified OCZ Black Edition 4GB kits for ultimate compatibility with AMD's next-generation Phenom II processors. These modules excel on Black Edition platforms at ultra-low voltage, an ideal parameter for the latest highly efficient processors. OCZ's unique Black Edition Series is designed to be the ultimate upgrade for users who not only want to reap the benefits of high-frequency DDR3, but want a future-proof choice for their system.

"OCZ is excited to launch our new AMD Black Edition Ready Series which is designed specifically to work with AMD's OverDrive software utility," said Eugene Chang, Vice President of Product Management at the OCZ Technology Group. "The new OCZ Black Edition modules not only interact with AOD to overclock the memory, but also communicate with the BIOS to increase the frequency and performance of the memory controller. The result is a symbiotic relationship between memory and the rest of the system to unleash the full power of the Dragon Platform."

Kingston Technology Company, Inc., the independent world leader in memory products, today announced it is adding 8GB dual-channel HyperX memory kits in support of Intel's new LGA1156 Core i5 and Core i7 systems. The DDR3 XMP-ready kits are available in 1600- and 1333MHz frequencies and run at a low 1.65 volts.

The 8GB memory kits help increase overall system performance in 64-bit operating systems including Windows Vista and the upcoming Windows 7. System builders and ultra-enthusiasts who deploy 8GB of Kingston dual-channel memory will find performance increases in such tasks as running virtual machines, video encoding and graphics-oriented applications.

A-DATA Technology Co., Ltd., a worldwide leading manufacturer in high-performance DRAM modules and flash application products, today announces that its XPG series DDR3 DRAM modules are fully compatible with ASUS P7P55D series and ROG Maximus III series motherboards. Once again, A-DATA has established an undisputed industry-leading position.

Moreover, in order to present the leading position and technology alliances between two major players in the IT industry, A-DATA and ASUS have demonstrated together their latest products for Intel P55 platform at ASUS P55 Technical Seminar. During this event A-DATA showcased its XPG series DDR3 DRAM modules including the Plus Series DDR3-2200+ 4GB dual channel kit, which adopts 2oz copper PCB (printed circuit board), while ASUS presented the P7P55D series and ROG Maximus III series motherboards.

Rambus Inc., one of the world's premier technology licensing companies specializing in high-speed memory architectures, and Kingston Technology, the independent world leader in memory products, today announced a collaborative development of a threaded module prototype using DDR3 DRAM technology. Initial silicon results show an improvement in data throughput of up to 50 percent, while reducing power consumption by 20 percent compared to conventional modules.

As demand grows for throughput-intensive computing in notebooks, desktops and servers, the performance requirements on DRAM memory subsystems rises dramatically. As a result, multi-core computing requires more bandwidth and higher rates of random access from DRAM memory.

Coinciding with Intel's launch of socket LGA-1156 Core i5/Core i7 processors, Lexar Media announced four Crucial DDR3 memory kits certified to work with the new platform. The four are dressed in Crucial's vanilla design that makes use of green PCBs sans heatspreaders, which may not be required considering the low voltage these modules operate on.

Coming as 2 GB (2x 1 GB) and 4 GB (2x 2 GB) capacities, the new kits in ECC and non-ECC variants. All four operate at 1333 MHz, with CAS latency of 9T, and DRAM voltage of 1.5 V. Backed by lifetime warranties, the 2 GB kits sell for 37 EUR, while the 4 GB ones for 95 EUR.

A-DATA Technology, the world leader in DRAM module and Flash application products, has announced the release of Intel-certified DDR3 memory 1333/1066 U-DIMM Kits for desktops and 1333/1066 SO-DIMM kits for laptops embedded with the latest Intel platforms.

As a close partner with Intel, A-DATA offers complete DDR3 solutions for the new Intel platforms, releasing certified DDR3 1333/1066 U-DIMM. Available in both triple- and dual-channel, A-DATA DDR3 memory modules are duly certified by Intel and ready to optimize the highly-anticipated Intel P55 chipset powered by Core i5 processor, which is set to debut this September. A-DATA, meantime, offers Intel-certified DDR3 1333/1066 SO-DIMM kits as well for mobile PC users who seek not only computing power, but also the benefits of low voltages and low latencies in DDR3 notebook computers equipped with the next-generation P55 platform.

GeIL today introduced a set of DDR2 and DDR3 dual-channel, and quad-channel memory kits. The new DDR2 kits make use of the company's newest 4 GB Black Dragon, Black Dragon EVO One module, while the DDR3 kits include 2 GB modules from the EVO One, and Ultra series. The DDR2 series features 8 GB (2x 4GB) and 16 GB (4x 4GB) kits, while DDR3 ones include 4 GB (2x 2GB) and 8 GB (4x 2GB) modules. The DDR2 series includes PC2-5600 (667 MHz) and PC2-6400 (800 MHz), while the DDR3 series is optimised for Intel LGA-1156 platform, and includes modules running at the speeds of PC3-16000 (2000 MHz) and PC3-17066 (2133 MHz). Detailed specifications follow.

After winning unanimous acclaims from game-players for the triple-channel Xtreem DDR3 2000 and Xtreem DDR3 1866 modules, Team introduces the brand new Xtreem LV (low voltage) DDR3 series targeted at high frequency and low latency. The Xtreem LV series includes the models at 2200, 2133, 2000, 1866, 1600MHz. It is expected that the Xtreem LV series will launch a new wave to the dual-channel module market.

Based on the memory architecture of Core i7/i5, Team has successfully boosted the frequency of DDR3 modules from 1333MHz to 2000MHz in the Xtreem LV series. In addition to enhancing the frequency by nearly 40%, Team has integrated the memory controller of the Xtreem DDR3 LV series to the CPU's internal architecture in order to break through the technical limit on X48 and P45 platforms. As a result, the performance of the Xtreem DDR3 LV series is unsurpassed. On the other hand, the Xtreem LV DDR3 1866/1600 models are equipped with a low latency design, 7-7-7-21 and 6-7-6-18 (tCL-tRCD-tRP-tRAS) respectively, at the same working voltage of 1.65V, showing off Team's excellent R&D capability.

OCZ Technology Group, Inc., a worldwide leader in innovative, ultra-high performance and high reliability memory, today unveiled low-voltage DDR3 designed specifically for the upcoming Intel P55 Chipset and subsequent Intel Core i7, i5, and i3 (Socket 1156) processors. Configured for dual channel mode, these ultra-compatible 4GB kits ensure optimal performance with an ideal combination of low power requirements and high frequencies.

Developed for cost-conscious enthusiasts and gamers, these new OCZ modules were engineered with the same affordability and performance standards as the new Lynnfield platform. By using sophisticated IC screening methods and qualifying on a variety of motherboards, OCZ low-voltage kits are the perfect complement for the P55 Chipset and choice CPU to deliver the maximum stability. Together, P55 and OCZ memory are the premium option for the midrange desktops.

Mushkin today announced four dual-channel DDR3 memory kits it claims to be best suited for the AMD AM3 socket processors. All of these are specified to run at PC3-12800 (DDR3 1600 MHz), and consist of two 2 GB modules. The changes kick in, in the form of memory timings and recommended vDIMM voltages. Says Mushkin: "Our Engineers have risen to the challenge of new technological advancements and set themselves upon our Dual Channel technology. The result thus far has been 4 exemplary new memory kits for the DDR3-Dual Channel segment that, because of diverse adjustments, are fine-tuned for the AM3 platform."

Product details, as listed by Mushkin are as follows:

• 996657AM3 - XP3-12800 4096MB Dual Channel Kit CL 7-7-7-20 1.85V-1.95V
• 996601AM3 - XP3-12800 4096MB Dual Channel Kit CL 7-7-6-18 1.85V-1.95V
• 996659AM3 - XP3-12800 4096MB Dual Channel Kit CL 9-9-9-27 1.65V-1.70V
• 996629AM3 - XP3-12800 4096MB Dual Channel Kit CL 8-8-8-24 1.80V-1.90V

All four kits are available now, at standard market prices. Mushkin says that it's working on even more memory kits optimized for the AM3 platform.

Corsair, a worldwide leader in high-performance computer memory, power supplies and flash memory products, including solid-state drives, today announced that is has launched a full range of dual-channel performance DDR3 memory products, designed for Intel Core i5-750, Core i7-870, and Core i7-860 "Lynnfield" processors.

The initial product offering consists of four 4GB kits comprised of matched pairs of 2GB DIMMs, and two 8GB kits comprised of four matched 2GB DIMMS, in frequencies of 1333MHz, 1600MHz and 2000MHz. This lineup includes a 4GB 1600MHz CAS 8 Dominator and 4GB 2000MHz CAS 8 Dominator GT, both of which feature Corsair's innovative DHX+ (Dual-path Heat eXchange) memory cooling technology for maximum performance and reliability. All the kits use a low operating voltage of 1.65V or less.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced a very low profile (VLP) DDR3-1333 Registered DIMM designed for use in servers with compact and low-profile enclosures.

This 2GB ECC registered module is only 0.72-inches tall, nearly half an inch shorter than standard height DDR3 modules. "We made this product for high density servers and embedded computers where space inside the chassis is severely constrained", explained Super Talent Director of Marketing, Joe James. VLP modules also make sense in 1U servers since their small stature improves airflow inside the chassis.

Mushkin is readying a new series of PC memory kits named Copperhead. The series circles around a new heatspreader design that heavily makes use of copper, to enhance its thermal characteristics. The company has in the the past worked on similar heatspreader innovations including a vapor-chamber technology based Ascent series. Considering that copper is an expensive (if not precious) metal, these kits could be positioned in the higher-end category, consisting of triple-channel and dual-channel DDR3 memory kits. Owing to its still sizable market, DDR2 kits in the series cannot be written off at this point. Expect product launches very soon.

With Intel's new socket LGA-1156 Core i5, Core i7 lines of processors, and compatible motherboards barely weeks away, memory specialist Corsair is readying a few DDR3 dual-channel memory kits to grace the occasion, and possibly coincide with the launch. Featuring in the XMS3 series, the four kits come in speeds of DDR3-1333 and DDR3-1600, with capacities of 2x 4GB (8 GB) and 2x 2GB (4 GB). Whether these kits carry some kind of special branding, is not known, though being JEDEC standards compliant, the memory may work on most DDR3-supportive motherboards. Some of these kits feature Corsair's high-density, 4 GB modules. Listed below are the four SKUs:

• CMX8GX3M4A1600C9 - 2x 4GB, DDR3-1600, 9-9-9-24
• CMX8GX3M4A1333C9 - 2x 4GB, DDR3-1333, 9-9-9-24
• CMX4GX3M2A1600C8 - 2x 2GB, DDR3-1600, 8-8-8-24
• CMX4GX3M2A1600C9 - 2x 2GB, DDR3-1600, 9-9-9-24

With one of the first 4 GB modules sold at (hopefully) mainstream prices, 8 GB (dual-channel), and 12 GB (triple-channel) kits could get popular in the months to come.

Corsair Labs recently conducted testing to determine whether the use of high-performance DDR3 memory for Core i7 platforms also requires the use of more effective CPU cooling products.

The results clearly show that using high-performance memory results in increased CPU temperatures, due to the higher CPU VTT voltages and Uncore clock speeds required by the IMC (Integrated Memory Controller) in the Core i7 processor. The average load temperature of a Core i7-920 processor cooled by the Intel HSF (heatsink and fan) was 11 degrees C higher when utilizing 2000MHz C8 Dominator GT memory compared to 1333MHz DDR3 memory. The same PC cooled using the Corsair H50 CPU Cooler maintained average CPU core temperatures up to 24 degrees C lower than the stock Intel HSF, and was able to stably cool an overclocked CPU while also maintaining a 2000MHz DDR3 memory frequency.

G.Skill International Co. Ltd., a world leader in extreme performance memory with solid quality, today unveiled the Gaming Series- Ripjaws performance DDR3 Dual-channel 1.65 volts memory solution with speeds ranging from 1333 to 1866MHz. G.SKILL also preparing production DDR3 dual-channel memory kits speeds range from 2000MHz CL9 to 2200MHz CL8 for upcoming Intel platform.

G.Skill Ripjaw Gaming Series Memory are designed to combine a performance DDR3 dual-channel memory solution with speeds ranging from 1,333 to 1,866MHz at just 1.65 Volts. At these speeds, G.Skill has optimised the high performance DIMMs for reliability so gamers get amazing FPS, while maintaining a solid overclock so your PC will not fail from memory errors mid-game.

Patriot Memory, a global pioneer in high-performance memory, NAND flash and computer technology, today announced the release of the Viper II DDR2 memory kits with Futuremark's 3DMark Vantage software.

Patriot Memory and Futuremark have teamed up once again to offer PC enthusiasts and overclockers the tools necessary to build the ultimate performance system. Futuremark's 3DMark Vantage, the world's #1 benchmarking software, offers consumers the chance to see how their system performs and stacks up against worldwide contention.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced it is preparing production quantities of HyperX DDR3 dual-channel 1.65-volt memory kits, and has successfully achieved 2133 MHz speed at CL8 latencies. In September, Kingston will ship a complete line of HyperX DDR3 dual-channel 1.65-volt performance memory kits from 1333 to 2133 MHz, so enthusiasts and do-it-yourself system builders can choose from a full set of offerings of the latest technology for their rigs.

Kingston memory is backed by a lifetime warranty and free, 24/7 technical support.

Micron Technology, Inc. today announced that it has produced the industry's first DDR3 load-reduced, dual-inline memory module (LRDIMM) and will begin sampling 16-gigabyte (GB) versions this fall. By reducing load on the server memory bus, Micron's LRDIMMs provide the option to support higher data frequencies and significantly increase memory capacity.

The new LRDIMMs will be manufactured using Micron's leading-edge 1.35-volt, 2-gigabit (Gb) 50-nanometer DDR3 memory chips, allowing the company to easily and cost-effectively increase server module capacity because of the chips' high-density and industry-leading small die size. Micron's 2Gb 50nm DDR3 product is currently in qualification with customers and is ramping toward high volume production.

World class memory/DRAM module manufacturer, Silicon Power sets the sight on server class DDR3 DRAM module. Officially released as of today, the modules come with built-in temperature sensors and are made specifically for servers and workstations. Available in 1333/1066 MHz speeds, they are compatible with Intel Nehalem-based Xeon 5500 platform in tri-channel operation. With its built-in temperature sensor, it can effectively prevent system crashes, maximize efficiency and improve overall performances. It is the perfect fit for servers and workstation PCs that require stability, efficiency and processing power.

For serves and workstation PCs, platform stability is always a concern with system's heat production. Silicon Power's DDR3 1333/1066 temperature sensor can be monitored by the system and will address memory workloads accordingly to prevent overheating or overworking the modules. It effectively lowers module temperatures by evenly distributing workloads to ensure maximum system performance and stability.

Corsair, a worldwide leader in high-performance computer and flash memory products, today announced the new Dominator GT line of ultra-high performance DDR3 memory modules, designed specifically for AMD Phenom II processor-based platforms using Socket AM3 motherboards.

The new 4GB (2 x 2GB) Dominator GT memory kit has been precision engineered to operate at a frequency of 1600MHz with ultra low-latency timings of 6-6-6-18 and a Command Rate of 1T. These settings are a perfect match for the latest, high-performance Socket AM3 AMD Phenom II processors, which feature an advanced, low-latency, integrated DDR3 memory controller.

A-DATA Technology Co., Ltd., the worldwide leader in DRAM modules and Flash application products, leads the industry by announcing today the availability of high-capacity 4GB single module for its entire DDR3 offering, which includes U-DIMM for desktops, SO-DIMM for laptops, and unbuffered ECC-DIMM/ECC Registered DIMM for workstations and servers.

Memory standards have been quickly evolving to the next generation DDR3 as memory requirement for both hardware and software has grown significantly to cope with the increasingly sophisticated applications and the latest platforms. To address the needs for a more powerful memory support, A-DATA makes high-density memory upgrade available and much easier by offering high-capacity 4GB DDR3 in single module.

A-DATA Technology Co., Ltd., a worldwide leading manufacturer in high-performance DRAM modules and flash application products, today announces its new XPG Plus Series DDR3-2200+ v2.0 dual channel kit, which is the highest speed of DDR3 DRAM module in the industry.

The XPG Plus Series DDR3-2200+ v2.0 DRAM module is designed and guaranteed to run on future dual-channel platforms at incredible 2,200MHz killer speed with tight CL8-8-8-24 timings at a voltage of 1.65V, and are available in 1GBx2 and 2GBx2 dual-channel kits.